CN203482249U - Novel mobile phone mainboard and smartphone - Google Patents

Novel mobile phone mainboard and smartphone Download PDF

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Publication number
CN203482249U
CN203482249U CN 201320393441 CN201320393441U CN203482249U CN 203482249 U CN203482249 U CN 203482249U CN 201320393441 CN201320393441 CN 201320393441 CN 201320393441 U CN201320393441 U CN 201320393441U CN 203482249 U CN203482249 U CN 203482249U
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board
mobile phone
main
pcb
main pcb
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CN 201320393441
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Chinese (zh)
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江小建
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深圳酷比通信设备有限公司
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Abstract

The utility model discloses a novel mobile phone mainboard and a smartphone. The mainboard comprises a main printed circuit board (PCB), a secondary PCB, and a flexible printed circuit board which is used for connecting the main and secondary PCBs together. The back surface of the main PCB is equipped with a first contact spring piece which is used for connecting with the flexible printed circuit board of a main antenna of a mobile phone, and also equipped with a three-in-one card seat which is used for placing a MicroSIM card, a mobile phone SIM card, and a mobile phone T card. The mainboard provided by the utility model can enable the whole smartphone to be ultrathin and cost to be low under the condition that the functional configuration of smartphone hardware is not changed. Moreover, the mainboard can meet the demands of thickness and cost of the smartphone.

Description

一种新型手机主板及智能手机 A new mobile motherboard and smart phones

技术领域 FIELD

[0001] 本实用新型涉及一种手机主板,尤其涉及的是一种低成本、超薄的新型手机主板及智能手机。 [0001] The present invention relates to a mobile phone board, and more particularly is a low-cost, ultra-thin smart phones and new mobile motherboard.

背景技术 Background technique

[0002] 随着通信技术的迅速发展,智能手机已经在快速普及,而且在各通信运营商对千元智能手机的大力推广下,各个智能手机厂商都在想方设法降低成本以满足千元智能手机的市场需要,但目前智能手机的成本还是普遍偏高,而且手机整机厚度普遍偏厚,消费者拿在手上的手感不好。 [0002] With the rapid development of communication technology, smart phones have rapidly spread, and in each communication operators to promote thousands of smart phones, the individual smart phone manufacturers are trying to reduce costs in order to meet thousands of smart phone needs of the market, but the current cost of smart phones is still generally high, and the phone the whole thickness of partial thickness general, consumers feel good in your hand. 智能手机的消费者不但追求性价比高、而且喜欢手握手感好的超薄的智能手机。 Smartphone consumers not only the pursuit of cost-effective, but also like a good hand feel ultra-thin smartphone. 众所周知,在保证智能手机所需硬件功能配置不变的前提下,主板堆叠方式决定了手机主板及其外围器件的成本。 As we all know, under the guarantees necessary for smartphone hardware features without changing the configuration, the board stacking determines the cost of mobile phone motherboard and peripheral devices.

[0003] 而现有技术在保证智能手机所需硬件功能配置不变的前提下,是无法实现超低成本、且整机厚度超薄的智能手机主板堆叠方式。 [0003] In the prior art hardware features to ensure the desired configuration without changing the smart phones, low cost can not be achieved, and the whole thickness of thin stacking smartphone motherboard.

[0004] 因此,现有技术还有待于改进和发展。 [0004] Thus, the prior art has yet to be improved and developed.

实用新型内容 SUMMARY

[0005] 鉴于上述现有技术的不足,本实用新型的目的在于提供一种新型手机主板及智能手机,该手机主板在保证智能手机所需硬件功能配置不变的前提下,其能实现智能手机整机厚度超薄,而且低成本,满足用户对智能手机厚度和成本的需求。 [0005] In view of the deficiencies of the prior art, the present invention aims to provide a novel motherboard and the smart phone handset that required to ensure the motherboard smartphone hardware features without changing the configuration, which enables smartphone the whole thickness of ultra-thin, and low cost, to meet user demand for smart phones thickness and cost.

[0006] 本实用新型的技术方案如下: [0006] The technical solution of the present invention are as follows:

[0007] 一种新型手机主板,其中,包括主PCB板、副PCB板,及用于将所述主PCB板与所述副PCB板连接在一起的柔性电路板; [0007] a new mobile phone board, which includes a main PCB, the sub-PCB board, and a flexible circuit board to the main PCB is connected to the sub board PCB board together;

[0008] 在所述主PCB板的背面设置有用于与手机主天线的柔性电路板连接的第一接触弹片以及用于放置Micro SIM卡、手机SIM卡和手机T卡的三合—^座。 [0008] The elastic piece is provided for the first contact with the primary antenna phone flexible circuit board connected to the back surface of the main board and a PCB disposed Micro SIM card, the SIM card and mobile phone card triple T - ^ seat.

[0009] 所述的新型手机主板,其中, New mobile phone board according to [0009], wherein,

[0010] 在所述主PCB板上设置有用于与所述柔性电路板进行焊接的第一焊盘; [0010] provided with a first land for soldering the flexible circuit board in the main PCB board;

[0011] 在所述主PCB板正面右侧上部设置有用于与前置摄像头的柔性电路板和后置摄像头的柔性电路板进行焊接的第二焊盘; [0011] provided for the front camera of the flexible circuit board and the rear camera of the flexible circuit board at an upper front right side of the main PCB board for a second welding pad;

[0012] 在所述主PCB板正面左侧下部设置有用于与手机音量键的柔性电路板进行焊接的第三焊盘; [0012] provided for the handset volume key flexible circuit board at the lower left side of the front plate of the third main PCB soldering pads;

[0013] 在所述主PCB板正面右侧下部设置有用于与手机开关键的柔性电路板进行焊接的第四焊盘; [0013] provided at a lower front right side of the main PCB board for a mobile phone with a key to open the flexible circuit board of a fourth welding pad;

[0014] 在所述主PCB板正面下部设置有用于与手机的TFT的液晶显示模块的柔性电路板进行焊接的第五焊盘。 [0014] The mobile phone is provided with a TFT for a liquid crystal display module, the flexible circuit board is welded to a fifth lower portion of the main PCB pad panel front.

[0015] 所述的新型手机主板,其中,在所述主PCB板正面上侧设置有前置摄像头、听筒、以及以SMT贴片方式设置的距离传感器。 [0015] The novel mobile phone board, wherein, on the front side is provided with a main PCB board front camera, receiver, and a distance sensor disposed in the SMT assembly. [0016] 所述的新型手机主板,其中,主PCB板在与TFT的液晶显示模块重叠的区域没有任何元器件,而且在所述主PCB板正面与所述TFT的液晶显示模块之间设置有用于散热的不锈钢结构件。 [0016] The novel mobile phone board, wherein the main PCB board without any components in the TFT liquid crystal display module overlap region, and the TFT liquid crystal display in front of the main PCB plate disposed between the modules useful in stainless steel heat dissipation structure.

[0017] 所述的新型手机主板,其中,在所述主PCB板的背面上侧依次设置有:RF屏蔽罩、RF测试连接器、BB屏蔽罩、USB连接器、电容TP的柔性电路板连接器、耳机座以及用于将手机的WIFI天线和BT天线的柔性电路板与所述主PCB板弹性接触的第二接触弹片。 [0017] The novel mobile phone board, wherein, on the rear surface side of the main PCB plate provided in this order: RF shield, the RF test connector, BB shield, USB connector, the capacitance of the flexible circuit board TP , a headphone housing and a second contact phone and BT antenna WIFI antenna flexible circuit board for contact with the main PCB plates shrapnel.

[0018] 所述的新型手机主板,其中,在所述主PCB板的背面下侧设置有:用于屏蔽手机WIFI天线、BT天线以及FM天线的三合一天线屏蔽罩。 [0018] The novel mobile phone board, wherein the rear surface side is provided in the main PCB board are: WIFI antenna for shielding a mobile phone, the BT antenna and an FM antenna radome triple.

[0019] 所述的新型手机主板,其中,在所述副PCB板的正面设置有:马达以及用于将所述马达与所述副PCB板进行焊接的马达焊盘;麦克风以及用于将所述麦克风与所述副PCB板进行焊接的麦克风焊盘。 [0019] The novel mobile phone board, wherein the front side of the sub board PCB provided with: a motor and a motor for the motor is welded to the sub pad PCB board; and a microphone for the said microphone and said microphone sub-PCB board pad welding.

[0020] 所述的新型手机主板,其中,在所述副PCB板的背面设置有喇叭。 [0020] The novel mobile phone board, wherein the rear surface of the PCB is provided with a sub-speakers.

[0021] 一种智能手机,其中,其包括上述任意一项所述的新型手机主板。 [0021] A smart phone, wherein it comprises any one of the above-described novel mobile phone board.

[0022] 所述的智能手机,其中,所述智能手机的厚度为8.5mm左右。 [0022] The smartphone, wherein the thickness of the smart phone is about 8.5mm.

[0023] 本实用新型所提供的一种新型手机主板及智能手机,由于所述手机主板包括主PCB板和与所述主PCB板通过一柔性电路板连接的副PCB板,所述柔性电路板通过在所述主PCB板上设置的第一焊盘与所述主PCB板焊接,使得该手机主板省去了FPC连接器,节省了不少成本,而且组装更方便、可靠;且在所述主PCB板的背面设置有第一接触弹片,手机主天线的柔性电路板通过该接触弹片与所述主PCB板弹性接触。 [0023] The utility a new mobile phone and smart phone novel motherboard provided, since the mobile phone board comprises a main PCB board sub-PCB board and connected with the main PCB board via a flexible circuit board, the flexible circuit board through a first pad disposed in the main PCB of the main board PCB board soldering, so that the mobile phone board FPC connector is omitted, saving a lot of cost and assembly more convenient, reliable; and the back of the main board PCB is provided with a first contact shrapnel, mobile phone main antenna flexible circuit board by contacting the elastic piece contacting elastically with the main PCB board. 这种放置形式突破了“主PCB板断板式+副板,天线布置在整机的底部”的传统堆叠方式,省去了RF同轴线及其相对应的两对RF连接器,也降低了手机整机成本,而且组装更加简单。 This placement broke the traditional form of stacking "+ main PCB board sub-plate off the plate, an antenna disposed at the bottom of the machine", eliminating the RF coaxial lines and their corresponding two pairs of RF connectors, but also reduces phone machine cost, and easier assembly.

附图说明 BRIEF DESCRIPTION

[0024] 图1是本实用新型中所述的手机主板的正面结构较佳实施例示意图。 A schematic diagram of [0024] FIG. 1 is in the present invention, the preferred structure of the front board mobile phone embodiment.

[0025] 图2是本实用新型中所述的手机主板的背面结构较佳实施例示意图。 A schematic diagram of [0025] FIG. 2 in the present invention is a mobile phone board backside structure preferred embodiment.

具体实施方式 Detailed ways

[0026] 本实用新型提供一种新型手机主板及智能手机,为使本实用新型的目的、技术方案及效果更加清楚、明确,以下参照附图并举实例对本实用新型进一步详细说明。 [0026] The present invention provides a novel and smart phone phone motherboard, for the purposes of the present invention, technical solutions and advantages clearer, clearly, the accompanying drawings and described in further detail new instance of the present invention with reference to the following. 应当理解,此处所描述的具体实施例仅仅用以解释本实用新型,并不用于限定本实用新型。 It should be understood that the specific embodiments described herein are only intended to illustrate the present invention, not to limit the present invention.

[0027] 以下结合图1对本实用新型所提供的新型手机主板的正面做详细说明,其中,图1是本实用新型中所述的手机主板的正面结构较佳实施例示意图。 [0027] FIG 1 in conjunction with the following detailed explanation of the novel positive phone board of the present invention is provided, wherein FIG. 1 is a schematic diagram of the present invention in a front board mobile structures preferred embodiment.

[0028] 由图1可知,所述新型手机主板包括主PCB板100和副PCB板200,以及用于将所述主PCB板100与所述副PCB板200连接在一起的柔性电路板300 ; [0028] Figure 1 shows, the novel mobile phone board PCB board 100 includes a main board 200 and the sub-PCB and the main PCB board for a flexible circuit board 100 connected with the sub-PCB board 200 300;

[0029] 其具体的连接方式是,在所述所述主PCB板100上设置的第一焊盘301,使得所述柔性电路板300通过在所述第一焊盘301与所述主PCB板焊接,且所述第一焊盘301设置在所述主PCB板100正面右侧下部; [0029] The specific connection, in the first pad 301 is provided on the main PCB 100 of the plate, so that the flexible circuit board 300 through the first pad 301 and the main PCB board welding, and the first pad 301 disposed at a lower portion of the right side of the front plate 100 of the main PCB;

[0030] 即所述主PCB板100与所述副PCB板200通过所述柔性电路板300进行连接,省去了FPC连接器,能够节省成本,符合制造商对成本控制的需求。 [0030] i.e., the main PCB 100 and the sub board PCB board 200 are connected by the flexible circuit board 300, a FPC connector is omitted, the cost can be saved, to meet the needs of the manufacturer and cost control. [0031] 参见图2对所述手机主板的背面的结构做详细说明,其中,图2是本实用新型中所述的手机主板的背面结构较佳实施例示意图。 Structure [0031] Referring to Figure 2 the back surface of the phone board detailed description, wherein FIG. 2 is a schematic diagram of the present invention in a mobile phone board backside structure of the preferred embodiment.

[0032] 由图2可知,在所述主PCB板100的背面设置有第一接触弹片122,所述第一接触弹片122用于将手机主天线的柔性电路板与所述主PCB板100弹性接触,且所述第一接触弹片122设置在主PCB板100背面的上侧,采用此种设置方式意味着主天线也将放置在整机的上侧,这种放置形式突破了现有技术中,“主PCB板断板式+副板,天线布置在整机的底部”的传统堆叠方式,省去了RF同轴线及其相对应的两对RF连接器,降低了手机整机成本,而且组装更加简单,提高了手机产线的效率。 [0032] FIG. 2 shows that the back plate 100 of the main PCB is provided with a first elastic piece 122 contacts the first contact 100 elastically elastic piece 122 for the main antenna phone flexible circuit board and the main board PCB contacting the first contact and the elastic piece 122 is provided on the back surface side of the main PCB board 100, and this arrangement means that the main antenna is also placed on the side of the machine, such placement of the prior art in the form of a breakthrough "+ main PCB board sub-plate off the plate, an antenna disposed at the bottom of the machine" conventional stacking, eliminating the RF coaxial lines and their corresponding two pairs of RF connectors, reducing the overall cost of the phone, and assembly easier and improve the efficiency of the mobile phone production line.

[0033] 以下结合图1对手机主板的正面结构做进一步的详细说明; [0033] below with reference to FIG. 1 phone board front structure further detail;

[0034] 在所述主PCB板100正面右侧上部设置有用于与前置摄像头的柔性电路板和后置摄像头的柔性电路板进行焊接的第二焊盘102 ; [0034] In the upper right side of the front surface of the main PCB board 100 is provided with a front camera for flexible circuit board and the rear camera of the flexible circuit board 102 is welded to a second pad;

[0035] 在所述主PCB板100正面左侧下部设置有用于与手机音量键的柔性电路板103进行焊接的第三焊盘104 ; [0035] disposed at a front lower portion of the left side of the main PCB 100 for the phone volume board bond the flexible circuit board 103 is welded to the third pad 104;

[0036] 在所述主PCB板正面右侧下部设置有用于与手机开关键的柔性电路板105进行焊接的第四焊盘106; [0036] provided at a lower front right side of the main PCB board for a mobile phone with a key to open the flexible circuit board 105 for soldering fourth pad 106;

[0037] 在所述主PCB板100正面下部设置有用于与手机的TFT的液晶显示模块的柔性电路板与所述主PCB板进行焊接的第五焊盘107 ;且所述TFT的液晶显示模块的位置是自由的,可以正放、也可以倒放,适合做不同的ID风格。 [0037] The mobile phone is provided with a TFT for a liquid crystal display module fifth pads of the flexible circuit board is soldered to the main PCB board 107 at a lower front surface of the main PCB board 100; and the TFT liquid crystal display module the location is free, one can put, you can rewind, suitable for different styles of ID.

[0038] 通过上述第一焊盘301、第二焊盘102、第三焊盘104、第四焊盘106以及第五焊盘107的设置,使得其取代了现有技术中FPC连接器的采用,省掉了四个ZIF连接器或四对BTB连接器的成本,进一步地节省了成本,符合制造商对节约成本的追求。 [0038] 301 through the first pad, a second pad 102, pad 104 of the third, fourth and fifth pads 106 pads 107 disposed such that it replaces the prior art using a FPC connector , eliminating the need for four ZIF connectors or four pairs of BTB connectors of costs and further cost savings, in line with the manufacturer pursuit of cost savings.

[0039] 较佳地是,在所述主PCB板100与所述TFT的液晶显示模块之间设置有用于散热的不锈钢结构件,所述不锈钢构件的采用使得所述手机主板具有较优的散热性能,可以解决智能手机局部过热的问题,而且进一步地,在所述主PCB板100的正面内层会设计大面积的露铜,增强对智能手机主芯片的散热,延长手机主板的使用寿命。 [0039] Preferably, in the main board PCB 100 and the TFT liquid crystal display module is provided between the stainless steel structural member for dissipating heat, the stainless steel member is employed such that the mobile phone board having superior heat dissipation properties, can solve the problem of local overheating smart phone, and further, the front inner panel main PCB 100 will be large areas of exposed copper design, enhance the cooling of the main chip smart phone, mobile phone board to extend the service life.

[0040] 更佳的是,在主PCB板100的正面,TFT液晶显示模块与主PCB板重叠的区域没有任何器件,可以使手机的整机厚度减薄,在保持手机整机成本超低的情况下能做到8.5mm左右的超薄厚度,符合用户对手机超薄性能的要求。 [0040] More preferably, there is no device in the front plate 100 of the main PCB, the TFT liquid crystal display module and the main board PCB overlap, the whole thickness of the phone can be made thin, the ultra-low cost of the machine holding the phone It can be done in the case of ultra-thin thickness of about 8.5mm, meet user requirements for performance thin phone.

[0041] 进一步参见图1可知,在所述主PCB板100正面上侧设置有前置摄像头101以及听筒109,在所述主PCB板100正面上侧还以SMT贴片方式设置有距离传感器108 ; [0041] Referring to FIG 1 further shows that the front surface of the main PCB 100 on the side plate 101 is provided with a front camera 109 and the receiver side further in SMT assembly 100 provided on the front surface of the main PCB board 108 with a distance sensor ;

[0042] 采用直接在主板上SMT贴片的距离传感器108,可以省去传统FPC转接式的FPC,简化了组装方式,也节省了一点成本。 [0042] The distance sensor SMT placement directly on the motherboard 108, the adapter may be omitted conventional FPC FPC type, assembly is simplified manner, it also saves costs.

[0043] 更进一步参见图1可知,在所述副PCB板200的正面设置有; [0043] Referring to Figure 1 further shows that the front side of the sub-PCB 200 is provided with a plate;

[0044] 马达201以及用于将所述马达201与所述副PCB板200进行焊接的马达焊盘202 ; [0044] The motor 201 and the motor 201 for the sub-PCB board with soldering pads 200,202 motor;

[0045] 麦克风203以及用于将所述麦克风203与所述副PCB板200进行焊接的麦克风焊盘204。 [0045] The microphone 203 and a microphone 200 for welding the microphone 203 and the sub pad 204 of PCB.

[0046] 以下结合图2对所述手机主板背面的结构做详细说明; [0046] The structure below in conjunction with FIG phone back of the board a detailed explanation of two pairs;

[0047] 在所述主PCB板100的背面上侧依次设置有:RF屏蔽罩120、RF测试连接器121、BB屏蔽罩123、USB连接器124、电容TP的柔性电路板连接器125、耳机座126以及第二接触弹片127 ;且所述耳机座126的尺寸为标准的3.5mm。 [0047] sequentially arranged on the rear surface 100 of the primary side of the PCB: RF shield 120, RF test connector 121, BB shield 123, USB connector 124, the capacitance TP flexible circuit board connector 125, the headset and a second elastic piece 126 contacts seat 127; and the size of the earphone housing 126 is a standard 3.5mm.

[0048] 其中,手机的WIFI天线和BT天线的柔性电路板通过所述第二接触弹片127与所述主PCB板100弹性接触,采用该种设置方式节省了手机WIFI天线和BT天线与手机主板进行连接时所使用的RF同轴线及其连接器,也节省了不少成本,而且组装更方便、可靠。 [0048] wherein, BT phone WIFI antenna and the antenna 127 of the flexible circuit board 100 in contact with the elastic plate of the main PCB through the second contact tabs, with this kind of arrangement saves the phone and BT antenna WIFI antenna phone board when used for the connection and RF coaxial connector, but also saves a lot of costs, and easier assembly, and reliable.

[0049] 因将所述RF屏蔽罩120、RF测试连接器121、BB屏蔽罩123均设置在手机主PCB板的背面,进而手机的BB、RF这样功耗大,易发热的芯片都放置在了主PCB板的背面,采用该种设置方式更有利于智能手机的散热,更好的解决了智能手机局部过热的问题。 [0049] because of the RF shield 120, RF test connector 121, BB shield case 123 are provided on the back of the phone main PCB board, and thus the phone BB, so that RF power consumption, easy to heat the chips are placed in the the back of the main PCB board using this type of cooling arrangement is more conducive to smartphones, better solves the problem of local overheating smartphone.

[0050] 且在所述主PCB板的背面下侧设置有: [0050] and the back surface side of the main PCB in the board are:

[0051] 用于屏蔽手机WIFI天线、BT天线以及FM天线的三合一天线屏蔽罩128 ; [0051] WIFI for shielding a mobile phone antenna, BT antenna and an FM antenna radome 128 triple;

[0052] 用于放置Micro SIM卡、手机SM卡和手机T卡的三合一^^座129 ; [0052] ^^ triple seat for placement of 129 Micro SIM card, phone card, and SM card phone T;

[0053] 其中,所述三合一卡座129根据不同的设置目的可采用不同的设置方式,例如,可采用分层的设置方式,在上层设置有用于放置Micro SM卡和T卡插槽,在下层设置有用于放置普通SM卡的插槽;还可采用三层的设置方式,每一层分别设置有一插槽。 [0053] wherein the triple deck 129 can be disposed in different ways depending on the purpose of setting, for example, may be employed in a layered arrangement, the upper layer is provided for placing Micro SM cards and card slots T, in general the lower layer is provided for placing the SM card slot; three-tier arrangement may be employed, each layer are provided with a slot.

[0054] 因所述三合一^^座129可适用Micro SIM卡、手机SM卡和手机T卡,使得该三合一卡座129大大减少了普通主板设计方案中卡座在主PCB板上的占用面积,进而可以使手机的整机厚度减薄,在保持手机整机成本超低的情况下能做到8.5mm左右的超薄厚度,而目前市场上8.5_左右厚度的智能手机的成本普遍很高,采用本实用新型所提供的手机主板,在保证智能手机整机厚度不增加、主PCB板尺寸不加大的前提下,仍能能实现双SIM卡的功能,这是大多市场主流的智能手机很难实现的。 [0054] ^^ seat 129 due to the triple applicable Micro SIM card, phone card, and SM card phone T, so that the triple deck 129 significantly reduces common motherboard design embodiment cartridge main PCB, footprint, in turn, can make the whole thickness of the phone thinner, while maintaining ultra-low-cost mobile phone the whole situation can do about ultra-thin thickness of 8.5mm, and is currently on the market cost about 8.5_ thickness of the smartphone generally high, the utility model provided by phone motherboard, to ensure the whole thickness of the smart phone does not increase, the main PCB board size without increasing the premise still be able to realize the function of dual SIM card, which is most of the mainstream market smartphone difficult to achieve.

[0055] 进一步参见图2可知,在所述副PCB板200的背面设置有喇叭206。 [0055] Referring to FIG 2 further shows that the back surface is provided with a speaker 206 in the plate 200 of the sub-PCB.

[0056] 本实用新型还提供了一种智能手机,该智能手机包含了上述的新型手机主板,且所述智能手机的厚度为8.5mm左右。 [0056] The present invention also provides a smart phone, a smart phone which comprises the above novel mobile phone board, and the thickness of the smart phone is about 8.5mm.

[0057] 综上所述,通过本实用新型所提供的一种新型的手机主板及智能手机,能够保证智能手机所需硬件功能配置不变的前提下,其能实现智能手机整机厚度超薄,而且低成本,满足用户对智能手机厚度和成本的需求,而且其组装更加容易方便,进而提高了生产效率,方便作业人员进行组装,而且因其主PCB板正面因基本上无器件,所以其内层可以做大面积的铺铜,能增强主板的散热,使得手机主板的使用寿命更长;因此本实用新型提供的手机主板以及智能手机能真正降低手机的核心部件主板及其外围器件的成本,而且手机的整机厚度能够做到尽量薄,进而满足了广大消费者的购买需求。 [0057] To sum up, a new mobile phone and smart phone motherboard provided by the present invention, it is possible to ensure the required functional configuration of the hardware without changing the smart phone, smart phone machine which can achieve ultrathin and low cost, to meet user demand for thickness and cost of the smart phone, and its easy assembly easier, thus improving the production efficiency, the worker easily assembled, but due to its side main PCB board is substantially no device, so that the inner area of ​​copper to be bigger, to enhance heat dissipation board, so that the mobile phone board longer life; Accordingly the present invention provides a mobile phone board and the smart phone phone can really reduce the core member and the peripheral device cost motherboard , and the phone can do the whole thickness as thin as possible, and then to meet the demand of consumers to buy.

[0058] 应当理解的是,本实用新型的应用不限于上述的举例,对本领域普通技术人员来说,可以根据上述说明加以改进或变换,所有这些改进和变换都应属于本实用新型所附权利要求的保护范围。 [0058] It should be appreciated that the present invention is not limited to the above application example, those of ordinary skill in the art, can be modified or converted according to the above description, all such modifications and variations shall fall within the present invention as claimed in the appended the scope of protection requirements.

Claims (10)

1.一种新型手机主板,其特征在于,包括主PCB板、副PCB板,及用于将所述主PCB板与所述副PCB板连接在一起的柔性电路板; 在所述主PCB板的背面设置有用于与手机主天线的柔性电路板连接的第一接触弹片以及用于放置Micro SIM卡、手机SIM卡和手机T卡的三合—^座。 A new mobile phone board, wherein the board comprises a main PCB, the sub-PCB board, and a flexible circuit board to the main PCB is connected to the sub board PCB board together; the main PCB board a first back surface disposed in contact with the elastic piece for mobile phones of the main antenna and the flexible circuit board for placement triple Micro SIM card, the SIM card and mobile phone card T - ^ seat.
2.根据权利要求1所述的新型手机主板,其特征在于, 在所述主PCB板上设置有用于与所述连接主PCB板和副PCB板的柔性电路板进行焊接的第一焊盘; 在所述主PCB板正面右侧上部设置有用于与前置摄像头的柔性电路板和后置摄像头的柔性电路板进行焊接的第二焊盘; 在所述主PCB板正面左侧下部设置有用于与手机音量键的柔性电路板进行焊接的第三焊盘; 在所述主PCB板正面右侧下部设置有用于与手机开关键的柔性电路板进行焊接的第四焊盘; 在所述主PCB板正面下部设置有用于与手机的TFT的液晶显示模块的柔性电路板进行焊接的第五焊盘。 New mobile phone according to claim 1 of the main board, wherein the first pad is provided for welding the flexible circuit board and the sub board main PCB of the PCB board in the main PCB; in the upper right side of the main PCB is provided with a front plate and a second pad for the front camera and the flexible circuit board rear camera of the flexible circuit board to be welded; is provided at a lower portion for the front left side of the main PCB board third pad for soldering the flexible circuit board of the handset volume key; at the lower front right side of the main PCB plate provided with an opening with the phone key pad of the flexible circuit board of the fourth welding; the main PCB a lower portion of the front plate is provided with a mobile phone for a TFT liquid crystal display module, the flexible circuit board of a fifth pad welding.
3.根据权利要求1所述的新型手机主板,其特征在于,在所述主PCB板正面上侧设置有前置摄像头、听筒、以及以SMT贴片方式设置的距离传感器。 3. The new mobile phone board according to claim 1, wherein the main PCB board on the front side is provided with a front camera, receiver, and a distance sensor disposed in the SMT assembly.
4.根据权利要求2所述的新型手机主板,其特征在于,主PCB板在与TFT的液晶显示模块重叠的区域没有任何元器件,而且在所述主PCB板正面与所述TFT的液晶显示模块之间设置有用于散热的不锈钢结构件。 According to claim 2 of the new mobile phone board, wherein the main PCB board and the TFT liquid crystal display module is no region overlapping components, and the TFT liquid crystal display panel on the front side of the main PCB It is provided with a stainless steel structural member for dissipating heat between the modules.
5.根据权利要求1所述的新型手机主板,其特征在于,在所述主PCB板的背面上侧依次设置有:RF屏蔽罩、RF测试连接器、BB屏蔽罩、USB连接器、电容TP的柔性电路板连接器、耳机座以及用于将手机的WIFI天线和BT天线的柔性电路板与所述主PCB板弹性接触的第二接触弹片。 5. The new mobile phone board according to claim 1, characterized in that, on the back surface side of the main PCB plate provided in this order: RF shield, the RF test connector, BB shield, USB connector, capacitors TP a flexible circuit board connector, and a second contact headphones on the mobile phone and BT antenna WIFI antenna flexible circuit board for contact with the main PCB plates shrapnel.
6.根据权利要求1所述的新型手机主板,其特征在于,在所述主PCB板的背面下侧设置有:用于屏蔽手机WIFI天线、BT天线以及FM天线的三合一天线屏蔽罩。 New mobile phone according to claim 1 of the main board, wherein, in the backside of the main PCB is provided with a side plate: WIFI antenna for shielding a mobile phone, the BT antenna and an FM antenna radome triple.
7.根据权利要求1所述的新型手机主板,其特征在于,在所述副PCB板的正面设置有:马达以及用于将所述马达与所述副PCB板进行焊接的马达焊盘;麦克风以及用于将所述麦克风与所述副PCB板进行焊接的麦克风焊盘。 7. The new mobile phone board according to claim 1, characterized in that a front surface of the sub-PCB board: a motor and means for the motor and the sub motor PCB board soldering pads; microphone and for the microphone and the secondary microphone PCB board soldering pads.
8.根据权利要求1所述的新型手机主板,其特征在于,在所述副PCB板的背面设置有喇叭。 New mobile phone according to claim 1 of the main board, wherein there is provided on the back surface of said horn sub-PCB board.
9.一种智能手机,其特征在于,其包括权利要求1至8任意一项所述的新型手机主板。 A smart phone, characterized in that it comprises any one of claims 1 to 8, a new mobile phone board as claimed in claim.
10.根据权利要求9所述的智能手机,其特征在于,所述智能手机的厚度为8.5mm。 Smart phone according to claim 9, wherein the thickness of the smart phone is 8.5mm.
CN 201320393441 2013-07-03 2013-07-03 Novel mobile phone mainboard and smartphone CN203482249U (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103888567A (en) * 2014-04-16 2014-06-25 深圳酷比通信设备有限公司 Intelligent mobile phone and main board component thereof
CN104853011A (en) * 2015-03-25 2015-08-19 青岛海信移动通信技术股份有限公司 Mobile terminal
CN107613047A (en) * 2017-08-23 2018-01-19 广东欧珀移动通信有限公司 Preparation method, electronic building brick and the electronic installation of electronic building brick
CN108011229A (en) * 2017-10-26 2018-05-08 上海与德科技有限公司 USB females and terminal
WO2018137303A1 (en) * 2017-01-25 2018-08-02 华为技术有限公司 Mobile terminal

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103888567A (en) * 2014-04-16 2014-06-25 深圳酷比通信设备有限公司 Intelligent mobile phone and main board component thereof
CN103888567B (en) * 2014-04-16 2016-08-17 深圳酷比通信股份有限公司 A kind of smart mobile phone and mainboard assembly thereof
CN104853011A (en) * 2015-03-25 2015-08-19 青岛海信移动通信技术股份有限公司 Mobile terminal
WO2018137303A1 (en) * 2017-01-25 2018-08-02 华为技术有限公司 Mobile terminal
CN107613047A (en) * 2017-08-23 2018-01-19 广东欧珀移动通信有限公司 Preparation method, electronic building brick and the electronic installation of electronic building brick
CN108011229A (en) * 2017-10-26 2018-05-08 上海与德科技有限公司 USB females and terminal

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