CN100553405C - The method of circuit board manufacturing - Google Patents
The method of circuit board manufacturing Download PDFInfo
- Publication number
- CN100553405C CN100553405C CNB200710138448XA CN200710138448A CN100553405C CN 100553405 C CN100553405 C CN 100553405C CN B200710138448X A CNB200710138448X A CN B200710138448XA CN 200710138448 A CN200710138448 A CN 200710138448A CN 100553405 C CN100553405 C CN 100553405C
- Authority
- CN
- China
- Prior art keywords
- insulation film
- circuit board
- line layer
- metal substrate
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
A kind of method of circuit board manufacturing comprises the steps: at first, and a metal substrate is provided, and carries out an electrophoretic deposition program, to form an insulation film in metallic substrate surfaces.Then, on insulation film, form a plurality of holes, with the metal substrate of exposed portion.Then, on insulation film, make a line layer, and cover above-mentioned hole, make line layer connect metal substrate by hole.Form a metal coupling on this line layer surface again.Afterwards,, metal substrate is made into another line layer, and forms a circuit board with double-deck circuit by actions such as little shadow and etchings.This circuit board can electrically connect by metal coupling and another substrate and constitute a composite base plate.The present invention utilizes the electrophoretic deposition program to form insulation film, can effectively reduce the thickness of circuit board, improves the density of configuration and improves the circuit characteristic of circuit board.Simultaneously, in the circuit board line processing procedure, form metal coupling (via) simultaneously, make when pressing can the conducting different layers line layer, so the present invention has higher process rate.
Description
Technical field
The present invention relates to a kind of method of circuit board manufacturing, particularly about a kind of method of utilizing the electrophoretic deposition program to come circuit board manufacturing.
Background technology
Along with the progress of science and technology and the raising of quality of the life, the consumer except powerful, also further requires light, thin, short, little for the requirement of electronic product.Therefore, the degree of integration of electronic product (integration) is more and more higher on the market, and function is also more and more stronger.
In order to meet above-mentioned development trend, the circuit board that is used for installing electronic component in the electronic product also little by little develops into bilayer, four layers, eight layers by the uniline layer, even ten layers more than the line layer, makes electronic component to be installed on the circuit board more thick and fast, thereby dwindle the volume of electronic product.
The substrate of general circuit plate also has some to have the also thin circuit board of special purpose and utilizes metal substrate to be made except common insulation resin class substrate (as FR4).Please refer to Figure 1A, Fig. 2 A, Fig. 3 A and Fig. 4, is the processing procedure schematic diagram of the circuit board of substrate for having now with the metal material.Please refer to Figure 1A, a metal substrate 10 at first is provided, wherein the material of this metal substrate 10 can be copper.
Then, one insulating material is coated on the metal substrate 10, makes it form an insulating barrier 12 in the mode of spin coating.Wherein, above-mentioned insulating material can be polyalkylene imine (polymide).Please also refer to Figure 1B, Figure 1B is the vertical view of Figure 1A, has shown that insulating barrier 12 covers the situation of metal substrates 10, and Figure 1A is along the a-a ' hatching among Figure 1B and profile.
Please refer to Fig. 2 A, then on above-mentioned insulating barrier 12, form several holes 14.Please also refer to Fig. 2 B, Fig. 2 B is the vertical view of Fig. 2 A, and Fig. 2 A is along the b-b ' hatching among Fig. 2 B and profile.
Then, please refer to Fig. 3 A, form a metal level earlier on insulating barrier 12 and hole 14, then carry out processing procedures such as little shadow, etching and make metal level form a line layer 16.Please also refer to Fig. 3 B, Fig. 3 B is the vertical view of Fig. 3 A, and Fig. 3 A is along the c-c ' hatching among Fig. 3 B and profile.
Wherein, this line layer 16 can produce intraconnections (interconnection) with metal substrate 10.Yet,, form another line layer so can carry out processing procedures such as little shadow, etching, thereby form a circuit board, as shown in Figure 4 with double-deck circuit to metal substrate 10 because metal substrate 10 itself also is a metal level.
In above-mentioned processing procedure, because the formation of insulating barrier 12 utilizes the spin coating mode to realize, such generation type causes insulating barrier 12 thickness excessive easily, with and planarization is not good etc. that problem produces.
Therefore, for overcoming above-mentioned existing in prior technology weak point, be necessary to provide a kind of effective solution.
Summary of the invention
One of purpose of the present invention is to utilize the electrophoretic deposition program to form the insulation film of circuit board, with the thickness of effective reduction circuit board, and the density of raising configuration.
Another object of the present invention is to utilize the electrophoretic deposition program to form the insulation film of circuit board, to improve the circuit characteristic of circuit board.
Another purpose of the present invention is to form via simultaneously in the circuit board line processing procedure, make when pressing can the conducting different layers line layer.Like this, can avoid existing via is to form after pressing again, thereby causes problems such as follow-up contraposition and processing procedure, so the present invention has higher process rate.
For achieving the above object, the invention provides a kind of method of circuit board manufacturing, comprise the steps: to provide one first metal substrate; Carry out an electrophoretic deposition program, on a surface of this first metal substrate, form one first insulation film; On this first insulation film, form a plurality of first holes, to expose this first metal substrate partly to the open air; On this first insulation film, make one first line layer, and cover this first hole, make this first line layer connect this first metal substrate by this first hole; Form one first metal coupling on this first line layer surface; One circuit base plate is provided, and this circuit base plate has one second line layer; And this first metal substrate covered and be pressed together on this circuit base plate, constituting a composite base plate, and electrically connect first line layer of this first metal substrate and this second line layer of this circuit base plate by this first metal coupling.
For achieving the above object, the invention provides the method for another kind of circuit board manufacturing, comprise the steps: at first, one first metal substrate and one second metal substrate are provided, and carry out an electrophoretic deposition program, on a surface of first metal substrate and second metal substrate, form one first insulation film and one second insulation film respectively.Then, on first insulation film, form a plurality of first holes, to expose first metal substrate partly to the open air; And on second insulation film, form a plurality of second holes, to expose second metal substrate partly to the open air.
Then, on first insulation film, make one first line layer, and cover first hole, make first line layer connect first metal substrate by first hole; And on second insulation film, make one second line layer, and cover second hole, make second line layer connect second metal substrate by second hole.
Subsequently, form one first metal coupling, and form one second metal coupling on second line layer surface on first line layer surface.Then, first metal substrate is covered and is pressed together on second metal substrate, to constitute a composite base plate.Wherein, second metal coupling can be connected with first metal coupling, to form the passage that electrically connects between first line layer and second line layer.
At last, do not cover at composite base plate and form a tertiary circuit layer and one the 4th line layer on the both side surface of first insulation film and second insulation film, formation one dielectric layer on tertiary circuit layer and the 4th line layer respectively more afterwards is to finish the making of circuit board.
Compared with prior art, the present invention utilizes the electrophoretic deposition program to form insulation film, can effectively reduce the thickness of circuit board, improves the density of configuration and improves the circuit characteristic of circuit board.Simultaneously, in the circuit board line processing procedure, form metal coupling (via) simultaneously, make when pressing can the conducting different layers line layer, so the present invention has higher process rate.
The present invention is further illustrated below in conjunction with accompanying drawing and embodiment.
Description of drawings
Figure 1A, Fig. 2 A, Fig. 3 A and Fig. 4 are a series of circuit board profile, in order to the making flow process of explanation available circuit plate;
Figure 1B is the schematic top plan view of Figure 1A;
Fig. 2 B is the schematic top plan view of Fig. 2 A;
Fig. 3 B is the schematic top plan view of Fig. 3 A;
Fig. 5 A, Fig. 6 A, Fig. 7 A and Fig. 8 to Figure 11 are a series of circuit board profile, in order to the making flow process of circuit board in the explanation first embodiment of the invention;
Fig. 5 B is the schematic top plan view of Fig. 5 A;
Fig. 6 B is the schematic top plan view of Fig. 6 A;
Fig. 7 B is the schematic top plan view of Fig. 7 A; And
Figure 12 to Figure 14 is a series of circuit board profile, in order to the making flow process of circuit board in the explanation second embodiment of the invention.
Embodiment
Relevant detailed description of the present invention and technology contents, existing as follows with regard to accompanying drawings:
Fig. 5 A, Fig. 6 A, Fig. 7 A, Fig. 8, Fig. 9, Figure 10 and Figure 11 are shown as the schematic diagram of first embodiment of the method for circuit board manufacturing of the present invention.Please refer to Fig. 5 A, one first metal substrate 20 at first is provided, and carry out an electrophoretic deposition program, form one first insulation film 22 on first metal substrate, 20 surfaces.Please also refer to Fig. 5 B, Fig. 5 B is the vertical view of Fig. 5 A, has shown that first insulation film 22 covers the situation of first metal substrates 20, and Fig. 5 A is along the d-d ' hatching among Fig. 5 B and profile.
Wherein, the material of first metal substrate 20 can be copper or aluminium.And above-mentioned electrophoretic deposition program comprises the following steps: at first metal substrate, 20 surface deposition macromolecule micellas, then carries out a heat treatment process, makes the macromolecule micella aggregate into first insulation film 22.
Wherein, the macromolecule micella is dispersed in earlier in the solution, utilizes electric field action again, with macromolecule micella electrophoretic deposition on first metal substrate, 20 surfaces.Because the micella in the solution is a kind of unpolymerized macromolecule, when being deposited on first metal substrate, 20 surfaces, still be gluey.Therefore, need carry out a heat treatment process, comprise the process of dehydration and cyclisation at least, make the macromolecule micella aggregate into required macromolecule kenel.
And the macromolecule micella comprises silica inorganic particulate and macromolecule predecessor, and the macromolecule predecessor can be chosen from the combination of the flame resistance macromolecule resin of polyimide resin and derivative, epoxy resin and derivative thereof, halogen-containing macromolecule resin, phosphorous, silicon, sulphur.
Advantage that it should be noted that the electrophoretic deposition program is to control the thickness of insulation film according to electric current, voltage or the time of deposition, and its thickness even can be controlled in below 10 microns.In addition, because insulation film is to form with depositional mode, so the rete of deposition can be quite even and smooth.Therefore, the thickness of insulation film of the present invention than the thin thickness of existing insulating barrier many, and more smooth.
Then, please refer to Fig. 6 A, on first metal substrate 20, form after first insulation film 22, form a plurality of first holes 24 at first insulation film 22, to expose first metal substrate 20 partly to the open air.Please also refer to Fig. 6 B, Fig. 6 B is the vertical view of Fig. 6 A, shows the situation that forms a plurality of first holes 24 on first insulation film 22.And Fig. 6 A is along the e-e ' hatching among Fig. 6 B and profile.Wherein, above-mentioned first hole 24 forms by Laser drill.Yet when the material of first insulation film 22 was photosensitive material, first hole 24 also can utilize the mode of exposure imaging to make, and perhaps utilizes engraving method to form.
Please refer to Fig. 7 A, form after first hole 24, on first insulation film 22, make one first line layer 26, and cover above-mentioned first hole 24, make first line layer 26 connect first metal substrate 20, and form intraconnections (interconnection) by first hole 24.Please also refer to Fig. 7 B, Fig. 7 B is the vertical view of Fig. 7 A, shows the wiring situation of first line layer 26.And Fig. 7 A is along the f-f ' hatching among Fig. 7 B and profile.
Wherein, the generation type of first line layer 26 comprises the following steps: at first, forms a metal level and covers on first insulation film 22 and first hole 24.Then, on above-mentioned metal level, form a patterning photoresist layer, and carry out etching, to form first line layer 26 metal layer patternization.Remove the patterning photoresist layer at last again.In preferred embodiment, this patterning photoresist layer is a dry film.
Please refer to Fig. 8, make after first line layer 26, form one first metal coupling 27 on first line layer, 26 surfaces.Wherein, first metal coupling 27 can utilize the mode of plating to form.
Please refer to Fig. 9, one second metal substrate 30 further is provided, and carry out and the identical manufacturing process of above-mentioned first metal substrate 20, processing procedure is as described below.The electrophoretic deposition program is carried out on a surface at second metal substrate 30, forming one second insulation film 32, and forms a plurality of second holes 34 on second insulation film 32, to expose second metal substrate 30 partly to the open air.
On second insulation film 32, make one second line layer 36, and cover second hole 34, make second line layer 36 connect second metal substrate 30 by second hole 34.And, form one second metal coupling 37 on second line layer, 36 surfaces.
Please continue with reference to figure 9, first metal substrate 20 be covered and is pressed together on second metal substrate 30, to constitute a composite base plate 5.Wherein, first metal substrate 20 and second metal substrate 30 are pressed together on the both sides of a dielectric layer 40.
And during two metal substrate pressings, second metal coupling 37 can be connected with first metal coupling 27, so that the passage that electrically connects between first line layer 26 and second line layer 36 to be provided, as shown in figure 10.At this moment, the effect of guide hole (via) has been played in the connection of two metal couplings 27,37, has formed the passage that electrically connects between line layer.
Please refer to Figure 11, owing to the both side surface that does not cover first insulation film 22 and second insulation film 32 at composite base plate 5 is metal level, so, can make a tertiary circuit layer 28 and one the 4th line layer 38 in the two sides of composite base plate 5 respectively.That is to say that metal substrate originally is used to be made into the outermost layer wiring.
Wherein, the manufacturing process of tertiary circuit layer 28 and the 4th line layer 38 is as described below.Form a patterning photoresist layer does not cover the two sides of first insulation film 22 and second insulation film 32 at composite base plate 5 layer on surface of metal respectively.Then, the above-mentioned part metals layer of etching removes the patterning photoresist layer again, to finish the making of two line layers.
It should be noted that for fear of the flexibility of metal substrate too highly, and cause base plate supports power in the processing procedure not enough and produce the problem of warpage, the metal substrate that is provided in the processing procedure all has certain thickness usually, so that metal substrate has enough rigidity.
Because metal substrate is thicker, so before making tertiary circuit layer 28 and the 4th line layer 38, can carry out a thinning earlier and handle.Wherein, the mode that can utilize mechanical lapping or chemical etching is handled in so-called thinning, with the metal level thinning of composite base plate 5 both sides, to reduce metal layer thickness.
And after tertiary circuit layer 28 and the 4th line layer 38 complete, form a welding cover layer (solder mask) more respectively on two line layer surfaces, with protection circuit.
Please refer to Figure 12 to Figure 14, be the schematic diagram of method second embodiment of circuit board manufacturing of the present invention.As the making step of first embodiment, and please refer to Figure 12, when after first line layer, 26 surfaces form first metal coupling 27, can provide a circuit base plate 50 again, this circuit base plate 50 has one second line layer 56.Wherein, the baseplate material of this circuit base plate 50 can be metal or other insulating material generally commonly used.And this circuit base plate 50 can be the circuit board with multilayer line layer.
Please continue with reference to Figure 12, first metal substrate 20 be covered and is pressed together on the circuit base plate 50, and constitute a composite base plate.Wherein, first metal substrate 20 and circuit base plate 50 are pressed together on the both sides of a dielectric layer 40.
And two substrates pressing and the composite base plate 6 that constitutes are to be used as the passage that electrically connects between second line layer 56 of first line layer 26 of first metal substrate 20 and circuit base plate 50 by first metal coupling 27, as shown in figure 13.At this moment, first metal coupling 27 has the function of guide hole (via).
Please refer to Figure 14, because the surface that composite base plate 6 does not cover first insulation film 22 is a metal level, so, can not cover at first metal substrate 20 of composite base plate 6 on the surface of first insulation film 22 and form a tertiary circuit layer 28.
Wherein, the manufacturing process of tertiary circuit layer 28 is as described below: the layer on surface of metal that does not cover first insulation film 22 at first metal substrate 20 of composite base plate 6 forms a patterning photoresist layer.Then, the above-mentioned part metals layer of etching removes the patterning photoresist layer again, to finish the making of tertiary circuit layer 28.
It should be noted that before making tertiary circuit layer 28, can carry out a thinning earlier and handle.Handle by thinning, the metal layer thickness of first metal substrate 20 is reduced to the thickness of suitable making line layer.And after tertiary circuit layer 28 completes, form a welding cover layer (solder mask) on its surface again, with protection circuit.
In sum, compared with prior art, the circuit board of making the method made of circuit board by the present invention has following advantages:
One, utilize the electrophoretic deposition program to form owing on the insulation film of circuit board, institute Thickness with insulation film is littler. Therefore, can significantly reduce the thickness of circuit board, and improve The density of configuration.
Two, because the formed insulation film of electrophoretic deposition program has better planarization, So the line layer that is formed on the insulation film will have better circuit characteristic.
Three, owing in the circuit processing procedure, formed simultaneously metal coupling (via), so that Get final product the line layer of conducting different layers during pressing. Therefore, can avoid existing via is to press Form again after closing, and have the problems such as contraposition and processing procedure, so the present invention has higher system The journey yield.
Claims (16)
1. the method for a circuit board manufacturing comprises the following steps:
(a) provide one first metal substrate;
(b) on a surface of described first metal substrate, form one first insulation film;
(c) on described first insulation film, form a plurality of first holes, with described first metal substrate of exposed portion;
(d) on described first insulation film, make one first line layer, and cover described first hole, make described first line layer connect described first metal substrate by described first hole;
(e) provide a circuit base plate, described circuit base plate has one second line layer; And
(f) described first metal substrate is covered and is pressed together on the described circuit base plate, to constitute a composite base plate;
It is characterized in that: step (b) is to realize by carrying out an electrophoretic deposition program, further be included in described first line layer surface between step (d) step (e) and form one first this step of metal coupling, and step (f) further comprises by described first metal coupling and electrically connects first line layer of described first metal substrate and described second line layer of described circuit base plate.
2. the method for circuit board manufacturing according to claim 1 is characterized in that the electrophoretic deposition program in the step (b) comprises the following steps:
Deposition macromolecule micella on described first metallic substrate surfaces; And carry out a heat treatment process, make described macromolecule micella aggregate into described first insulation film.
3. as the method for circuit board manufacturing as described in the claim 2, it is characterized in that described macromolecule micella comprises silica inorganic particulate and macromolecule predecessor, described macromolecule predecessor is to choose from the combination of the flame resistance macromolecule resin of polyimide resin and derivative, epoxy resin and derivative thereof, halogen-containing macromolecule resin, phosphorous, silicon, sulphur.
4. as the method for circuit board manufacturing as described in the claim 2, it is characterized in that described heat treatment process comprises the process of dehydration and cyclisation at least.
5. the method for circuit board manufacturing according to claim 1 is characterized in that described first hole that forms in the step (c) is that mode by Laser drill, etching or exposure imaging forms.
6. the method for circuit board manufacturing according to claim 1 is characterized in that the formation method of first line layer described in the step (d) comprises following substep:
Forming a metal level covers on described first insulation film and described first hole; On described metal level, form a patterning photoresist layer;
Carry out etching with described metal layer patternization, to form described first line layer; And remove described patterning photoresist layer.
7. the method for circuit board manufacturing according to claim 1 is characterized in that described first metal coupling is to be formed on described first line layer by the mode of electroplating.
8. the method for circuit board manufacturing according to claim 1 is characterized in that step (f) comprises further that afterwards a thinning handles.
9. as the method for circuit board manufacturing as described in the claim 8, it is characterized in that described thinning handles the mode that comprises mechanical lapping or chemical etching.
10. the method for circuit board manufacturing according to claim 1 is characterized in that step (f) afterwards, comprises that further forming a tertiary circuit layer does not cover on the surface of described first insulation film at described first metal substrate of described composite base plate.
11. the method as circuit board manufacturing as described in the claim 10 is characterized in that the step of the described tertiary circuit layer of above-mentioned formation comprises following substep:
Forming a patterning photoresist layer does not cover on the layer on surface of metal of described first insulation film at described first metal substrate of described composite base plate;
The above-mentioned metal level of etching part; And
Remove described patterning photoresist layer.
12. the method for a circuit board manufacturing comprises the following steps:
(a) provide one first metal substrate and one second metal substrate;
(b) on a surface of described first metal substrate and described second metal substrate, form one first insulation film and one second insulation film respectively;
(c) on described first insulation film, form a plurality of first holes, with described first metal substrate of exposed portion, and on described second insulation film, form a plurality of second holes, with described second metal substrate of exposed portion;
(d) on described first insulation film, make one first line layer, and cover described first hole, make described first line layer connect described first metal substrate by described first hole, and on described second insulation film, make one second line layer, and cover described second hole, make described second line layer connect described second metal substrate by described second hole;
(e) described first metal substrate is covered and is pressed together on described second metal substrate, to constitute a composite base plate;
(f) do not cover at described composite base plate and form a tertiary circuit layer and one the 4th line layer on the both side surface of described first insulation film and described second insulation film; And
(g) on described tertiary circuit layer and described the 4th line layer, form a welding cover layer respectively; It is characterized in that: step (b) is to realize by carrying out an electrophoretic deposition program, further be included in described first line layer surface between step (d) step (e) and form one first metal coupling, and in described second line layer surface formation one second this step of metal coupling, and step (f) further comprises described second metal coupling of connection and described first metal coupling, so that the passage that electrically connects between described first line layer and described second line layer to be provided.
13. the method as circuit board manufacturing as described in the claim 12 is characterized in that the electrophoretic deposition program in the step (b) comprises the following steps:
Deposition macromolecule micella on described first metal substrate and described second metallic substrate surfaces; And
Carry out a heat treatment process, make described macromolecule micella aggregate into described first insulation film and described second insulation film.
14. method as circuit board manufacturing as described in the claim 13, it is characterized in that described macromolecule micella comprises silica inorganic particulate and macromolecule predecessor, described macromolecule predecessor is to choose from the combination of the flame resistance macromolecule resin of polyimide resin and derivative, epoxy resin and derivative thereof, halogen-containing macromolecule resin, phosphorous, silicon, sulphur.
15. the method as circuit board manufacturing as described in the claim 12 is characterized in that step (e) afterwards, comprises that further a thinning handles.
16. the method as circuit board manufacturing as described in the claim 12 is characterized in that step (f) comprises following substep:
Do not cover at described composite base plate on the layer on surface of metal of two sides of described first insulation film and described second insulation film and form a patterning photoresist layer respectively;
The above-mentioned metal level of etching part; And
Remove described patterning photoresist layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200710138448XA CN100553405C (en) | 2007-07-27 | 2007-07-27 | The method of circuit board manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200710138448XA CN100553405C (en) | 2007-07-27 | 2007-07-27 | The method of circuit board manufacturing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101087494A CN101087494A (en) | 2007-12-12 |
| CN100553405C true CN100553405C (en) | 2009-10-21 |
Family
ID=38938182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200710138448XA Active CN100553405C (en) | 2007-07-27 | 2007-07-27 | The method of circuit board manufacturing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100553405C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103278956A (en) * | 2013-05-08 | 2013-09-04 | 京东方科技集团股份有限公司 | Display panel and manufacturing method thereof |
| CN111432577B (en) * | 2020-03-03 | 2023-02-17 | 宁波华远电子科技有限公司 | Photosensitive polyimide addition and subtraction circuit process of ultrathin rigid-flex board |
-
2007
- 2007-07-27 CN CNB200710138448XA patent/CN100553405C/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101087494A (en) | 2007-12-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6000130A (en) | Process for making planar redistribution structure | |
| KR100836653B1 (en) | Circuit board and method for manufacturing thereof | |
| EP0450381B1 (en) | Multilayer interconnection structure | |
| JP2001320171A (en) | Multilayer wiring board and semiconductor device | |
| JPH0432295A (en) | Manufacture of multilayer wiring board | |
| JPH04355086A (en) | Manufacture of electric connecting element | |
| US20050218491A1 (en) | Circuit component module and method of manufacturing the same | |
| KR20070068445A (en) | Structure and method of making interconnect element having metal traces embedded in surface of dielectric | |
| US8186043B2 (en) | Method of manufacturing a circuit board | |
| US8756804B2 (en) | Method of manufacturing printed circuit board | |
| CN100553405C (en) | The method of circuit board manufacturing | |
| US6651324B1 (en) | Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer | |
| JPH0513960A (en) | Manufacture of multilayer wiring board | |
| KR101039774B1 (en) | Method of fabricating a metal bump for printed circuit board | |
| CN100584156C (en) | Circuit board and its making method | |
| TW201927090A (en) | Wiring board and manufacturing method thereof | |
| KR20130047080A (en) | Method for manufacturing substrate with metal post and substrate manufactured by the same method | |
| JP2000269642A (en) | Multilayer interconnection board and manufacture thereof | |
| KR20060042723A (en) | Method for manufacturing rigid-flexible printed circuit board | |
| US10553475B2 (en) | Single layer integrated circuit package | |
| TW201804879A (en) | Circuit carrier and manufacturing method thereof | |
| TW201812929A (en) | Package substrate, method for making the same, and package structure having the same | |
| CN117440599A (en) | Circuit board structure and manufacturing method thereof | |
| US8671562B2 (en) | Method for manufacturing a circuit board | |
| JP2024012083A (en) | Package structure that achieves chip interconnection, and method of manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |