CN100562239C - Heat abstractor - Google Patents

Heat abstractor Download PDF

Info

Publication number
CN100562239C
CN100562239C CNB2007100730752A CN200710073075A CN100562239C CN 100562239 C CN100562239 C CN 100562239C CN B2007100730752 A CNB2007100730752 A CN B2007100730752A CN 200710073075 A CN200710073075 A CN 200710073075A CN 100562239 C CN100562239 C CN 100562239C
Authority
CN
China
Prior art keywords
heat
transfer segment
heat transfer
base plate
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2007100730752A
Other languages
Chinese (zh)
Other versions
CN101237757A (en
Inventor
杨平安
符猛
陈俊吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CNB2007100730752A priority Critical patent/CN100562239C/en
Publication of CN101237757A publication Critical patent/CN101237757A/en
Application granted granted Critical
Publication of CN100562239C publication Critical patent/CN100562239C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations

Abstract

A kind of heat abstractor, be used for the heat-generating electronic elements on the circuit board is dispelled the heat, it comprises a base plate, be positioned at 2 first heat pipes and crooked 2 second heat pipes that are bonded to this base plate that some fins, bending on this base plate is bonded to described base plate, this 2 first heat pipe all is serpentine and parallel is bonded to this base plate, and each first heat pipe comprises one first heat transfer segment, one second heat transfer segment and one the 3rd heat transfer segment; Each second heat pipe comprises one first heat transfer segment, wherein first heat transfer segment of one second heat pipe is between first heat transfer segment and second heat transfer segment of this 2 first heat pipe, first heat transfer segment of another second heat pipe is between second heat transfer segment and the 3rd heat transfer segment of this 2 first heat pipe, make this two heat pipe cover most of zone of this base plate, and the heat that this base plate is absorbed is uniformly distributed on this base plate by this two heat pipe, distribute thereby make heat on this base plate promptly be passed to above-mentioned fin, the heat dispersion of this heat abstractor promotes.

Description

Heat abstractor
Technical field
The present invention relates to a kind of heat abstractor, relate in particular to a kind of heat abstractor that is used for electronic element radiating.
Background technology
Electronic components such as central processing unit produce a large amount of heat in running, for guaranteeing the normal operation of electronic component, the heat of its generation need distribute in time.Usually, install a heat abstractor on this electronic component additional and think its heat radiation.
Heat abstractor commonly used comprises a metal base plate and the some radiating fins that extend from this base plate.This base plate adheres on heat-generating electronic elements and absorbs the heat of its generation, and then heat transferred is dispersed into surrounding space to fin.Yet along with the development of electronic industry, the running frequency and the function of electronic component promote day by day, and its caloric value also increases thereupon.Above-mentioned heat abstractor often adds a heat pipe to promote its heat dispersion.Heat-pipe radiating apparatus commonly used comprises a base plate, be located at these base plate one lip-deep some fins and be embedded at a linear heat pipe of this base plate.During use, the part of this base plate absorbs the heat that this electronic component produces as endothermic section contact electronic component, and the heat pipe section that is in this base plate endothermic section absorbs this heat, and then by its part of heat pipe heat is transmitted to other positions of base plate.Yet, because heat pipe is a linear, its configuration orientation on this base plate is single, and on base plate, can prolong and regional little, and can not heat is uniform to whole base plate, cause heat accumulation in the endothermic section that roughly is positioned at this base plate center, make that the heat dispersion of this heat-pipe radiating apparatus is not high, influence the normal operation of electronic component, so this heat abstractor needs further to improve.
Summary of the invention
In view of this, be necessary in fact the heat abstractor that provides a kind of heat dispersion good.
A kind of heat abstractor, be used for the heat-generating electronic elements on the circuit board is dispelled the heat, it comprises a base plate, be positioned at 2 first heat pipes and crooked 2 second heat pipes that are bonded to this base plate that some fins, bending on this base plate is bonded to described base plate, this 2 first heat pipe all is serpentine and parallel is bonded to this base plate, and each first heat pipe comprises one first heat transfer segment, one second heat transfer segment and one the 3rd heat transfer segment; Each second heat pipe comprises one first heat transfer segment, wherein first heat transfer segment of one second heat pipe is between first heat transfer segment and second heat transfer segment of this 2 first heat pipe, and first heat transfer segment of another second heat pipe is between second heat transfer segment and the 3rd heat transfer segment of this 2 first heat pipe.
Compared with prior art, above-mentioned first heat pipe and the second heat pipe bending are bonded on the above-mentioned base plate, make this two heat pipe cover most of zone of this base plate, and the heat that this base plate is absorbed is uniformly distributed on this base plate by this two heat pipe, distribute thereby make heat on this base plate promptly be passed to above-mentioned fin, the heat dispersion of this heat abstractor promotes.
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Description of drawings
Fig. 1 is the inverted three-dimensional exploded view of first embodiment of the invention heat abstractor.
Fig. 2 is the part assembly drawing of Fig. 1.
Fig. 3 is the assembly drawing of Fig. 2.
Fig. 4 is the inverted three-dimensional exploded view of second embodiment of the invention heat abstractor.
Fig. 5 is the inverted three-dimensional exploded view of third embodiment of the invention heat abstractor.
Fig. 6 is the assembly drawing of Fig. 5.
Fig. 7 is the inverted three-dimensional exploded view of fourth embodiment of the invention heat abstractor.
Embodiment
See also Fig. 1 to Fig. 3, the first embodiment of the invention heat abstractor comprises a base plate 10, be bonded to 2 first heat pipes 20 of this base plate 10, be bonded to 2 second heat pipes 30 of this base plate 10 and be arranged at fins group 40 on this base plate 10.
Above-mentioned base plate 10 is the good square plate body of a heat conductivility, and it has opposite first (not indicating) and second surface (not indicating).Above-mentioned first heat pipe 20 and second heat pipe 30 are bonded to the first surface of this base plate 10, and above-mentioned fins group 40 is bonded to the second surface of this base plate 10.The first surface of this base plate 10 is provided with in conjunction with the 2 first parallel grooves 110 of this first heat pipe 20 and in conjunction with the 2 second relative grooves 120 of this second heat pipe 30.Each first groove 110 roughly is serpentine, it second groove 113, that comprises that first groove 111, that roughly is positioned at this base plate 10 one the first limit portions roughly is positioned at these base plate 10 middle parts roughly be positioned at this base plate 10 1 second limit portion relative with this first limit portion the 3rd groove 115, connect first connecting portion 117 of this first groove 111 and second groove 113 and be connected this second groove 113 and second connecting portion 119 of the 3rd groove 115.This first groove 111, second groove 113 and the 3rd groove 115 are parallel to each other.This first connecting portion 117 and second connecting portion 119 roughly are positioned at the other two limit portions of this base plate 10.Each second groove 120 is roughly L-shaped, and it comprises that one first groove 121 reaches and second groove 123 of these first groove, 121 approximate vertical.Wherein first groove 121 of one second groove 120 is between first groove 111 and second groove 113 of this first groove 110, and second groove 123 is positioned at the outside of second connecting portion 119 of this first groove 110.First groove 121 of another second groove 120 is between second groove 113 and the 3rd groove 115 of this first groove 110, and second groove 123 is positioned at the outside of first connecting portion 117 of this first groove 110.Parallel first groove 111, second groove 113 and the 3rd groove 115. with this first groove 110 of first groove 121 of this second groove 120
Above-mentioned each first heat pipe 20 roughly is serpentine, its shape is similar to first groove 110 of above-mentioned base plate 10, and it comprises one first heat transfer segment 211, one second heat transfer segment 213, one the 3rd heat transfer segment 215, connects first linkage section 217 of this first heat transfer segment 211 and second heat transfer segment 213 and be connected this second heat transfer segment 213 and second linkage section 219 of the 3rd heat transfer segment 215.This first heat transfer segment 211, second heat transfer segment 213 and the 3rd heat transfer segment 215 are parallel to each other.The cross section of each section of this first heat pipe 20 is semicircle.This first heat pipe 20 has a serpentine planar bottom surface.
Above-mentioned each second heat pipe 30 is roughly L-shaped, its shape is similar to second groove 120 of above-mentioned base plate 10, it comprise that one first heat transfer segment 311, is extended from these first heat transfer segment, 311 ends and with second heat transfer segment 313 of these first heat transfer segment, 311 approximate vertical.The cross section of this first heat transfer segment 311 and second heat transfer segment 313 is semicircle.This second heat pipe 30 has one " L " shape planar bottom surface.
Above-mentioned fins group 40 comprises some assemblings fin unit (not indicating) together, and each fin unit comprises some fins (not indicating).The fin length difference of adjacent fin unit.The bottom surface of this fins group 40 forms a smooth faying face.
During assembling, above-mentioned first heat pipe 20, second heat pipe 30 are bonded to respectively in first groove 110, second groove 120 of above-mentioned base plate 10.First heat transfer segment 211 of first heat pipe 20 is bonded in first groove 111 of this first groove 110, in second groove 113 of second heat transfer segment 213 in conjunction with this this first groove 110, the 3rd heat transfer segment 215 is bonded in the 3rd groove 115 of this first groove 110, first linkage section 217 is bonded in first connecting portion 117 of this first groove 110, second linkage section 219 is bonded in second connecting portion 119 of this first groove 110, from first heat transfer segment 211 of this first heat pipe 20, second heat transfer segment 213, the 3rd heat transfer segment 215 lays respectively at the limit portion of this base plate 10, the middle part, limit portion.First heat transfer segment 311 of this second heat pipe 30 is bonded to first groove 121 of this second groove 120, second heat transfer segment 313 is bonded to second groove 123 of this second groove 120, thereby wherein first heat transfer segment 311 of one second heat pipe 30 is between first heat transfer segment 211 and second heat transfer segment 213 of this 2 first heat pipe 20, second heat transfer segment 313 is positioned at the outside of second linkage section 219 of this 2 first heat pipe 20, first heat transfer segment 311 of another second heat pipe 30 is between second heat transfer segment 213 and the 3rd heat transfer segment 215 of this 2 first heat pipe 20, and second heat transfer segment 313 is positioned at the outside of first linkage section 217 of this 2 first heat pipe 20.First heat transfer segment 311 of this 2 second heat pipe 30 is parallel to first heat transfer segment 211, second heat transfer segment 213 and the 3rd heat transfer segment 215 of this 2 first heat pipe 20.This 2 first heat pipe 20 and 2 second heat pipes 30 cover most of zone of these base plate 10 first surfaces.The first surface of these first heat pipe, 20 bottom surfaces, second heat pipe, 30 bottom surfaces and this base plate 10 constitutes a smooth contact-making surface with the contact heating electronic component.The bottom surface of above-mentioned fins group 40 be bonded to this base plate with this contact-making surface opposing second surface on.
During use, the middle part of above-mentioned heat abstractor base plate 10 is corresponding above-mentioned electronic component usually, the first surface of this base plate 10, be positioned at these base plate 10 middle parts first heat pipe 20 second heat transfer segment 213 and be positioned at these base plate 10 middle parts second heat pipe 30 first heat transfer segment, the 311 above-mentioned electronic components of contact and absorb the heat that this electronic component produces.The heat of this base plate 10, first heat pipe, 20 second heat transfer segment 213 and second heat pipe, 30 first heat transfer segment 311 directly or other parts by first heat pipe 20, second heat pipe 30 be distributed to the other parts of this base plate 10.Thereby the heat that this electronic component produces evenly distributes on this base plate 10, and then arrives above-mentioned fins group 40 equably and distributed by fin.
Compared with prior art, above-mentioned first heat pipe 20, second heat pipe, the 30 crooked supreme most of zones stating on the base plate 10 and cover these base plate 10 first surfaces that distribute, directly be uniformly distributed on this base plate 10 from the heat that above-mentioned electronic component absorbs, thereby the heat that electronic component is produced dispels the heat away apace from above-mentioned electronic component heat absorption and with this base plate 10.The heat dispersion of this heat abstractor promotes.
See also Fig. 4, it discloses the heat abstractor of second embodiment of the invention, the structure of this heat abstractor and above-mentioned first is executed the structural similarity of the heat abstractor of example, difference is that fins group 40 in the present embodiment is bonded to the first surface of base plate 10, and first heat pipe 20, second heat pipe 30 are between this base plate 10 and fins group 40.During use, the second surface contact heating electronic component of this base plate 10 and absorb the heat that electronic component produces.
See also Fig. 5 and Fig. 6, it discloses the heat abstractor of third embodiment of the invention, and the structure of this heat abstractor is similar to the mechanism of the heat abstractor of above-mentioned first embodiment, and difference is that the second heat pipe 30a roughly is " U " shape in the present embodiment.Each second heat pipe 30a comprises one first heat transfer segment 311a, the second heat transfer segment 313a parallel with this first heat transfer segment and connects this first heat transfer segment 311a and the linkage section 315a of this second heat transfer segment 313a.On described base plate 10, wherein the first heat transfer segment 311a of one second heat pipe 30a is between first heat transfer segment 211 and second heat transfer segment 213 of 2 first heat pipes 20, the second heat transfer segment 313a is positioned at the outside of the 3rd heat transfer segment 215 of this 2 first heat pipe 20, and linkage section 315a is positioned at the outside of second linkage section 219 of this 2 first heat pipe 20.On described base plate 10, the first heat transfer segment 311a of another second heat pipe 30a is between second heat transfer segment 213 and second heat transfer segment 215 of this 2 first heat pipe 20, the second heat transfer segment 313a is positioned at first heat transfer segment, 211 outsides of this 2 first heat pipe 20, and linkage section 315a is positioned at first linkage section, 217 outsides of this 2 first heat pipe 20.
See also Fig. 7, it discloses the heat abstractor of fourth embodiment of the invention, the structural similarity of the structure of this heat abstractor and above-mentioned the 3rd embodiment, difference is that fins group 40 among this embodiment is bonded to the first surface of base plate 10, and first heat pipe 20 and the second heat pipe 30a are between this base plate 10 and fins group 40.During use, the second surface contact heating electronic component of this base plate 10 and absorb the heat that this electronic component produces.

Claims (12)

1. heat abstractor, be used for the heat-generating electronic elements on the circuit board is dispelled the heat, it comprises a base plate and is positioned at some fins on this base plate, it is characterized in that: comprise that also bending is bonded to 2 first heat pipes and crooked 2 second heat pipes that are bonded to this base plate of described base plate, this 2 first heat pipe all is serpentine and parallel is bonded to this base plate, and each first heat pipe comprises one first heat transfer segment, one second heat transfer segment and one the 3rd heat transfer segment; Each second heat pipe comprises one first heat transfer segment, wherein first heat transfer segment of one second heat pipe is between first heat transfer segment and second heat transfer segment of this 2 first heat pipe, and first heat transfer segment of another second heat pipe is between second heat transfer segment and the 3rd heat transfer segment of this 2 first heat pipe.
2. heat abstractor as claimed in claim 1 is characterized in that: the respective surfaces of described first heat pipe, second heat pipe and base plate constitutes a smooth contact-making surface with the contact heating electronic component, described fin be bonded to this base plate with this contact-making surface facing surfaces.
3. heat abstractor as claimed in claim 1 is characterized in that: described first heat pipe, second heat pipe are between described fin and base plate.
4. as claim 2 or 3 described heat abstractors, it is characterized in that: described each first heat pipe comprises first linkage section of its first heat transfer segment of connection and second heat transfer segment and is connected second linkage section of its second heat transfer segment and the 3rd heat transfer segment.
5. heat abstractor as claimed in claim 4 is characterized in that: first heat transfer segment of described each first heat pipe, second heat transfer segment and the 3rd heat transfer segment are parallel to each other.
6. heat abstractor as claimed in claim 4 is characterized in that: described each second heat pipe comprise one with its first heat transfer segment not in second heat transfer segment of same straight line.
7. heat abstractor as claimed in claim 6 is characterized in that: described each second heat pipe is L-shaped, and its second heat transfer segment is extended from the end of its first heat transfer segment.
8. heat abstractor as claimed in claim 7, it is characterized in that: described wherein second heat transfer segment of one second heat pipe is positioned at second linkage section outside of described 2 first heat pipes, and second heat transfer segment of another second heat pipe is positioned at the outside of first linkage section of this 2 first heat pipe.
9. heat abstractor as claimed in claim 6 is characterized in that: described each second heat pipe is " U " shape, comprises that one connects the linkage section of its first heat transfer segment and its second heat transfer segment.
10. heat abstractor as claimed in claim 9 is characterized in that: first heat transfer segment and second heat transfer segment of described each second heat pipe are parallel to each other.
11. heat abstractor as claimed in claim 9, it is characterized in that: the described wherein linkage section of one second heat pipe is positioned at second linkage section outside of described 2 first heat pipes, its second heat transfer segment is positioned at the 3rd heat transfer segment outside of this 2 first heat pipe, the linkage section of another second heat pipe is positioned at first linkage section outside of this 2 first heat pipe, and its second heat transfer segment is positioned at first heat transfer segment outside of this 2 first heat pipe.
12. as claim 2 or 3 described heat abstractors, it is characterized in that: described some fins are divided into some unit, and the fin length of adjacent Unit two does not wait.
CNB2007100730752A 2007-02-02 2007-02-02 Heat abstractor Expired - Fee Related CN100562239C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2007100730752A CN100562239C (en) 2007-02-02 2007-02-02 Heat abstractor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2007100730752A CN100562239C (en) 2007-02-02 2007-02-02 Heat abstractor

Publications (2)

Publication Number Publication Date
CN101237757A CN101237757A (en) 2008-08-06
CN100562239C true CN100562239C (en) 2009-11-18

Family

ID=39921032

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2007100730752A Expired - Fee Related CN100562239C (en) 2007-02-02 2007-02-02 Heat abstractor

Country Status (1)

Country Link
CN (1) CN100562239C (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6651732B2 (en) * 2001-08-31 2003-11-25 Cool Shield, Inc. Thermally conductive elastomeric heat dissipation assembly with snap-in heat transfer conduit
CN2665919Y (en) * 2003-09-12 2004-12-22 珍通科技股份有限公司 Expansive heat radiation device
CN2746530Y (en) * 2004-12-02 2005-12-14 珍通科技股份有限公司 Conduction heat-sink structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6651732B2 (en) * 2001-08-31 2003-11-25 Cool Shield, Inc. Thermally conductive elastomeric heat dissipation assembly with snap-in heat transfer conduit
CN2665919Y (en) * 2003-09-12 2004-12-22 珍通科技股份有限公司 Expansive heat radiation device
CN2746530Y (en) * 2004-12-02 2005-12-14 珍通科技股份有限公司 Conduction heat-sink structure

Also Published As

Publication number Publication date
CN101237757A (en) 2008-08-06

Similar Documents

Publication Publication Date Title
CN101839658B (en) Heat sink
CN100470773C (en) Heat pipe radiating device
CN102449759B (en) Radiator
CN101573017A (en) Radiating device
CN101106888A (en) Heat radiation module
CN205430849U (en) Flexible even temperature plate
CN101861075A (en) Heat radiating device
US7487825B2 (en) Heat dissipation device
CN105611804B (en) Heat conductive pad, radiator and electronic product
US7891414B2 (en) Method for manufacturing heat dissipator having heat pipes and product of the same
CN100562231C (en) Heat-pipe radiating apparatus
CN103096678B (en) Heat abstractor
CN101415312B (en) Radiating device
KR20100039719A (en) Heat sink for electric and electronic products with propagation heat
US20060207747A1 (en) Isothermal plate heat-dissipating device
CN100562239C (en) Heat abstractor
CN101312634A (en) Heat radiating device
CN101115368A (en) Heat radiating device
CN101616567B (en) Heat sink
CN100518470C (en) Heat radiator
CN100464408C (en) Radiating apparatus
CN101212886B (en) Heat radiator
CN101528019A (en) Heat radiating device
CN100518477C (en) Heat radiating device
CN101374395B (en) Radiating device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091118

Termination date: 20150202

EXPY Termination of patent right or utility model