CN101026152B - Light-emitting device - Google Patents
Light-emitting device Download PDFInfo
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- CN101026152B CN101026152B CN2006101722212A CN200610172221A CN101026152B CN 101026152 B CN101026152 B CN 101026152B CN 2006101722212 A CN2006101722212 A CN 2006101722212A CN 200610172221 A CN200610172221 A CN 200610172221A CN 101026152 B CN101026152 B CN 101026152B
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- light
- emitting device
- luminescence component
- assembly
- correction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Abstract
This invention relates to an illuminant device including a loading component for connecting No.2 body of a supply, an illuminant component set on the loading component and connected with the No.2 body and at least a modifying component connected with the illuminant component, which is used in providing light source after the No.2 body is connected with the supply and has the character of temperature compensation, voltage modification or sudden wave absorption.
Description
Technical field
The present invention relates to a kind of light-emitting device, relate in particular to a kind of light-emitting device that temperature-compensating, voltage correction and surging absorb effect that has.
Background technology
Lighting is the necessity during the modern lives always, and the electric power that the whole world is used to throw light on is about 40% of total electricity consumption, and visible people are for the demand of illumination.In recent years, with white light-emitting diode (LED) bulb that the optoelectronic semiconductor technology is made, it is little because of specifically amassing, power consumption is economized, long advantage of life-span, is expected to replace tungsten lamp and mercury vapor lamp in 21st century, becomes the lighting source that has power saving and environmental protection notion concurrently.And in the past over more than 20 year, for the exploitation of light-emitting diode, made the light-emitting diode output value of China be only second to Japan and occupy the second in the world, hence one can see that, and light-emitting diode occupies critical role in photoelectric field.
With the alternating-current light emitting diode (AC LED) developed now is example, it is formed (being about 30 to 100 luminous microtubule cores) by the luminous microtubule core of majority, and lighting in the process after bestowing power supply, it can produce heat energy because of the light source that is sent, and then make temperature raise, cause the original electric current and voltage of this alternating-current light emitting diode (V-I) characteristic curve to produce shift phenomenon, as shown in Figure 1, L1 is the volt-ampere characteristic curve of temperature when T1, and when temperature rises to T2, can make volt-ampere characteristic curve be offset to position as L2, if like this, can cause voltage to reduce, and under the operation of decide voltage, more can make operand power rising even be a times; In addition, because of the tube core manufacture method control acceptance rate of alternating-current light emitting diode is lower, the power supply that can make each produced alternating-current light emitting diode use mostly is different, and when deciding the voltage use, then can cause the problem of illuminating source inequality; Moreover, under the situation that power supply was supplied with in moment, can produce pulse signal, and then the thing that alternating-current light emitting diode burns easily takes place.
So, how a kind of light emitting diode construction that temperature-compensating, voltage correction and surging absorb that has is provided, becoming in fact has problem to be solved in the opto-electronics.
Summary of the invention
Prior art problems the object of the present invention is to provide a kind of light-emitting device with at least one function in temperature-compensating, voltage correction and the surging absorption in view of the above.
In addition, the present invention discloses a kind of light-emitting device, it comprises the bearing assembly that is provided with two electric conductors that are used to connect power supply, the luminescence component that is arranged on this bearing assembly and electrically connects with this two electric conductor, and at least one and the correction assembly of this luminescence component electric connection.
Than prior art, the invention provides at least one effect at least one correction temperature-compensating that assembly had, voltage correction and the surging absorption.
Description of drawings
Fig. 1 is a curve synoptic diagram, the existing characteristic shift phenomenon of baroluminescence diode voltage electric current (V-I) of its expression;
The 2nd figure is a structural representation, the structure aspect of first embodiment of its expression light-emitting device of the present invention;
The 3rd (A) figure is a structural representation, the structure aspect of the luminescence component of first embodiment in its expression light-emitting device of the present invention;
The 3rd (B) figure is a schematic equivalent circuit, the equivalent electric circuit of the luminescence component of first embodiment in its expression light-emitting device of the present invention;
The 3rd (C) figure is a schematic equivalent circuit, and the luminescence component in its expression light-emitting device of the present invention is first equivalent electric circuit that example is connected with the correction assembly with the alternating-current light emitting diode;
The 3rd (D) figure is a schematic equivalent circuit, and the luminescence component in its expression light-emitting device of the present invention is second equivalent electric circuit that example is connected with the correction assembly with the alternating-current light emitting diode;
The 3rd (E) figure is a schematic equivalent circuit, luminescence component in its expression light-emitting device of the present invention and correction assembly equivalent electric circuit in parallel;
The 3rd (F) figure is a schematic equivalent circuit, and the luminescence component in its expression light-emitting device of the present invention is connected and equivalent electric circuit in parallel with the correction assembly;
Fig. 4 is a structural representation, the structure aspect of second embodiment of its expression light-emitting device of the present invention;
The 5th (A) figure is a structural representation, the luminescence component of second embodiment in its expression light-emitting device of the present invention and the structure aspect of revising after assembly electrically connects;
The 5th (B) figure is a schematic equivalent circuit, the luminescence component of second embodiment in its expression light-emitting device of the present invention and the equivalent electric circuit of revising after assembly electrically connects;
Fig. 6 is a structural representation, the structure aspect of the 3rd embodiment of its expression light-emitting device of the present invention;
The 7th (A) and 7 (B) figure are structural representation, the electric connection mode of luminescence component, correction assembly and the substrate of the 3rd embodiment in its expression light-emitting device of the present invention;
The 7th (C) figure is a schematic equivalent circuit, the equivalent electric circuit of the electric connection mode of luminescence component, correction assembly and the substrate of the 3rd embodiment in its expression light-emitting device of the present invention;
Fig. 8 is a structural representation, the structure aspect of the 4th embodiment of its expression light-emitting device of the present invention;
The 9th (A) and 10 (A) figure are structural representation, the electric connection mode of luminescence component, correction assembly and the substrate of the 4th embodiment in its expression light-emitting device of the present invention; And
The 9th (B) figure and 10 (B) figure are schematic equivalent circuit, the equivalent electric circuit of the electric connection mode of luminescence component, correction assembly and the substrate of the 4th embodiment in its expression light-emitting device of the present invention.
The element numbers simple declaration:
1 light-emitting device
10 bearing assemblies
100 and 101 electric conductors
11 luminescence components
110 and S1～S7 alternating-current light emitting diode tube core
12 revise assembly
13 substrates
14 conducting wires
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention, those skilled in the art can understand other advantage of the present invention and function easily by the content that this specification disclosed.The present invention also can be implemented or be used by other different specific embodiment, and the every details in this specification also can be based on different viewpoints and application, carries out various modifications and change under the spirit of the present invention not deviating from.
(B, 6,7 (A) is to shown in 7 (C), 8,9 (A) and 9 (B), 10 (A) and 10 (B) figure as the 2nd, 3 (A) and 3 (B), 3 (C) and 3 (D), 3 (E) and 3 (F), 4,5 (A) and 5, correlative type for light-emitting device of the present invention, to describe the preferred embodiment of narration light-emitting device of the present invention with graphic like this cooperation in detail.Wherein, it is noted that the described graphic schematic diagram that is simplification only illustrates the embodiments of the invention structure in a schematic way.Therefore, only show the assembly relevant described in graphic with the present invention, and shown assembly be not number when implementing, shape with reality, and dimension scale etc. drawn, number, shape and dimension scale during its actual enforcement is a kind of optionally design, and its assembly layout form may be more complicated, illustrates earlier at this.
At first, shown in the 2nd figure, be the first example structure schematic diagram of light-emitting device 1 of the present invention, it comprises that bearing assembly 10, luminescence component 11 and at least one revise assembly 12, below aforementioned each object of being disclosed at light-emitting device 1 of the present invention respectively be elaborated.
This bearing assembly 10 is provided with two electric conductors 100 and 101, and this two electric conductor 100 and 101 is used to connect power supply, and the preferred implementation of this bearing assembly 10 is a carrier; This two electric conductor 100 and 101 is formed by lead frame (Lead Frame).
This luminescence component 11 is arranged on this bearing assembly 10, and electrically connect with this two electric conductor 100 and 101, and be used for after this two electric conductor 100 and 101 connects power supply, providing light source, and this luminescence component 11 can be embodied as a plurality of alternating-current light emitting diodes (AC LED) tube core or a plurality of direct current light-emitting diode (DC LED) tube core, shown in the 3rd (A) figure, with unidirectional direct current LED core 110 is example, this direct current LED core 110 is an individual layer luminescence component structure at present embodiment, but also can be double-deck luminescence component structure.In addition, this luminescence component 11 has single wavelength or at least two wavelength, that is to say, the glow color of this luminescence component can be monochrome or polychrome.Moreover the light source that this luminescence component 11 is provided behind the connection power supply can be embodied as visible light or invisible light (as ultraviolet light or infrared light).
This at least one correction assembly 12 electrically connects with this luminescence component 11, and be used for after this luminescence component 11 connects power supply, this luminescence component 11 temperature-compensatings are provided, at least one effect during voltage correction and surging absorb, by among Fig. 2 as can be known, this at least one correction assembly 12 is to electrically connect with ad hoc fashion and this luminescence component 11, this ad hoc fashion is that this correction assembly 12 is arranged at earlier on the set electric conductor 100 of this bearing assembly 10, and this luminescence component 11 and this correction assembly 12 are formed series connection (shown in the equivalent electric circuit of the 3rd (B) figure) on current circuit by the routing mode, when power supply is supplied, make this correction assembly 12 produce temperature-compensating thus, at least one effect during voltage correction and surging absorb.And the preferred implementation of this correction assembly 12 is the assembly of the two at least in temperature compensation component or voltage correction assembly or surging absorbent assembly or tool temperature-compensating, voltage correction and the surging absorption function.
Moreover, shown in the 3rd (C) and 3 (D) figure, for being the equivalent circuit diagram of example with the alternating-current light emitting diode tube core.In 3 (C) figure, have at least two alternating-current light emitting diode tube core S1 and S2 reverse parallel connection and join, when bright as if this S1 alternating-current light emitting diode tube core, then this S2 alternating-current light emitting diode tube core does not work, and vice versa.In 3 (D) figure, having at least five alternating-current light emitting diode tube core S3, S4, S5, S6 and S7 joins, when if this S5, S7 and S4 alternating-current light emitting diode tube core are bright, then this S3 and S6 alternating-current light emitting diode tube core do not work, otherwise, if when this S3, S7 and S6 alternating-current light emitting diode tube core were bright, then this S5 and S4 alternating-current light emitting diode tube core did not work.
Wherein, if when this corrections assembly 12 is embodied as single temperature compensation component, then can be the effect that this luminescence component 11 provides temperature-compensating, and the polarity of temperature compensation component institute tool temperature coefficient is decided on the actual state that institute's desire compensates; If this luminescence component 11 when temperature raises under constant voltage supply, can turn left to be offset because of volt-ampere characteristic curve causes the electric current rising (to rise to I2 by I1, shown in Figure 1 as Fig. 1), then can be embodied as the impedance-compensated assembly impedance of positive temperature coefficient rises and can revise the volt-ampere characteristic curve shift phenomenon of turning left, if this luminescence component 11 is when temperature reduces, can be because of the volt-ampere characteristic curve skew of turning right cause electric current to reduce, be embodied as the impedance-compensated assembly impedance of negative temperature coefficient and descend and can revise the volt-ampere characteristic curve shift phenomenon of turning right.
Wherein, when if this correction assembly 12 is embodied as single voltage correction assembly, then can be this luminescence component 11 provides the effect of voltage correction, the effect of this voltage correction is to avoid that the tube core manufacture method control acceptance rate because of this luminescence component 11 is lower makes produced applied power source mostly be different (the driving bias voltage of luminescence component 11), if when deciding the voltage use, cause produces the problem of illuminating source inequality with current difference between batch assembly.And this voltage correction assembly can be embodied as resistance, electric capacity, inductance or other can absorb the assembly of pressure drop.
Wherein, when if this correction assembly 12 is embodied as single surging absorbent assembly, then can be the effect that this luminescence component 11 provides surging to absorb, the effect that this surging absorbs is to avoid power supply under the situation of moment supply, the pulse signal of meeting because of being produced, the thing that causes luminescence component 11 to be burnt, this moment, this luminescence component 11 formed state in parallel with this correction assembly 12 on current circuit, and its equivalent circuit diagram is shown in the 3rd (E) figure.And this voltage correction assembly can be embodied as piezo-resistance, electric capacity, Zener diode (Zener) or the made assembly of piezoresistive material (as ZnO).
Wherein, when if this correction assembly 12 is embodied as the two assembly at least in tool temperature-compensating, voltage correction and the surging absorption function, the effect that it produced is as above-mentioned, and it can be connected and state in parallel by the while tool with the electric connection of this luminescence component 11, shown in the 3rd (F) figure, repeat no more in this.
In addition, shown in the 4th and 5 (A) figure, the second example structure schematic diagram for light-emitting device of the present invention, this second embodiment is as first embodiment, comprise bearing assembly 10, luminescence component 11 and at least one correction assembly 12, and the effect of those assemblies and execution mode repeat no more in this described in first embodiment; Wherein, shown in the 5th (A) figure, can find out that second embodiment and the difference of first embodiment only are the mode that electrically connects different (ad hoc fashions of indication among first embodiment), at least one revises assembly 12 earlier by after being arranged on this luminescence component 11 as crystal type of heap of stone among second embodiment this, again behind routing, as Fig. 4, (TOP CHIP packaged type) is packaged as a whole.Its equivalent electric circuit is shown in the 5th (B) figure.
Again as shown in Figure 6, the 3rd example structure schematic diagram for light-emitting device of the present invention, this the 3rd embodiment comprises bearing assembly 10, luminescence component 11 and at least one correction assembly 12 as first and two embodiment, and the effect of those assemblies and execution mode repeat no more in this described in first and two embodiment; As shown in the figure, the difference that can find out the 3rd embodiment and first and two embodiment is that the 3rd embodiment also comprises substrate 13, this substrate 13 is used to connect this luminescence component 11 (covering crystalline substance), and the electric connection mode (ad hoc fashion of preceding finger) of at least one the correction assembly 12 among this embodiment can be implemented respectively shown in the 7th (A) and 7 (B) figure.
Wherein, shown in the 7th (A) figure, the electric connection mode of this at least one correction assembly 12 is engaged in this substrate 13 for this at least one correction assembly 12, and (among the figure, being formed with many conducting wires 14 on this substrate 13) more as shown in Figure 6 is packaged as a whole with this luminescence component 11.Shown in the 7th (B) figure, the electric connection mode of this at least one correction assembly 12 is packaged as a whole with this luminescence component 11 more as shown in Figure 4 for this at least one correction assembly 12 is made in earlier on this substrate 13.Above-mentioned equivalent electric circuit is shown in the 7th (C) figure.Shown in the 6th figure, this substrate 13 is arranged on this bearing assembly 10.
Again as shown in Figure 8, the 4th example structure schematic diagram for light-emitting device of the present invention, this the 4th embodiment is as first and second and three embodiment, comprise bearing assembly 10, luminescence component 11 and at least one correction assembly 12, and described in the effect of those assemblies and execution mode such as first and second and three embodiment, repeat no more in this; As shown in the figure, can find out that the 4th embodiment is the 4th embodiment with the difference of first and second and three embodiment and is used to be connected the substrate 13 of this luminescence component 11 (covering crystalline substance) except that comprising, this at least one revise assembly 12 electric connection mode (ad hoc fashion of preceding finger) also different (shown in the 9th (A) and 10 (A) figure).Shown in the 8th figure, this substrate 13 is arranged on this bearing assembly 10.
Wherein, shown in the 9th (A) figure, the electric connection mode of this at least one correction assembly 12 is that this at least one correction assembly 12 is formed on the conducting wire (as label 14) on the substrate 13 earlier, be packaged as a whole with this luminescence component 11 as shown in Figure 8 again, and the equivalent electric circuit of the 9th (A) figure is shown in the 9th (B) figure.Shown in the 10th (A) figure, the electric connection mode of this at least one correction assembly 12 is arranged at earlier on this luminescence component 11 with crystal type of heap of stone for this at least one correction assembly 12, be arranged at again on this substrate 13 and be packaged as a whole as shown in Figure 4, and the equivalent electric circuit of the 10th (A) figure is shown in the 10th (B) figure.And employed encapsulating material can be embodied as metal or nonmetal in aforementioned all encapsulation, the material that aforementioned components can be packaged as a whole as glass-ceramic resin or transparent plastic etc.
By preceding addressing graphic performance, can be well understood to the mode of technical characterictic of the present invention and enforcement thereof, it mainly is the correction assembly that electrically connects by at least one and this luminescence component, provide this luminescence component after light-emitting device of the present invention connects power supply, has temperature-compensating, at least one effect during voltage correction and surging absorb, if the same time, three's effect has concurrently, not only can avoid causing the problem (power is controlled at certain safe range) of electric current that current/voltage skew caused and power rising because of variations in temperature, more can solve because of luminescence component tube core manufacture method control acceptance rate lower, and when deciding the voltage use, the problem of the illuminating source inequality that causes, relatively, for manufacturer and Yan Zeke reach the different tube core fair curve of bias voltage can shipment at the same level to promote the function of shipment acceptance rate, in addition, more under the situation that can supply with in power supply moment, absorb the pulse signal (opposing power surging) that power supply produced, make that light-emitting device of the present invention is unlikely to be burnt.
The above embodiments only are illustrative principle of the present invention and function thereof, but not are used to limit the present invention.Any those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is modified and changed.Therefore, the scope of the present invention, the claim scope is listed as described later.
Claims (24)
1. light-emitting device includes:
Bearing assembly, it is provided with two electric conductors, and this two electric conductor is used to connect power supply;
Luminescence component, it is arranged on this bearing assembly, and electrically connects with this two electric conductor, and is used for providing light source after this two electric conductor connects power supply; And
Revise assembly, be single temperature compensation component, it electrically connects with series system and this luminescence component, and be used for after this luminescence component connects power supply, the effect of this luminescence component temperature-compensating is provided, wherein, this luminescence component is a plurality of alternating-current light emitting diode tube cores or a plurality of direct current LED core.
2. light-emitting device according to claim 1, wherein, this bearing assembly is a carrier.
3. light-emitting device according to claim 1, wherein, this two electric conductor is to be formed by lead frame.
4. light-emitting device according to claim 2, wherein, this luminescence component is the alternating-current light emitting diode tube core of a plurality of series connection or the direct current LED core of a plurality of series connection.
5. light-emitting device according to claim 1, wherein, this luminescence component has two alternating-current light emitting diode tube core reverse parallel connections at least and joins.
6. light-emitting device according to claim 1, wherein, this luminescence component has five alternating-current light emitting diode tube cores at least and joins.
7. light-emitting device according to claim 1, wherein, this luminescence component has single wavelength.
8. light-emitting device according to claim 1, wherein, this luminescence component has at least two wavelength.
9. light-emitting device according to claim 1, wherein, this luminescence component is a visible light in that the light source that is provided behind the power supply is provided.
10. light-emitting device according to claim 1, wherein, this luminescence component is an invisible light in that the light source that is provided behind the power supply is provided.
11. light-emitting device according to claim 1, wherein, this temperature compensation component is the impedance-compensated assembly of positive temperature coefficient.
12. light-emitting device according to claim 1, wherein, this temperature compensation component is the impedance-compensated assembly of negative temperature coefficient.
13. light-emitting device according to claim 11 also comprises voltage correction assembly.
14. light-emitting device according to claim 13, wherein, this voltage correction assembly is for absorbing the assembly of pressure drop.
15. light-emitting device according to claim 1 also comprises the surging absorbent assembly.
16. light-emitting device according to claim 1 wherein, also is provided with substrate on this bearing assembly.
17. light-emitting device according to claim 16, wherein, this correction assembly is to electrically connect with ad hoc fashion and this luminescence component, and this ad hoc fashion is meant this correction assembly, is engaged in this substrate earlier and is packaged as a whole with this luminescence component.
18. light-emitting device according to claim 16, wherein, this correction assembly is to electrically connect with ad hoc fashion and this luminescence component, and this ad hoc fashion is meant that this correction establishment of component is packaged as a whole with this luminescence component again on this substrate.
19. light-emitting device according to claim 16, wherein, this correction assembly is to electrically connect with ad hoc fashion and this luminescence component, and this ad hoc fashion is meant that this correction assembly is formed at the conducting wire on this substrate earlier, is packaged as a whole with this luminescence component again.
20. light-emitting device according to claim 16, wherein, this correction assembly is to electrically connect with ad hoc fashion and this luminescence component, and this ad hoc fashion is meant that this corrections assembly is arranged on this luminescence component and is packaged as a whole to build crystal type.
21. light-emitting device according to claim 16, wherein, this correction assembly is to electrically connect with ad hoc fashion and this luminescence component, and this ad hoc fashion is meant that this corrections assembly is arranged on this luminescence component to build crystal type, is arranged on this substrate again and is packaged as a whole.
22. light-emitting device according to claim 16, wherein, this luminescence component and correction assembly are arranged on this substrate, and this substrate is arranged on this bearing assembly.
23. light-emitting device according to claim 16, wherein, this luminescence component is to be arranged on this substrate to cover brilliant structure.
24. light-emitting device according to claim 1, wherein, this correction assembly is arranged on this luminescence component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101722212A CN101026152B (en) | 2005-12-23 | 2006-12-25 | Light-emitting device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510135136.4 | 2005-12-23 | ||
| CN200510135136 | 2005-12-23 | ||
| CN2006101722212A CN101026152B (en) | 2005-12-23 | 2006-12-25 | Light-emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101026152A CN101026152A (en) | 2007-08-29 |
| CN101026152B true CN101026152B (en) | 2011-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2006101722212A Active CN101026152B (en) | 2005-12-23 | 2006-12-25 | Light-emitting device |
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| CN (1) | CN101026152B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2067034U (en) * | 1989-10-18 | 1990-12-05 | 姚福来 | Light emitting diode |
| CN2620959Y (en) * | 2003-03-07 | 2004-06-16 | 赵文兴 | New lamp body control and protective return for luminous diode |
| CN2657203Y (en) * | 2003-09-01 | 2004-11-17 | 光鼎电子股份有限公司 | Luminous diode packaging device with rectification circuit |
| CN1682381A (en) * | 2002-09-30 | 2005-10-12 | 丰田合成株式会社 | White light emitting device |
| CN1703121A (en) * | 2004-05-22 | 2005-11-30 | 株式会社半导体能源研究所 | Display device and electronic device |
-
2006
- 2006-12-25 CN CN2006101722212A patent/CN101026152B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2067034U (en) * | 1989-10-18 | 1990-12-05 | 姚福来 | Light emitting diode |
| CN1682381A (en) * | 2002-09-30 | 2005-10-12 | 丰田合成株式会社 | White light emitting device |
| CN2620959Y (en) * | 2003-03-07 | 2004-06-16 | 赵文兴 | New lamp body control and protective return for luminous diode |
| CN2657203Y (en) * | 2003-09-01 | 2004-11-17 | 光鼎电子股份有限公司 | Luminous diode packaging device with rectification circuit |
| CN1703121A (en) * | 2004-05-22 | 2005-11-30 | 株式会社半导体能源研究所 | Display device and electronic device |
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| Publication number | Publication date |
|---|---|
| CN101026152A (en) | 2007-08-29 |
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