CN101050946A - Apparatus for measuring thickness of glass substrate - Google Patents
Apparatus for measuring thickness of glass substrate Download PDFInfo
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- CN101050946A CN101050946A CNA2006101262223A CN200610126222A CN101050946A CN 101050946 A CN101050946 A CN 101050946A CN A2006101262223 A CNA2006101262223 A CN A2006101262223A CN 200610126222 A CN200610126222 A CN 200610126222A CN 101050946 A CN101050946 A CN 101050946A
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- 239000000758 substrate Substances 0.000 title claims abstract description 152
- 239000011521 glass Substances 0.000 title claims abstract description 71
- 238000006073 displacement reaction Methods 0.000 claims abstract description 12
- 238000005259 measurement Methods 0.000 claims description 30
- 238000012546 transfer Methods 0.000 claims description 9
- 239000005340 laminated glass Substances 0.000 abstract description 82
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 5
- 238000007689 inspection Methods 0.000 abstract description 2
- 238000005498 polishing Methods 0.000 description 16
- 239000000126 substance Substances 0.000 description 11
- 238000012545 processing Methods 0.000 description 7
- 238000005406 washing Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005571 horizontal transmission Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 101100162186 Mus musculus Slc25a4 gene Proteins 0.000 description 1
- 101100536259 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) TAF14 gene Proteins 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 101150084439 anc1 gene Proteins 0.000 description 1
- 230000001458 anti-acid effect Effects 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004441 surface measurement Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
- G01M11/025—Testing optical properties by measuring geometrical properties or aberrations by determining the shape of the object to be tested
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/38—Concrete; Lime; Mortar; Gypsum; Bricks; Ceramics; Glass
- G01N33/386—Glass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0181—Memory or computer-assisted visual determination
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/10—Plc systems
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- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Geometry (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Medicinal Chemistry (AREA)
- Food Science & Technology (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
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- Length Measuring Devices With Unspecified Measuring Means (AREA)
Abstract
A thickness measuring apparatus 40 is provided which receives a laminated glass substrate GL for use in flat panel display having subjected to thinning process, and measures thickness of the glass substrate in a plurality of inspection lines LN1-LN3. Provided are three sets of displacement sensors Si arranged orthogonally to a conveyance path in which the glass substrate is conveyed, on the sides of front and back faces of the glass substrate; a first means that calculates clearances Dl, D2 between each sensor and a face of the glass substrate GL based on an output signal from the displacement sensor; and a second means that calculates thickness T of the glass substrate being conveyed based on a value calculated in the first means and clearance DO of a pair of sensors determined in advance. According to the present invention, it is possible to accurately measure thickness even for a thinned glass substrate.
Description
Technical field
The present invention relates to a kind of thickness measurement device, it can accurately measure the thin thickness of glass substrate of for example handling by chemical polishing, transmits this glass substrate simultaneously.
Background technology
" flat-panel monitor " (being designated hereinafter simply as " FPD ") is to be used for the term that contrasts with the display device that has a Braun pipe of too fat to move profile such as CRT monitor, be characterized in that thickness is little and save the space, and display board thickness is little.FPD drops into actual the use as LCD, plasma display, OLED display.In FPD, particularly LCD not only is widely used as the televisor into TV, and is used for the display device of portable phone and computer installation.
In recent years, in order to satisfy the needs of the LCD of developing thin thickness in light weight, trend towards adopting a kind of chemical polishing technology, polishing constitutes the laminated glass substrate of LCD as far as possible.More particularly, form a plurality of display boards zone PN on it and be bonded together formation laminated glass substrate GL to first and second glass substrates 60,60 of PN.Laminated glass substrate GL immerses to contain and fluoridizes aqueous acid then, and the periphery 62 of laminated glass substrate GL is sealed closely simultaneously, thereby carries out chemical polishing to reduce thickness (referring to Fig. 9).According to this chemical polishing technology, its advantage is not only can produce a plurality of display board PN simultaneously to PN, and can obtain the good production rate, because increased processing speed with comparing of being reached of mechanical buffing.In addition, owing to can do thinly as much as possible, have also satisfied the requirement that display board PN is reduced thickness and reduction weight to laminated glass substrate GL.
By the laminated glass substrate of such chemical polishing attenuation, be subjected to thickness measure respectively at a plurality of check points then, whether the variation that detects thickness drops in the predetermined scope.In this thickness detects, used a kind of laser sensor, and determined thickness (referring to Figure 10) by reflection wave R1 and the reflection wave R2 in second glass substrate that extracts first glass substrate.
Along with the continuous attenuation of laminated glass substrate, measure thickness and just become very difficult.In other words, because glass substrate is very little, difference is very little between the path of two reflection wave R1 and R2, makes to be difficult to extract respectively them.Especially, be used for the laminated glass substrate of LCD, owing to there is the scattering wave Rn that comes from the substrate that seals between first and second glass substrates, it almost is impossible accurately measuring thickness.
In order further to improve the throughput rate of display board, wish to measure the thickness of the glass substrate that moves in the transfer path.Yet the glass surface of the glass substrate of motion has slight fluctuation on transfer path, and this makes traditional equipment that accurate measurement can not be provided.
The present invention designs in view of the above problems, and the object of the present invention is to provide a kind of thickness measurement device, and it can accurately measure the thickness of the little glass substrate of thickness.A further object of the invention provides a kind of thickness measurement device, and it can accurately measure the thickness of moving glass substrate.
Summary of the invention
In order to realize above purpose, by receiving the glass substrate handled through thinning and, the invention provides the equipment that a kind of measurement is used for the thickness of glass substrate of flat-panel monitor at the thickness of a plurality of these glass substrates of position measurement.The characteristics of this equipment are with the rear surface side many group sensors and the transfer path vertical arrangement that transmit glass substrate are arranged before glass substrate; First device, it is based on the gap of calculating from signal of sensor between each sensor and the glass baseplate surface; And second device, it calculates the thickness of the glass substrate that is transmitted based on the value of calculating and the gap of pre-determined pair of sensors in first device.
Among the present invention, preferably a kind of displacement transducer of sensor, this sensor receives reflection wave simultaneously with preset time interval transmitted wave.Preferably use reflection wave in the reflection of glass substrate outside surface.
The present invention preferably also comprises a PLC, be used to obtain the one-tenth-value thickness 1/10 that is calculated by second device, and/or by sensor, this sensor constantly monitors transfer path, and export " opening " signal when it grabs a glass substrate.As glass substrate, the laminated glass substrate that forms by bonding two glass substrates can advantageously unrestrictedly be used.Its advantage is that sensor has the emission element of emission of lasering beam, and receives the light-receiving member from the reflection wave of glass substrate, and light-receiving member comprises CCD.
According to above invention, can realize a kind of thickness measurement device, even also can measure the thickness of this glass substrate during the glass substrate thinning with pinpoint accuracy.In addition, even glass substrate also can be measured the thickness of this glass substrate with pinpoint accuracy when transmitting.
Description of drawings
Fig. 1 is the view of overall formation that the equipment for after-treatment of thickness measurement device is equipped with in expression;
Fig. 2 is the block diagram of the circuit arrangement of expression thickness measurement device;
Fig. 3 is the view of the position of arranging of expression sensor head;
Fig. 4 is the view of expression measuring operation;
Fig. 5 is the sequential chart of the operation of each parts in the expression thickness measurement device;
Fig. 6 is the skeleton view that the part of unit is introduced in expression;
Fig. 7 is the skeleton view that the other parts of unit are introduced in expression;
Fig. 8 is the block scheme of the circuit arrangement of another thickness measurement device of expression;
Fig. 9 is the view of the general structure of expression laminated glass substrate; And
Figure 10 is the view of the problem of expression conventional art.
Embodiment
Describe the present invention in detail now with reference to preferred embodiment.Fig. 1 is the block diagram that the equipment for after-treatment EQU that implements thickness measurement device 40 of the present invention is equipped with in expression.In Fig. 1, illustrate planimetric map (a), front view (b) and left side elevational view (c).In this equipment for after-treatment EQU, the glass substrate of handling attenuation by chemical polishing is subjected to carrying out washing treatment, dried and thickness measure processing in order.
In the present embodiment, the laminated glass substrate GL that is used for LCD is assumed to be glass substrate GL (referring to Fig. 9) ad lib, and wherein liquid crystal closed area 61 is installed between two glass substrates 60,60 in the display.Chemical polishing is handled, and for example but without limitation by the polishing solution of laminated glass substrate GL immersion based on fluorinated, acid carried out, its periphery 62 seals with antiacid sealant, substrate attenuation equably like this.
Equipment for after-treatment EQU shown in Figure 1 comprises introducing unit 1, this unit receives the laminated glass substrate GL that has been subjected to polishing, washing unit 2, this unit washes the top and bottom surface of the laminated glass substrate GL of reception with water, that uses air knife AK drains unit 3, measure the measuring unit 4 of the thickness of dry laminated glass substrate GL, and this unit removes the ejection unit 5 of finishing the laminated glass substrate GL that measures processing.Measuring unit 4 is equipped with thickness measurement device 40.
In equipment for after-treatment EQU, a plurality of rotation roller RL are contained in from introducing unit 1 to the same plane of ejecting unit 5 to RL.On these rotation rollers RL, in the process of horizontal transmission laminated glass substrate GL, carry out polishing solution flushing processing, dried and thickness measure automatically and handle.Introducing unit 1 and ejecting unit 5 has substantially the same configuration, but operates in antipodal mode.
Fig. 2 is the block diagram that expression constitutes the thickness measurement device 40 of measuring unit 4.Thickness measurement device 40 comprises laser displacement gauge 41, is used for the front or rear surface measurement clearance D for laminated glass substrate GL, by sensor element 42, is used to monitor passing through of laminated glass substrate GL; PLC (programmable logic controller (PLC)) 43 is used for receiving data from laser displacement gauge 41 with by sensor element 42; The touch pad 44 that in the initial setting up of equipment and other operation, uses; And PC (personal computer) 45, be used to store the control data of the thickness T that comprises laminated glass substrate GL.
When laser displacement gauge 41 when sensor head Si obtains a significant detection signal, it is carried out a predetermined algorithm and handles, and this result is sent to PLC 43 continuously with the form of thickness mode analog signal T.On the other hand, when PLC 43 when identifying glass substrate GL from " opening " signal and arrived measuring unit 4 by sensor element 42, PLC 43 carries out measuring operation described below.
At first, PLC 43 is converted to numeral to the thickness mode analog signal T that receives from laser displacement gauge 41 by AD converter 43b, and add temporal information (year-moon-Ri and time-minute-second), and sequentially store these data at internal register to the thickness data of gained.When after the obtaining of the thickness data of finishing predetermined number when receiving " pass " signal by sensor element 42, PLC 43 switches to ready mark " opening " state and finishes current measuring operation.
On the other hand, PC 45 catches " opening " state of ready mark by the mark sense process, and comprises the control data of thickness data by the Ethernet cable collection from PLC 43.PC45 carries out page demonstration or graphic presentation based on this control data then.Surpass at the thickness data value T that collects under the improper situation of the upper limit or lower limit, warning occurs and show.Because PLC 43 is for a laminated glass substrate GL sampling 80 times, thereby each glass substrate GL obtains 3 * 80=240 group thickness data.
In order to realize above operation, comprise two photoelectric sensor SN and be used for amplifying the prime amplifier AMP of the output of each photoelectric sensor SN by sensor element 42 by PLC 43.Photoelectric sensor SN comprises luminous component and light-receiving member.In the present embodiment, photoelectric sensor SN determines only not reflected by laminated glass substrate GL and the arrival light-receiving member from the inspection of luminous component.These two photoelectric sensor SN for example are configured in the upstream close with laser displacement gauge 41.Thereby, when laminated glass substrate GL arrives measuring unit 4,, and when finishing by measuring unit 4, exports laminated glass substrate GL " pass " signal by sensor element 42 output " opening " signals.
In this thickness measurement device 40, use six sensor head Si that arrange by mode shown in Fig. 3 (b).Laser beam is launched to laminated glass substrate GL from the emission element TR of each sensor head Si.In this structure, from the receiving-member RV reception of reflection wave of laminated glass substrate GL by forming by CCD (charge-coupled device (CCD)).
The configuration of emission element TR makes it for the angular emission laser beam (referring to Fig. 4 (c)) of the laminated glass substrate GL that moves on surface level to become θ with respect to perpendicular line.Thereby with respect to the outside travel distance L of laser beam, the vertical range from the launching site P of laser beam to glass substrate GL is D=L * COS (θ).Here, outwards travel distance L is based on the gap delta between launching site P and the acceptance point Q, and the traveling time τ that reaches laser beam is defined by L=(τ xv+ δ).Thereby the vertical range D that arrives glass substrate GL calculates by D=(τ xv+ δ)/2 * COS (θ).Notice that δ is along the relative distance that receives wave measurement, and v is the light velocity.
The view of Fig. 3 is represented the state of arranging of six sensor head Si of above-mentioned functions, and wherein illustrates planimetric map (a), front view (b) and along the view (c) of arrow A-A.As shown in FIG., right and left vertical panel 46R, 46L and the bridge joint upper and lower maintenance track 47U between vertical panel 46,47D has formed rectangular frame FM, and rectangular frame FM is around the transfer path of glass substrate GL.Specifically, keep track 47U bridge joint above glass substrate GL, and keep track 47D bridge joint below glass substrate GL.
Sensor head S1
uTo S3
uBe connected to maintenance track 47 by link 48.Sensor head S1
dTo S3
dBe connected to down maintenance track 47 by link 48.Upper and lower sensor head Si
uAnd Si
dIn the laminated glass substrate GL symmetric arrangement of vertical direction with respect to horizontal transmission betwixt, and upper and lower sensor head Si
u, Si
dEmission element TR, the vertical range between the TR is accurately controlled at predetermined value D0 (referring to Fig. 4 (a)).For the detection line LN1-LN3 of each laminated glass substrate GL by each to upper and lower sensor head Si
uAnd Si
dDefinition.Shown in Fig. 3 (d), along detection line LN1-LN3 in left and right and thickness T center position measurement laminated glass substrate GL.
Each of arranging by mode shown in Figure 3 is to upper and lower sensor head Si
uAnd Si
dBe connected to sensor controller CTi (referring to Fig. 2).Sensor controller CT1-CT3 drives the emission element TR of six sensor head Si with the predetermined cycle, and from light-receiving member RV sensor-lodging.In Fig. 4 (d) and 4 (e), a desirable transmitted wave and light-receiving ripple are shown according to this principle.Shown in Fig. 4 (b), from laminated glass substrate GL, acquisition is located the reflection wave RF5 of reflection etc. at the ripple RF1 of first glass substrate 60a front surface place reflection, at the ripple RF2 of place, first glass substrate 60a rear surface reflection, from the irregular reflection ripple RF3 of liquid crystal closed area 61 at the reflection wave RF4 of second glass substrate 60b front surface place reflection, in the second glass substrate 60b rear surface.
Sensor controller CTi (=CT1-CT3), from upper and lower sensor head Si
uAnd Si
dAmong the reflection wave RF1-RF4 that receives, be proportional to the front-reflection ripple RF1 that is reflected of initial reception and the simulated time difference signal τ ij (i=1 to 3, j=1 to 2) of the mistiming τ between the transmitted wave, output to analog controller ANCi.As mentioned above, because the vertical range D between sensor head Si and the glass substrate GL determines vertical range D by D=(τ xv+ δ)/2 * COS (θ) definition based on the mistiming signal τ ij from sensor controller CTi output.
Analog controller ANCi (ANC1-ANC3) calculates the clearance D 1 from emission element TR to glass substrate, D2 based on the mistiming signal τ ij that receives from sensor controller then.For example, with respect to the first detection line LN1, from upper sensor head S1
uEmission element calculate by D1=(τ 11xv+ δ 1)/2 * COS (θ) to the vertical range D1 of the end face of laminated glass substrate GL, and from lower sensor head S1
dEmission element calculate by D2=(τ 12xv+ δ 2)/2 * COS (θ) to the vertical range D2 of the bottom surface of laminated glass substrate GL.Here the emission of τ 11 and τ 12 each expression transmitted wave regularly and the mistiming of the light-receiving of front-reflection ripple RF1 between regularly, along receiving the relative distance that ripple calculates, they are respectively for upper and lower sensor head Si between δ 1 and δ 2 each expression launching site P and the acceptance point Q
uAnd Si
dValue.
Then, analog controller ANCi is based on the clearance D of calculating 1, and D2 determines the thickness T of laminated glass substrate GL.More particularly, based on upper and lower emission element TR, the down suction D0 of TR is by the thickness T (referring to accompanying drawing 4 (a)) of T=D0-D1-D2 calculating laminated glass substrate GL.The thickness T of Que Dinging is with the form output of simulating signal then.
Like this, according to present embodiment, by only using surface echo RF1 to determine clearance D 1 between each emission element TR and the glass substrate among a plurality of reflection wave RF1-RF4, D2, and determine the thickness T of glass substrate by the calculating of D0-D1-D2.Thereby as long as by improving upper and lower emission element TR, the mechanical accuracy of the down suction D0 of TR no matter whether the mechanical accuracy of the transfer path that is formed by rotation roller RL is good, just can accurately be measured the thickness T of laminated glass substrate GL.
The sequential chart that Fig. 5 provides is represented the mistiming signal τ ij from sensor controller CTj reception by analog controller ANCi, and the thickness mode analog signal T that is outputed to PLC 43 by analog controller ANCi.As previously mentioned, (a) mistiming signal τ ij is proportional to the transmitted wave of laser beam and from the mistiming between the surface echo RF1 of glass substrate, and (b) therefore, mistiming signal τ ij has defined before laser emission part TR and the glass substrate and the distance D 1 between the rear surface, D2.
(come down to clearance D 1, D2) be attributable to the laminated glass substrate GL that together is transmitted with the rotation of rotating roller RL from the fluctuation variation of Fig. 5 signal τ of appreciable mistiming ij.Even laminated glass substrate GL is transmitted in certain fluctuation mode, with respect to the clearance D 1 of the front surface of laminated glass substrate GL and with respect to the clearance D 2 of rear surface with opposite direction displacement, (referring to Fig. 5 (a), (b)), calculate the thickness T (referring to Fig. 5 (c)) of laminated glass substrate GL all the time by the calculating pinpoint accuracy of D0-(D1+D2).
In the present embodiment, sensor controller CTi and PLC 43 are subjected to the intervention of each analog controller ANCi, and the thickness T of mistiming τ ij between the transmitting and receiving of laser beam and laminated glass substrate GL transmits with the form of simulating signal.This helps to realize to transmit fast to handle, and improving the resolution of processed signal, and improves the degree of accuracy of the thickness T of being calculated.
Be not limited to circuit arrangement shown in Figure 2, can provide by shown in Figure 8 based on the controller CTL1-CTL3 of the sensor signal calculated thickness that receives from sensor head Si.The thickness T that calculates needn't offer PLC 43 with the form of simulating signal, but preferably offers PLC 43 input port IN1-IN3 with the form of numerical data.PLC43 not necessarily, and PC 45 can play PLC 43.
Other parts that constitute equipment for after-treatment EQU below will be described.Fig. 6 and Fig. 7 are skeleton views, and the structure of unit 1 (ejecting unit 5) is introduced in expression, and what be used to keep laminated glass substrate GL shown in it lays unit 10, and is used to make the driver part 20 of laying parts 10 swings.Laying parts 10 is connected with the output shaft 21 of driver part 20 by a driver part 20, make the motion of the reciprocating-piston lay parts 10 response driver parts 20, the state of falling (referring to Fig. 6) that is in surface level with spend standing up of standing up with about 60 to 80 and switch between the state.
Now further specify and lay parts 10 with reference to Fig. 6.The shown formation of laying parts 10 mainly is: a pair of pectination swivel arm 11,11, a plurality of back up pads 13 to 13 that are fixed to the fixed block 12,12 of swivel arm 11 near-ends and are used to support laminated glass substrate GL.
These parts 11 are for example formed by aluminium alloy to 13, and swivel arm 11 and fixed block 12 are by aluminium welding or alternate manner combination.Swivel arm 11 and fixed block 13 are provided with the through hole that is used to hold output shaft 21.Through hole has keyway KY, and the key of output shaft 21 is fitted to keyway KY, is delivered to swivel arm 11,11 (referring to Fig. 6 (b)) reliably with the rotation that guarantees output shaft 21.
Shown in Fig. 6 (b), swivel arm 11 by the L shaped main body BDY of integral body and from the outstanding comb teeth CMB of main body BDY in conjunction with forming.The arrangement pitch of comb teeth CMB is identical with the arrangement pitch of rotation roller RL, their half pitch but comb teeth CMB and rotation roller RL stagger each other.The result is that at the state of falling (Fig. 6) of swivel arm 11, each comb teeth CMB comes adjacent rotation roller RL, between the RL.These comb teeth CMB only is equipped with a barbed portion SP, can be by this breach operator near the rear surface of laminated glass substrate GL, and grip laminated glass substrate GL reliably.When swivel arm 11 is in when falling state most, keep laminated glass substrate GL thereon to keep (referring to Fig. 6 (b)) by swivel arm 11 by rotation roller RL.
Shown in Fig. 6 (b), each comb teeth CMB has the far-end of the outstanding shape of a U, or in other words, and each comb teeth CMB is formed with recess 14 corresponding to back up pad 13 thickness at its far-end.Barrier plate 15 is fixed to the far-end of swivel arm 11, and its state is that the two ends of back up pad 13 all are fitted in the recess 14, and by this barrier plate 15, back up pad 13 stationary are to swivel arm 11.
Back up pad 13 specifically is divided into two back up pad 13A with different vertical width, 13B.Among them, be configured in the width of the width of the recently distolateral back up pad 13A of swivel arm 11 greater than another back up pad 13B.In the surface of contact of back up pad 13A and laminated glass substrate GL periphery, be stained with a liner component 16, be used for protecting laminated glass substrate GL.
On the other hand, for other back up pad 13B, a plurality of O shapes ring 17 be wrapped in each plate around, with the rear surface of protection back up pad 13B superimposed layer glass substrate GL.As mentioned above, at the state of falling of laying parts 10 shown in Figure 6, laminated glass substrate GL discharges from encircling 17 state of contact with O shape, and is brought into and rotates roller RL and contact.The concrete structure example of the perspective representation driver part 20 of Fig. 7.Driver part 20 comprises retaining part 22A, and 22B is used for rotatably carrying the two ends of output shaft 21, be fixed to from the linking arm 23 of the outstanding output shaft 21 of one of retaining part 22A, and the drive source 24 that is used for allowing linking arm 23 swings.
Because linking arm 23 is connected in a manner described with drive source 24, pulled into first state (referring to Fig. 1 (a)) of cylinder body 25 at piston 26, lay parts 10 and drop to horizontality.On the other hand, stretch out (referring to Fig. 1 (b)) under the similar emulation mode from cylinder body 25 at piston 26, lay parts 10 from horizontality rise to about 60 to 80 the degree and stand up.
Consider the premises, with the operation of explanation equipment for after-treatment EQU shown in Figure 1.When the operator formed suitable blocked operation for the control device (not shown), the driver part 20 of introducing unit 1 moved to second state from first state, and consequently, the parts 10 of laying of introducing unit 1 rise to the state of standing up from falling state.
At this moment, be sent to the position of introducing unit 1 owing to be subjected to the laminated glass substrate GL of chemical polishing processing, the operator grips laminated glass substrate GL and it is placed into laying on the parts 10 of the state of standing up.In this placement operation, the operator grips the right side and left hand edge at the mid point of vertical direction.Because swivel arm 11,11 jagged part SP in comb teeth can use barbed portion SP that the laminated glass substrate GL that is held is placed into gently and lay on the parts 10.Lay state at this, liner component 16 adjacency of the following peripheral of laminated glass substrate GL and back up pad 13A, and the O shape of the back side of laminated glass substrate GL and back up pad 13B is encircled 17 adjacency.
Afterwards, when the operator further formed blocked operation, the driver part 20 of introducing unit 1 moved to first state from second state lentamente, and the parts 10 laid of introducing unit 1 turn back to the state of falling from the state of standing up.As mentioned above, laying the falling most under the state of parts 10, the back side of laminated glass substrate GL is from contacting release with O shape ring 17, and is brought into and rotates roller RL and contact.
Thereby, arrived under the condition of the state of falling most and rotated laying parts 10 by making rotation roller RL, be contained in the laminated glass substrate GL that introduces in the unit 1 and be fed to water washing unit 2.Owing to flow in the preceding and rear surface of the laminated glass substrate GL that washings move in water washing unit 2, the polishing solution that is attached on the glass substrate in chemical polishing is handled is cleaned.
Be fed to through the laminated glass substrate GL that washs unit 2 this operations then and drained unit 3.Draining unit 3, the pressure-air of fine rule form effectively is ejected into the laminated glass substrate GL that transmits in Fig. 1 right, thereby is removed reliably attached to the washings of before the laminated glass substrate GL and rear surface.Then, the transmission of laminated glass substrate GL also makes the preceding of laminated glass substrate and rear surface drying.
Like this, pass through measuring unit 4 under the condition that laminated glass substrate GL is cleaned with the rear surface before it.Measuring unit 4 is equipped with thickness measurement device 40, wherein sensor head Si
u, Si
dBe configured in the above and below (referring to Fig. 2) of the laminated glass substrate GL that is traveling in transfer path.Thickness measurement device 40 then, based on before laminated glass substrate GL and the laser light reflected bundle of rear surface, determine to go up or lower sensor head Si
u, Si
dAnd the distance D 1 between the laminated glass substrate GL, D2, and calculate the thickness of laminated glass substrate GL based on the result of calculation of D0-D1-D2.Each laminated glass substrate GL is obtained 240 groups the thickness data altogether from three detection line LN1-LN3, and these data storage are in PC 45.
Then, laminated glass substrate GL moves to and ejects the unit and stop at the there.Eject unit 5 and have the structure identical, and when laminated glass substrate GL is fed, the fixed part 10 of ejection unit 5 is awaited orders and fallen state with introducing unit 1 shown in Fig. 6 and 7.
When the operator carries out suitable blocked operation under laminated glass substrate GL is introduced into the condition of fixed part 10, fixed part 10 begins to rise to this response lentamente, and is kept thereon laminated glass substrate GL to be sent to the back up pad 13B of fixed part 10 and be raised by rotation roller RL.In the process of this lifting, glass substrate GL tends to slide on the O of back up pad 13B shape ring 17, yet because the following side periphery of laminated glass substrate GL is held by liner component 16, needn't worry that laminated glass substrate GL will slide and be damaged.
Just be parked in the there after fixed part 10 rises to restriction site, the operator inserts his/her hand by the barbed portion SP of swivel arm 11 in the behind of laminated glass substrate GL, and grips laminated glass substrate GL then.The operator is from ejecting the laminated glass substrate GL that unit 5 removes gripping then.Handled certain thickness from the laminated glass substrate GL that is removed by chemical polishing, it is fed to follow-up processing then, such as the packaging liquid crystal process after the sealing that discharges laminated glass substrate GL periphery.
As mentioned above, in the present embodiment, because the thickness measurement device 40 with special configuration is provided, it can be during it transmits, and accurately measurement has been subjected to the thickness of the laminated glass substrate GL of chemical polishing processing.
Though used special term that the preferred embodiments of the present invention have been described, this explanation just is the purpose of example, and should be appreciated that can make under the spirit or scope that do not deviate from following claim and change and distortion.
Claims (7)
1. thickness measurement device that is used for the glass substrate of flat-panel monitor, this equipment receives the glass substrate of having handled through thinning, and at the thickness of a plurality of position measurement glass substrates, described equipment comprises:
Many group sensors, they are arranged at the preceding of glass substrate and rear surface side perpendicular to the transfer path that glass substrate is transmitted;
First device, it is based on each sensor of calculated signals exported from sensor and the gap between the glass baseplate surface; And
Second device, it calculates the thickness of the glass substrate that is transmitted based on the value of calculating and the gap of pre-determined pair of sensors in first device.
2. according to the thickness measurement device of claim 1, wherein sensor is a displacement transducer, and it sends transmitted wave at interval with preset time, receives reflection wave simultaneously.
3. according to the thickness measurement device of claim 2, wherein reflection wave is the reflection wave in the outside surface reflection of glass substrate.
4. according to the thickness measurement device of claim 3, also comprise the PLC (programmable logic controller (PLC)) that is used to obtain the one-tenth-value thickness 1/10 that calculates by second device.
5. according to the thickness measurement device of claim 4, comprise that also by sensor, it continuously monitors transfer path, and when it grasps glass substrate, export " opening " signal.
6. according to any one thickness measurement device of claim 1 to 5, wherein glass substrate forms by bonding two glass substrates.
7. according to the thickness measurement device of claim 1, wherein sensor has the emission element of emission of lasering beam, and receives the light-receiving member from the reflection wave of glass substrate, and light-receiving member comprises CCD (charge-coupled device (CCD)).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006106645 | 2006-04-07 | ||
| JP2006106645 | 2006-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101050946A true CN101050946A (en) | 2007-10-10 |
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ID=38782473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101262223A Pending CN101050946A (en) | 2006-04-07 | 2006-08-28 | Apparatus for measuring thickness of glass substrate |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR20070100618A (en) |
| CN (1) | CN101050946A (en) |
| SG (1) | SG136848A1 (en) |
| TW (1) | TWI421467B (en) |
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| CN102073327A (en) * | 2010-12-23 | 2011-05-25 | 南京林业大学 | Online monitoring and control system for continuous flat press plate blank thickness of artificial plate |
| CN102305593A (en) * | 2011-05-20 | 2012-01-04 | 西安迈瑞测控技术有限公司 | Method and device for measuring geometric elements of high-accuracy and wide-range thin-film transistor (TFT) substrate glass |
| CN109813238A (en) * | 2019-01-28 | 2019-05-28 | 广东拓斯达科技股份有限公司 | The control method and device of thickness of glass detection |
| CN110006350A (en) * | 2018-09-19 | 2019-07-12 | 永康市巴九灵科技有限公司 | Thickness measure platform based on radiating laser beams |
| CN110353506A (en) * | 2019-07-31 | 2019-10-22 | 广东万家乐燃气具有限公司 | One kind is cut off the water control method, water dispenser |
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| CN114812452A (en) * | 2022-06-14 | 2022-07-29 | 芜湖东旭光电科技有限公司 | Glass substrate detection system, method, device, electronic device and storage medium |
| US11913772B2 (en) * | 2022-03-17 | 2024-02-27 | Intel Corporation | Non-destructive gap metrology |
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| KR101220654B1 (en) * | 2010-12-27 | 2013-02-07 | 주식회사 포스코 | system and method for measuring surface rough |
| KR200469125Y1 (en) * | 2012-03-13 | 2013-09-25 | 노바테크인더스트리 주식회사 | An Automatic thickness measurement system of a display panel |
| WO2015001145A1 (en) | 2013-07-04 | 2015-01-08 | Fuesca, S.L. | Apparatus for measuring the surface diffusion and the nanometric thickness of metals or metallic oxides on glass substrates |
| KR101413511B1 (en) * | 2013-11-28 | 2014-07-04 | 컨트롤코리아 주식회사 | System for measuring thickness |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000055626A (en) * | 1998-08-06 | 2000-02-25 | Nanotemu:Kk | Plate thickness measuring method and device therefor |
| DE19949019C2 (en) * | 1999-10-11 | 2001-12-13 | Leica Microsystems | Measuring device and method for measuring structures on substrates of various thicknesses |
| KR100652948B1 (en) * | 2000-12-08 | 2006-12-01 | 삼성코닝 주식회사 | Method and system for measuring glass thickness of liquid crystal display |
| JP3768443B2 (en) * | 2002-01-09 | 2006-04-19 | 大日本スクリーン製造株式会社 | Width dimension measuring device and thin film position measuring device |
| DE10225488A1 (en) * | 2002-06-10 | 2003-12-18 | Bild Und Signalverarbeitung Mb | Method and device for non-contact thickness measurement of transparent measurement objects |
| JP2005061982A (en) * | 2003-08-12 | 2005-03-10 | Nishiyama Stainless Chem Kk | Apparatus for inspecting display glass substrate |
| JP2006133099A (en) * | 2004-11-08 | 2006-05-25 | Micronics Japan Co Ltd | Inspection device of display panel |
-
2006
- 2006-07-24 SG SG200604974-6A patent/SG136848A1/en unknown
- 2006-07-28 KR KR1020060071296A patent/KR20070100618A/en not_active Application Discontinuation
- 2006-08-15 TW TW095129930A patent/TWI421467B/en not_active IP Right Cessation
- 2006-08-28 CN CNA2006101262223A patent/CN101050946A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102073327A (en) * | 2010-12-23 | 2011-05-25 | 南京林业大学 | Online monitoring and control system for continuous flat press plate blank thickness of artificial plate |
| CN102305593A (en) * | 2011-05-20 | 2012-01-04 | 西安迈瑞测控技术有限公司 | Method and device for measuring geometric elements of high-accuracy and wide-range thin-film transistor (TFT) substrate glass |
| CN110006350A (en) * | 2018-09-19 | 2019-07-12 | 永康市巴九灵科技有限公司 | Thickness measure platform based on radiating laser beams |
| CN109813238A (en) * | 2019-01-28 | 2019-05-28 | 广东拓斯达科技股份有限公司 | The control method and device of thickness of glass detection |
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| WO2022118184A1 (en) * | 2020-12-01 | 2022-06-09 | Lohia Mechatronik Private Limited | A device and a method to measure and monitor physical properties of moving web of slit plastic film tapes |
| US11913772B2 (en) * | 2022-03-17 | 2024-02-27 | Intel Corporation | Non-destructive gap metrology |
| CN114812452A (en) * | 2022-06-14 | 2022-07-29 | 芜湖东旭光电科技有限公司 | Glass substrate detection system, method, device, electronic device and storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200739031A (en) | 2007-10-16 |
| TWI421467B (en) | 2014-01-01 |
| SG136848A1 (en) | 2007-11-29 |
| KR20070100618A (en) | 2007-10-11 |
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