CN100559913C - High-frequency equipments assembly base plate and communicating machine - Google Patents

High-frequency equipments assembly base plate and communicating machine Download PDF

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Publication number
CN100559913C
CN100559913C CN 200610006443 CN200610006443A CN100559913C CN 100559913 C CN100559913 C CN 100559913C CN 200610006443 CN200610006443 CN 200610006443 CN 200610006443 A CN200610006443 A CN 200610006443A CN 100559913 C CN100559913 C CN 100559913C
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mentioned
frequency
base plate
circuit substrate
assembly base
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CN1809246A (en
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生田贵纪
古贺亘
韩纮己
横田裕子
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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Abstract

Overleaf on the surface of the circuit substrate that is covered by back side conductor layer (6), form and be used for putting the terminal electrode (9) that carries high-frequency apparatus (3), be formed with a plurality of holding wires (2) that are used for carrying out the handshaking between high-frequency apparatus (3) and the external circuit.Terminal electrode (9) is arranged on the central portion of circuit substrate, and holding wire (2) is radial extension from terminal electrode (9).Thereby can reduce the electromagnetic interference between the holding wire (2), for example be under the situation of duplexer at high-frequency apparatus (3), can bring into play well and be with overseas attenuation characteristic and stalling characteristic.

Description

High-frequency equipments assembly base plate and communicating machine
Technical field
The present invention relates to a kind of substrate that high-frequency apparatus is installed, particularly a kind ofly be suitable for installing employed high-frequency apparatus in the mobile communicating machine, be the high-frequency equipments assembly base plate that high frequency filter or send receives channel-splitting filter (below be called duplexer).
In addition, the invention still further relates to a kind of communicating machine that is loaded with above-mentioned high-frequency equipments assembly base plate of putting.
In addition, the invention still further relates to the method that a kind of evaluation is installed in the characteristic of the high-frequency apparatus on the above-mentioned high-frequency equipments assembly base plate.
Background technology
In recent years, for high frequency filters such as employed acoustic surface wave filter in the mobile communicating machines such as mobile phone, need its small-sized light weight more and more strongly, low by band territory internal loss, by big with overseas attenuation, and from by the band territory to by very precipitous with overseas characteristic variations.
In addition, for the signal that separates transmitter side frequency band (for example lower frequency one side), for the duplexer of the signal of receiver side frequency band (for example upper frequency one side), also require its small-sized light weight, transmission in duplexer is with in the high frequency filter, it is high to send in the low and receiving belt territory of band territory loss decay, receiving with in the high frequency filter, loss is low and to send in the band territory decay high in the receiving belt territory.In addition, in the duplexer, in order to prevent that sending signal leaks into the reception terminal from sending terminal, requires from sending terminal better to the stalling characteristic that receives terminal.In addition, as duplexer, need a kind of will send with high frequency filter for example low-frequency band side high frequency filter, with reception with high frequency filter incorporate, the more small-sized element of high frequency band side high frequency filter for example.
If do not use the high-frequency apparatus that satisfies above-mentioned requirements in communicating machine, then the problem that may produce is: it is low excessively and bring obstruction etc. to other radio communication machines to have sent or received the quality of unwanted wireless signal, received wireless signal.
In addition, for the characteristic of high frequency equipment such as aforesaid high frequency filter or duplexer is estimated, these high-frequency apparatus be put and be stated from evaluation with on the installation base plate, whether mensuration can access desired characteristic and estimate.
Owing to must accurately carry out evaluation of measuring, therefore usually being connected or, needing use scolding tin guarantee that reliable conductivity also is joined together securely between high-frequency apparatus and the high-frequency equipments assembly base plate being used for and being connected between high-frequency equipments assembly base plate and the coaxial connector and high-frequency equipments assembly base plate that the coaxial cable of analyzer is connected.
General high-frequency equipments assembly base plate and coupled high-frequency apparatus and the summary stereogram of coaxial connector have been shown among Figure 22.
High-frequency equipments assembly base plate has a plurality of insulator layers (not shown) and is formed with in inside on the surface of circuit substrate 50 of grounding conductor layer (not shown) in lamination, forms necessary electric loop with conductor and obtains.
This electric loop is by the terminal electrode (not shown) that is used for installing the high-frequency apparatus 41 that will estimate, holding wire 2 formations that are used to connect the signal electrode 23 and the grounding electrode 24 of coaxial connector and connect terminal electrode with the signal electrode 23 of high-frequency apparatus 41.Wherein, coaxial connector is mounted the cable and the high-frequency equipments assembly base plate that are used for being connected with analyzer and couples together.
In addition, be provided with the through hole 47 of the insulator layer that connects circuit substrate 50,, come to be electrically connected mutually with inner grounding conductor layer by conductor layer also is set in the inner face of through hole 47, reduce the stray inductance of grounding electrode 24, by increasing the ground connection effect like this.
Coaxial connector, usually by be used for the center conductor 44 of transmission signals, it is surrounded and the periphery conductor 45 of ground connection and the insulating element that they insulate constituted, center conductor 44 be in order can be connected with the signal electrode 23 of high-frequency equipments assembly base plate, and the parts of use form from the outstanding shape of insulating element and the width of thickness and signal electrode 23 and are complementary.
For each parts are assembled as shown in figure 22, at first, coating paste scolding tin (cream solder) on the terminal electrode that forms on the circuit substrate 50, and put thereon and carry a high-frequency apparatus 41, this high-frequency apparatus 41 with the corresponding position of terminal electrode on be provided with electrode, after by refluxing high-frequency equipments assembly base plate and high-frequency apparatus 41 being coupled together, respectively with signal electrode 23 and grounding electrode 24, with the center conductor 44 and the periphery conductor 45 of coaxial connector, weld with welding wire and flatiron.
Then, coaxial connector and the coaxial cable that is connected on the analyzer are coupled together, measure the characteristic of high-frequency apparatus 41.
In addition,, high-frequency equipments assembly base plate need be heated to the temperature (200 ℃～300 ℃) of scolding tin fusion, and high-frequency apparatus 41 be taken off by tweezers etc. for coaxial connector is taken off from high-frequency equipments assembly base plate.
In recent years, because the miniaturization lightweight of high-frequency apparatus constantly develops, the thermal capacity of equipment self also diminishes thereupon, therefore the problem that has the thermal endurance deterioration, thereby coaxial connector is being installed like that as described above, and need take off the time, requirement can be compared with the operating time in the past to finish installation shorter heating time, to take off.
In addition, not only carrying out like that as described above under the situation of evaluation of measuring, in high-frequency equipments assembly base plate being put communicating machines such as being stated from base station or terminal, come under the actual situation about using, also need be used for connecting between the coaxial connector and high-frequency equipments assembly base plate of high-frequency equipments assembly base plate and other circuit blocks, use scolding tin to couple together securely.If a little less than connecting, then can lose the reliability of conductivity, cause the reliability of the action of high-frequency apparatus to reduce.
Summary of the invention
Therefore, the objective of the invention is to, a kind of high-frequency equipments assembly base plate that can bring into play the characteristic of the high-frequency apparatus that carries of putting well is provided.
Another object of the present invention is to, provide a kind of can guarantee with coaxial connector between firm the connection, and when taking off, can take off the high-frequency equipments assembly base plate of coaxial connector simply.
Another purpose more of the present invention is, provide a kind of can be to being installed in the characteristic of the high-frequency apparatus on the above-mentioned high-frequency equipments assembly base plate, the evaluating characteristics of the high-frequency apparatus of estimating with high reliability.
High-frequency equipments assembly base plate of the present invention is characterized in that, has: circuit substrate has conductor layer in the back side or the inside of insulator layer; A plurality of terminal electrodes, it is arranged on the surface of foregoing circuit substrate, is connected with the terminal of high-frequency apparatus; And, a plurality of holding wires, it is arranged on the surface of foregoing circuit substrate, be connected with above-mentioned terminal electrode, above-mentioned holding wire is radial extension from above-mentioned terminal electrode, with the straight line of any 1 holding wire from above-mentioned terminal electrode virtual extension, any 1 holding wire does not constitute same straight line from the straight line of above-mentioned terminal electrode virtual extension with inciting somebody to action in addition.
Another kind of high-frequency equipments assembly base plate of the present invention is characterized in that having: circuit substrate has conductor layer in the back side or the inside of insulator layer; A plurality of terminal electrodes, it is arranged on the surface of foregoing circuit substrate, is connected with the terminal of high-frequency apparatus; A plurality of holding wires, it is arranged on the surface of foregoing circuit substrate, is connected with above-mentioned terminal electrode; And, grounding conductor layer, be arranged on the surface of foregoing circuit substrate, and be positioned at the both sides of above-mentioned holding wire, the grounding conductor layer that the both sides of above-mentioned holding wire are provided with, be connected with same above-mentioned conductor layer by connecting conductor, above-mentioned holding wire is radial extension from above-mentioned terminal electrode, with the straight line of any 1 holding wire from above-mentioned terminal electrode virtual extension, any 1 holding wire does not constitute same straight line from the straight line of above-mentioned terminal electrode virtual extension with inciting somebody to action in addition.
The straight line of above-mentioned two virtual extensions intersects at 1 sometimes, and is parallel to each other sometimes.
Above-mentioned terminal electrode can be arranged on the optional position of foregoing circuit substrate, for example can be arranged on the central portion.
By this high-frequency equipments assembly base plate,, can between adjacent holding wire, allow the approaching part between the holding wire shorten, thereby can reduce the electromagnetic coupled between the holding wire by allowing above-mentioned holding wire be radial extension from above-mentioned terminal electrode.In addition, because holding wire direction each other staggers, therefore has the signal that allows in the transmission of holding wire cathetus, be difficult to be transferred in other holding wires advantage (in general, in accurate TEM ripple as the transmission mode of microstrip line, extending direction at two holding wires constitutes under the collinear situation, the easiest transmission of signal between this holding wire).
Therefore, the present invention can bring into play overseas attenuation characteristic of being with of they and stalling characteristic well using under high frequency filter or the situation of duplexer as high-frequency apparatus.
On the surface of preferred foregoing circuit substrate, the both sides of above-mentioned holding wire are provided with grounding conductor layer, and the interval W between above-mentioned holding wire and the above-mentioned grounding conductor layer is greater than above-mentioned holding wire and be formed on the back side of above-mentioned insulator layer or the interval t between the inner above-mentioned conductor layer.
Between holding wire and the grounding conductor layer, respectively filled half by air and the dielectric constant dielectric body higher than air, relative therewith, between holding wire and the conductor layer, filled by the dielectric dielectric that dielectric constant is higher than air.Therefore concentrate electric field between holding wire and the conductor layer easily.
Therefore, narrower by the interval that allows between holding wire and the conductor layer than the interval between holding wire and the grounding conductor layer, can be with the electromagnetic field that produced around the holding wire, specially be enclosed in the insulator layer between the conductor layer with the back side of facing holding wire.
So, can reduce the aerial each other electromagnetic interference of the lip-deep holding wire that is arranged on installation base plate, using under high frequency filter or the situation of duplexer as high-frequency apparatus, can further improve measuring their influence, perhaps bring into play their obstacle with overseas attenuation or stalling characteristic with overseas attenuation or stalling characteristic.
Be formed with perforation foregoing circuit substrate, and under the situation of a plurality of perforation conductors that are electrically connected with the above-mentioned conductor layer of the back side that is formed on above-mentioned insulator layer or inside, because through connecting conductor and the back side or conductor inside layer, the grounding conductor layer that is arranged on the both sides of holding wire is electrically connected, and therefore can eliminate the potential difference between the grounding conductor layer.Therefore, the earthing potential of the grounding conductor layer in can the surface of stabilizing circuit substrate, the interference of minimizing between the holding wire of grounding conductor layer, therefore using under high frequency filter or the situation of duplexer, more well evaluation of measuring or bring into play it and be with overseas attenuation characteristic or stalling characteristic as high-frequency apparatus.
In addition, when high-frequency apparatus is the piezoelectrics filter, by allowing the holding wire that extends from the input terminal of piezoelectrics filter and lead-out terminal constitute as previously mentioned, can allow influence to the piezoelectrics filter with overseas attenuation characteristic, compare with high-frequency equipments assembly base plate in the past and improve.And,, also can keep the outstanding overseas attenuation characteristic of being with even use the piezoelectrics filter of height miniaturization.
In addition, when high-frequency apparatus is to use the channel-splitting filter of piezoelectrics filter, owing to can suppress from the transmission of channel-splitting filter with terminal, antenna terminal and receive electromagnetic coupled between the holding wire that extends with terminal, so installation base plate of being realized, the transmission that can make channel-splitting filter with high frequency filter and receive with high frequency filter separately be with overseas attenuation characteristic very outstanding, and can access high score from characteristic.And,, also can keep outstanding overseas attenuation characteristic and the stalling characteristic be with even use the channel-splitting filter of height miniaturization.
In addition, put piezoelectrics filter that is loaded in the high-frequency equipments assembly base plate of the present invention and the channel-splitting filter that uses it as high-frequency apparatus, can be the element that uses elastic surface wave, also can be to use the element etc. of the so-called FBAR of use (Film Balk Acoustic Resonator) of bulk wave.Effect of the present invention, to all miniaturizations high frequency filter and channel-splitting filter all effective.
In addition, high-frequency equipments assembly base plate of the present invention is suitable for being configured for the circuit substrate of middle actual uses such as mobile communicating machine and the circuit module of the RF integrally of communicating machine and the module substrate of miniaturization etc.
In addition, as described later, high-frequency equipments assembly base plate of the present invention can be applicable to the evaluation of measuring of high-frequency apparatus.
Next, high-frequency equipments assembly base plate of the present invention has: circuit substrate has conductor layer in the back side or the inside of insulator layer; Terminal electrode, it is arranged on the surface of foregoing circuit substrate, is used for putting a year high-frequency apparatus; Holding wire, it is arranged on the surface of foregoing circuit substrate, is connected with above-mentioned terminal electrode; Signal electrode, it is arranged on the periphery on surface of foregoing circuit substrate, is connected with above-mentioned holding wire, and is connected with the center conductor of coaxial connector; And, grounding electrode, it is arranged on the periphery on surface of foregoing circuit substrate, be used to use scolding tin to connect the periphery conductor of above-mentioned coaxial connector, in the above-mentioned grounding electrode, in adhering to the zone of above-mentioned scolding tin, be formed with the through hole that connects the foregoing circuit substrate, on the inner face of this through hole, be coated with conductor layer.
By this high-frequency equipments assembly base plate, when using scolding tin that the periphery conductor of coaxial connector is installed, scolding tin flow in the through hole.By like this, can be with the periphery conductor of coaxial connector, firm engagement is on the grounding electrode of circuit substrate.
In addition, with as in the past Figure 22, the situation that through hole 47 is set on the part near high-frequency apparatus 41 of circuit substrate 50 is compared, can be under the littler state of stray inductance, the grounding conductor layer of inside is connected with the earthing potential of analyzer, therefore can measures the characteristic of high-frequency apparatus more exactly.
In addition, with the coaxial connector in the high-frequency equipments assembly base plate of the present invention discussed above, effect when being installed on the high-frequency equipments assembly base plate, certainly to coaxial connector with high-frequency equipments assembly base plate temporarily couples together and it is effective to take off the situation of coaxial connector after mensuration, to the so-called mainboard that will need permanent connection, when coupling together, also very effective with the connector that is connected this mainboard and external circuit.
In addition, as described later, with coaxial connector when high-frequency equipments assembly base plate takes off, and when in being connected of this mainboard of the permanent connection of needs and connector, needing to repair, very effective.
The foregoing circuit substrate can be the laminated substrate that lamination has a plurality of insulator layers, and its inside is formed with internal conductor layer, is formed on the conductor layer of the inner face of above-mentioned through hole, can be connected with above-mentioned internal conductor layer.
In addition, preferably the back side of foregoing circuit substrate with the corresponding position of above-mentioned grounding electrode on, be formed with the 2nd grounding electrode, the 2nd grounding electrode, the above-mentioned conductor layer of the inner face through being formed on above-mentioned through hole is connected with above-mentioned grounding electrode.
In this structure,, therefore can connect coaxial connector more securely because scolding tin passes through through hole continued presence to the 2 grounding electrode places always.Simultaneously, when carrying out the scolding tin connection, the scolding tin of the heat of flatiron from the face that is present in a side (for example surface), scolding tin in through hole passes to the scolding tin on the face (for example back side) that is present in opposite side rapidly, therefore the scolding tin on two sides fusion simultaneously, thus can be through the soldering tin amount equalization of through hole by the two sides.
In addition, when taking off coaxial connector, therefore the scolding tin fusion simultaneously on two sides can easily can be finished and is taken off operation the short time too.So, the put high-frequency apparatus that carries can be taken off and can not make its characteristic degradation.In addition, can also reuse coaxial connector and high-frequency equipments assembly base plate, and can not bring infringement to it because of heat.
At above-mentioned through hole, on the position of the periphery of foregoing circuit substrate, being provided with under a plurality of situations of above-mentioned grounding electrode, owing to can allow this electric route of conductor layer one inner conductor in periphery conductor one through hole of the coaxial connector that is connected by scolding tin the shortest, therefore can allow the caused stray inductance minimum of conductor layer in the through hole.
At above-mentioned through hole, also on above-mentioned grounding electrode and position above-mentioned holding wire opposition side, under the situation about being provided with from the outer circumferential central portion of foregoing circuit substrate, has following effect.
In the high-frequency equipments assembly base plate in the past, when the connection of coaxial connector, if increase soldering tin amount for firm engagement, then the signal electrode of close setting and grounding electrode might be through the scolding tin short circuits, and by adopting high-frequency equipments assembly base plate of the present invention, at above-mentioned through hole, also on above-mentioned grounding electrode and position above-mentioned holding wire opposition side, under the situation about being provided with from the outer circumferential central portion of foregoing circuit substrate, when the engages in coaxial connector, the pairing unnecessary scolding tin of grounding electrode on surface, flow to by the through hole that adds on the 2nd grounding electrode at the back side, so the shape of scolding tin relies on a side opposite with holding wire of grounding electrode slightly.Therefore, because employed scolding tin is difficult to flow to the signal electrode side, thereby can prevent effectively that signal electrode and grounding electrode are through the scolding tin short circuit.
In addition, at above-mentioned grounding electrode, with under the situation that formed surface earthing conductor layer is connected along above-mentioned holding wire on the surface of foregoing circuit substrate, because can be under the state of stray inductance minimum, the surface earthing conductor layer is connected with the grounding electrode of analyzer, therefore can allow the current potential of the electrode that is grounded in the signal terminal of high-frequency apparatus, more near the earthing potential of analyzer.
In addition, high-frequency equipments assembly base plate of the present invention, be not limited in the evaluation of measuring of high-frequency apparatus and use, also be highly suitable for being configured for actual employed circuit substrate or the RF integrally of communicating machine and the circuit modules such as module substrate of miniaturization in mobile communicating machine etc.
The evaluating characteristics of high-frequency apparatus of the present invention, be a kind of with high-frequency apparatus, being installed in holding wire is the high-frequency equipments assembly base plate of radial extension from above-mentioned terminal electrode, in above-mentioned high-frequency equipments assembly base plate, connect to measure with wiring the method that the characteristic of the above-mentioned high-frequency apparatus installed on the above-mentioned high-frequency equipments assembly base plate is checked.In this method,, therefore can reduce the electromagnetic coupled between holding wire, accurately determine the characteristic of above-mentioned high-frequency apparatus because holding wire is radial extension from the terminal electrode of high-frequency equipments assembly base plate.
In addition, the evaluating characteristics of high-frequency apparatus of the present invention comprises: high-frequency apparatus is installed in the operation in the high-frequency equipments assembly base plate that above-mentioned coaxial connector can be installed; The operation of using scolding tin that above-mentioned high-frequency equipments assembly base plate and coaxial connector are coupled together; And, the characteristic check operation that the characteristic that is installed in the above-mentioned high-frequency apparatus on the above-mentioned high-frequency equipments assembly base plate is checked.By adopting this method, can on above-mentioned high-frequency equipments assembly base plate, connect coaxial connector reliably, carry out the evaluating characteristics of high-frequency apparatus, simultaneously, in the time will taking off high-frequency apparatus, also can take off simply.
Above-mentioned and other advantages, feature and effect among the present invention can be clearer and more definite by the explanation of the contrast execution mode that accompanying drawing carried out.
Description of drawings
Fig. 1 is for illustrating at the mid-vertical view that is loaded with the state of high-frequency apparatus of high-frequency equipments assembly base plate of the present invention.
Fig. 2 is the vertical view of high-frequency equipments assembly base plate of the present invention.
Fig. 3 wants portion's profile for what cut off with the A-A ' line of Fig. 1.
Fig. 4 is the vertical view that has changed the radical of holding wire and the high-frequency equipments assembly base plate of the present invention of angle is set.
Fig. 5 is the vertical view that has changed the radical of holding wire 2 and the high-frequency equipments assembly base plate of the present invention of angle is set.
Fig. 6 wants portion's profile for what cut off with the B-B ' line of Fig. 1.
Fig. 7 be in the comparative example high-frequency equipments assembly base plate want portion's profile.
Fig. 8 is another routine vertical view of explanation high-frequency equipments assembly base plate of the present invention.
Fig. 9 wants portion's profile for what cut off with the C-C ' line of Fig. 8.
Figure 10 is the back view with high-frequency equipments assembly base plate of the 2nd grounding electrode 28.
Figure 11 be have the 2nd grounding electrode 28 high-frequency equipments assembly base plate, want portion's profile with what the C-C ' line of Fig. 8 cut off.
Figure 12 is under high-frequency equipments assembly base plate and situation that coaxial connector is connected by scolding tin, wants portion's profile with D-D ' the line cut-out of Fig. 8.
Figure 13 A is the vertical view on the surface of another example of explanation high-frequency equipments assembly base plate of the present invention.
Figure 13 B is the vertical view on the surface of another example of explanation high-frequency equipments assembly base plate of the present invention.
Figure 14 wants portion's profile for explanation with the high-frequency equipments assembly base plate E-E ' line shown in Figure 13 A cut-out.
Figure 15 be comparative example high-frequency equipments assembly base plate want portion's profile.
Figure 16 is the vertical view on the surface of another example of explanation high-frequency equipments assembly base plate of the present invention.
Figure 17 is for comparing the curve chart of the stalling characteristic in embodiments of the invention and the comparative example.
Figure 18 is the enlarged drawing of the regional F among Figure 16.
Figure 19 is the enlarged drawing at the back side of regional F.
Figure 20 is the enlarged drawing of other structures among the declare area F.
Figure 21 is for being formed with the profile of the high-frequency equipments assembly base plate of the present invention of holding wire in the explanation circuit substrate.
Figure 22 is the general high-frequency equipments assembly base plate of explanation, coupled high-frequency apparatus and the summary stereogram of coaxial connector.
Embodiment
Among Fig. 1 and Fig. 2, represent an example of high-frequency equipments assembly base plate of the present invention.
Fig. 1 is for being illustrated on the high-frequency equipments assembly base plate 1, putting the vertical view that is loaded with as the state of the duplexer 3 of high-frequency apparatus.Fig. 2 is for only representing not put the vertical view of the high-frequency equipments assembly base plate 1 that carries duplexer 3.
High-frequency equipments assembly base plate 1 is made of the circuit substrate that includes insulator layer 7.The surface of insulator layer 7 is put and is carried duplexer 3.Duplexer 3 includes at least to send with high frequency filter and receive and uses high frequency filter (all not shown).
On the surface of the insulator layer 7 of circuit substrate, the electrode configuration corresponding to duplexer 3 is provided with a plurality of terminal electrodes 9 that are used for connecting duplexer 3.
In addition, on the surface of the insulator layer 7 of circuit substrate, be provided with surface earthing conductor layer 4 and a plurality of holding wire 2a～2c (when general name, being called " holding wire 2 ").
Each holding wire 2 is connected with given terminal electrode 9, is radial extension from terminal electrode 9.
Surface earthing conductor layer 4 is connected with other given terminal electrodes 9.
Like this, in the terminal electrode 9, each holding wire 2 of the connection that has, the connection surface earthing conductive layer 4 that has.
The back side of insulator layer 7, (with reference to Fig. 3) covers by back side conductor layer 6.
In addition, as Fig. 1 and shown in Figure 2, grounding conductor layer 4 is the holding wire 2 of radial extension relatively respectively, is configured in its both sides.These surface earthing conductor layers 4 on the surface of insulator layer 7, separate gap W and are provided with on the both sides of holding wire 2.This gap W, wideer than the interval t (with reference to Fig. 3) between holding wire 2 and the back side conductor layer 6.
5 for connecting conductor, and the limit of the approach signal line 2 of grounding conductor layer 4 is provided with a plurality of surfacewise.These connect conductor 5, are used for connecting the back side conductor layer 6 of surface earthing conductor layer 4 and insulator layer 7.This perforation conductor 5 can be to cover the so-called via hole conductor that conductor forms on the inwall of through hole set in insulator layer 7, and the inside that also can be through hole is by conductor filled so-called via conductors.
Fig. 3 wants portion's profile for what obtain with the cut-out of the A-A ' line of Fig. 1.
As shown in Figure 3, the back side conductor layer 6 of insulator layer 7 is electrically connected with the lip-deep surface earthing conductor layer 4 of insulator layer 7 by connecting conductor 5.Back side conductor layer 6, on the connector installation portion of the end face of the high-frequency equipments assembly base plate 1 that is used for holding wire 2 and external measurement device etc. are coupled together, earthy periphery conductor by scolding tin and connector couples together, by coming ground connection like this, like this, the earthing potential of surface earthing conductor layer 4 is stable.
In the execution mode of Fig. 1～shown in Figure 3, terminal electrode 9 as shown in Figure 2, be arranged on the central portion of insulator layer (circuit substrate) 7, because holding wire 2 is radial extension from these terminal electrodes 9, therefore the length of the part that is close each other of holding wire 2 can be shortened, thereby holding wire electromagnetic interference each other can be alleviated.
Particularly, as Fig. 1 and shown in Figure 2, the holding wire 2 that is radial extension is set to, and terminal electrode 9 is clipped between it.That is terminal electrode 9 holding wire 2 that is set to terminate and is radial extension.Simultaneously, the straight line that any 1 holding wire 2 is obtained from terminal electrode 9 virtual prolongations, with will be arbitrarily 1 straight line that holding wire 2 obtains from the 9 virtual prolongations of another terminal electrode in addition, do not constitute same straight line.
Therefore,, therefore can suppress the electromagnetic interference between the holding wire, by like this, can keep outstanding overseas attenuation characteristic and the stalling characteristic be with owing to make the signal in holding wire cathetus transmission be difficult for being attached in other holding wires.
In addition, though be provided with surface earthing conductor layer 4 in the both sides of holding wire 2, between holding wire 2 and the surface earthing conductor layer 4, by air and dielectric body (glass epoxy resin for example; Dielectric constant 4.7) fill up, relative therewith, filled up fully by dielectric body between holding wire 2 and the back side conductor layer 6.Therefore, between holding wire 2 and the back side conductor layer 6, concentrate electric field easily.
Particularly, by making the gap W between holding wire 2 and the surface earthing conductor layer 4, big apart from t than between holding wire 2 and the back side conductor layer 6 makes above-mentioned electric field concentrate and becomes more remarkable.
Therefore, owing to can suppress the expansion that the electromagnetic field that is produced of holding wire distributes on every side, so signal is difficult to leak into aerial and cause interference for adjacent holding wire 2.So, can suppress the interference between the adjacent signals line 2 well, keep outstanding overseas attenuation characteristic and the stalling characteristic be with.
Specifically, duplexer 3 for the 800MHz band, if the insulator layer of thickness t=0.1mm 7 be provided with wide 0.1mm holding wire 2 and and holding wire 2 between separate W=1mm the interval be provided with on the high-frequency equipments assembly base plate 1 of surface earthing conductor layer 4, above-mentioned duplexer 3 is installed and is estimated characteristic, the stalling characteristic that then sends the band territory is-70dB.The thickness t of insulator layer 7 and holding wire 2, and surface earthing conductor layer 4 between gap W between ratio be 1: 1 o'clock, be-60dB.Compare with them, the thickness t by making insulator layer 7, and holding wire 2 and surface earthing conductor layer 4 between the ratio of gap W be 1: 10, can allow stalling characteristic improve 10dB.
In addition, in the grounding conductor layer 4 owing to the both sides that are arranged on holding wire 2, be connected with a plurality of perforation conductors 5 that are electrically connected with back side conductor layer 6, therefore, surface earthing conductor layer 4 is electrically connected with back side conductor layer 6 through connecting conductor 5 each other.So the surface earthing conductor layer 4 of the both sides of holding wire 2 is a same potential, can eliminate the potential difference between the surface earthing conductor layer 4, thus earthing potential that can surface of stability grounding conductor layer 4.Therefore, the interference between the holding wire 2 of surface earthing conductor layer 4 can be reduced, thereby the characteristic of high-frequency apparatus 3 can be optimized.
Specifically, by the limit of the signal line side of grounding conductor layer 4 surfacewise, the via conductors that diameter 0.3mm is set with the interval of 0.7mm is used as connecting conductor 5, thereby compares with the situation that does not connect conductor 5, stalling characteristic can be improved about 5dB.
By above this high-frequency equipments assembly base plate 1, when high-frequency apparatus 3 is duplexer, can access desired characteristic, and the transmission that can not worsen duplexer 3 is with high frequency filter and receive with overseas attenuation characteristic of being with of high frequency filter and stalling characteristic.
So,, can improve function according to the characteristic of bringing into play duplexer 3 equipment such as high frequency such as grade like that of hope as high-frequency equipments assembly base plate by using as high-frequency model.
In addition, when high-frequency apparatus 3 is the piezoelectrics filter,, can alleviate the interference between the holding wire 2 of surface earthing conductor layer 4, be with overseas attenuation characteristic thereby can keep well owing to pass through the earthing potential of surface of stability grounding conductor layer 4.
In addition, the radical of holding wire 2 with angle is set, be not limited to Fig. 1, example shown in Figure 2.
Though among Fig. 1, Fig. 2, with the 2 equal angles settings of 3 holding wires, also can be for example shown in Figure 4,4 holding wires 2 are radial setting.Angle between the holding wire 2 is also not necessarily wanted equal angles.
Under the situation of this Fig. 4, any 1 holding wire 2 is from the straight line of terminal electrode 9 virtual prolongations, intersect at 1 from the straight line of terminal electrode 9 virtual prolongations with any 1 holding wire 2 in addition.
In addition, also can be as shown in Figure 5, holding wire 2 is radial and be arranged in parallel.In this case, any 1 holding wire 2 from the straight line of terminal electrode 9 virtual prolongations, with any 1 holding wire 2 in addition from the straight line of terminal electrode 9 virtual prolongations, parallel to each other.
Under the situation of above-mentioned Fig. 4, Fig. 5, identical with the formation of Fig. 1, Fig. 2, owing to be difficult for being attached in other holding wires, therefore can suppress the electromagnetic interference between the holding wire at the signal of holding wire cathetus transmission, by like this, can keep outstanding overseas attenuation characteristic and the stalling characteristic be with.
Illustrated among Fig. 6 high-frequency equipments assembly base plate of the present invention another configuration example want portion's profile.In addition, with the identical portion's profile of wanting, the structure that shows high-frequency equipments assembly base plate as a comparative example among Fig. 7.
Because the flat shape of these high-frequency equipments assembly base plates is identical with Fig. 1 and Fig. 2, therefore omit vertical view.
Fig. 6 for cut off with the B-B ' line of Fig. 1 obtain want portion's profile, Fig. 7 wants portion's profile what same position cut-out obtained.In addition, to the place identical, mark identical symbol among Fig. 6 with Fig. 1 and Fig. 2.
In the embodiments of the present invention shown in Fig. 6, high-frequency equipments assembly base plate 1 ', be by holding wire 2 (not shown), surface earthing conductor layer 4, insulator layer 7b, cover the back side of insulator layer 7b back side conductor layer 6b, clip back side conductor layer 6b lamination on insulator layer 7b insulator layer 7a and cover the Mulitilayer circuit board that the back side conductor layer 6a at the back side of insulator layer 7a constitutes.
If enumerate numerical example, then the thickness of insulator layer 7a is 1mm, and the thickness of insulator layer 7b is 0.1mm, by insulator layer 7a is set, can strengthen the intensity of high-frequency equipments assembly base plate 1 '.In addition, conductor layer 6a goes up and forms other circuit overleaf.
If insulator layer is set again, make that conductor layer is a sandwich construction, then can further again integrated circuit.Integrated by this, can be with employed circuit substrate miniaturization in the mobile communicating machines such as mobile phone.
High-frequency equipments assembly base plate 10 shown in Fig. 7, same with Fig. 6, be by grounding conductor layer 14, insulator layer 17b, pattern form given pattern form and cover the back side of insulator layer 17b conductor layer 16b, clip conductor layer 16b lamination on insulator layer 17b insulator layer 17a and cover the Mulitilayer circuit board that the conductor layer 16a at the back side of insulator layer 17a constitutes.
In the high-frequency equipments assembly base plate of this Fig. 7, if near the zone 18 under the terminal electrode 19 that high frequency equipment 3 such as duplexer is installed conductor layer is set, can produce parasitic capacitance between terminal electrode 19 and the conductor layer, if produce parasitic capacitance like this, this part characteristic impedance meeting of terminal electrode 19 departs from from 50 Ω, produce the reflection of signal and cause characteristic degradation, so near the zone 18 not under terminal electrode 19 conductor layer is set.
For this reason, in the conductor layer 16b that the back side that will put the insulator layer 17b that carries high-frequency apparatus 3 covers, as shown in Figure 7, corresponding should zone 18, non-formation zone is set in conductor layer 16b carries out pattern and forms (form by carrying out this pattern sometimes, insulated body 17c fills in the non-zone 18 that forms the zone that becomes conductor layer 17b).
But, by non-formation zone is set among near the conductor layer 17b under terminal electrode 19 for the generation that prevents parasitic capacitance like this, when high-frequency apparatus 3 actions, near the terminal electrode 19 Electric Field Distribution, be deep into the inside of insulator layer 17a by the non-formation zone of conductor layer 17b, can in zone 18, combine with conductor layer 16a, a part of electromagnetic field wherein becomes the reason that allows signal leak into the feedthrough in other terminal electrodes 19 by the non-formation zone of adjacent conductor layer 16b.
To this, the high-frequency equipments assembly base plate 1 ' shown in Fig. 6 has improved this problem.According to Fig. 6, the back side conductor layer 6b that covers for the back side that will put the insulator layer 7b that carries high-frequency apparatus 3, unlike implement as shown in Figure 7 to terminal electrode 9 under near zone 8 corresponding parts the non-pattern that forms the zone be set form.
Even like this, be not provided with among the conductor layer 6b overleaf under the non-situation that forms the zone, because very in the high-frequency apparatus 3 of miniaturization, the size of terminal electrode 9 self is very little, therefore minimum can the ignoring of parasitic capacitance that produces.So the parasitic capacitance that produces between back side conductor layer 6b and the terminal electrode 9 can not make impedance discontinuous and cause the reflection of signal.
In addition, for back side conductor layer 6b, by be not provided with terminal electrode 9 under near corresponding non-formation in zone 8 regional, when high-frequency apparatus 3 actions, near the terminal electrode 9 Electric Field Distribution can not be deep into the inside of insulator layer 7a by back side conductor layer 6b, thereby can suppress it to combine with back side conductor layer 6a and produce feedthrough.
At high-frequency apparatus 3 is under the situation of piezoelectrics filter, according to simulation result, structure in the high-frequency equipments assembly base plate shown in Fig. 7, by correspondence terminal electrode 19 under near that non-formations is set in conductor layer 16b is regional in zone 18, the stalling characteristic that terminal electrode is 19 is-76.5dB.
In the structure of the present invention shown in Fig. 6, it is regional non-formations to be set among the conductor layer 6b overleaf by near the zone 8 under not corresponding the terminal electrode 9, the stalling characteristic that at high-frequency apparatus 3 is 9 at the situation lower terminal electrode of piezoelectrics filter is-80.4dB, can learn the remarkable influence that has improved stalling characteristic.
Like this, by adopting high-frequency equipments assembly base plate of the present invention, be under the situation of piezoelectrics filter or the channel-splitting filter that uses the piezoelectrics filter at the put high-frequency apparatus 3 that carries, can not damage the stalling characteristic of 9 of terminal electrodes.
In addition, owing to can suppress the generation of feedthrough, therefore can keep well and be with overseas attenuation characteristic.
In addition, when high-frequency apparatus 3 is duplexer, owing to can suppress the generation of feedthrough, therefore can send with high frequency filter and keep well in receiving with these both sides of high frequency filter and be with overseas attenuation characteristic, and can suppress signal and leak to receiving terminal, thereby keep stalling characteristic well from sending terminal.
Fig. 8 is another routine vertical view of explanation high-frequency equipments assembly base plate of the present invention.In addition, Fig. 9 wants portion's profile for what obtain with the cut-out of the C-C ' line of Fig. 8.
High-frequency equipments assembly base plate 1, lamination insulator layer 32,39 and 41 and the central portion on the surface of the circuit substrate 30 that forms of grounding conductor layer 33 and 40 on, be provided with the terminal electrode 9 that high-frequency apparatus is installed.In addition, on the surface of circuit substrate 30, put electronic units 60 such as being loaded with resistor, capacitor, integrated circuit.
On the periphery on the surface of circuit substrate 30, be formed with the signal electrode 23 that is connected with the center conductor (not shown) of coaxial connector and with the periphery conductor (not shown) that is welded on coaxial connector on grounding electrode 24.
Terminal electrode 9 and signal electrode 23, the holding wire 2 that is radial extension by the central portion from circuit substrate 30 is connected.
Here, on the position of the outer circumferential side of the circuit substrate 30 of grounding electrode 24, be formed with through hole (via hole) 25 along the periphery of circuit substrate 30.
In the inner face of through hole 25, as shown in Figure 9, be coated with conductor layer 27.Conductor layer 27 is electrically connected with grounding electrode 24 and grounding conductor layer 33,40.
In addition, in the terminal electrode 9, the given terminal that is grounded, the via conductors through being filled conductor (not shown) is connected with grounding conductor layer 33 under it.
Using such high-frequency equipments assembly base plate of the present invention 1, measure under the situation of characteristic of high-frequency apparatus (not shown), at first, on terminal electrode 9, be coated with paste scolding tin etc., it is contacted with the respective terminal (not shown) of high-frequency apparatus, and be heated to more than the melt temperature of paste scolding tin.By like this, high-frequency apparatus is installed on the high-frequency equipments assembly base plate 1.
Next,, use scolding tin and flatiron, the center conductor of coaxial connector is connected with signal electrode 23, and the periphery conductor of coaxial connector is connected with grounding electrode 24 coaxial connector (not shown).
At this moment, because the existence of through hole 25, the scolding tin of fusion flows in through hole 25 from grounding electrode 24, enters in the through hole 25.By like this, the periphery conductor 45 (with reference to Figure 22) of scolding tin from through hole 25 inside to coaxial connector forms continuously.
Therefore, can guarantee firm connection between high-frequency equipments assembly base plate 1 and the coaxial connector.So even loaded physical loads by cable etc. in mensuration, the probability of the center conductor of coaxial connector and signal electrode 23 disengagements also can be very little.
In addition, in high-frequency equipments assembly base plate 1, because can be through the conductor layer 27 in grounding electrode 24 and the through hole 25, on the position near the grounding electrode of analyzer, the periphery conductor and the grounding conductor layer 33,40 of coaxial connector are coupled together, therefore can reduce because of from the grounding electrode of analyzer to the caused stray inductance of physical distance the grounding conductor layer 33,40, so, can measure the characteristic of high-frequency apparatus more exactly.
Next, another example again to embodiments of the present invention describes.
In this example, vertical view and Fig. 8 of high-frequency equipments assembly base plate 1 are same, but with position that the grounding electrode 24 at the back side of circuit substrate 30 is faced mutually on, be provided with the 2nd grounding electrode 28.
The vertical view at the back side of this routine high-frequency equipments assembly base plate 1 has been shown among Figure 10.In addition, illustrated among Figure 11 to this example with the C-C ' line of Fig. 8 cut off obtain want portion's profile.Figure 11 is with the different of Fig. 9, among Figure 11, is provided with the 2nd grounding electrode 28 at the back side of high-frequency equipments assembly base plate 1.
The 2nd grounding electrode 28 through the conductor layer 27 of the inner face of through hole 25, is electrically connected with the grounding electrode 24 on surface and inner grounding conductor layer 33,40.
Illustrated among Figure 12 under the situation that high-frequency equipments assembly base plate that this is routine 1 and coaxial connector weld, wanted portion's profile with what D-D ' the line cut-out of Fig. 8 obtained.
As shown in figure 12, because periphery conductor (not shown) for coaxial connector, scolding tin 36 can pass through the continuous always periphery conductor to face side of through hole 25 from the rear side of high-frequency equipments assembly base plate 1, therefore, can more securely the grounding electrode 24 of high-frequency equipments assembly base plate 1 and the periphery conductor of coaxial connector be coupled together.
In addition, when the grounding electrode 24 and the periphery conductor dbus of coaxial connector being crossed scolding tin 36 couple together, because the scolding tin 36 of heat in through hole 25 of flatiron, the scolding tin 36 of scolding tin 36 on another side on one side transmits rapidly, therefore can be with scolding tin 36 fusions simultaneously on two sides.By like this, because the soldering tin amount equalization on two sides, therefore can reduce to load stress load to the signal electrode 23 of the center conductor 44 of coaxial connector or high-frequency equipments assembly base plate 1.
In addition, when taking off coaxial connector, therefore scolding tin 36 fusions simultaneously on two sides can easily can be finished with the short time and are taken off operation too.So, the put high-frequency apparatus that carries can be taken off and can not make its characteristic degradation.In addition, can not cause damage, can utilize again them to coaxial connector and high-frequency equipments assembly base plate 1.
In addition, because can be in high-frequency equipments assembly base plate 1, conductor layer 27 in grounding electrode the 24, the 2nd grounding electrode 28 and through hole 25, periphery conductor and grounding conductor layer 33 with coaxial connector near the position of the grounding electrode of analyzer couple together, therefore can reduce because of from the grounding electrode of analyzer to the caused stray inductance of physical distance the grounding conductor layer 33, so, can measure the characteristic of high-frequency apparatus more exactly, this point is identical with above-mentioned execution mode.
Next, another example again to embodiments of the present invention describes.
Among Figure 13 A and Figure 13 B, show the vertical view on the surface of this routine high-frequency equipments assembly base plate 1.
In this example of Figure 13 A, on the position of the outer circumferential side of the circuit substrate 30 of the grounding electrode 24 on the surface of high-frequency equipments assembly base plate 1, be formed with through hole 25, simultaneously, on grounding electrode 24 and positions holding wire 23 opposition sides, also be provided with through hole 25 ' from the outer circumferential central portion of circuit substrate 30.
In this example of Figure 13 B, do not form through hole 25, replace it on grounding electrode 24 and positions holding wire 23 opposition sides, be provided with through hole 25 ' from the outer circumferential central portion of circuit substrate 30.
In addition, illustrated among Figure 14 on this high-frequency equipments assembly base plate 1 and be connected with under the situation of coaxial connector by scolding tin 36, with the E-E ' line of Figure 13 A, Figure 13 B cut off obtain want portion's profile.
In addition, as a comparative example, identical with Figure 14 portion's profile of wanting under the situation that through hole 25 ' is not set has been shown among Figure 15.
Grounding electrode 24 be not provided with under the situation of through hole 25 ', as shown in figure 15, be present in the distribution separately of top scolding tin 36 of the top and signal electrode 23 of grounding electrode 24, because of the surface tension of scolding tin 36 approaching, if therefore soldering tin amount is more, then short circuit sometimes between the scolding tin.
Relative therewith, under this routine situation, the distribution of scolding tin 36 because scolding tin 36 flow in the through hole 25 ', therefore can allow the top scolding tin 36 that is present in grounding electrode 24 distribute slightly away from signal electrode 23 as shown in figure 14.So, signal electrode 23 and not The book of Changes scolding tin 36 short circuits of grounding electrode 24.
In addition, though show the situation of the 2nd grounding electrode 28 that does not have the back side here, identical with the example shown in Figure 10～Figure 12, also the 2nd grounding electrode 28 can be set on the back side of high-frequency equipments assembly base plate 1.
In addition, also can on the surface of the circuit substrate 30 that so far illustrates to Figure 15, surface earthing conductor layer 4 be set along holding wire 2 with Fig. 8.
The vertical view on the surface of the high-frequency equipments assembly base plate 1 that surface earthing conductor layer 4 and grounding electrode are 24 that be connected, this is routine has been shown among Figure 16.
Because by adopting such formation, can be under the state of stray inductance minimum with surface earthing conductor layer 4, be connected with the grounding electrode of analyzer, therefore can be with the little state of stray inductance, make the current potential of the terminal that is grounded in the signal terminal of high-frequency apparatus, more near the earthing potential of analyzer.
High-frequency equipments assembly base plate 1 of the present invention can be applied to communicating machine.
Also promptly, can in side with receiving circuit or transtation mission circuit or both sides' communicating machine, use high-frequency equipments assembly base plate 1 of the present invention.
Above-mentioned transtation mission circuit for example is will send signal by frequency mixer to be stated from the carrier frequency, by band pass filter decay unwanted signal, amplifies by power amplifier afterwards and sends signal, and the circuit that sends with antenna by duplexer.
Above-mentioned receiving circuit for example is to receive received signal by antenna, by low noise amplifier the received signal by duplexer is amplified, afterwards, by band pass filter decay unwanted signal, from carrier frequency, isolate signal by frequency mixer, and take out the circuit of this signal.
By above-mentioned duplexer or band pass filter are installed on the high-frequency equipments assembly base plate 1 of the present invention, and be assembled in the communicating machine, can realize putting the communicating machine that is loaded with the outstanding characteristic of having of high-frequency equipments assembly base plate 1 of the present invention.
Next, the method for using high-frequency equipments assembly base plate 1 to estimate high-frequency apparatus is described.
This high-frequency equipments assembly base plate 1 is used for carrying out non-defective unit in the characteristic check operation of the volume production operation of high-frequency apparatus and judges, or estimates the characteristic of exploitation product.
Specifically, under with the situation of duplexer of using the piezoelectrics filter as high-frequency apparatus, on the wafer that constitutes by piezoelectrics, once form after a plurality of piezoelectrics filters, the piezoelectrics filter is cut into monolithic one by one, with each piezoelectrics filter face down ground upside-down mounting on given circuit substrate, obtain duplexer, and resulting duplexer is installed on the high-frequency equipments assembly base plate 1, carry out non-defective unit and judge.Owing to can't be used for carrying out the characteristic check operation that above-mentioned non-defective unit is judged, duplexer is welded on the high-frequency equipments assembly base plate 1, therefore being connected between duplexer and the high-frequency equipments assembly base plate 1, waiting by contact pin set in the terminal electrode on the high-frequency equipments assembly base plate 1 and realize.In this case, in order stably to measure characteristic, in the high-frequency equipments assembly base plate 1, the anchor clamps of fixing plug pin or fixedly duplexer put the miter guide that carries the position, be fixed on together on the pedestal of brass or aluminium etc., and push with certain pressure from the top of duplexer, by fix like this with contact pin between be connected.
Under this state, as mentioned above, on the signal electrode 23 and grounding electrode 24 of high-frequency equipments assembly base plate 1, be connected with coaxial cable, carry out the evaluating characteristics of high-frequency apparatus by solder.
＜embodiment 1 〉
Use FR-4 (glass epoxy resin), as the material of the insulator layer (circuit substrate) of high-frequency equipments assembly base plate.
Forming one deck grounding conductor layer on the surface of circuit substrate, in the rear side of circuit substrate, is insulator layer and the conductor layer alternate repetition that covers its back side 3 times of 0.1mm with thickness, constitutes the lamination structure.
If the width of the surperficial set holding wire of circuit substrate is 0.13mm, thickness is 0.06mm, and holding wire and the gap W that is arranged between the grounding conductor layer of its both sides are 1mm.Holding wire is radial extension setting from the central authorities of circuit substrate as shown in Figure 1 and Figure 2.
In addition, cover the conductor layer at the back side of each insulator layer, respectively whole the covering at the back side of insulator layer got up.
Limit along the signal line side of grounding conductor layer, on the position of this limit 0.5mm, with fixing interval 0.7mm 1～3 layer the via conductors that connects insulator layer is set, by like this, realizes being arranged on the stabilisation of the earthing potential of lip-deep grounding conductor layer.In addition, the characteristic impedance of holding wire is designed to 50 Ω.
Among the embodiment of the high-frequency equipments assembly base plate of the present invention of this structure, put and carry subminiature 800MHz band duplexer, its size with the face that installation base plate is faced mutually is 2.5mm * 2.0mm, couple together with above-mentioned holding wire and as the coaxial cable of measuring with wiring, carry out the mensuration of stalling characteristic.
In addition, as a comparative example, also to carry putting of duplexer the position under the conductor layer at the back side of the 1st layer insulator layer on, pattern is formed with conductor layer near under terminal electrode the zone non-ly forms regional high-frequency equipments assembly base plate, also carries out same mensuration.Among Figure 17, by the measurement result of this stalling characteristic of graphical representation.
Among Figure 17, transverse axis represents that (Frequency, unit: MHz), the longitudinal axis is represented separation property (Isolation, unit: dB) to frequency.
The characteristic curve of solid line is represented the result of comparative example, and the characteristic curve of dotted line is represented the result of embodiments of the invention.
Can learn from the curve chart shown in Figure 17, by as embodiments of the invention, with the conductor layer at the back side that is formed on insulator layer with putting of duplexer carry the position under near the zone cover, can (stalling characteristic in 824～849MHz) be significantly improved about 10dB with sending the band territory.
＜embodiment 2 〉
Produce the high-frequency equipments assembly base plate 1 of structure as shown in figure 16.
Holding wire 2 is radial extension from terminal electrode 9, connects the structure of the regional F of coaxial connector, also as shown in figure 16.
Figure 18 is the enlarged drawing by the regional F shown in the dotted line of Figure 16.The number of through hole 25 and position are as shown in figure 18.
In addition, connect the part of coaxial connector, comprise that as shown in figure 16 regional F is 3 places, but its integral body is shape shown in Figure 180.
Enlarged drawing with the back side at the corresponding position of Figure 18 has been shown among Figure 19.The 2nd grounding electrode of facing mutually with two grounding electrodes 24 on the surface of circuit substrate 30 28 forms continuously.In addition, among Figure 19,4 ' expression is formed on the grounding conductor layer at the back side of circuit substrate 30.
In addition, circuit substrate 30 wants portion's profile as with Figure 11.
The material of the insulator layer 32,39,41 of circuit substrate 30 uses FR-4 (glass epoxy resin), and the material of grounding conductor layer 33,40, grounding electrode the 24, the 2nd grounding electrode 28 and back side grounding conductor layer 4 ' uses copper.
The thickness of insulator layer 32 and insulator layer 41 is respectively 0.1mm, and the thickness of insulator layer 39 is 1mm.In addition, the thickness of grounding conductor layer 33 and grounding conductor layer 40 is respectively 0.035mm.The thickness of grounding electrode 24 and the 2nd grounding electrode 28 is respectively 0.06mm.The width of the holding wire 2 on the surface of circuit substrate 30 is 0.13mm, the width w1 of the signal electrode 23 that is connected with the center conductor 44 of coaxial connector is 0.6mm, the horizontal wide w2 of grounding electrode 24 is 5mm, and the gap w3 between signal electrode 23 and the grounding electrode 24 is 0.85mm.
In addition, the characteristic impedance with holding wire 2 is designed to 50 Ω.The vertical wide w4 of grounding electrode 24 is 3mm.In addition, the horizontal wide w5 of the 2nd grounding electrode 28 at the back side of circuit substrate 30 is 13mm, and vertical wide w6 is 3mm.In addition, in the grounding electrode 24, with the radius of the 2nd grounding electrode 28 that connects the back side of circuit substrate 30 and circuit substrate 30 is the through hole 25 of 0.3mm, from the inboard 0.6mm of distance grounding electrode 24 and apart from the position of peripheral part (outer circumferential side of the circuit substrate 30) 0.3mm of grounding electrode 24, be provided with 6 with the interval of 0.8mm.In each through hole 25, by the conductor layer 27 that copper constitutes, realized the stabilisation of surface earthing conductor layer 4 that is connected with grounding electrode 24 and the earthing potential of the back side grounding conductor layer 4 ' that is connected with the 2nd grounding electrode 28 in the inner face setting.
In addition, produce except through hole 25 is not set, the high-frequency equipments assembly base plate that other designs are all same as the previously described embodiments is used as comparative example.
To embodiments of the invention and the comparative example of producing like this, put respectively and carry high-frequency apparatus, installed after the coaxial connector, measure high frequency characteristics through holding wire 2, next after coaxial connector is taken off, measure high frequency characteristics once more.
The mensuration of this moment is by directly contacting high frequency probe (GGB corporate system, trade name: micromicro probe 40A-GS-600-DP) carry out on the terminal electrode of high-frequency apparatus.
In addition, as high-frequency apparatus, adopt 800MHz band duplexer, it uses the size of the face that is connected with terminal electrode 9 to be 2.5mm * 2.0mm and high small-sized high frequency filter as 0.6mm.
At first, to embodiment and comparative example, all on terminal electrode 9, be coated with paste scolding tin, and put year this high-frequency apparatus.Afterwards, use heating plate fusion paste scolding tin, the terminal and the terminal electrode 9 of high-frequency apparatus coupled together.
Next, coaxial connector is installed.To embodiment and comparative example, all on signal electrode 23, grounding electrode 24 and the 2nd grounding electrode 28, use flatiron with thread scolding tin (Sn-Cu-Ag: fusion 217 ℃ of fusing points), on high-frequency equipments assembly base plate 1, coaxial connector is installed.
Under the situation of using comparative example, even apply the heat of same time for thread scolding tin, the amount of its fusion also might not, in addition, because the scolding tin of grounding electrode 24 and the 2nd grounding electrode 28 can not directly flow, so be difficult to allow the amount homogenizing of scolding tin of grounding electrode 24 and the 2nd grounding electrode 28.
Relative therewith, among the embodiment, if use flatiron by scolding tin 36 fusions of signal electrode 23 with grounding electrode 24, then heat also passes to the scolding tin 36 that is positioned on the 2nd grounding electrode 28 through through hole 25, therefore can allow also fusion simultaneously of scolding tin 36 on the 2nd grounding electrode 28, in addition, because the scolding tin 36 of fusion flows mutually by through hole 25, therefore can eliminate the deviation of the soldering tin amount in grounding electrode 24 and the 2nd grounding electrode 28.
Next, the coaxial connector and the analyzer that will be connected on the high-frequency equipments assembly base plate 1 by cable couple together, and measure the high frequency characteristics of high-frequency apparatus.
During this is measured, in comparative example, the power that applies by the cable that connects coaxial connector and analyzer, coaxial connector can be thrown off, and among the embodiment, as shown in figure 12, for the periphery conductor of coaxial connector and Yan Eryan, scolding tin 36 can be from the 2nd grounding electrode 28 1 sides at the back side of high-frequency equipments assembly base plate 1, by through hole 25 continuously to the periphery conductor of grounding electrode 24 sides on surface, therefore, can connect high-frequency equipments assembly base plate 1 and coaxial connector more securely, coaxial connector can not thrown off.
Next, coaxial connector is taken off from high-frequency equipments assembly base plate 1.
Under the situation of comparative example, in order to take off coaxial connector, at first to use scolding tin extractor (manufacturer: Ha ッ コ one company, trade name: scolding tin is removed station 24V474) remove the scolding tin of the 2nd grounding electrode 28, after only forming the state that engages that keeps coaxial connector and high-frequency equipments assembly base plate 1 by signal electrode 23 and scolding tin on the grounding electrode 24, with the scolding tin fusion of signal electrode 23, thereby coaxial connector is taken off from high-frequency equipments assembly base plate 1 with grounding electrode 24.
Relative therewith, under the situation of embodiment, after using scolding tin 36 fusions of flatiron by signal electrode 23 and grounding electrode 24, heat also passes to the scolding tin 36 that is positioned on the 2nd grounding electrode 28 through through hole 25, therefore can allow also fusion simultaneously of scolding tin 36 on the 2nd grounding electrode 28.Therefore, compare, can with the short period coaxial connector be taken off easily with comparative example.
Like this, embodiment compares with comparative example, does not need to use the scolding tin extractor, as long as give scolding tin 36 heating of one side with flatiron, the scolding tin 36 of another side also can be melted, thereby takes off coaxial connector, therefore can make the time of high-frequency equipments assembly base plate 1 and high-frequency apparatus heating very short.
Next, take off high-frequency apparatus.Embodiment and comparative example all put be loaded on the heating plate, allow the fusion of paste scolding tin by heating, and use tweezers to take off high-frequency apparatus.
Afterwards, measure the high frequency characteristics of the high-frequency apparatus that takes off.Consequently, under the situation of the high-frequency equipments assembly base plate 1 that uses embodiments of the invention, before and after above-mentioned a series of operation, the characteristic of high-frequency apparatus does not worsen, but under the situation of the high-frequency equipments assembly base plate that uses comparative example, because the high-frequency apparatus that high frequency characteristics worsens appears in the installation of coaxial connector and the heat that is applied when taking off.
＜embodiment 3 〉
The vertical view on the surface of high-frequency equipments assembly base plate 1 is identical with the 1st embodiment, but as among Figure 20 by shown in the enlarged drawing like that, difference is: from being positioned at through hole 25A grounding electrode 24 and ends signal electrode 23 opposite sides, towards central portion, be provided with two through holes 25 ' onesize from the peripheral part of circuit substrate 30 with through hole 25.
Among the embodiment 2, as shown in figure 15, be present in the top of grounding electrode 24 and be present in the distribution of the top scolding tin 36 of signal electrode 23, because of the surface tension of scolding tin 36 is close, because of the difference of soldering tin amount, sometimes can be through these scolding tin 36 short circuits.
As present embodiment, by on grounding electrode 24, through hole 25 ' being set, because scolding tin 36 flow in the through hole 25 ' as shown in figure 14, thereby the scolding tin 36 that can make way for the top of grounding electrode 24 distributes slightly away from signal electrode 23, so signal electrode 23 can be through scolding tin 36 short circuits with grounding electrode 24.
In addition, the present invention is not limited in above execution mode embodiment, can also carry out various changes in the scope that does not break away from main points of the present invention.
For example, the material of the insulator layer of circuit substrate, be not limited in the cited material of above embodiment, can also use, perhaps use potteries such as aluminium oxide or with the inorganic material such as glass ceramics of aluminium oxide as main component with organic materials such as tetrafluoroethene or BT resins.
In addition, the lamination number of the conductor layer at the back side of insulator layer and covering insulator layer can be arbitrarily.In the above example, illustration except grounding conductor layer 33, also be provided with the example of grounding conductor layer 28 on the rear side, but also can omit this grounding conductor layer 28.
In addition, though the shape of through hole 25 is shown as circle in Fig. 8 etc., shape also can be arbitrarily.In addition, position about through hole 25, aim at central part and how much enter some the zone of central part side though be arranged on from the periphery of circuit substrate 30, but also can be on the periphery of circuit substrate 30 in the longitudinal direction opening form through hole, and face covers conductor layer 27 and forms so-called castration conductor within it, is connected through circumferential lateral surface and grounding electrode 24, grounding conductor layer 33,40 and the 2nd grounding electrode 28 of circuit substrate 30.
In addition, the characteristic impedance of holding wire is not limited in 50 Ω, can be complementary with the characteristic impedance of the system that uses high-frequency apparatus.
In addition, in the above explanation, show the lip-deep situation that holding wire is arranged on high-frequency equipments assembly base plate, but also can be as shown in figure 21, with several in the holding wire inside that are arranged on insulator layer.In this case, because by signalization line in mutually different layer, holding wire is not faced mutually yet on thickness direction, therefore can further improve the stalling characteristic between these holding wires, by like this, can further reduce influence, perhaps bring into play its characteristic better the characteristic of high-frequency apparatus.
In addition, in the explanation among the employed figure, show the terminal that high-frequency equipments assembly base plate 1 is connected with the coaxial connector group of grounding electrode 24 (signal electrode 23 with) and be 3 groups situation, but this number can be arbitrary value in conjunction with the number of terminals of high-frequency apparatus.
In addition, can also surface with high-frequency equipments assembly base plate 1 in, do not need and the contacted part of scolding tin, protect by solder resist etc.By like this, there is scolding tin owing to can only allow on the part of wanting to contact scolding tin, therefore can prevent between holding wire 2 conductors such as grade through unnecessary scolding tin short circuit.
In addition, high-frequency apparatus is not limited in piezoelectrics filter or duplexer, is used for the high-frequency apparatus of the high-frequency signal processing of mobile communicating machine or WLAN, ETC etc., all can use.
In addition, scope of the present invention also comprises the formation that the formation combination in any described in each claim is obtained.

Claims (22)

1. a high-frequency equipments assembly base plate is characterized in that,
Have: circuit substrate has conductor layer in the back side or the inside of insulator layer;
A plurality of terminal electrodes, it is arranged on the surface of foregoing circuit substrate, is connected with the terminal of high-frequency apparatus;
A plurality of holding wires, it is arranged on the surface of foregoing circuit substrate, is connected with above-mentioned terminal electrode; And,
Grounding conductor layer is arranged on the surface of foregoing circuit substrate,
Interval between above-mentioned holding wire and the above-mentioned grounding conductor layer, greater than above-mentioned holding wire and be formed on the back side of above-mentioned insulator layer or the interval between the inner above-mentioned conductor layer,
Above-mentioned holding wire is radial extension from above-mentioned terminal electrode, and with the straight line of any 1 holding wire from above-mentioned terminal electrode virtual extension, any 1 holding wire does not constitute same straight line from the straight line of above-mentioned terminal electrode virtual extension with inciting somebody to action in addition.
2. high-frequency equipments assembly base plate as claimed in claim 1 is characterized in that:
The straight line of above-mentioned two virtual extensions intersects at 1.
3. high-frequency equipments assembly base plate as claimed in claim 1 is characterized in that:
The straight line of above-mentioned two virtual extensions is parallel to each other.
4. high-frequency equipments assembly base plate as claimed in claim 1 is characterized in that:
Above-mentioned terminal electrode is arranged on the central portion of foregoing circuit substrate.
5. high-frequency equipments assembly base plate as claimed in claim 1 is characterized in that:
In the above-mentioned grounding conductor layer, be connected with a plurality of perforation conductors that connect the foregoing circuit substrate and be electrically connected with the above-mentioned conductor layer of the back side that is formed on above-mentioned insulator layer or inside.
6. high-frequency equipments assembly base plate as claimed in claim 1 is characterized in that:
Above-mentioned high-frequency apparatus is the piezoelectrics filters.
7. high-frequency equipments assembly base plate as claimed in claim 1 is characterized in that:
Above-mentioned high-frequency apparatus is a channel-splitting filter.
8. high-frequency equipments assembly base plate as claimed in claim 1 is characterized in that:
Also have: signal electrode, it is arranged on the periphery on surface of foregoing circuit substrate, is connected with above-mentioned holding wire, and is connected with the center conductor of coaxial connector; And,
Grounding electrode, it is arranged on the periphery on surface of foregoing circuit substrate, is used to use scolding tin to connect the periphery conductor of above-mentioned coaxial connector,
In the above-mentioned grounding electrode, in adhering to the zone of above-mentioned scolding tin, be formed with the through hole that connects the foregoing circuit substrate,
On the inner face of this through hole, be coated with conductor layer.
9 high-frequency equipments assembly base plates as claimed in claim 1 is characterized in that:
The back side of above-mentioned holding wire and above-mentioned insulator layer or the inner above-mentioned conductor layer that forms are disposed by relative, and above-mentioned conductor layer ground connection.
10. communicating machine is characterized in that:
Put and be loaded with the high-frequency equipments assembly base plate described in the claim 1.
11. a high-frequency equipments assembly base plate is characterized in that,
Have: circuit substrate has conductor layer in the back side or the inside of insulator layer;
A plurality of terminal electrodes, it is arranged on the surface of foregoing circuit substrate, is connected with the terminal of high-frequency apparatus;
A plurality of holding wires, it is arranged on the surface of foregoing circuit substrate, is connected with above-mentioned terminal electrode;
Signal electrode, it is arranged on the periphery on surface of foregoing circuit substrate, is connected with above-mentioned holding wire, and is connected with the center conductor of coaxial connector; And,
Grounding electrode, it is arranged on the periphery on surface of foregoing circuit substrate, is used to use scolding tin to connect the periphery conductor of above-mentioned coaxial connector,
In the above-mentioned grounding electrode, in adhering to the zone of above-mentioned scolding tin, be formed with the through hole that connects the foregoing circuit substrate,
On the inner face of this through hole, be coated with conductor layer,
The foregoing circuit substrate is the laminated substrate that lamination has a plurality of insulator layers, and its inside is formed with internal conductor layer, is formed on the conductor layer on the inner face of above-mentioned through hole, be connected with above-mentioned internal conductor layer,
Above-mentioned holding wire is radial extension from above-mentioned terminal electrode, and with the straight line of any 1 holding wire from above-mentioned terminal electrode virtual extension, any 1 holding wire does not constitute same straight line from the straight line of above-mentioned terminal electrode virtual extension with inciting somebody to action in addition.。
12. high-frequency equipments assembly base plate as claimed in claim 11 is characterized in that:
On the position near the foregoing circuit substrate outside in above-mentioned grounding electrode, a plurality of above-mentioned through holes are set.
13. high-frequency equipments assembly base plate as claimed in claim 12 is characterized in that:
Also the position away from above-mentioned holding wire is provided with above-mentioned through hole in above-mentioned grounding electrode, above-mentioned through hole by from the periphery of foregoing circuit substrate towards the central portion setting.
14. high-frequency equipments assembly base plate as claimed in claim 11 is characterized in that:
Position away from above-mentioned holding wire in above-mentioned grounding electrode is provided with above-mentioned through hole, above-mentioned through hole by from the periphery of foregoing circuit substrate towards the central portion setting.
15. high-frequency equipments assembly base plate as claimed in claim 11 is characterized in that:
Above-mentioned grounding electrode is with on the surface of foregoing circuit substrate, be connected along the formed surface earthing conductor layer of above-mentioned holding wire.
16. a high-frequency equipments assembly base plate is characterized in that,
Have: circuit substrate has conductor layer in the back side or the inside of insulator layer;
A plurality of terminal electrodes, it is arranged on the surface of foregoing circuit substrate, is connected with the terminal of high-frequency apparatus;
A plurality of holding wires, it is arranged on the surface of foregoing circuit substrate, is connected with above-mentioned terminal electrode; And,
Signal electrode, it is arranged on the periphery on surface of foregoing circuit substrate, is connected with above-mentioned holding wire, and is connected with the center conductor of coaxial connector; And,
Grounding electrode, it is arranged on the periphery on surface of foregoing circuit substrate, is used to use scolding tin to connect the periphery conductor of above-mentioned coaxial connector,
In the above-mentioned grounding electrode, in adhering to the zone of above-mentioned scolding tin, be formed with the through hole that connects the foregoing circuit substrate,
On the inner face of this through hole, be coated with conductor layer,
The back side of foregoing circuit substrate with the corresponding position of above-mentioned grounding electrode on, be formed with the 2nd grounding electrode, the 2nd grounding electrode, the above-mentioned conductor layer on the inner face through being formed on above-mentioned through hole, be connected with the above-mentioned grounding electrode on the surface of foregoing circuit substrate
Above-mentioned holding wire is radial extension from above-mentioned terminal electrode, and with the straight line of any 1 holding wire from above-mentioned terminal electrode virtual extension, any 1 holding wire does not constitute same straight line from the straight line of above-mentioned terminal electrode virtual extension with inciting somebody to action in addition.
17. a high-frequency equipments assembly base plate is characterized in that,
Have: circuit substrate has conductor layer in the back side or the inside of insulator layer;
Terminal electrode, it is arranged on the surface of foregoing circuit substrate, is connected with the terminal of high-frequency apparatus;
Holding wire, it is arranged on the surface of foregoing circuit substrate, is connected with above-mentioned terminal electrode;
Grounding conductor layer is arranged on the surface of foregoing circuit substrate;
Signal electrode, it is arranged on the periphery on surface of foregoing circuit substrate, is connected with above-mentioned holding wire, and is connected with the center conductor of coaxial connector; And,
Grounding electrode, it is arranged on the periphery on surface of foregoing circuit substrate, is used to use scolding tin to connect the periphery conductor of above-mentioned coaxial connector,
Interval between above-mentioned holding wire and the above-mentioned grounding conductor layer, greater than above-mentioned holding wire and be formed on the back side of above-mentioned insulator layer or the interval between the inner above-mentioned conductor layer,
In the above-mentioned grounding electrode, in adhering to the zone of above-mentioned scolding tin, be formed with the through hole that connects the foregoing circuit substrate,
On the inner face of this through hole, be coated with conductor layer.
18. high-frequency equipments assembly base plate as claimed in claim 17 is characterized in that:
Above-mentioned high-frequency apparatus is the piezoelectrics filters.
19. high-frequency equipments assembly base plate as claimed in claim 17 is characterized in that:
Above-mentioned high-frequency apparatus is a channel-splitting filter.
20. a communicating machine is characterized in that:
Put and be loaded with the high-frequency equipments assembly base plate described in the claim 17.
21. the evaluating characteristics of a high-frequency apparatus is estimated the characteristic that is installed in the high-frequency apparatus on the high-frequency equipments assembly base plate, it is characterized in that, comprising:
High-frequency apparatus is installed in operation on the described high-frequency equipments assembly base plate of claim 1;
Above-mentioned high-frequency equipments assembly base plate is connected the operation of measuring with wiring; And,
The characteristic check operation that the characteristic that is installed in the above-mentioned high-frequency apparatus on the above-mentioned high-frequency equipments assembly base plate is checked.
22. the evaluating characteristics of a high-frequency apparatus is estimated the characteristic that is installed in the high-frequency apparatus on the high-frequency equipments assembly base plate, it is characterized in that, comprising:
High-frequency apparatus is installed in operation on the described high-frequency equipments assembly base plate of claim 17;
Use scolding tin that the coaxial connector that above-mentioned high-frequency equipments assembly base plate is connected with coaxial connector is connected operation; And,
The characteristic check operation that the characteristic that is installed in the above-mentioned high-frequency apparatus on the above-mentioned high-frequency equipments assembly base plate is checked.
CN 200610006443 2005-01-20 2006-01-20 High-frequency equipments assembly base plate and communicating machine Active CN100559913C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005012430 2005-01-20
JP2005012430 2005-01-20
JP2005049191 2005-02-24

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CN100559913C true CN100559913C (en) 2009-11-11

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Application Number Title Priority Date Filing Date
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Publication number Priority date Publication date Assignee Title
JP5434019B2 (en) * 2008-09-03 2014-03-05 三菱電機株式会社 Inspection jig
CN114520212B (en) * 2022-04-20 2022-08-23 之江实验室 Wideband chip packaging structure supporting high-speed signal transmission

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