CN101030091A - Radiator of notebook computer - Google Patents
Radiator of notebook computer Download PDFInfo
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- CN101030091A CN101030091A CN 200710097738 CN200710097738A CN101030091A CN 101030091 A CN101030091 A CN 101030091A CN 200710097738 CN200710097738 CN 200710097738 CN 200710097738 A CN200710097738 A CN 200710097738A CN 101030091 A CN101030091 A CN 101030091A
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Abstract
A heat radiation device of notebook computer is prepared as setting heat absorption module at heat generating position, conducting heat source to heat conduction module by heat absorption module, conducting heat source of refrigerating chip to bridge model then conducting two said heat sources both to bottom heat radiation module to carry out heat radiation there, conducting cold source to top heat radiation module by refrigerating chip through cold tube and utilizing fan to discharge out heat stream in top and bottom heat radiation module for quickly and effectively radiating heat out.
Description
Technical field
The present invention relates to a kind of radiator of notebook computer, particularly a kind of heat abstractor with heat, cold pipe and the collocation of cooling wafer member is a kind of device that splendid radiating effect is provided for notebook computer.
Background technology
The member of computer is small but excellent close, the manufacturer is in fear of computer can influence the wherein life-span of electronic component at the high temperature that work of treatment the time is produced, be particularly useful for the top device radiation sheet group and the radiator fan of central processing unit, must turn round effectively and dispel the heat, just can guarantee the running that computer is normal.Yet, the notes type that current global computer dealer is released, mini, slim computer product etc., or in conjunction with the electric equipment products of computer, more and more fast on computing (commentaries on classics) speed, the arithmetic speed of its central processing unit has surmounted 3.2GHZ or higher arithmetic speed and 64 central processing unit, or multinuclear heart technology, be the new trend in future, therefore impel one merchant of factory to drop into the research and development improvement of heating radiator energetically.The central processing unit heating radiator of the designed improvement of dealer at present, all be radiating fin part or the improvement a little of radiator fan part at heating radiator, each dealer release person is similar, basically all on radiating efficiency, do not have significantly fast and break through, influence notes type, mini, slim computer product or operate the speed of execution in conjunction with computer in the electrical equipment product of one.
In view of this, this case inventor is based on above-mentioned drawback, still actively make great efforts to develop, study improvement, and accumulation is made for many years, knowhow, and a creation generation that is enough to solve above-mentioned drawback is arranged finally.
Summary of the invention
The purpose of this invention is to provide a kind of radiator of notebook computer, to solve the relatively poor problem of radiating effect that existing notebook computer heating radiator exists.
A kind of radiator of notebook computer of the present invention, its fundamental purpose system provides can condense aqueous vapor, and removes the condensation adsorption piece of condensation aqueous vapor, make outside aqueous vapor is excluded in, and the supply low-temperature receiver is done effective convection current.
A kind of computer of the present invention, heat radiation of electrical apparatus device, main system includes:
One heat-absorbing model is installed on thermal source generation place of computer.
One heat transfer module, top overlap a bridge mould, and bridge mould top is a refrigeration wafer and a low-temperature receiver module;
One refrigeration wafer, one side can produce low-temperature receiver for refrigeration face, and face can produce temperature for the pyrogenicity face in addition, and refrigeration face is fitted with the low-temperature receiver module, and pyrogenicity face and bridge mould are fitted.
Heat radiation module in one top has the heat radiator of plural number, blows away cold air with a fan, and the below connects establishes the below module that dispels the heat.
Heat radiation module in one below has the heat radiator of plural number.
Several heat pipes are directed in heat transfer module by heat-absorbing model, import below heat radiation module again.
Several side pipes are directed in below heat radiation module by the bridge mould.
Number Zhi Lengguan is directed in top heat radiation module by the low-temperature receiver module.
In view of the above, the thermal source that the thermal source of heat-absorbing model conducts to the pyrogenicity face of heat transfer module and cooling wafer conducts to the bridge mould, and do heat radiation to below heat radiation module and move, again by cooling wafer with cold pipe conduction low-temperature receiver to the top module that dispels the heat, to the cooling of below heat radiation module, with fan top module, the below heat radiation mould hot-fluid that dispels the heat is discharged,, can keep the notebook computer normal operation to reach heat radiation effectively apace.
Description of drawings
Fig. 1 is the perspective view of first embodiment of the invention.
Fig. 2 fastens the side-looking floor map of an embodiment.
Fig. 3 fastens the fan, low-temperature receiver module level of an embodiment to diagrammatic cross-section.
Fig. 4 dispels the heat module, low-temperature receiver module level to diagrammatic cross-section on fastening an embodiment.
Fig. 5 fastens the low-temperature receiver module, cooling wafer, bridge mould, heat transfer module of an embodiment vertically to diagrammatic cross-section.
Fig. 6 fastens just dispel the heat under the embodiment module, bridge mould, heat transfer module level to diagrammatic cross-section.
Fig. 7 is the perspective exploded view of second embodiment of the invention.
Fig. 8 is the perspective exploded view of third embodiment of the invention.
Description of reference numerals:
1 central processing unit; 11 heat pipes; 10 heat-absorbing models; 12 jacks; 20 heat transfer modules; 21 jacks; 30 bridge moulds; 31 side pipes; 32 jacks; 40 cooling wafers; 41 refrigeration faces; 42 pyrogenicity faces; 50 low-temperature receiver modules; 51 cold pipes; 52 jacks; 60 tops heat radiation module; 61 jacks; 62 embedded spaces; 63 embedded spaces; 70 belows heat radiation module; 71 jacks; 80 fans; 90 cover bodies; 91 left runners; 92 right runners; 100 left condensation adsorption pieces; 101 multilayer plates; 102 retaining walls; 103 upright bars; 110 right condensation adsorption pieces; 111 multilayer plates; Laminate piece more than 112 lower floors; 113 risers; 114 cylindrical shells; 1141 openings; 115 ports; 120 left condensation adsorption pieces; 121 multilayer plates; Laminate piece more than 122 outsides; 123 retaining walls; 124 ports; 125 cylindrical shells; 1251 openings; 126 upright bars; 130 right condensation adsorption pieces; Laminate piece more than 131 upper stratas; Laminate piece more than 132 lower floors; Laminate piece more than 133 outsides; 134 risers; 135 cylindrical shells; 1351 openings; 136 ports.
Embodiment
The present invention's embodiment is described in detail in detail below in conjunction with accompanying drawing:
At first, a kind of radiator of notebook computer of the present invention, shown in Fig. 1 to 6, main system includes a heat-absorbing model 10, one heat transfer module 20, bridge mould 30, one refrigeration wafer 40, low-temperature receiver module 50, one top heat radiation module 60, one below heat radiation module 70, several heat pipes 11, several side pipes 31 and several Zhi Lengguan 51, this heat-absorbing model 10 is installed on thermal source heat radiation place of notebook computer, as present embodiment is central processor (CPU) 1 among the notebook computer, heat-absorbing model 10 is provided with three jacks 12, these heat-absorbing model 10 adjacent sides are a heat transfer module 20, heat transfer module 20 also is provided with three jacks 21, these heat transfer module 20 tops overlap a bridge mould 30, this bridge mould 30 is the arch bridge shape, bridge mould 30 tops are a refrigeration wafer 40 (as Fig. 1 to Fig. 5) and a low-temperature receiver module 50, this cooling wafer 40 connects power supply in addition, can produce low-temperature receiver for refrigeration face 41 above it, be that pyrogenicity face 42 produces high temperature heat relatively below, refrigeration face 41 is fitted with low-temperature receiver module 50, pyrogenicity face 42 is fitted with bridge mould 30, by the cooling wafer 40 whole blocks that form the freezing low temperature of a tool, can reduce low-temperature receiver module 50 temperature rapidly, obtain cooling rapidly, the effect of heat radiation, bridge mould 30 both sides respectively are provided with a jack 32, low-temperature receiver module 50 is provided with three jacks 52, and low-temperature receiver module 50 adjacent sides are top heat radiation module 60.
This top heat radiation module tool 60 has the heat radiator (fin) of plural number, fan 80 has been set up in the top, blow downwards with fan 80, blow away the cold air of top heat radiation module 60, these heat radiation module 60 belows, top connect establishes below heat radiation module 70, this below heat radiation module 70 has the heat radiator (fin) of plural number, fan 80 can blow away hot gas, top heat radiation module 60 is provided with three jacks 61, below heat radiation module 70 is provided with five jacks 71, heating tube 11, side pipe 31 penetrates, three heat pipes 11 are directed in heat transfer module 20 by heat-absorbing model 10, import below heat radiation module 70 again, two side pipes 31 are directed in below heat radiation module 70 by bridge mould 30, three cold pipes 51 are directed in top heat radiation module 60 by low-temperature receiver module 50, and this low-temperature receiver module 50 top outer covers one cover body 90 (can be transparent material) respectively forms left runner 91 and right runner 92 in these cover body 90 both sides.
This heat pipe 11 (normal temperature pipe) and cold pipe 51 (cryotron) are in the body with copper, aluminium or other metal tubulation, to be grooved pipe or sintered pipes (as the copper powder sintering), and pipe is implanted into liquid medium, and (the normal temperature pipe is the alleged heat pipe 11 of this case, and pipe is implanted into as pure water; Cryotron is the alleged cold pipe 51 of this case, and pipe is implanted into ammonia or other) when its molecule receives heat, promptly can produce the evaporation of height, cause the body condensation segment and reflux again, and thermal source is conducted fast in the mode of fluctuation; Because of its conduction velocity system than the high several times of rates of heat transfer of common metal rod or heat radiator or pick up more than the several times; In order to do the characteristic with high speed heat conduction (cold) of this heat pipe 11 of mat (cold pipe 51), the thermal source heat energy that can will be positioned on this heat-absorbing model 10 is passed to rapidly on the heat transfer module 20.
By above-mentioned textural association, a kind of radiator of notebook computer of the present invention, use when of the present invention, the thermal source of central processor among the computer (CPU) 1, by heat-absorbing model 10 thermal source is conducted to 11, three heat pipes 11 of three heat pipes and thermal source is conducted to heat transfer module 20 again, the pyrogenicity face 42 of cooling wafer 40 conducts to bridge mould 30 with thermal source simultaneously, by three heat pipes 11 and two side pipes 31 thermal source is conducted to below heat radiation module 70, below heat radiation module 70 is done the heat radiation action.
And the refrigeration face 41 of cooling wafer 40 produces low-temperature receivers to low-temperature receiver module 50, low-temperature receiver module 50 with three cold pipes 51 conduction low-temperature receivers to top heat radiation module 60, to below heat radiation module 70, three heat pipes 1
1, two side pipes, 31 coolings, this bridge mould 30, heat transfer module 20 and heat-absorbing model 10 and central processing unit 1 reach heat radiation effectively apace.
Blow to top heat radiation module 60 by fan 80, make cold air, do the cooling action, and form runner in these cover body 90 both sides, air-flow is entered by left side runner 91, flow out by right side runner 92 down to below heat radiation module 70.
A kind of radiator of notebook computer of the present invention, second embodiment system as shown in Figure 7, heat radiation module 60 both sides respectively are provided with an embedded space 62 above this, 63, the embedded space 62 in left side is to go into a left condensation adsorption piece 100, this left side condensation adsorption piece 100 is provided with multilayer plate 101, multilayer plate 101 outsides are provided with a L type retaining wall 102,102 times auspicious upright bars 103 that are provided with plural number of retaining wall, heat radiation module 70 right sides, this below are provided with embedded space, and (figure does not show, be positioned at embedded space 63 belows), embedded space under the embedded space 63 on heat radiation module 60 right sides, top and the below heat radiation module, go into a right condensation adsorption piece 110, this right side condensation adsorption piece 110 has laminate piece 111 laminate piece 112 more than lower floor more than the upper strata, all be incorporated into a riser 113, there is a cylindrical shell 114 in laminate piece 111 outsides more than the upper strata, barrel front end is opening 114 soil, one port 115 is arranged at the inner face bottom, port 115 connects riser 113, laminate piece 112 front ends are sealing more than this lower floor, the rear end is an opening, this left side condensation adsorption piece 100, right condensation adsorption piece 110 all has the multilayer plate, and the adsorbable plate of plural pore is arranged, be the cohesion aqueous vapor, and remove the usefulness of condensation aqueous vapor.
When blow to top heat radiation module 60 by fan, when making cold air 70 down to below heat radiation module, air-flow is entered by the embedded space 62 in left side, through left condensation adsorption piece 100 more than laminate pieces 101, to cover body 90 left side runners 91, again to cover body 90 right side runners 92, go into the opening 1141 of right condensation adsorption piece 110, enter laminate piece 111 more than the upper strata, discharge through port 115, laminate piece 112 more than this lower floor, then the air-flow by below heat radiation module 70 directly enters and discharges, can suitably be lowered the temperature, and the cohesion aqueous vapor, got rid of aqueous vapor, avoid aqueous vapor to enter in the notebook computer.
A kind of radiator of notebook computer of the present invention, the 3rd embodiment system as shown in Figure 8, system changes the left condensation adsorption piece 100 and right condensation adsorption piece 110 of second embodiment, left condensation adsorption piece 120 more than the laminate pieces of the 3rd embodiment, be divided into more than the inboard laminate piece 122 more than the laminate piece 121 and the outside, middle with a L type retaining wall 123 combinations, the retaining wall 123 nearly back auspicious ports 124 that have, port 124 connects retaining wall 123, there is a cylindrical shell 125 in laminate piece 122 outsides more than the outside, cylindrical shell 125 front ends are opening 1251, and the back is auspicious to be sealing, more than the outside laminate piece 122 times auspicious be provided with plural number found bars 126.
This right side condensation adsorption piece 130 has laminate piece 132 laminate piece 133 more than the outside more than laminate piece 131 more than the upper strata, the lower floor, all be incorporated into a riser 134, laminate piece 131 has a cylindrical shell 135 more than the upper strata, auspicious before the cylindrical shell 135 is opening 1351, one port 136 is arranged at the inner face bottom, port 136 connects risers 134, and laminate piece 132 front ends are sealing more than this lower floor, and the rear end is an opening.
When blow to top heat radiation module 60 by fan, when making cold air down to below heat radiation module 70, air-flow is entered by the embedded space 62 in left side, laminate piece 121 is through port 124 laminate piece 122 more than the outside more than left condensation adsorption piece 120 inboards, to cover body 90 left side runners 91, again to cover body 90 right side runners 92, go into the opening 1351 of right condensation adsorption piece 130, enter laminate piece 131 more than the upper strata, laminate piece 133 is discharged through port 136 and more than the outside that arrives, laminate piece 132 more than this lower floor, then the air-flow by below heat radiation module 70 directly enters and is discharged by the rear end, can suitably be lowered the temperature, and the cohesion aqueous vapor, got rid of aqueous vapor, avoid aqueous vapor to enter in the notebook computer.
Claims (9)
1, a kind of radiator of notebook computer is characterized in that: comprising:
One heat-absorbing model is installed on thermal source heat radiation place of notebook computer;
One heat transfer module, top overlap a bridge mould, and bridge mould top is a refrigeration wafer and a low-temperature receiver module;
One refrigeration wafer, one side can produce low-temperature receiver for refrigeration face, and face can produce temperature for the pyrogenicity face in addition, and refrigeration face is fitted with the low-temperature receiver module, and pyrogenicity face and bridge mould are fitted;
Heat radiation module in one top has the heat radiator of plural number, blows away cold air with fan, and the below connects establishes the below module that dispels the heat;
Heat radiation module in one below has the heat radiator of plural number, blows away hot gas with fan;
Several heat pipes are directed in heat transfer module by heat-absorbing model, import below heat radiation module again;
Several side pipes are directed in below heat radiation module by the bridge mould;
Number Zhi Lengguan is directed in top heat radiation module by the low-temperature receiver module.
2, radiator of notebook computer as claimed in claim 1, it is characterized in that: described heat-absorbing model, heat transfer module and below heat radiation module respectively are provided with three jacks, heating tube penetrates, bridge mould both sides respectively are provided with a jack, respectively be provided with a side opening with these heat radiation module both sides, below, the side opening of the jack of bridge mould and this below heat radiation module, heating tube penetrates.
3, radiator of notebook computer as claimed in claim 1 is characterized in that: described low-temperature receiver module and top heat radiation module, respectively be provided with three jacks, and the cooling pipe penetrates.
4, radiator of notebook computer as claimed in claim 1, it is characterized in that: described top heat radiation module both sides respectively are provided with an embedded space, the embedded space in left side is to go into a left condensation adsorption piece, this heat radiation module right side, below is provided with embedded space, embedded space under the embedded space on heat radiation module right side, top and the below heat radiation module, go into a right condensation adsorption piece, this left and right condensation adsorption piece is that multilayer has the adsorbable plate of pore, for coagulating many aqueous vapors, and remove the usefulness of condensation aqueous vapor.
5, radiator of notebook computer as claimed in claim 1 is characterized in that: the laminate piece outside is provided with a L type retaining wall more than the described left condensation adsorption piece, the auspicious upright bar that is provided with plural number under the retaining wall.
6, radiator of notebook computer as claimed in claim 1, it is characterized in that: described right condensation adsorption piece has more than the upper strata laminate piece more than the laminate piece and lower floor, all be incorporated into a riser, there is a cylindrical shell in the laminate piece outside more than the upper strata, auspicious before the cylindrical shell is opening, and a port is arranged at the inner face bottom, and port connects riser, auspicious for sealing before the laminate piece more than this lower floor, the rear end is an opening.
7, radiator of notebook computer as claimed in claim 1, it is characterized in that: described low-temperature receiver module top outer cover one cover body, form runner in these cover body both sides, reach the embedded space in top heat radiation module left side and the embedded space on right side respectively, the cooling air by the embedded space in left side through the left side runner to flowing to the embedded space on right side.
8, radiator of notebook computer as claimed in claim 1, it is characterized in that: laminate piece more than the described left condensation adsorption piece, be divided into more than the inboard laminate piece more than the laminate piece and the outside, middle there is a port the nearly rear end of retaining wall with a L type retaining wall combination, and port connects retaining wall, the laminate piece outside has one simplified more than the outside, barrel front end is an opening, and the back is auspicious to be sealing, and laminate piece lower end is provided with the bar that stands of plural number more than the outside.
9, radiator of notebook computer as claimed in claim 1, it is characterized in that: described right condensation adsorption piece has more than laminate piece more than the upper strata, the lower floor laminate piece more than the laminate piece and the outside, all be incorporated into a riser, there is a cylindrical shell laminate piece inboard more than the upper strata, barrel front end is an opening, and a port is arranged at the inner face bottom, and port connects riser, laminate piece front end is sealing more than this lower floor, and the back is auspicious to be opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710097738 CN101030091A (en) | 2007-04-29 | 2007-04-29 | Radiator of notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710097738 CN101030091A (en) | 2007-04-29 | 2007-04-29 | Radiator of notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101030091A true CN101030091A (en) | 2007-09-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710097738 Pending CN101030091A (en) | 2007-04-29 | 2007-04-29 | Radiator of notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101030091A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102479759A (en) * | 2010-11-23 | 2012-05-30 | 英业达股份有限公司 | Heat dissipation apparatus |
-
2007
- 2007-04-29 CN CN 200710097738 patent/CN101030091A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102479759A (en) * | 2010-11-23 | 2012-05-30 | 英业达股份有限公司 | Heat dissipation apparatus |
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