CN101008055A - Siler alloy for reflection or half-reflection layer - Google Patents
Siler alloy for reflection or half-reflection layer Download PDFInfo
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- CN101008055A CN101008055A CNA2006100069394A CN200610006939A CN101008055A CN 101008055 A CN101008055 A CN 101008055A CN A2006100069394 A CNA2006100069394 A CN A2006100069394A CN 200610006939 A CN200610006939 A CN 200610006939A CN 101008055 A CN101008055 A CN 101008055A
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Abstract
The invention provides a silver alloy, which possesses optical penetrance of reflection and semi- penetrance. It can reach stable reflection rate and penetrance rate by means of monolayer film formation in wide wave length range. By adjusting the thickness of said alloy membrane, combination of reflection and penetrance rate can be got, and then applies it to reflection layer or semi- relfection layer of optical assembly.
Description
Technical field
The present invention relates to a kind of silver alloys, with and as the purposes of reflecting layer or semi-reflective layer.
Background technology
Along with advancing by leaps and bounds of electronics industry science and technology, optoelectronics industry such as CD industry and flat-panel screens already wait has developed a large amount of consuming product, and wherein metallic reflective coating has been played the part of indispensable role.Utilize the characteristic such as reflection, half reflection, beam split, optical filtering of metal, can design different optical modules.
For instance, in reading the data process of optical data recording medium, laser beam sees through polycarbonate substrate and recording layer and read message by beam reflected on the reflecting layer.Reflectivity, resistance to sudden heating and chemical stability etc. thereby become the factor of selecting the required consideration of reflector material for use.The material that becomes known for the reflecting layer has silver, silver alloys (as the Ag-Pd alloy), aluminium alloy (as the Al-Ti alloy).The optical maser wavelength that generally is usually used in the optical data recording medium be 780,650 and 405nm near, and this type of metal or alloy multilist in 400 to 800nm wide area wavelength region reveals high-reflectivity.With regard to display unit, then many use aluminium and aluminium alloy (as the Al-Nd alloy) are as the material in reflecting layer.
Recently, the DVD epoch of heavy body, high tone quality and high image quality arrive, and wherein the DVD disc plate of single-surface double-layer also has semi-reflective layer except having the high reflection layer.In the application of semi-reflective layer,, need usually to use multilayer film just can reach for obtaining the close combination of reflectivity and penetration coefficient.For example, No. 90118577 patent application case of TaiWan, China discloses combination ag alloy layer and titanium oxide layer to obtain reflectivity and penetration coefficient effect about equally.In view of this, only need plate unitary film can obtain the alloy of same effect thereby more meet the industry demand.
Summary of the invention
The invention provides a kind of silver alloys, it reaches the optical characteristics that partly penetrates with reflection, therefore can reach the combination of stable reflection and penetration coefficient by means of forming unitary film in wide wavelength region.Also have, can obtain required reflection and penetration coefficient combination by means of the thickness of adjusting this alloy film, thereby be applied on the reflecting layer or semi-reflective layer of optical module.
For meeting the demand, one of the object of the invention is for providing silver alloys, and it mainly is made up of the metal of Ag, a kind of Zn of being selected from, Sn and Cd and the metal of a kind of Al of being selected from, Ga, In, Si, Ge and Sb, and it is with formula Ag
xX
zY
rExpression, wherein X is Zn, Sn or Cd, Y is Al, Ga, In, Si, Ge or Sb; And with the silver alloys gross weight is benchmark, and z is 0.01～5 weight %, and r is 0.01～3 weight %, and x is a surplus.
The present invention also provides a kind of silver alloys, and it mainly is made up of the metal of Ag, Cu and a kind of Zn of being selected from, Sn and Cd, and it is with formula Ag
xCu
yX
zExpression, wherein X is Zn, Sn or Cd; And with the silver alloys gross weight is benchmark, and y is 0.01～8 weight %, and z is 0.01～5 weight %, and x is a surplus.
Silver alloys of the present invention can contain the metal of a kind of Al of being selected from, Ga, In, Si, Ge and Sb in addition, and it is with formula Ag
xCu
yX
zY
rExpression, wherein X is Zn, Sn or Cd, Y is Al, Ga, In, Si, Ge or Sb; And with the silver alloys gross weight is benchmark, and y is 0.01～8 weight %, and z is 0.01～5 weight %, and r is 0.01～3 weight %, and x is a surplus.
Silver alloys of the present invention not only has unique optical characteristics, and its method for making is also simple and easy than known method.Particularly, silver alloys of the present invention can utilize cycle induction melting technology, at first silver is heated to fusing, adds an amount of alloying element (according to the alloy ratio adjustment) subsequently, and ingot casting is made in casting.Need use (the Vacuum ArcRemelting Process of vacuum arc melting system with respect to other alloy, VAR) or vacuum induction melting technology (Vacuum InductionMelting Process, it has more competitiveness VIM) to wait comparatively complicated and expensive technology.After using the cycle induction melting, remove the oxide compound on gained silver alloys surface, and after utilizing roller press to be machined to 9 * 9cm size, heat-treat material is homogenized, and the leveling material surface is cut out following 2 inches circular targets (the about 3mm of thickness) with wire cutting machine again in order to following process.Therefore thickness in the standard target is about 6.35mm, alloy target material is carried out soft soldering with indium and is bonded on the red metal backboard and makes target reach standard thickness.
Silver alloys of the present invention can form metal level by means of the known sputtering method.Generally speaking, the surfaceness of alloy coating is influenced by operating pressure and substrate temperature mainly.Can improve electricity slurry dissociation yield if improve operating pressure, but can density of film be reduced, cause membrane structure loose and surfaceness is higher because of rete is mingled with gas easily; Become big and the crystal grain of film is grown up the substrate heating along with the increase of substrate temperature, and produce tangible crystal boundary chase appearance, so surfaceness increases relatively.Main process parameter of the present invention (as background pressure, operating pressure, sputter power and substrate temperature) is all controlled identical, and is therefore, little by the mean roughness otherness of the formed film of silver alloys of the present invention.In addition, silver alloys of the present invention also has clear improvement to thermotolerance, and therefore formed alloy firm has little mean roughness under thermal treatment.
An other purpose of the present invention provides the reflecting layer, and it is formed by silver alloys of the present invention.When the about 80nm of silver alloys thickness of the present invention is above, can reach totally reflected effect.On the other hand, silver alloys of the present invention, can be applicable on the semi-reflective layer during approximately less than 80nm at thickness, wherein reflectivity be about 20%～40% and penetration coefficient be about 50% better when above.
The range of application of silver alloys of the present invention also can be applicable to multiple industries such as liquid crystal panel, large glass or PDA(Personal Digital Assistant) except aforementioned CD production (as DVD).
Description of drawings
Fig. 1 is the cycle induction melting furnace of preparation silver alloys of the present invention.
Fig. 2 is the microstructure of the ACZ1 alloy target material of one of specific examples of the present invention.
Fig. 3 (a) is the precipitate in the ACZ1 alloy target material of one of specific examples of the present invention.
Fig. 3 (b) analyzes for the EDX in the ACZ1 alloy target material of one of specific examples of the present invention.
Fig. 4 (a) is that the field emission microscope of the ACZ1 alloy firm original surface pattern of the present invention of thickness 30nm is observed.
Fig. 4 (b) is that the field emission microscope of the ACZ1 alloy firm original surface pattern of the present invention of thickness 100nm is observed.
Fig. 5 (a) is the atomic force microscope observation of the ACZ1 alloy firm original surface pattern of the present invention of the thick 100nm of first plated film.
Fig. 5 (b) is the atomic force microscope observation of the ACZ1 alloy firm original surface pattern of the present invention of the thick 30nm of first plated film.
Fig. 6 (a) is the atomic force microscope observation of ACZ1 alloy firm of the present invention original surface pattern after 100 ℃ of thermal treatment of thick 100nm.
Fig. 6 (b) is the atomic force microscope observation of ACZ1 alloy firm of the present invention original surface pattern after 200 ℃ of thermal treatment of thick 100nm.
Fig. 7 (a) is the atomic force microscope observation of ACZ1 alloy firm of the present invention original surface pattern after 100 ℃ of thermal treatment of thick 30nm.
Fig. 7 (b) is the atomic force microscope observation of ACZ1 alloy firm of the present invention original surface pattern after 200 ℃ of thermal treatment of thick 30nm.
Fig. 8 just plates the reflectivity of optical thin film spectrogram for the silver-bearing copper series alloy of thick 20nm and 30nm.
Fig. 9 (a) to (e) is each alloy plated film reflectivity of optical thin film/penetration rate spectrum figure just.
Figure 10 (a) is ACT1 and the reflectance varies of ACZ1 alloy firm of the present invention after different tests under wavelength 405nm.
Figure 10 (b) is ACT1 and the reflectance varies of ACZ1 alloy firm of the present invention after different tests under wavelength 650nm.
Figure 11 for ACZ1 of the present invention respectively at first plated film, place that a week, 100 ℃ of thermal treatment, 200 ℃ handle and the spectrogram of weather resistance test rear film reflectivity.
The primary clustering nomenclature
The R reflectivity
The T penetration coefficient
AC0.5 represents to add in the silver alloys 0.5 weight %Cu.
AC1.5 represents to add in the silver alloys 1.5 weight %Cu.
ACT1 represents to add in the silver alloys 1 weight %Cu and 1 weight %Ti.
ACT3 represents to add in the silver alloys 1 weight %Cu and 3 weight %Ti.
ACZ1 represents to add in the silver alloys 1 weight %Cu and 1 weight %Zn.
ACZ3 represents to add in the silver alloys 1 weight %Cu and 3 weight %Zn.
Embodiment
Following embodiment only is illustrative application of the present invention and effect, is not to be used to limit the present invention.Those skilled in the art are for all belonging in the category of the present invention in various corrections of being done under the situation of spirit of the present invention and change.
The preparation example of silver alloys
Alloy melting
Silver is placed as shown in Figure 1 cycle induction melting furnace (reference: M.P.Groover, " Fundamentals of Modern Manufacturing 2/e ", 2002 John Wiley﹠amp; Sons, Inc.p235) in, silver is heated to fusing.Add other alloying element subsequently, its component proportions is as shown in table 1.Ingot casting is made in casting.
Table 1 silver alloys composition ratio
| Composition | Silver | Copper | Zinc |
| The expectation ratio | 98 weight % | 1 weight % | 1 weight % |
| Substantial proportion (ICP) | 98.062 weight % | 0.921 weight % | 1.017 weight % |
The target processing instance
After using cycle induction melting silver alloys, after removing the oxide compound on silver alloys surface and utilizing roller press that it is machined to 9 * 9cm size, heat-treat,, cut out the circular material of following 2 inches thick 3mm again with wire cutting machine so that material homogenizes and flattens material surface in order to following process.Alloy target material carries out soft soldering with indium and is engaged on the red metal backboard, makes target reach standard thickness 6.35mm.
Alloy component analysis
Use ionic bond electricity slurry mass spectrograph (ICP-MS) that the silver alloys that makes is carried out composition analysis, its actual alloying constituent proportional recording is in table 1.
The target microstructure analysis
Utilize opticmicroscope that the silver alloys target that makes is carried out metallurgical analysis, its result is shown in Fig. 2 and Fig. 3 (a).
The silver alloys target that makes is carried out energy dispersed light spectrometer (EDX) analysis, and the result is shown in Fig. 3 (b).
The preparation of plated film
Silver alloys target of the present invention is made the plated film of thick 30nm and 100nm respectively with known jet-plating method, and use therein sputter parameter is as shown in table 2.
Table 2 sputter parameter
| Substrate | Si chip, BK7 glass |
| Background pressure | 7.0×10 -4Torr |
| The Ar flow | About 100sccm |
| Operating pressure | 5.0×10 -3Torr |
| Direct supply | 100W |
| Collision time | 15 seconds |
| The |
5 seconds to 45 seconds |
Plated film is analyzed
Field emission microscope is observed
Use field emission microscope to observe the surface topography of the silver alloy film of the present invention of thick 30nm of plated film and 100nm, shown in Fig. 4 (a) and 4 (b).
Atomic force microscope (AFM) is observed
Use the surface profile of the silver alloy film of the present invention of atomic force microscope observation thickness 30nm and 100nm, its stereopsis figure is shown in Fig. 5 (a) and 5 (b).Measure via surfaceness, its roughness of film (Ra) is all less than 0.8nm.
Surfaceness relatively
Measure via surfaceness, relatively the surfaceness of silver alloy film of the present invention and other known alloy firm is as shown in table 3.
Table 3 just plated film roughness of film compares
Various alloy firms through the variation of heat treatments at different rear surface roughness shown in table 4 and table 5.
Each alloy firm of table 4 (surfaceness after heat treatments at different of thickness=100nm)
Each alloy firm of table 5 (surfaceness after heat treatments at different of thickness=30nm)
Fig. 6 (a) and (b) and Fig. 7 (a) and (b) for ACZ1 alloy coating of the present invention through 100 ℃ with 200 ℃ of thermal treatments after AFM measuring surface appearance result.The result shows that ACZ1 has clear improvement to thermotolerance, no matter be the thermal treatment of 100 ℃ or 200 ℃, mean roughness is all about 0.2nm.
The optical characteristics of alloy firm
The alloy of the present invention and the known alloy that use spectrophotometer (SP 1024 USB spectrophotometer, IZOVAC Ltd.) to measure thick respectively 20nm and 30nm just plate the reflectivity of film in 400～800nm wavelength region, as shown in Figure 8.
Also have, use the alloy of the present invention of the thick 30nm of spectrophotometer measurement and the reflectivity that known alloy just plates film.Obtain the spectrogram of each the alloy firm reflectivity/penetration coefficient in 400～800nm wavelength region, shown in Fig. 9 (a) to (e).By spectrogram as can be known, ACZ1 alloy firm of the present invention has stable reflection and penetration coefficient ratio with respect to other known alloy firm in 400～800nm wavelength region.
Compare ACZ1 alloy firm of the present invention and the reflectance varies of known ACT1 alloy firm after various tests, shown in Figure 10 (a) and 10 (b).As seen from the figure, the reflectivity decline ratio of placing a week back ACT1 is very big, descends but the reflectivity of ACZ1 after for every test then presents linear the mitigation.
ACZ1 alloy firm of the present invention is measured its reflectivity in every test back in 400～800nm wavelength region, obtain spectrogram, shown in Figure 11 (a) and 11 (b).
Claims (9)
1. silver alloys, it mainly is made up of the metal of Ag, a kind of Zn of being selected from, Sn and Cd and the metal of a kind of Al of being selected from, Ga, In, Si, Ge and Sb, and it is with formula Ag
xX
zY
rRepresent that wherein X is Zn, Sn or Cd, Y is Al, Ga, In, Si, Ge or Sb; And with the silver alloys gross weight is benchmark, and z is 0.01～5 weight %, and r is 0.01～3 weight %, and x is a surplus.
2. silver alloys, it mainly is made up of the metal of Ag, Cu and a kind of Zn of being selected from, Sn and Cd, and it is with formula Ag
xCu
yX
zRepresentative, wherein X is Zn, Sn or Cd; And with the silver alloys gross weight is benchmark, and y is 0.01～8 weight %, and z is 0.01～5 weight %, and x is a surplus.
3. apply for a patent 2 silver alloys, it contains the metal of a kind of Al of being selected from, Ga, In, Si, Ge and Sb again, with formula Ag
xCu
yX
zY
rRepresentative, wherein X is Zn, Sn or Cd, Y is Al, Ga, In, Si, Ge or Sb; And with the silver alloys gross weight is benchmark, and y is 0.01～8 weight %, and z is 0.01～5 weight %, and r is 0.01～3 weight %, and x is a surplus.
4. silver alloy film, its silver alloys by claim 1 or 2 forms.
5. the silver alloy film of claim 4, it is as reflecting layer 2 or semi-reflective layer.
6. optical recording medium, its silver alloy film that contains claim 4 is as reflecting layer or semi-reflective layer.
7. display unit, its silver alloy film that contains claim 4 is as reflecting layer or semi-reflective layer.
8. a method for preparing the silver alloys of claim 1 is characterized in that using the melting of cycle induction melting furnace.
9. method that forms the silver alloy film of claim 4, it is formed on the substrate by means of physical vapor deposition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100069394A CN101008055A (en) | 2006-01-26 | 2006-01-26 | Siler alloy for reflection or half-reflection layer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100069394A CN101008055A (en) | 2006-01-26 | 2006-01-26 | Siler alloy for reflection or half-reflection layer |
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| Publication Number | Publication Date |
|---|---|
| CN101008055A true CN101008055A (en) | 2007-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100069394A Pending CN101008055A (en) | 2006-01-26 | 2006-01-26 | Siler alloy for reflection or half-reflection layer |
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|---|---|
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102092679A (en) * | 2011-01-06 | 2011-06-15 | 上海大学 | Method for manufacturing (0, 1, 2 and non-integer)-dimension germanium nanometer controllable structures |
| CN102687044A (en) * | 2010-01-25 | 2012-09-19 | 株式会社神户制钢所 | Reflective film laminate |
| CN105220003A (en) * | 2015-10-25 | 2016-01-06 | 无棣向上机械设计服务有限公司 | A kind of high temperature resistant silver alloy and preparation method thereof |
-
2006
- 2006-01-26 CN CNA2006100069394A patent/CN101008055A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102687044A (en) * | 2010-01-25 | 2012-09-19 | 株式会社神户制钢所 | Reflective film laminate |
| CN102092679A (en) * | 2011-01-06 | 2011-06-15 | 上海大学 | Method for manufacturing (0, 1, 2 and non-integer)-dimension germanium nanometer controllable structures |
| CN105220003A (en) * | 2015-10-25 | 2016-01-06 | 无棣向上机械设计服务有限公司 | A kind of high temperature resistant silver alloy and preparation method thereof |
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Open date: 20070801 |