CN101037251B - 纯水供应系统和清洗系统和使用纯水的清洗方法 - Google Patents
纯水供应系统和清洗系统和使用纯水的清洗方法 Download PDFInfo
- Publication number
- CN101037251B CN101037251B CN2007100053403A CN200710005340A CN101037251B CN 101037251 B CN101037251 B CN 101037251B CN 2007100053403 A CN2007100053403 A CN 2007100053403A CN 200710005340 A CN200710005340 A CN 200710005340A CN 101037251 B CN101037251 B CN 101037251B
- Authority
- CN
- China
- Prior art keywords
- pure water
- feeding mechanism
- substrate
- dissolved
- water feeding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/20—Treatment of water, waste water, or sewage by degassing, i.e. liberation of dissolved gases
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/68—Treatment of water, waste water, or sewage by addition of specified substances, e.g. trace elements, for ameliorating potable water
- C02F1/685—Devices for dosing the additives
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/02—Treatment of water, waste water, or sewage by heating
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
- C02F2103/346—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2301/00—General aspects of water treatment
- C02F2301/06—Pressure conditions
- C02F2301/063—Underpressure, vacuum
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2303/00—Specific treatment goals
- C02F2303/26—Reducing the size of particles, liquid droplets or bubbles, e.g. by crushing, grinding, spraying, creation of microbubbles or nanobubbles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Degasification And Air Bubble Elimination (AREA)
- Physical Water Treatments (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006036647 | 2006-02-14 | ||
JP2006036647 | 2006-02-14 | ||
JP2006-036647 | 2006-02-14 | ||
JP2006333322 | 2006-12-11 | ||
JP2006333322A JP2007251127A (ja) | 2006-02-14 | 2006-12-11 | 純水供給システム、純水を用いた洗浄システムおよび洗浄方法 |
JP2006-333322 | 2006-12-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101037251A CN101037251A (zh) | 2007-09-19 |
CN101037251B true CN101037251B (zh) | 2011-09-14 |
Family
ID=38367089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100053403A Expired - Fee Related CN101037251B (zh) | 2006-02-14 | 2007-02-14 | 纯水供应系统和清洗系统和使用纯水的清洗方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20070186960A1 (zh) |
JP (1) | JP2007251127A (zh) |
CN (1) | CN101037251B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2957715B1 (fr) * | 2010-03-18 | 2012-04-20 | Centre Nat Rech Scient | Procede de formation d'un motif sur une surface d'un support |
JP5460633B2 (ja) | 2010-05-17 | 2014-04-02 | 東京エレクトロン株式会社 | 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記録した記録媒体 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3639102B2 (ja) * | 1996-12-10 | 2005-04-20 | オルガノ株式会社 | ウェット処理装置 |
US5800626A (en) * | 1997-02-18 | 1998-09-01 | International Business Machines Corporation | Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates |
US6319331B1 (en) * | 1997-12-01 | 2001-11-20 | Mitsubishi Denki Kabushiki Kaisha | Method for processing semiconductor substrate |
US6321759B1 (en) * | 1997-12-26 | 2001-11-27 | Canon Kabushiki Kaisha | Method for cleaning a substrate |
JP2000164551A (ja) * | 1998-11-26 | 2000-06-16 | Sony Corp | 洗浄装置及び洗浄方法 |
JP2000290693A (ja) * | 1999-04-12 | 2000-10-17 | Japan Organo Co Ltd | 電子部品部材類の洗浄方法 |
US6167891B1 (en) * | 1999-05-25 | 2001-01-02 | Infineon Technologies North America Corp. | Temperature controlled degassification of deionized water for megasonic cleaning of semiconductor wafers |
JP2001271188A (ja) * | 2000-03-24 | 2001-10-02 | Ses Co Ltd | 基板処理装置 |
-
2006
- 2006-12-11 JP JP2006333322A patent/JP2007251127A/ja active Pending
-
2007
- 2007-02-08 US US11/703,692 patent/US20070186960A1/en not_active Abandoned
- 2007-02-14 CN CN2007100053403A patent/CN101037251B/zh not_active Expired - Fee Related
Non-Patent Citations (2)
Title |
---|
JP特开2000-290693A 2000.10.17 * |
JP特开平10-225664A 1998.08.25 * |
Also Published As
Publication number | Publication date |
---|---|
JP2007251127A (ja) | 2007-09-27 |
CN101037251A (zh) | 2007-09-19 |
US20070186960A1 (en) | 2007-08-16 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: PS4 LASCO CO., LTD. Free format text: FORMER OWNER: NIHITATSU MEMORY CO., LTD. Effective date: 20130828 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130828 Address after: Luxemburg Luxemburg Patentee after: ELPIDA MEMORY INC. Address before: Tokyo, Japan Patentee before: Nihitatsu Memory Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110914 Termination date: 20150214 |
|
EXPY | Termination of patent right or utility model |