CN100570421C - A kind of photoelectric encapsulation structure - Google Patents
A kind of photoelectric encapsulation structure Download PDFInfo
- Publication number
- CN100570421C CN100570421C CNB2008100866687A CN200810086668A CN100570421C CN 100570421 C CN100570421 C CN 100570421C CN B2008100866687 A CNB2008100866687 A CN B2008100866687A CN 200810086668 A CN200810086668 A CN 200810086668A CN 100570421 C CN100570421 C CN 100570421C
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- Prior art keywords
- fiber
- transceiver device
- optoelectronic transceiver
- dip plane
- face
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 22
- 230000005693 optoelectronics Effects 0.000 claims abstract description 49
- 239000013307 optical fiber Substances 0.000 claims abstract description 36
- 239000000835 fiber Substances 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 230000000994 depressogenic effect Effects 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 abstract description 12
- 238000010168 coupling process Methods 0.000 abstract description 12
- 238000005859 coupling reaction Methods 0.000 abstract description 12
- 238000013461 design Methods 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
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Abstract
The invention discloses a kind of photoelectric encapsulation structure, comprise substrate and be installed in optoelectronic transceiver device on the substrate, also be provided with the structure of fiber_optic that is used for bearing fiber on the described substrate, the side that described structure of fiber_optic is pressed close to described optoelectronic transceiver device and close described optoelectronic transceiver device is provided with a dip plane, described dip plane is provided with at least one groove, optical fiber is fastened in the described groove, and fiber end face is positioned at the top of the light transmitting-receiving face of described optoelectronic transceiver device.Whole coupled system of the present invention does not need lens, and is compact to design, with low cost, improved the coupling efficiency between optical fiber and optoelectronic transceiver device and increased the margin tolerance of assembling.
Description
Technical field
The present invention relates to optical communication field, relate in particular to a kind of photoelectric encapsulation structure.
Background technology
Along with the development of optical communication technique, optical fiber has been widely used in various communicatory occasions.The principal mode of optical communication is to transmit the arrival transmission destination by the light signal beared information by optical fiber, utilizes the optoelectronic transceiver device that light signal is converted into electric signal then and obtains information for transmission destination.Because optical fiber is low-loss good transmission medium, in optical communication, main loss occurs in the process of optoelectronic transceiver device transmitting-receiving light signal, and promptly the coupling efficiency of optical fiber and optoelectronic transceiver device has bigger influence to the loss of optical communication.
Summary of the invention
In view of this, the present invention proposes a kind of photoelectric encapsulation structure, the margin tolerance in the time of can improving the coupling efficiency between optical fiber and optoelectronic transceiver device effectively and increase assembling.
In order to solve the problems of the technologies described above, the present invention has adopted following technical scheme:
A kind of photoelectric encapsulation structure, comprise substrate and be installed in optoelectronic transceiver device on the substrate, also be provided with the structure of fiber_optic that is used for bearing fiber on the described substrate, the side that described structure of fiber_optic is pressed close to described optoelectronic transceiver device and close described optoelectronic transceiver device is provided with a dip plane, described dip plane is provided with at least one groove, optical fiber is fastened in the described groove, and fiber end face is positioned at the top of the light transmitting-receiving face of described optoelectronic transceiver device, the angle of the light transmitting-receiving face of described dip plane and described optoelectronic transceiver device is not more than 60 degree, and described fiber end face is received and dispatched the vertical range of face less than 3 millimeters to the light of described optoelectronic transceiver device.
Preferably, this angle be 30 spend to 45 the degree.
The shape of cross section of described groove is " V " shape, " U " shape or rectangle.
Described dip plane also is provided with a depressed area at the upper side place near structure of fiber_optic, and the described optical fiber that is fastened in the described groove passes through the upper side that described depressed area extends to structure of fiber_optic.
Described photoelectric encapsulation structure also comprises transparent shroud, and described transparent shroud covers on the described dip plane.
Another kind of photoelectric encapsulation structure of the present invention, comprise substrate and be installed in optoelectronic transceiver device on the substrate, also be provided with the structure of fiber_optic that is used for bearing fiber on the described substrate, the side that described structure of fiber_optic is pressed close to described optoelectronic transceiver device and close described optoelectronic transceiver device is provided with a dip plane, carry a positioning table on the described dip plane, described positioning table is provided with at least one groove, optical fiber is fastened in the described groove, and fiber end face is positioned at the top of the light transmitting-receiving face of described optoelectronic transceiver device, the angle of the light transmitting-receiving face of described dip plane and described optoelectronic transceiver device is not more than 60 degree, and described fiber end face is received and dispatched the vertical range of face less than 3 millimeters to the light of described optoelectronic transceiver device.
Described positioning table is a silicon chip or glass sheet.
Compared with prior art, the present invention is by the close optoelectronic transceiver device of structure of fiber_optic and the dip plane is set on structure of fiber_optic, optical fiber is fastened in the groove on the dip plane, thereby make optical fiber be positioned as close to the light transmitting-receiving face of optoelectronic transceiver device at a certain angle, reached the purpose that improves the coupling efficiency between optical fiber and optoelectronic transceiver device, whole coupled system does not need lens, and is compact to design, with low cost.
Further, a depressed area is set on the dip plane, can plays buffer action optical fiber.
Description of drawings
Fig. 1 is the application synoptic diagram of the photoelectric encapsulation structure of the specific embodiment of the invention;
Fig. 2 is the overall schematic of the photoelectric encapsulation structure of the specific embodiment of the invention;
Fig. 3 is the structural representation of the structure of fiber_optic bearing fiber in the photoelectric encapsulation structure of the specific embodiment of the invention;
Fig. 4 is the decomposing schematic representation of the optical fiber of structure of fiber_optic in the photoelectric encapsulation structure of the specific embodiment of the invention and carrying thereof.
Embodiment
Contrast accompanying drawing and the present invention is further elaborated below in conjunction with embodiment.
As shown in Figure 1, in an application examples of the present invention, the photoelectric encapsulation structure 1 of the specific embodiment of the invention is installed on the pcb board (printed circuit board (PCB)) 2, the high speed optoelectronic converter of Gou Chenging can be linked in the various signal access devices 3 thus, for example possible a kind of signal access device 3 is HDMI (High Definition Multimedia Interface) (HDMI), obviously, the signal access device is not limited thereto, and the signal access device that can be other kind equally is inserting through the signal of high speed optoelectronic converter conversion.
A kind of embodiment of the photoelectric encapsulation structure of the specific embodiment of the invention is shown in Fig. 2,3 and 4, optoelectronic transceiver device 11, it for example can be photodiode, be set on the substrate 16, in the position of substrate 16 near optoelectronic transceiver device 11, be installed on a structure of fiber_optic 12, structure of fiber_optic 12 is provided with a dip plane 121 near a side of optoelectronic transceiver device 11, and the angle between the light transmitting-receiving face of dip plane 121 and optoelectronic transceiver device 11 is for being not more than 60 degree.On this dip plane 121, place a positioning table 13, positioning table 13 can be a silicon chip or glass sheet, on positioning table 13, offer many grooves 131 that are used for bearing fiber 14, many grooves 131 are uniformly-spaced to be arranged, the precision that need be less than 10 μ m usually, its spacing satisfies makes non-interfering transmission requirement between two optical fiber, and as using on more than a light transmitting and receiving system, the transmitting-receiving identity distance that also need satisfy light transmitting-receiving array is from requiring.The shape of cross section of groove 131 can be " V " shape, " U " shape, rectangle or the like, optical fiber 14 utilizes the ultraviolet curing bonding agent to be fastened in the groove 131, one end is positioned at the top of optoelectronic transceiver device 11, receives and dispatches the distance of face less than 3mm apart from the light of optoelectronic transceiver device.The other end of optical fiber 14 stretches out from the upper side of structure of fiber_optic 12, positioning table 13 is provided with depressed area 132 in the position near structure of fiber_optic 12 upper sides, make optical fiber 14 when groove 131 is stretched over the upper side of structure of fiber_optic 12, optical fiber 14 can obtain cushioning in depressed area 132 in the dogleg section of positioning table 13 to structure of fiber_optic 12 upper sides, optical fiber 14 can be in the depressed area 132 slowly extends to both sides, more outward with other outside structure Colaesce.In order to give optical fiber 14 with protection, also dispose transparent shroud 15 and cover the dip plane that carries optical fiber 14, transparent shroud 15 can adopt glass to make.
The foregoing description has been described the photoelectric encapsulation structure with positioning table 13, because the positioning table individualism has made things convenient for offering of groove 131 and depressed area 132.Be appreciated that for for simplicity essential positioning table 13 can directly be offered groove with bearing fiber fully on the dip plane of structure of fiber_optic 12.
A Consideration of the angle Selection of dip plane is the bending amplitude that optical fiber can bear, through experiment, the optical fiber pack camber of 30 degree～45 degree is to guarantee neither can cause the excessive bending of optical fiber, the scope that good coupling efficiency can be arranged again, the optical fiber pack camber is as exceeding 60 degree, and it is very low that coupling efficiency will become.Optical fiber pack camber, fiber end face see the following form 1 apart from the distance of the light transmitting-receiving face of optoelectronic transceiver device and the relation of coupling efficiency.
Table 1
| Fiber end face is apart from the distance (mm) of light transmitting-receiving face | Coupling efficiency (%) under 30 degree | Coupling efficiency (%) under 45 degree |
| 0.0625 | 100 | 99.7 |
| 0.1625 | 92 | 69.2 |
| 0.2625 | 40 | 28.2 |
| 0.3625 | 19.3 | 12.6 |
| 0.4625 | 11 | 7 |
Can see, coupling efficiency with fiber end face apart from the reducing and increase of the distance of the light of optoelectronic transceiver device transmitting-receiving face, on the other hand, coupling efficiency with the angle of fiber end face and light transmitting-receiving face reduce and increase to some extent.
The present invention is less than the high coupling efficiency of having reached under the 3mm situation between optical fiber and optoelectronic transceiver device at the optical fiber horizontal level to the optoelectronic transceiver height of devices, whole encapsulating structure does not need to use any optical lens, compact to design, reduced accuracy requirement and the cost produced.Because do not use any eyeglass, the feasible tolerance that does not have eyeglass itself, many optical fiber are fastened on the groove simultaneously, and the distance of optical fiber and optical fiber is quite accurate, and the margin tolerance when these two factors make assembling can increase.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (7)
1. photoelectric encapsulation structure, comprise substrate and be installed in optoelectronic transceiver device on the substrate, it is characterized in that, also be provided with the structure of fiber_optic that is used for bearing fiber on the described substrate, the side that described structure of fiber_optic is pressed close to described optoelectronic transceiver device and close described optoelectronic transceiver device is provided with a dip plane, described dip plane is provided with at least one groove, optical fiber is fastened in the described groove, and fiber end face is positioned at the top of the light transmitting-receiving face of described optoelectronic transceiver device, the angle of the light transmitting-receiving face of described dip plane and described optoelectronic transceiver device is not more than 60 degree, and described fiber end face is received and dispatched the vertical range of face less than 3 millimeters to the light of described optoelectronic transceiver device.
2. photoelectric encapsulation structure as claimed in claim 1 is characterized in that, the angle of the light of described dip plane and described optoelectronic transceiver device transmitting-receiving face is 30 to spend to 45 degree.
3. photoelectric encapsulation structure as claimed in claim 1 or 2 is characterized in that, the shape of cross section of described groove is " V " shape, " U " shape or rectangle.
4. photoelectric encapsulation structure as claimed in claim 1 or 2, it is characterized in that, described dip plane also is provided with a depressed area at the upper side place near structure of fiber_optic, and the described optical fiber that is fastened in the described groove passes through the upper side that described depressed area extends to structure of fiber_optic.
5. photoelectric encapsulation structure as claimed in claim 1 or 2 is characterized in that, also comprises transparent shroud, and described transparent shroud covers on the described dip plane.
6. photoelectric encapsulation structure, comprise substrate and be installed in optoelectronic transceiver device on the substrate, it is characterized in that, also be provided with the structure of fiber_optic that is used for bearing fiber on the described substrate, the side that described structure of fiber_optic is pressed close to described optoelectronic transceiver device and close described optoelectronic transceiver device is provided with a dip plane, carry a positioning table on the described dip plane, described positioning table is provided with at least one groove, optical fiber is fastened in the described groove, and fiber end face is positioned at the top of the light transmitting-receiving face of described optoelectronic transceiver device, the angle of the light transmitting-receiving face of described dip plane and described optoelectronic transceiver device is not more than 60 degree, and described fiber end face is received and dispatched the vertical range of face less than 3 millimeters to the light of described optoelectronic transceiver device.
7. photoelectric encapsulation structure as claimed in claim 6 is characterized in that, described positioning table is a silicon chip or glass sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008100866687A CN100570421C (en) | 2008-03-19 | 2008-03-19 | A kind of photoelectric encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008100866687A CN100570421C (en) | 2008-03-19 | 2008-03-19 | A kind of photoelectric encapsulation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101251632A CN101251632A (en) | 2008-08-27 |
| CN100570421C true CN100570421C (en) | 2009-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2008100866687A Expired - Fee Related CN100570421C (en) | 2008-03-19 | 2008-03-19 | A kind of photoelectric encapsulation structure |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106405754B (en) * | 2016-11-25 | 2018-01-16 | 华进半导体封装先导技术研发中心有限公司 | A kind of structure stand of optical fiber module and preparation method thereof |
| CN109038193A (en) * | 2018-09-07 | 2018-12-18 | 广东国志激光技术有限公司 | A kind of optical fiber self-retaining coiling apparatus and the method using the device coiled fiber |
| CN113937613A (en) * | 2021-09-22 | 2022-01-14 | 中国电子科技集团公司第十一研究所 | Satellite-borne pump LD strengthening assembly and laser |
| CN114415299B (en) * | 2022-03-30 | 2022-06-24 | 深圳市埃尔法光电科技有限公司 | Optical fiber signal direct-guiding type optical module |
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| Publication number | Publication date |
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| CN101251632A (en) | 2008-08-27 |
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Granted publication date: 20091216 |