CN101024485B - Method for making surface plasma micro-nano structure - Google Patents
Method for making surface plasma micro-nano structure Download PDFInfo
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- CN101024485B CN101024485B CN2007100646911A CN200710064691A CN101024485B CN 101024485 B CN101024485 B CN 101024485B CN 2007100646911 A CN2007100646911 A CN 2007100646911A CN 200710064691 A CN200710064691 A CN 200710064691A CN 101024485 B CN101024485 B CN 101024485B
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Abstract
The invention supplies a method to make surface plasma microstructure by using wet corrosion method. It includes the following steps: adopting corrosion material as base, coating masking film on the surface of base, coating photoresist on the masking film surface, and making graphics by adopting photo-etching technology; taking corrosion in corrosion liquid; after the base material connecting masking film no longer, stopping corrosion and remove the masking layer and photo-etching layer to gain base template with nanometer line; using the template to make surface plasma microstructure. The method could be widely used in making large area, small line width and random structure.
Description
Technical field
The present invention relates to a kind of plasma photoetching template forming method, specifically a kind of wet corrosion technique that utilizes is made localization surface plasma photoetching template, and further obtains the method for surface plasma micro-nano structure.
Background technology
In recent years, along with developing rapidly of micro-nano process technology and nano material, the electromagnetic property of micro-nano metal structure is just receiving increasing concern.The interaction of light and surperficial micro-nano metal structure has produced a series of new unusual physical phenomenons.For example, French scientist Ebbesen in 1998 and partner thereof find the unusual enhancing phenomenon (Extraordinary Optical Transmission) by the light of sub-wavelength metallic hole array.People's such as H.J.Lezec research further shows: when light transmission sub-wavelength metal nano-pore, its transmitance not only can be enhanced, and the angle of diffraction of light beam is very little, and the diffraction law in the common dielectric medium structure is not followed in transmission direction.In addition, relevant new phenomenon with the surface plasma metal micro-nanostructure also has: after the metal micro structure effect of light and special distribution, occur along the characteristic of left hand rule propagation, illustrative material has negative index; Light is by behind the special metal nano-pore structure, and the light wave outgoing has fabulous directionality or the like.The research of micro-nano metal structure surface plasma wave has formed a new field.Novel surface plasma technique based on the micro-nano metal structure can be widely used in a plurality of fields such as military affairs, medical treatment, national security.
The shaping of micro-nano metal structure is the basis of surface plasma experimental study and application.The shaping of realization micro-nano metal structure is for the surface plasma experimental study and use significant.Because it is sub-micron even nanoscale that surface plasma micro-nano metal structure requires live width, therefore adopt conventional microlithography technology can't realize.At present, surface plasma micro-nano metal structure mainly adopts straight write device such as electron beam, ion beam to process, but this method processing method not only needs expensive process equipment, and the micro-nano structure area of making is difficult to break through 200 microns.Next adopts self-assembling technique also can make nano level structure, and structural area also can do greatly, but self-assembling technique can only be made lattice array, is difficult to make the micro-nano structure of linear array, ring array and other non-array.This gives and to need that large tracts of land, fine rule are wide, the experimental study and the Preliminary Applications of the surface plasma of arbitrary structures have been brought very big problem.
Summary of the invention
The technical problem to be solved in the present invention is to solve the deficiencies in the prior art, and a kind of method that realizes that large tracts of land, any lines graphic structure, the wide surface of fine rule make surface plasma micro-nano structure is provided.
The technical solution adopted for the present invention to solve the technical problems may further comprise the steps:
The selective etching material is as substrate;
Plate mask membrane layer at described substrate material surface;
Coat photoresist at described mask membrane layer material surface, and according to the lines distribution situation in the object construction, adopt photoetching process to make described photoresist and mask membrane layer graphical;
The substrate that will have patterned mask membrane layer and photoresist layer is placed in the wet etching liquid corrodes;
Base material does not have when connection with mask membrane layer, stops corrosion, removes the mask membrane layer and the photoresist layer of substrate material surface, obtains to have the substrate template of nanometer line;
Utilize described substrate template to make surface plasma micro-nano structure.
Described corrosion material is glass, quartz, silicon or germanium.
Described mask membrane layer is a metal level.
Method by evaporation plates mask membrane layer at described substrate material surface.
Method by spin coating is coated photoresist at described mask membrane layer material surface.
The described method of utilizing described substrate template to make surface plasma micro-nano structure is: with the described substrate that has nanometer line is that template is carried out moulding replication, obtains nano level lines and distributes.
The described method of utilizing described substrate template to make surface plasma micro-nano structure is: with described substrate template surface coating light absorbent, only make the most advanced and sophisticated printing opacity of micro-structural of substrate template, be coated with metal material at another piece substrate material surface, layer on surface of metal coating photoresist is that mask plate exposes on the photoresist surface with the substrate template; After exposure, development are finished, remove the metal that exposes, wash photoresist, obtain the suitable metal wire structure of micro-structural tip size with the substrate template.
The present invention compared with prior art has the following advantages:
1. adopt wet method to realize micro-nano structure processing, therefore do not need expensive electron beam and the straight write device of FIB can produce sub-micron even nano level linear, the area of micro-nano structure can reach the hundreds of millimeter.
2. the micro-nano structure figure of Cheng Xinging can be annular, linear and arbitrary curve, and figure can be array arrangement, also can be irregular arranging; Micro-nano structure can be a metal structure, also can nonmetal structure.
3. except having the ability of making the high-freedom degree microstructure graph, the micro-nano structure template that wet method is made combines with duplication process or photoetching process, can greatly reduce the cost of manufacture of micro-structural.
4. can be used for the being shaped surface plasma micro-nano metal structure of various functions is for surface plasma experimental study and application provide approach.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the annular surface plasma micro-nano metal structure vertical view that will make among the embodiment one.2000 microns in greatest circle collar extension footpath, minimum feature 10 nanometers.
Fig. 2 is the annular surface plasma micro-nano metal structure profile that will make among the embodiment one.
Fig. 3 has the K9 substrate of glass of 100 nanometer chromium layers for evaporation.
Fig. 4 is after overexposure, developing, and obtains patterned photoresist lines structure and crome metal linear behind the corrosion that dechromises.
Fig. 5 is K9 substrate of glass certain intermediateness in wet etching course that has photoresist lines and crome metal lines.
Fig. 6 no longer is connected with metallic chromium layer for the K9 substrate of glass, stops the micro-nano structure of the K9 glass material that obtains behind the wet etching.
Fig. 7 carries out reproduction process for the K9 glass template that adopts wet method to make.
Fig. 8 carries out the structure that has micro-nano annular lines that obtains behind the moulding replication for adopting K9 glass wet etching template.
Fig. 9 is the otherwise rectilinear, surface plasma micro-nano metal structure vertical view that will make among the embodiment two.Minimum feature 10 nanometers.
Figure 10 is the otherwise rectilinear, surface plasma micro-nano metal structure profile that will make among the embodiment two.
Figure 11 is the micro-nano structure that stops the K9 glass material to obtain behind the wet etching.
Figure 12 is the micro-structural after micro-structure surface coating resistance luminescent material, and micro-structural is only at most advanced and sophisticated printing opacity.3 represent K9 glass material structure.
Figure 13 exposes as mask for adopting the micro-nano structure that is coated with the resistance luminescent material, and 1 represents the object construction base material among the figure.
Figure 14 is for also adopting the liquid that dechromises to remove the nano level metal narrow slit structure that obtains behind the crome metal that exposes through exposure imaging.
The specific embodiment
Embodiment one is by method making of the present invention bore φ=2000 μ m as depicted in figs. 1 and 2, the surface plasma endless metal structure of line thickness h=10nm, and 1 represents base material among the figure.2 represent the linear material, and the linear material among the embodiment one is the moulding replication material.Its manufacturing process is as follows:
1) at first select K9 glass 1 as base material; The corrosion rate of K9 glass is very fast, and material price is cheap, also can select other corrosion materials to do substrate as required, for example the glass of quartz, silicon, germanium or other types;
2) at the mask membrane layer crome metal Cr of K9 glass substrate material 1 surperficial evaporation one deck 100nm, section as shown in Figure 3,3 represent K9 glass among the figure, 4 represent metallic chromium layer;
3) at metallic diaphragm material surface spin coating photoresist S1830,1 micron of thickness, and photoresist exposed, obtain the photoresist lines in the relevant position, adopt the liquid that dechromises to remove the crome metal that exposes then, make photoresist and metallic diaphragm graphical, section as shown in Figure 4,5 represent photoresist layer among the figure;
4) substrate that will have patterned metallic diaphragm and a photoresist layer is placed in the HF corrosive liquid and corrodes.The corrosion intermediateness as shown in Figure 5;
5) in the corrosion process, K9 glass material below the metallic diaphragm is constantly fallen by sideetching, the K9 glass material of being covered by metal constantly attenuates, when the K9 glass material does not have when connection with the masking layer metal, stop corrosion, remove the metal level and the photoresist layer on surface, can obtain the line thickness of tens nanometers even several nanometers, section as shown in Figure 6;
6) be that template is carried out moulding replication with the substrate that has nanometer line, can obtain nano level lines distributes, mold process is seen shown in the accompanying drawing 7, section is as shown in Figure 8 as a result in mold pressing, 1 represents the object construction base material among the figure, 2 represent the object construction wire member, and 3 is K9 glass wet etching template.
The embodiment of the invention two is to make a photoresist straight line line array as Fig. 9 and live width 50 nanometers shown in Figure 10, and 1 represents base material in the picture in picture.2 represent linear metal material chromium.Process is as follows:
1) select K9 glass as mould material;
2) at K9 glass substrate material surface evaporation one deck 100nm mask membrane layer crome metal Cr;
3) at metallic diaphragm material surface spin coating photoresist S1830,1 micron of thickness exposes to photoresist, obtains the photoresist lines in the relevant position, adopts the liquid that dechromises to remove the crome metal that exposes then, makes photoresist and metallic diaphragm graphical;
4) substrate that will have patterned metallic diaphragm and a photoresist layer is placed in the HF corrosive liquid and corrodes;
5) in the corrosion process, base material below the metallic diaphragm is constantly fallen by sideetching, the base material of being covered by metal constantly attenuates, when having when connection, base material and masking layer metal do not stop corrosion, remove the metal level and the photoresist layer on surface, can obtain the line thickness of tens nanometers even several nanometers, section as shown in Figure 11,3 represent K9 glass material structure among the figure;
6) with the most of zone coating in micrographics surface light absorbent, only make the most advanced and sophisticated printing opacity of micro-structural, section as shown in Figure 12, the resistance luminescent material of micro-structure surface is coated in 6 representatives among the figure;
7) be coated with metal material chromium at another piece substrate material surface, and apply 20 nano-photoetching glue at the chromium laminar surface, be that mask plate exposes on the resist surface at last with the micro-structural, exposure process as shown in figure 13,2 represent metallic chromium layer among the figure, 3 represent K9 glass material micro-nano structure, and the resistance luminescent material of micro-nano structure surface is coated in 6 representatives, and the photoresist layer on metallic chromium layer surface is coated in 7 representatives;
8) after exposure, development are finished, adopt the liquid that dechromises to remove the crome metal that exposes.Wash photoresist at last, can obtain the metal wire structure suitable with the micro-structural tip size, section as shown in Figure 14,1 represents the object construction base material among the figure, 2 represent metallic chromium layer.
Claims (6)
1. make the method for surface plasma micro-nano structure, may further comprise the steps:
The selective etching material is as substrate;
Plate mask membrane layer at described substrate material surface;
Coat photoresist at described mask membrane layer material surface, and according to the lines distribution situation in the object construction, adopt photoetching process to make described photoresist and mask membrane layer graphical;
The substrate that will have patterned mask membrane layer and photoresist layer is placed in the wet etching liquid corrodes;
Base material does not have when connection with mask membrane layer, stops corrosion, removes the mask membrane layer and the photoresist layer of substrate material surface, obtains to have the substrate template of nanometer line;
Utilize described substrate template to make surface plasma micro-nano structure, the specific implementation method is: with described substrate template surface coating light absorbent, only make the most advanced and sophisticated printing opacity of micro-structural of substrate template, be coated with metal material at another piece substrate material surface, layer on surface of metal coating photoresist is that mask plate exposes on the photoresist surface with the substrate template; After exposure, development are finished, remove the metal that exposes, wash photoresist, obtain the suitable metal wire structure of micro-structural tip size with the substrate template.
2. the method for making surface plasma micro-nano structure according to claim 1 is characterized in that, described corrosion material is glass, quartz, silicon or germanium.
3. the method for making surface plasma micro-nano structure according to claim 1 is characterized in that, described mask membrane layer is a metal level.
4. the method for making surface plasma micro-nano structure according to claim 1 is characterized in that, the method by evaporation plates mask membrane layer at described substrate material surface.
5. the method for making surface plasma micro-nano structure according to claim 1 is characterized in that, coats photoresist by the method for spin coating at described mask membrane layer material surface.
6. the method for making surface plasma micro-nano structure according to claim 1, it is characterized in that, the described method of utilizing described substrate template to make surface plasma micro-nano structure is: with the described substrate that has nanometer line is that template is carried out moulding replication, obtains nano level lines and distributes.
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| CN101024485B true CN101024485B (en) | 2010-12-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856165A (en) * | 2012-09-10 | 2013-01-02 | 中国科学院物理研究所 | Method for simply preparing ordered V-shaped nanometer silicon pore array |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101794072B (en) * | 2010-01-15 | 2012-02-15 | 中国科学技术大学 | Method for preparing substrate with nano structure with line width below 20 nanometers |
| CN104495742B (en) * | 2014-12-15 | 2017-03-22 | 北京大学 | Process for processing surface plasmon polariton coupled nano array based on scallop effect |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001015427A (en) * | 1999-04-30 | 2001-01-19 | Fuji Photo Film Co Ltd | Formation of fine pattern |
| JP2004051432A (en) * | 2002-07-19 | 2004-02-19 | Fujitsu Ltd | Substrate for manufacturing carbon nanotube and method of manufacturing carbon nanotube using the same |
| CN1775658A (en) * | 2005-12-15 | 2006-05-24 | 中国科学院光电技术研究所 | Method for forming surface plasma micronano structure |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001015427A (en) * | 1999-04-30 | 2001-01-19 | Fuji Photo Film Co Ltd | Formation of fine pattern |
| JP2004051432A (en) * | 2002-07-19 | 2004-02-19 | Fujitsu Ltd | Substrate for manufacturing carbon nanotube and method of manufacturing carbon nanotube using the same |
| CN1775658A (en) * | 2005-12-15 | 2006-05-24 | 中国科学院光电技术研究所 | Method for forming surface plasma micronano structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856165A (en) * | 2012-09-10 | 2013-01-02 | 中国科学院物理研究所 | Method for simply preparing ordered V-shaped nanometer silicon pore array |
| CN102856165B (en) * | 2012-09-10 | 2015-06-03 | 中国科学院物理研究所 | Method for simply preparing ordered V-shaped nanometer silicon pore array |
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