CN101026210A - Semiconductor chip package structure and its package method - Google Patents
Semiconductor chip package structure and its package method Download PDFInfo
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- CN101026210A CN101026210A CNA2006100580248A CN200610058024A CN101026210A CN 101026210 A CN101026210 A CN 101026210A CN A2006100580248 A CNA2006100580248 A CN A2006100580248A CN 200610058024 A CN200610058024 A CN 200610058024A CN 101026210 A CN101026210 A CN 101026210A
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Abstract
This invention relates to a package structure of a semiconductor chip and its package method, which dopes at least a kind of fluorescent powder in a heat conducting glue to adhere the chip to a base, in which, the fluorescent powder can excite a fluorescence matched with the light generated by the chip so the package structure of the chip can generate white light.
Description
Technical field
The present invention relates to a kind of semiconductor chip package and method for packing thereof, and particularly relevant a kind of encapsulating structure and method for packing thereof of simplifying the light-emitting diode chip for backlight unit of canned program.
Background technology
In recent years, along with development of semiconductor, use the light-emitting device of light-emitting diode (Light Emitting Diode is called for short LED), the existing gesture that replaces conventional light source gradually as light source.General in the application of light-emitting diode, except as the light emitting sources such as traffic sign or signal light, the light-emitting diode that can send white light is still suitable light-emitting diode as lighting source.
Prior art has the packaged type of several white light emitting diodes, be summarized as follows respectively: first kind is that blue LED chip is attached on the cooling base (Lead Frame), again coated with the fluorescent material that can inspire its complementary color gold-tinted, because part is directly launched or the blue light through reflecting can arrive outer surface by penetration phosphor, another part then excitated fluorescent powder is sent gold-tinted, make blue Huang be able to complementation and produce white light that fluorescent material wherein can use gold-tinted fluorescent material separately or mix and use green glow and red light fluorescent powder.
Second kind is that the ultraviolet light-emitting diodes chip is attached on the cooling base, again coated with the multiple fluorescent material that excites visible light, but send the fluorescence of multiple different colours owing to the ultraviolet light excitated fluorescent powder, the result of addition gets final product synthesize white light mutually, this kind packaged type normally mixes and uses three kinds of different fluorescent material such as red, blue, green, reaches the effect of its addition.More than two kinds of packaged types that all are to use the made light-emitting diode chip for backlight unit of gallium nitride (GaN) base material.
The third is with red, green, blue Tricolor LED Chip Packaging together, makes the direct synthesize white light of light of the different colours that the red, green, blue light-emitting diode chip for backlight unit produced.This method is to use the made indigo plant of gallium nitride (GaN) base material, green light LED chip and uses the packaged type of the made red light-emitting diode chip portfolio of GaAs (GaAs) base material.
In addition, a kind of blue light diode chip that is grown is arranged still on zinc selenide (ZnSe) base material, produce gold-tinted with the blue light complementation, make light-emitting diode chip for backlight unit synthesize white light voluntarily itself owing to base material itself just can be stimulated.Therefore, during encapsulation, just can directly be attached on the cooling base, and need not be coated with the fluorescent material that can produce complementary color.
Aforementioned first and second kind packaged type; owing to need on light-emitting diode chip for backlight unit, to cover fluorescent material; make that canned program relatively can be comparatively complicated; and because of the fluorescent material thickness that is covered is difficult for evenly distributing; even so consistent and use under the situation of identical fluorescent material at the emission wavelength of light-emitting diode chip for backlight unit, the white light colour temperature that is produced also regular meeting produces error because of the fluorescent material uneven thickness.
The third packaged type, because three light-emitting diode chip for backlight unit still have certain alternate position spike, make the light that projects to produce colored edge, and this kind packaged type need three groups of drive circuits simultaneously, when it adjusts colour temperature, more need to possess the synthetic professional ability of certain light color.
The 4th kind of packaged type, though light-emitting diode chip for backlight unit itself gets final product synthesize white light, colour temperature can't be adjusted during encapsulation, and color rendering is not good, luminous efficiency is not high yet, so still have its defective to exist.
Summary of the invention
In view of this, the purpose of this invention is to provide a kind of semiconductor chip package and method for packing thereof, not only can simplify canned program, have more preferable colour temperature consistency.
For reaching above-mentioned and other purpose, the invention provides a kind of semiconductor chip package, comprising: pedestal, semiconductor chip and fusion have the heat-conducting glue of at least a fluorescent material, and the heat-conducting glue of this fusion fluorescent material is attached at semiconductor chip on the pedestal.Described fluorescent material can inspire the fluorescence that the light that is produced with semiconductor chip has complementary colours.For example this semiconductor chip is a blue LED chip, and the fluorescent material of this fusion in heat-conducting glue is gold-tinted fluorescent material, perhaps mixes mutually for red light fluorescent powder and green light fluorescent powder.
In addition, in another embodiment of the present invention, also can comprise another kind of fluorescent material, this fluorescent material is covered on this semiconductor chip.Wherein, the fluorescent material of this fusion in heat-conducting glue is one of red light fluorescent powder or green light fluorescent powder, and the fluorescent material that is covered on the semiconductor chip then is the another kind of fluorescent material different with aforementioned fluorescent material.
The present invention provides a kind of semiconductor die package method in addition, comprises the following steps: at first to provide a pedestal and semiconductor chip; At least a fluorescent material of fusion in heat-conducting glue; And use the heat-conducting glue of fusion fluorescent material that semiconductor chip is attached on the pedestal.
Can also another kind is fluorescent powder coated on semiconductor chip.
Heat-conducting glue of the present invention can be silica gel or epoxy resin etc.; And the mix proportions of fluorescent material and heat-conducting glue does not have strict restriction, basically can any mixed.
For above and other objects of the present invention, feature and advantage can be become apparent, hereinafter special with preferred embodiment, and cooperate appended accompanying drawing, be described in detail below:
Description of drawings
Fig. 1 is the semiconductor chip package schematic diagram according to first embodiment of the invention;
Fig. 2 is the semiconductor chip package schematic diagram according to second embodiment of the invention.
Description of reference numerals: 100,200 semiconductor chip packages; 110,210 semiconductor chips; 111 blue lights; 112 fluorescence; 120,220 pedestals; 121,122,221,222 electrodes; 130,230 heat-conducting glues; 140,240 leads; 211 ultraviolet lights; 250 fluorescent material.
Embodiment
Please refer to shown in Figure 1ly, it is the semiconductor chip package schematic diagram according to first embodiment of the invention.Among the figure, this semiconductor chip package 100 is to use heat-conducting glue 130 that semiconductor chip 110 is attached on the pedestal 120, and heat-conducting glue 130 before use and fusion in advance at least a fluorescent material is arranged, so that the light that semiconductor chip 110 produces, but the fluorescence that the light that excitated fluorescent powder and sending is produced with semiconductor chip 110 has complementary colours makes this semiconductor chip package 100 can send the light of white.In addition, semiconductor chip 110 also connects two different electrodes 121 and 122 of pedestal 120 via lead 140, drives its luminous power circuit in order to semiconductor chip 110 is connected to.
Among Fig. 1, the fluorescent material of semiconductor chip 110 and 130 fusion of heat-conducting glue can have various combination on demand.First kind of semiconductor chip 110 that is to use blue light-emitting diode, and in heat-conducting glue 130 fusion gold-tinted fluorescent material, so, blue light-emitting diode is the blue light 111 of emission downwards, can excite gold-tinted fluorescent material to make it send yellow fluorescence 112, these yellow fluorescence 112 can be directly or via reflection upwards, and with blue light-emitting diode blue light 111 synthesize white lights of emission upwards, the colour temperature of the white light that produces then can be adjusted via the concentration of fusion fluorescent material.This kind practice is not because of needing on the semiconductor chip 110 again coated with fluorescent material, so can reach the purpose of simplifying canned program.
Second kind of semiconductor chip 110 that also is to use blue light-emitting diode, and in heat-conducting glue 130 fusion red light fluorescent powder and green light fluorescent powder, so, blue light-emitting diode is the blue light 111 of emission downwards, can excite red light fluorescent powder and green light fluorescent powder, make it send red with green fluorescence 112 respectively, these red or green fluorescence 112 can directly or via reflection make progress, and with blue light-emitting diode blue light 111 synthesize white lights of emission upwards, the colour temperature of the white light that produces then can be adjusted the red light fluorescent powder of institute's fusion and the concentration of green light fluorescent powder respectively and change, therefore, this practice can obtain having the white light of preferable color rendering.In addition, because do not need equally on the semiconductor chip 110 again coated with fluorescent material, so also can reach the purpose of simplifying canned program.
Please refer to shown in Figure 2ly, it is the semiconductor chip package schematic diagram according to second embodiment of the invention.Here used semiconductor chip also can be the semiconductor chip of blue light-emitting diode, but the semiconductor chip of preferred ultraviolet light-emitting diodes.Among the figure, this semiconductor chip package 200 is to use heat-conducting glue 230 that semiconductor chip 210 is attached on the pedestal 220, and heat-conducting glue 230 before use and fusion in advance at least a fluorescent material is arranged.In addition, the top of semiconductor chip 210 also is coated with layer of fluorescent powder 250, so that the light that semiconductor chip 210 produces, can excite the fluorescent material of fusion in heat-conducting glue 230, and excite the fluorescent material 250 that covers semiconductor chip 210, and send the fluorescence 212 that has complementary colours each other, make this semiconductor chip package 200 can send the light of white.Similarly, two different electrodes 221 that semiconductor chip 210 also needs to connect pedestal 220 via lead 240 are with 222, in order to semiconductor chip 210 is connected to its luminous power circuit of driving.
Among Fig. 2, the fluorescent material 250 of the fluorescent material of semiconductor chip 210,230 fusion of heat-conducting glue and covering semiconductor chip 210 all can have various combination on demand.For example, when using the semiconductor chip 210 of ultraviolet light-emitting diodes, this fusion in heat-conducting glue fluorescent material and this to be covered in fluorescent material on the semiconductor chip be one kind of or wherein two kinds of red light fluorescent powder, green light fluorescent powder and blue light fluorescent powder.Be the fluorescent material of 230 fusion of heat-conducting glue and the fluorescent material 250 that covers semiconductor chip 210, it can be the various combination of red light fluorescent powder, green light fluorescent powder and blue light fluorescent powder etc., the ultraviolet light 211 that ultraviolet light-emitting diodes is produced, excite the fluorescent material of 230 fusion of heat-conducting glue and the fluorescent material 250 of covering semiconductor chip 210, and generation redness respectively, green or blue fluorescence 212, and synthesize white light.In addition, cover the fluorescent material 250 of semiconductor chip 210, the ultraviolet light 211 that ultraviolet light-emitting diodes also capable of blocking produces is outwards dispersed.
Certainly, as have the knack of known to this skill person, semiconductor chip 210 among second embodiment, also can be as employed semiconductor chip 110 among first embodiment, for example, semiconductor chip 210 is a blue LED chip, the fluorescent material of 230 fusion of heat-conducting glue is wherein a kind of fluorescent material of red light fluorescent powder or green light fluorescent powder, the fluorescent material 250 that covers semiconductor chip 210 then is the another kind of fluorescent material different with the fluorescent material of 230 fusion of heat-conducting glue, or the fluorescent material of 230 fusion of heat-conducting glue and the fluorescent material 250 that covers semiconductor chip 210 is gold-tinted fluorescent material, or the fluorescent material of 230 fusion of heat-conducting glue and the fluorescent material 250 that covers semiconductor chip 210 are the combination of red light fluorescent powder and green light fluorescent powder.That is the fluorescent material 250 of the fluorescent material of semiconductor chip 210,230 fusion of heat-conducting glue and covering semiconductor chip 210 etc. all can change combination according to different demands.
Though the present invention discloses as above with preferred embodiment, so it is not in order to limiting the present invention, anyly has the knack of this skill person, and various changes and the retouching done without departing from the spirit and scope of the present invention also belong to scope of the present invention.Therefore, protection scope of the present invention is as the criterion when looking the accompanying Claim person of defining.
Claims (12)
1. a semiconductor chip package is characterized in that, comprising:
One pedestal;
The semiconductor chip; And
One heat-conducting glue, fusion have at least a fluorescent material, and this fusion has the heat-conducting glue of fluorescent material that this semiconductor chip is attached on this pedestal.
2. semiconductor chip package as claimed in claim 1 is characterized in that this semiconductor chip is a blue LED chip, and the fluorescent material of this fusion in heat-conducting glue is gold-tinted fluorescent material.
3. semiconductor chip package as claimed in claim 1 is characterized in that this semiconductor chip is a blue LED chip, and the fluorescent material of this fusion in heat-conducting glue comprises red light fluorescent powder and green light fluorescent powder.
4. semiconductor chip package as claimed in claim 1 also comprises another kind of fluorescent material, and it is covered on this semiconductor chip.
5. semiconductor chip package as claimed in claim 4, it is characterized in that, this semiconductor chip is a blue LED chip, the fluorescent material of this fusion in heat-conducting glue is one of red light fluorescent powder or green light fluorescent powder, and the fluorescent material that is covered on the semiconductor chip then is the another kind of fluorescent material different with aforementioned fluorescent material.
6. semiconductor chip package as claimed in claim 4, it is characterized in that, this semiconductor chip is the ultraviolet light-emitting diodes chip, this fusion in heat-conducting glue fluorescent material and this to be covered in fluorescent material on the semiconductor chip be one kind of or wherein two kinds of red light fluorescent powder, green light fluorescent powder and blue light fluorescent powder.
7. a semiconductor die package method is characterized in that, comprises the following steps:
One pedestal and semiconductor chip are provided;
At least a fluorescent material of fusion in a heat-conducting glue; And
Use this heat-conducting glue that this semiconductor chip is attached on this pedestal.
8. semiconductor die package method as claimed in claim 7 is characterized in that this semiconductor chip is a blue LED chip, and the fluorescent material of this fusion in heat-conducting glue is gold-tinted fluorescent material.
9. semiconductor die package method as claimed in claim 7 is characterized in that this semiconductor chip is a blue LED chip, and the fluorescent material of this fusion in heat-conducting glue comprises red light fluorescent powder and green light fluorescent powder.
10. semiconductor die package method as claimed in claim 7 also comprises the step of using another kind of fluorescent material to cover this semiconductor chip.
11. semiconductor die package method as claimed in claim 10, it is characterized in that, this semiconductor chip is a blue LED chip, the fluorescent material of this fusion in heat-conducting glue is one of red light fluorescent powder or green light fluorescent powder, and the fluorescent material that is covered on the semiconductor chip then is the another kind of fluorescent material different with aforementioned fluorescent material.
12. semiconductor die package method as claimed in claim 10, it is characterized in that, this semiconductor chip is the ultraviolet light-emitting diodes chip, this fusion in heat-conducting glue fluorescent material and this to be covered in fluorescent material on the semiconductor chip be one kind of or wherein two kinds of red light fluorescent powder, green light fluorescent powder and blue light fluorescent powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100580248A CN101026210A (en) | 2006-02-24 | 2006-02-24 | Semiconductor chip package structure and its package method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100580248A CN101026210A (en) | 2006-02-24 | 2006-02-24 | Semiconductor chip package structure and its package method |
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| Publication Number | Publication Date |
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| CN101026210A true CN101026210A (en) | 2007-08-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2006100580248A Pending CN101026210A (en) | 2006-02-24 | 2006-02-24 | Semiconductor chip package structure and its package method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108561764A (en) * | 2018-03-21 | 2018-09-21 | 厦门市三安光电科技有限公司 | LED filament structure and LED illumination lamp based on it |
| CN113054066A (en) * | 2021-03-12 | 2021-06-29 | 京东方科技集团股份有限公司 | Display panel and display device |
-
2006
- 2006-02-24 CN CNA2006100580248A patent/CN101026210A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108561764A (en) * | 2018-03-21 | 2018-09-21 | 厦门市三安光电科技有限公司 | LED filament structure and LED illumination lamp based on it |
| CN108561764B (en) * | 2018-03-21 | 2019-11-22 | 厦门市三安光电科技有限公司 | LED filament structure and LED illumination lamp based on it |
| CN113054066A (en) * | 2021-03-12 | 2021-06-29 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN113054066B (en) * | 2021-03-12 | 2022-12-09 | 京东方科技集团股份有限公司 | Display panel and display device |
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