CN101009982B - A method for making the ultra-thin smart handset - Google Patents

A method for making the ultra-thin smart handset Download PDF

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Publication number
CN101009982B
CN101009982B CN 200610003366 CN200610003366A CN101009982B CN 101009982 B CN101009982 B CN 101009982B CN 200610003366 CN200610003366 CN 200610003366 CN 200610003366 A CN200610003366 A CN 200610003366A CN 101009982 B CN101009982 B CN 101009982B
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China
Prior art keywords
pcb
setting
board
card holder
modules
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CN 200610003366
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Chinese (zh)
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CN101009982A (en
Inventor
杨振峰
邹林波
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上海毅仁信息科技有限公司
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Priority to CN 200610003366 priority Critical patent/CN101009982B/en
Publication of CN101009982A publication Critical patent/CN101009982A/en
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Publication of CN101009982B publication Critical patent/CN101009982B/en

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Abstract

The provided manufacture method for ultrathin intelligent mobile phone comprises: (1) arranging a LCD display module included a hand-write board and a cell module oppositely, and a supporting steel board between two modules; (2) setting a RF and a baseband modules on two surfaces of a first PCB main board; (3) setting the antenna on bottom of the phone body; and (4) setting the T-flash card holder and SIM card holder on the second PCB board, and using a connector to connect two PCB boards. Besides, it also comprises: on phone body top, setting a camera and a receiver and an earphone jack in turns, a microphone under the phone body, and a flexible PCB circuit to connect all former members with the first PCB board. This invention holds all function of mobile phone, and meets people individual request.

Description

一种制造超薄智能手机的方法 A method for manufacturing ultra-thin smartphone

技术领域 FIELD

[0001] 本发明涉及一种制造超薄智能手机的方法。 [0001] The present invention relates to a method for producing an ultra thin smartphone. 背景技术 Background technique

[0002] 随着通信技术的迅猛发展,用户对所使用手机的功能需求越来越多,集多种功能于一身的智能手机应运而生。 [0002] With the rapid development of communication technology, mobile phone users are using more and more functional requirements, a multi-in-one smartphone came into being. 但是采用当前的智能手机制造方法所制出的手机虽然功能丰富,但体积庞大、厚度较厚,不便于随身携带使用。 But using the current method of manufacturing a smart phone manufactured by a feature-rich mobile phones though, but bulky, thicker, not easy to carry use. 因此如何能制造出同时具有丰富的功能和小巧的尺寸及较薄厚度的智能手机是急待解决的问题。 So how we can simultaneously create feature-rich and compact size and thickness of thin smartphone is pressing problem.

发明内容 SUMMARY

[0003] 本发明的目的是提供一种制造超薄智能手机的方法,其包括以下步骤: [0003] The object of the present invention is to provide a method of producing an ultra thin smart phone, comprising the steps of:

[0004] (1)彼此背面相对地设置含有手写板的液晶显示模块和电池模块,并在上述两模块之间设置一支撑钢板; [0004] (1) arranged opposite each other back surface of the liquid crystal display panel comprising a handwriting module and battery module, and a supporting plate disposed between said two modules;

[0005] (2)在第一PCB主板的两面上集中地设置射频模块与基带模块; [0005] (2) arranged centrally RF module and baseband modules on both sides of the first main PCB;

[0006] (3)在整个机身的最下端设置天线; [0006] (3) disposed at the lowermost end of the entire antenna body;

[0007] (4)在第二PCB板上集中设置Tf Iash卡卡座与SIM卡卡座,并通过连接器将所述第二PCB板与第一PCB主板相连。 [0007] (4) collectively set Tf Iash card holder SIM card holder in a second PCB board, and the second by a connector plate connected to the first PCB PCB board.

[0008] 根据本发明,所述制造方法还包括以下步骤,在整个机身的上端顺序设置摄像头、 接收器及耳机插孔,在机身的下端设置麦克风,并通过柔性印刷电路将上述部件与第一PCB 主板相连。 [0008] According to the invention, the method further comprising the step of setting the camera body at the upper end of the entire sequence, headphone jack and a receiver, disposed at the lower end of the microphone body, and through the flexible printed circuit with the above-described member The first is connected to the main PCB.

[0009] 根据本发明,所述制造方法进而以下步骤,采用金属材料制造所述手机的外壳上围绕液晶显示模块的部分和覆盖所述电池模块的部分。 [0009] According to the invention, the method further the step of using a portion of the display module and a cover portion surrounding the liquid crystal cell module on the housing of the mobile phone for producing a metal material.

[0010] 优选地,所述支撑钢板的厚度为0. 3mm。 [0010] Preferably, the support plate thickness of 0. 3mm.

[0011] 优选地,所述T-fIash卡卡座是只允许侧向插拔T-fIash卡的。 [0011] Preferably, the T-fIash card holder is to allow only a lateral plug T-fIash card.

[0012] 采用本发明的方法,可以制造出体积小,厚度薄,且未减少任何功能的超薄智能手机,满足了人们随身携带和使用智能手机的需求。 [0012] The method of the invention can be manufactured small in size, thin, and does not cut any thin smart phones, meet the people to carry and use demand for smart phones.

附图说明 BRIEF DESCRIPTION

[0013] 图1是示出了根据本发明方法制造的超薄智能手机的侧视图; [0013] FIG. 1 is a side view showing a thin smartphone manufactured according to the invention;

[0014] 图2a及图2b是示出了根据本发明的方法在整个手机机身的上端设置摄像头、接收器及耳机插孔被并通过柔性印刷电路将上述部件与第一PCB主板相连接的示意图; [0014] Figures 2a and 2b is a diagram illustrating a camera disposed at the upper end of the phone the entire process according to the present invention, headphone jack and a receiver through a flexible printed circuit and is connected to the above-described first member and the main PCB schematic diagram;

[0015] 图3是示出了根据本发明的方法在第二PCB板上集中设置T-flash卡卡座与SIM 卡卡座的示意图。 [0015] FIG. 3 is a schematic diagram showing collectively set T-flash card holder SIM card socket in the PCB according to the second method of the present invention.

具体实施方式 Detailed ways

[0016] 下面结合附图对本发明的优选实施例进行详细描述。 [0016] Hereinafter, preferred embodiments of the present invention is described in detail in conjunction with the accompanying drawings. [0017] 在图1中示出了采用本发明的方法所制造的超薄智能手机的侧视图,从图中可以看出,手机的整体厚度主要取决于含有手写板的液晶显示模块1和电池模块2。 [0017] In FIG 1 shows a side view of the ultra-thin smartphone method of the present invention is produced, it can be seen from the figure, the overall thickness of the phone depends on the liquid crystal display panel comprising the handwriting and the battery module 1 module 2. 为了将手机厚度降低到最低,根据本发明方法首先将所述含有手写板的液晶显示模块1和所述电池模块2彼此背面相对地设置,同时在其间设置一厚度为0. 3mm的钢板3作为支撑以提高强度。 In order to reduce to a minimum thickness of the mobile phone, according to the method of the present invention, the first liquid crystal display module comprising a tablet and a back surface of the battery modules 2 arranged opposite each other, and set a steel sheet having a thickness of 0. 3mm therebetween as 3 support to increase the strength.

[0018] 为了进一步减小手机体积,将射频模块(未示出)与基带模块(未示出)集中地两面布置在第一PCB主板4上,从而提高器件集成度。 [0018] In order to further reduce the volume of the handset, the RF module (not shown) and a baseband module (not shown) centrally disposed on both sides of the first main PCB 4, thereby increasing the level of component integration.

[0019] 为了最大限度地利用空间,防止相互干扰,将天线5设置在整个手机的最下端,这样也有利于实现SAR保护。 [0019] In order to maximize the use of space, to prevent mutual interference, at the lowermost end of the entire mobile phone, which would also help protect the SAR antenna 5 arranged to achieve.

[0020] 接下来,如图2a及图2b所示,将摄像头6、接收器7和耳机插孔8集中地设置在整个手机的上端,将麦克风(未示出)设置在手机下端,并使用柔性印刷电路(FPC)9将上述多个部件与第一PCB主板4相连从而构成一个完整的系统。 [0020] Next, as shown in Figures 2a and 2b, the camera 6, a receiver 7 and a headphone jack 8 is provided centrally at the upper end of the entire mobile phone, a microphone (not shown) provided at the lower end of the phone, and using a flexible printed circuit (FPC) 9 and the plurality of first members connected to the main PCB 4 so as to constitute a complete system.

[0021] 最后,如图3中所示出的,将T-flash卡卡座11和SIM卡卡座10集中设置在第二PCB板12上,并借助连接器(未示出)将所述第二PCB板12与第一PCB主板4相连接从而充分利用厚度空间。 [0021] Finally, as illustrated in FIG. 3, and the T-flash card holder 11 and the SIM card holder 10 is provided on the second PCB focus plate 12, and a connector means (not shown) to the a second PCB connected with the first plate 12 of the main PCB 4 so as to make full use of the thickness of the space. 优选地,为了防止对SIM卡进行热插拔操作,所述SIM卡卡座10被设计为,只有在取出电池后才能对SIM卡进行插拔操作;而所述T-flash卡卡座11为是只允许侧向插拔T-flash卡。 Preferably, the SIM card in order to prevent hot-plug operation, the SIM card holder 10 is designed, in order to remove the battery only after the SIM card is unplugged; and the T-flash card socket 11 only allows lateral plug T-flash card.

[0022] 为了更加有效地减少手机的厚度同时保证其结构强度,采用金属材料制造所述手机的外壳上围绕液晶显示模块1的部分和覆盖所述电池模块2的部分。 [0022] In order to more effectively reduce the thickness of the phone while maintaining structural strength, the use of the cover portion and the battery module 1 of the module on the housing 2 of the mobile phone for producing a metal material around the liquid crystal display.

[0023] 本领域普通技术人员应当知道,除特别指出的部件排布方案以及连接方式以外, 可以采用本领域已知的任何恰当的方法布设与连接所述智能手机的其他部件与模块,从而构成稳定运行的手机系统。 [0023] One of ordinary skill will appreciate that, except where otherwise indicated member arrangement and connection of the program, any suitable method known in the art and layout of the modules is connected to other components of the smart phone can be employed to constitute stable operation of the phone system.

[0024] 通过采用本发明的方法,可以制造出体积小,厚度薄,且未减少任何功能的超薄智能手机,满足了人们随身携带和使用智能手机的需求。 [0024] By using the method of the present invention, it can be manufactured small in size, thin, and does not reduce any thin smart phone function, to meet the people to carry and use demand for smart phones.

Claims (4)

  1. 一种制造超薄智能手机的方法,其特征在于,其包括以下步骤:(1)彼此背面相对地设置含有手写板的液晶显示模块和电池模块,并在上述两模块之间设置一支撑钢板;(2)在第一PCB主板的两面上集中地设置射频模块与基带模块;(3)在整个机身的最下端设置天线;(4)在第二PCB板上集中设置T-flash卡卡座与SIM卡卡座,并通过连接器将所述第二PCB板与第一PCB主板相连;所述方法还包括以下步骤,在整个机身的上端顺序设置摄像头、接收器及耳机插孔,在机身的下端设置麦克风,并通过柔性印刷电路将上述部件与第一PCB主板相连。 A method of producing an ultra thin smartphone, characterized in that it comprises the following steps: (1) the back surface disposed opposite to each other tablet containing liquid crystal display module and a battery module, and a supporting plate disposed between said two modules; (2) disposed centrally RF module and baseband modules on both sides of the first main PCB; (3) disposed at the lowermost end of the entire antenna body; (4) T-flash collectively set in the second card socket PCB board with the SIM card holder, and through the second PCB connector plate connected to the first main PCB; said method further comprising the step of setting a camera, a receiver and a headphone jack at the upper end of the entire sequence of the fuselage, in the lower end of the microphone body is provided, and the above-described components are connected by a flexible printed circuit and the first main PCB.
  2. 2.如权利要求1所述的制造方法,其特征在于,所述方法还包括以下步骤,采用金属材料制造所述手机的外壳上围绕液晶显示模块的部分和覆盖所述电池模块的部分。 2. The method according to claim 1, wherein said method further comprises the step of using a portion of the display module and a cover portion surrounding the liquid crystal cell module on the housing of the mobile phone for producing a metal material.
  3. 3.如权利要求1所述的制造方法,其特征在于,所述支撑钢板的厚度为0. 3mm。 The manufacturing method as claimed in claim 1, characterized in that the support plate thickness of 0. 3mm.
  4. 4.如权利要求1所述的制造方法,其特征在于,所述T-flash卡卡座是只允许侧向插拔T-flash 卡的。 The manufacturing method according to claim 1, wherein said T-flash card holder laterally to allow only the T-flash card plug.
CN 200610003366 2006-01-26 2006-01-26 A method for making the ultra-thin smart handset CN101009982B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103338281A (en) * 2013-03-04 2013-10-02 佳也瑞吉科技(深圳)有限公司 Mobile phone protection sleeve with display screen

Families Citing this family (5)

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Publication number Priority date Publication date Assignee Title
CN201032729Y (en) * 2007-07-02 2008-03-05 华为技术有限公司 Mobile terminal equipment
CN101710834B (en) * 2009-10-23 2013-08-21 中兴通讯股份有限公司 Wireless data terminal equipment
CN101820727B (en) * 2010-04-27 2012-05-09 青岛海信移动通信技术股份有限公司 Circuit board with cassette and mobile terminal
CN104468871B (en) * 2013-09-12 2019-01-15 联想(北京)有限公司 A kind of electronic equipment
CN105827915B (en) * 2016-04-22 2019-09-03 上海青橙实业有限公司 Cam device and mobile terminal

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KR20020013673A (en) 2000-08-14 2002-02-21 우종명 Surface-mounted multi-layered Chip Ceramic Dielectric antenna for PCS Phone
CN2622944Y (en) 2003-05-26 2004-06-30 海信集团有限公司 Thin phone

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
KR20020013673A (en) 2000-08-14 2002-02-21 우종명 Surface-mounted multi-layered Chip Ceramic Dielectric antenna for PCS Phone
CN2622944Y (en) 2003-05-26 2004-06-30 海信集团有限公司 Thin phone

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103338281A (en) * 2013-03-04 2013-10-02 佳也瑞吉科技(深圳)有限公司 Mobile phone protection sleeve with display screen

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