CN2622944Y - Thin phone - Google Patents

Thin phone Download PDF

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Publication number
CN2622944Y
CN2622944Y CN 03217710 CN03217710U CN2622944Y CN 2622944 Y CN2622944 Y CN 2622944Y CN 03217710 CN03217710 CN 03217710 CN 03217710 U CN03217710 U CN 03217710U CN 2622944 Y CN2622944 Y CN 2622944Y
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CN
China
Prior art keywords
printed circuit
circuit board
board
arranged
phone
Prior art date
Application number
CN 03217710
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Chinese (zh)
Inventor
贾辉
李勇
李甫
张秀梅
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海信集团有限公司
青岛海信通信有限公司
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Application filed by 海信集团有限公司, 青岛海信通信有限公司 filed Critical 海信集团有限公司
Priority to CN 03217710 priority Critical patent/CN2622944Y/en
Application granted granted Critical
Publication of CN2622944Y publication Critical patent/CN2622944Y/en

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Abstract

A thin type cell phone belongs to mobile communication technical field, comprising a casing, a printed circuit board arranged in the casing, an electronic circuit on the printed circuit board and the casing, keys, a displayer, a microphone, a receiver, a power supply, etc. Only one main board is arranged in the printed circuit board. The radio frequency circuit and the digital circuit in the electronic circuit are arranged at one side of the main board, while the keys are arranged at the other side of the main board. A ground isolated shield is adopted between the radio frequency circuit and the digital circuit, while the ground isolated shield is also adopted between the radio frequency ray and the digital ray. The printed circuit board has six layers, and the thickness is only 0.6mm. The utility model adopting the ALIVH-G technology is of small size, thin thickness, low production cost and more convenient portability and use. The utility model can be widely applied to mobile communication.

Description

薄型手机 Thin phone

技术领域 FIELD

本实用新型属于移动通讯技术领域,更具体地说涉及手机的薄型化和小型化的改进。 Mobile relates thinning and miniaturization of the improvements of the present invention belongs to the technical field of mobile communication, and more specifically.

背景技术 Background technique

根据市场调查,用户对于手机的外形、功能要求越来越高。 According to market research, the mobile phone user for form, function increasingly demanding. 因此,手机厂家在设计手机时更加注重折叠双屏和彩屏的设计,并且为了满足用户需要,摄像头也加入到手机上。 Thus, mobile phone manufacturers pay more attention in the design of the mobile phone is folded and dual color design, and to meet user needs, but also added to the camera phone. 这就要求生产厂在与以往的直板手机宽度相同、但长度很短的手机中布置越来越多的元器件。 This requires more and more plant components arranged in the same width as the previous candy bar phone, but a very short length of the phone. 所以最初的折叠手机,都是采用两块印刷电路板(PCB板)一主板(双面布件)和按键板分离的形式。 Therefore, the first clamshell phone, are based on two printed circuit boards (PCB board) form (double-sided fabric member) and a keypad separated from a motherboard. 但是,随着PCB板数量的增加,手机的厚度随之增加;而且由于在两板之间还要加装金属电镀支架,这就进一步增加了手机的厚度。 However, as the number of the PCB, the thickness of the phone increases; but also because the installation of metal plating the stent between the two plates, which further increases the thickness of the phone. 另外,这种多PCB板和加装金属电镀支架的结构同时增大了手机的生产成本,还给用户的携带和使用带来诸多不便。 Further, the installation of this plurality of PCB and metal plating the stent structure while increasing the production cost of the phone, returned to the user's inconvenience to carry and use.

本实用新型的目的,就在于克服上述缺点和不足,提供一种尺寸更小、厚度更薄,而且生产成本较低、携带和使用更加方便的薄型手机。 The object of the present invention, to overcome the above mentioned drawbacks and disadvantages, to provide a smaller, thinner, and lower cost, more convenient to carry and use a thin mobile phone.

发明内容 SUMMARY

为了达到上述目的,本实用新型由机壳,安装在机壳中的印刷电路板,安装在印刷电路板和机壳上的电子线路以及按键、显示器、听筒话筒和电源等所组成。 To achieve the above object, the present invention by a housing, a printed circuit board mounted in the cabinet, is mounted on the printed circuit board and housing electronic circuits and buttons, a display, a microphone, and earpiece of the power supply components. 印刷电路板中的主板只有一块。 The printed circuit board in only one board. 电子线路中的射频电路和数字电路安装在主板的一面。 Electronic circuit RF and digital circuitry mounted on one side of the motherboard.

为了满足用户对于手机趋于薄行化的需要,采用了单面布件的方法,一面放置元器件,另一面则和原来按键板一样专门放置按键。 In order to meet user needs of the mobile phone tends dissipated, a method using single cloth member, component placement side, the other side is the same as the original special place keypad keys. 但是,国内已有的生产PCB板的技术不能满足上述需要,即使达到单面布件的要求,也不能使得PCB板降到理想的厚度。 However, the prior art production of domestic PCB board can not meet the above needs, to meet the requirements even single cloth member, so that the thickness of the PCB can not be reduced to the ideal. 鉴于以上诸多原因,选用了ALIVH-G技术。 In view of these many reasons, we selected ALIVH-G technique. 得以完成单面布板设计。 Sided design layout has been completed.

采用单面布板设计,利用ALIVH-G技术,将射频电路和数字电路部分放到手机板同一面,按键部分在手机板另一面,满足了手机的各项性能指标,并且使手机板厚度大幅度减少,使手机外形趋于小型化,薄型化,满足用户首选手机的条件。 Using single-sided layout design using ALIVH-G technology, the RF circuit and the digital circuit portion with the side plate into the phone, the phone button part on the other surface plate to meet the performance of mobile phones, mobile phones and the large thickness plate reduce the magnitude of the mobile phone form factor become smaller and thinner to meet the user's preferred phone's condition. 此单面布板技术也可以广泛应用于小型化的PCB板设计。 This one-sided layout techniques can be widely applied to a miniaturized PCB design. 沿袭以前传统的PCB设计方案,选用双面布板(两面都放置元器件),加单独的按键板和金属镀架,这样每面放置的元件对于空间利用率不高,有许多闲置位置,而且使手机很厚,达不到小型化的要求。 Followed before the traditional PCB design, selection of a double-sided layout (placement of components on both sides), plus a separate keypad and plated metal frame, so that each side element disposed for space utilization is not high, many of the rest position, and the phone is very thick, not up to the miniaturization requirements. 将这些闲置的位置充分利用起来,把两面的元件放置到一面去,把按键板去掉,来减少手机的整体厚度。 These idle position fully utilized, the components are placed on both sides to the side, the key sheet removed to reduce the overall thickness of the phone.

手机上用到元器件非常多,采用单面布板需要将多达五百个的元器件放到面积为43.5mm×78.5mm的主板上,对于空间的利用率相当高。 On the phone components used very much, single-sided cloth panels require as many as five hundred components on the motherboard into the area of ​​43.5mm × 78.5mm, for the space utilization is very high. 若采用已有的BUILDUP制板技术,需要至少10层才能实现单面布板,不能有效降低手机板的厚度。 If the system board using conventional techniques BUILDUP, at least 10 layers to achieve single cloth plate, can not effectively reduce the plate thickness of the phone.

印刷电路板可以为6层,厚度只有0.6毫米。 The printed circuit board 6 may be a layer thickness of only 0.6 mm. 由于ALIVH-G技术可以在任意层之间进行打孔连线,也可以进行孔叠孔的设计,这样在每层上都提供了更多的布线空间,在每个层次上也可以充分利用上层孔下的位置布线。 Since ALIVH-G technique can be punctured connection between any of the layers may be stacked hole-hole design, so that each layer provides additional routing space on each level may take advantage of the upper layer the position of the wiring hole. 因此只用了六层。 Therefore, only a six.

印刷电路板上的射频电路和数字电路之间采用地隔离屏蔽,射频线和数字线之间也采用地隔离屏蔽。 Using the isolation barrier between the RF and digital circuitry of the printed circuit board, also be employed between the line and the digit line RF shield isolated.

射频电路部分(发射、接收、PLL和VCO电路)和数字电路部分放置在同一面上,靠的很近,会影响射频参数。 RF circuit (transmitter, receiver, PLL, and VCO circuit) and a digital circuit portion disposed on the same surface, in close proximity, may affect RF parameters. 采用双面布板很容易解决掉这一问题,但是,采用单面布板就不得不把射频部分和数字电路部分放到同一面,因此必须考虑屏蔽问题,在射频和数字电路之间采用地隔离,并且射频线和数字线之间也采用地隔离。 Plate using double-sided fabric is easy to get rid of this problem, however, use of single layout would have to RF and digital circuitry into the same portion side shielding problems must be considered, employed between the RF and digital circuitry isolation, and between the RF cable and also used to isolate digit line.

本实用新型使单纯的PCB板的厚度比以前的PCB板(包含两层板之间的电镀支架)减少2.3mm的厚度。 The present invention is simple to make the thickness of the PCB than the previous PCB board (comprising two layers between the plate holder plating) to reduce the thickness of 2.3mm. 可以利用这个优势使得电池容量增大,从而延长通话时间和待机时间,满足现在数据业务发展使得耗电量大的需要。 You can take advantage of this so that the battery capacity is increased, thereby extending the talk time and standby time, such that data services to meet the current needs of large power. 同时,PCB板数量的减少和电镀支架的省略相应节省了这部分的费用。 At the same time, reducing the PCB is omitted and the plating rack number corresponding to this part of the cost savings.

本实用新型的任务就是这样完成的。 The task of the present invention is thus completed.

本实用新型提供了一种尺寸更小、厚度更薄,而且生产成本较低、携带和使用更加方便的薄型手机。 The present invention provides a smaller, thinner, and lower cost, more convenient to carry and use a thin mobile phone. 它可广泛应用于移动通讯中。 It can be widely used in mobile communications.

附图说明 BRIEF DESCRIPTION

图1为本实用新型的PCB主板的A面图。 A sectional view of FIG. 1 of the present invention, a PCB board.

图2为PCB主板的B面图。 FIG 2 is a sectional view B of the main PCB.

图3为本实用新型单面布板与已有双面布板的比较表。 Figure 3 is a comparison table of new and existing single-sided double-sided layout practical layout.

具体实施方式 Detailed ways

实施例1.一种薄型手机,它由机壳,安装在机壳中的印刷电路板,安装在印刷电路板和机壳上的电子线路以及按键、显示器、听筒话筒和电源等所组成。 Example 1. A thin cell phone embodiment, a housing which, mounted on the chassis printed circuit board is mounted on the printed circuit board and the electronics housing and buttons, a display, a microphone, and earpiece of the power supply components. 印刷电路板中的主板只有一块。 The printed circuit board in only one board. 参阅图1和图2,电子线路中的射频电路1和数字电路2安装在主板的B面,按键3安装在主板的A面。 Referring to FIG 1 and FIG 2, the electronic circuit 1 and the RF circuit 2 is mounted on the digital circuit board B side, the A side key 3 is installed in the motherboard. 射频电路1和数字电路2之间采用地隔离4屏蔽,射频线 和数字线之间也采用地隔离4屏蔽。 Using a radio frequency circuit and the digital circuit 4 between the two isolated shield, the shield 4 also used to isolate digit line and between the RF cable. 印刷电路板为6层,厚度只有0.6毫米。 The printed circuit board having 6 layers, thickness of only 0.6 mm. 如表3所示,与已有技术相比,其印刷电路板层数减少4层,厚度减少0.8毫米,省略支架厚度1.5毫米,总厚度减少2.3毫米。 As shown in Table 3, compared with the prior art, which reduces the printed circuit board layers 4 layers, reducing the thickness of 0.8 mm, 1.5 mm thick holder omitted, reducing the overall thickness of 2.3 mm. 实施例1采用ALIVH-G技术制作,尺寸小、厚度薄,而且生产成本较低、携带和使用更加方便。 Example 1 A production technology ALIVH-G, a small-sized, thin, and low production cost, more convenient to carry and use. 可广泛应用于移动通讯中。 It can be widely used in mobile communications.

Claims (3)

1.一种薄型手机,它由机壳,安装在机壳中的印刷电路板,安装在印刷电路板和机壳上的电子线路以及按键、显示器、听筒话筒和电源等所组成,其特征在于所说的印刷电路板中的主板只有一块,电子线路中的射频电路和数字电路安装在主板的一面,按键安装在主板的另一面。 A thin mobile phone, which consists of housing, a printed circuit board mounted in the cabinet, is mounted on the printed circuit board and housing electronic circuits and buttons, a display, a microphone, and earpiece of the power supply, and is characterized in that said printed circuit board only a motherboard, the electronic circuit of the RF circuit and the digital circuit board mounted on one side, the other side of the button mounting board.
2.按照权利要求1所述的薄型手机,其特征在于所说的印刷电路板上的射频电路和数字电路之间采用地隔离屏蔽,射频线和数字线之间也采用地隔离屏蔽。 2. The thin mobile phone according to claim 1, characterized in that a RF circuit and a digital circuit between said printed circuit board is isolated from the shield, also be employed between the line and the digit line RF shield isolated.
3.按照权利要求1或2所述的薄型手机,其特征在于所说的印刷电路板为6层,厚度只有0.6毫米。 3. The phone as claimed in claim thin or claim 12, wherein said printed circuit board having 6 layers, thickness of only 0.6 mm.
CN 03217710 2003-05-26 2003-05-26 Thin phone CN2622944Y (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008031278A1 (en) * 2006-09-13 2008-03-20 E28 (Shanghai) Limited A method for manufacturing a smart handset with a super-thin thickness
WO2009003381A1 (en) * 2007-07-02 2009-01-08 Huawei Technologies Co., Ltd. Mobile terminal device
CN101009982B (en) 2006-01-26 2010-09-29 上海毅仁信息科技有限公司 A method for making the ultra-thin smart handset
US7880817B2 (en) 2005-08-24 2011-02-01 Sharp Kabushiki Kaisha Receiver apparatus for outputting digital video and audio signals and receiver system incorporating the receiver apparatus
US7907218B2 (en) 2005-11-07 2011-03-15 Sharp Kabushiki Kaisha Receiver apparatus and receiver system
US7932957B2 (en) 2005-09-09 2011-04-26 Sharp Kabushiki Kaisha Receiver apparatus and receiver system
CN101257726B (en) 2007-02-26 2011-10-26 京瓷株式会社 Portable electronic device and portable telephone
CN102984317A (en) * 2012-12-10 2013-03-20 华为终端有限公司 Mobile terminal

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7880817B2 (en) 2005-08-24 2011-02-01 Sharp Kabushiki Kaisha Receiver apparatus for outputting digital video and audio signals and receiver system incorporating the receiver apparatus
US7932957B2 (en) 2005-09-09 2011-04-26 Sharp Kabushiki Kaisha Receiver apparatus and receiver system
US7907218B2 (en) 2005-11-07 2011-03-15 Sharp Kabushiki Kaisha Receiver apparatus and receiver system
CN101009982B (en) 2006-01-26 2010-09-29 上海毅仁信息科技有限公司 A method for making the ultra-thin smart handset
WO2008031278A1 (en) * 2006-09-13 2008-03-20 E28 (Shanghai) Limited A method for manufacturing a smart handset with a super-thin thickness
CN101257726B (en) 2007-02-26 2011-10-26 京瓷株式会社 Portable electronic device and portable telephone
WO2009003381A1 (en) * 2007-07-02 2009-01-08 Huawei Technologies Co., Ltd. Mobile terminal device
CN102984317A (en) * 2012-12-10 2013-03-20 华为终端有限公司 Mobile terminal
CN102984317B (en) * 2012-12-10 2015-07-22 华为终端有限公司 Mobile terminal

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