CN100541845C - Luminescent device and lighting device - Google Patents

Abstract

Problem of the present invention provide with in the past device mutually specific energy realize high power, high output device property luminescent device and manufacture method thereof and improved thermal diffusivity and the high lighting device of reliability.Luminescent device of the present invention is characterised in that: possess ceramic component 1, light-emitting component 2, light transmission member 4 and hardware 5, with bonding agent mutually bonding ceramic component 1 and light transmission member 4 and ceramic component 1 and hardware 5, this bonding agent is to be constituted as the hot melt material 6 that demonstrates flexibility under the adhering state solidifying, ceramic component 1 has pore h at least on the surface portion of power supply bonding region, simultaneously hot melt material 6 be impregnated among this pore h.

Description

Luminescent device and lighting device

Technical field

The present invention relates to the luminescent device and the manufacture method thereof of light-emitting diode or laser diode etc., for example relate to light-emitting diode as the light-emitting component that is provided with high power, high output be configured, aspect thermal diffusivity good luminescent device and manufacture method thereof, also relate to the lighting device that uses this luminescent device and be configured.

Background technology

As luminescent device, can enumerate the electronic device of light-emitting diode or laser diode etc. typically.Wherein, for light-emitting diode (below be also referred to as LED),, penetrate light from this light-emitting component by light-emitting component being set and this light-emitting component being supplied with the power of regulation.At this moment, light-emitting component follows this luminous and generate heat, and thus, the temperature of LED has risen.

In recent years, practicability along with blue led and White LED, more and more LED is used in the demonstration in the indicator light of electric product or the liquid crystal back of the body irradiation source of portable telephone etc., and then, along with the high luminous efficiency and the raising of brightness, expection will be used in the illumination of room lighting, automobile illumination, semaphore etc. etc. widely.Be used in by this way under the situation of illumination etc., requiring the LED of higher output from now on, at this moment, light-emitting component is being supplied with higher power, correspondingly the temperature of LED rises manyly.

In the luminescent device of the LED of such high power, high output etc., adopt sometimes the encapsulation that constitutes by pottery with ceramic component as the encapsulation member that can tolerate temperature rising as described above.

Possessing such encapsulation with in the luminescent device of ceramic component, for example on encapsulating, the heat transmission hardware that is made of metal is set with ceramic component, so that the temperature of the semiconductor element of light-emitting component etc. is suppressed at below the guarantee of work temperature of regulation, utilize heat conduction that the heat from semiconductor element is promptly moved towards hardware from ceramic component, with this hardware it is disperseed simultaneously, carried out heat radiation efficiently from metal component surface to radiating part.

Possessing such heat transmission hardware and encapsulation with in the luminescent device of ceramic component, usually with bonding agent bonding mutually hardware and ceramic component.In the past, carried out the welding of tape welding material as such bonding agent, carried out the bonding of such hardware and ceramic component by welding material with the general silver (Ag) that uses, gold (Au), copper (Cu), Zn (zinc), Cd (cadmium) etc.

But, possess heat transmission hardware and encapsulation with ceramic component and with welding in the luminescent device of mutually bonding hardware and ceramic component as described above, if in the coefficient of linear expansion of hardware and ceramic component, there are differences, then correspondingly in hardware and ceramic component, produce the stress of following temperature to rise, the breakage (crackle) of warpage, ceramic component etc. takes place easily.For fear of this problem, in ceramic component and hardware bonding, used the approximate material of coefficient of linear expansion separately as ceramic material and metal material in the past.

As above-mentioned ceramic material, generally use aluminium nitride (AlN), aluminium oxide (Al ₂O ₃) etc., as above-mentioned metal material, generally use copper-composite tungsten material (CuW), copper-molybdenum composite material (CuMo, CuMoCu) etc.Below, the coefficient of linear expansion of each material is shown.

Ceramic material AlN 4.5 * 10 ^-6

Al ₂O ₃ 6.7×10 ^-6

Metal material CuW 6.5 * 10 ^-6(W-10:89W, 11Cu)

CuMo 7.0×10 ^-6(CM-15：85Mo，15Cu)

CuMoCu 8.9×10 ^-6(CMC111)

Have, above-mentioned CuMoCu (CMC111) is the material of living the Mo plate and having carried out crimping with 2 Cu plate holders again, and 3 layers of ratio are decided to be Cu: Mo: Cu=1: 1: 1.

But, the pyroconductivity of the metal material of above-mentioned CuW, CuMo, CuMoCu etc. compares the pyroconductivity (being Cu (393W/mk) typically) of good metal material with respect to pyroconductivity, be poor, i.e. CuW (180W/mk), CuMo (160W/mk), CuMoCu (232W/mk).Thereby, be in a ratio of in the luminescent device of LED etc. of high power, high output with the existing device that is used in illumination etc., as the heat transmission hardware, though wish to use relatively good metal material of the such pyroconductivity of Cu, (coefficient of linear expansion is 17.0 * 10 to Cu ^-6) coefficient of linear expansion of such metal material is with respect to the coefficient of linear expansion of ceramic material, it differs greatly, and the problem that results from the warpage of the stress that the temperature of following hardware and ceramic component rises, the breakage (crackle) of ceramic component etc. as described above takes place easily.

On the other hand, in the LED of high power, high output, following requirement is arranged.That is, in LED, in general, be difficult to utilize the light that penetrates from the side of light-emitting component, correspondingly be difficult to penetrate efficiently light.For example, use ceramic component as encapsulation with under the situation of member, because the light that penetrates from the side of light-emitting component reflects by ceramic component and send to the outside, so correspondingly can not utilize light efficiently.In addition, for example under the situation that LED is used in illumination etc.,, then cause optically focused irregular because of the catoptrical cause that is reflected by ceramic component from the light-emitting component side if the light that comes self-emission device is carried out optically focused with lens etc.A plurality of LED were set in the past as a plurality of light sources, to reduce influence because of the irregular generation of this optically focused.But the LED that is in a ratio of high power, high output with existing device can be used as single light source and utilizes.Thereby, being in a ratio of among the LED of high power, high output with existing device, special requirement effectively utilize efficiently and in the irregular few mode of optically focused from the light of light-emitting component side ejaculation.

In addition, in the lighting device of the luminescent device that has utilized above-mentioned existing LED etc., utilize the method for the clamping etc. of soldering or lead frame carried out with luminescent device being electrically connected and fixing.Thereby, owing to utilized the lighting device of this luminescent device to carry out the heat radiation of circuit board,, can not guarantee thermal diffusivity fully so have the limit aspect the hot amount of movement from luminescent device to the outside through the part or the lead frame of soldering.Therefore, the electric current that can not illumination apparatus has high input can not make the lighting device of high brightness.

In addition, if once utilizing with the soldering of outside circuit board or clamping existing luminescent device was packed in the part of lighting device, the part that then is difficult to only to take off luminescent device is repaired.

Moreover the part of the electroconductive member pattern that will be provided with on the interarea of luminescent device and outside circuit board carry out soldering or clamping and the luminescent device of the existing lighting device that constitutes is subjected to the harmful effect that causes because of the mechanical oscillation from the outside easily.That is, if clamp, then be easy to generate because of luminescent device rotates the change of optical property that causes in lighting device, if carry out soldering, it is bad with being electrically connected of circuit external substrate then to be easy to generate luminescent device.

Summary of the invention

The present invention carries out in order to solve above problem, its the 1st purpose is the luminescent device and the manufacture method thereof that provide following: luminescent device of the present invention possesses heat transmission hardware that is made of metal and the encapsulation ceramic component that is made of pottery, with bonding agent mutually bonding above-mentioned hardware and above-mentioned ceramic component, the warpage of the stress that the temperature that can suppress to result to follow above-mentioned hardware and above-mentioned ceramic component rises, the generation of the problem during variations in temperature that the difference because of the coefficient of linear expansion of above-mentioned hardware and above-mentioned ceramic component of the breakage of above-mentioned ceramic component (crackle) etc. causes, thereby, available heat conductivity relatively good metal material can realize being in a ratio of high power with existing device as the material of above-mentioned hardware, the device property of high output.

In addition, the 2nd purpose of the present invention is the luminescent device that provides following: luminescent device of the present invention possesses heat transmission hardware that is made of metal and the encapsulation ceramic component that is made of pottery, with bonding agent mutually bonding above-mentioned hardware and above-mentioned ceramic component, for example under situation about being configured, can effectively utilize from the light of above-mentioned light-emitting component side ejaculation efficiently and in the irregular few mode of optically focused as being provided with the light-emitting diode of light-emitting component.

Moreover the 3rd purpose of the present invention is the lighting device that provides following: this lighting device is to have improved thermal diffusivity and the high lighting device of reliability, replaceable existing bulb, fluorescent lamp etc.

When the present inventor repeats to study with keen determination in order to realize above-mentioned the 1st purpose, found following situation.Promptly, with bonding agent mutually bonding heat transmission hardware that constitutes by metal and the encapsulation that constitutes by pottery with in the luminescent device of ceramic component, using welding material to carry out under the bonding situation of above-mentioned hardware and above-mentioned ceramic component as above-mentioned bonding agent and with welding, the resiliency of the stress that the temperature of following above-mentioned hardware and above-mentioned ceramic component of this welding material rises is poor, thus, warpage takes place easily, problem during variations in temperature that the difference because of the coefficient of linear expansion of above-mentioned hardware and above-mentioned ceramic component of the breakage of above-mentioned ceramic component (crackle) etc. causes.Therefore, if use to be constituted as under the curing adhering state and demonstrate the hot melt material of flexibility as bonding above-mentioned hardware of above-mentioned bonding agent and above-mentioned ceramic component, the stress that the temperature of then utilizing this hot melt material to relax to follow above-mentioned hardware and above-mentioned ceramic component rises, the generation of the problem in the time of thus, can suppressing variations in temperature that the difference because of the coefficient of linear expansion of above-mentioned hardware and above-mentioned ceramic component of the breakage (crackle) etc. of warpage, ceramic component causes.

In addition, the opinion below the present inventor has also obtained in above-mentioned research process.That is, in ceramic material, the viewpoint from brittleness, processability etc. has the material with pore.If utilize this pore, above-mentioned hot melt material be impregnated in the pore on surface of above-mentioned ceramic component, this hot melt material is attached in this pore, then improved the bonding force of this ceramic component and this hot melt material, thus, even the thickness of the above-mentioned hot melt material under the adhering state is thinner, also can keep cementability well, correspondingly improved the heat conductivity of above-mentioned hot melt material.

The present invention is based on the invention of such opinion, in order to realize above-mentioned the 1st purpose, provides the manufacture method of following luminescent device and luminescent device.

(1) luminescent device

A kind of luminescent device, possess heat transmission hardware that constitutes by metal and the encapsulation ceramic component that constitutes by pottery, with bonding agent mutually bonding above-mentioned hardware and above-mentioned ceramic component, it is characterized in that: above-mentioned bonding agent is to be constituted as solidifying the hot melt material that demonstrates flexibility under the adhering state in the heating and melting under than the high melt temperature of the temperature of regulation, above-mentioned ceramic component has pore at least in the surface portion of the bonding region of stipulating, simultaneously above-mentioned hot melt material be impregnated in this pore.

(2) manufacture method of luminescent device

A kind of manufacture method of luminescent device, this luminescent device possesses heat transmission hardware that is made of metal and the encapsulation ceramic component that is made of pottery, with bonding agent mutually bonding above-mentioned hardware and above-mentioned ceramic component, it is characterized in that, comprise following operation: make to be dissolved in water or the water-miscible organic solvent and under than the high melt temperature of the temperature of regulation, to solidify the resin material that demonstrates flexibility under the adhering state in the heating and melting to be dissolved in above-mentioned water or the above-mentioned water-miscible organic solvent to make hot melt material and to make operation as the bonding agent of above-mentioned bonding agent; Adopt at least the ceramic component that has pore on the surface portion of the bonding region of regulation as above-mentioned ceramic component, surface portion at the above-mentioned bonding region of above-mentioned ceramic component on coating make above-mentioned hot melt material that operation makes with above-mentioned bonding agent, adhesive applicating that this hot melt material be impregnated in the pore in the surface portion of above-mentioned bonding region of above-mentioned ceramic component floods operation; Thereby and between the above-mentioned ceramic component that has flooded above-mentioned hot melt material with the coating of above-mentioned adhesive applicating dipping operation and above-mentioned hardware under the bonding temp more than the above-mentioned melt temperature ceramic-metal bonding operation of the mutual bonding above-mentioned ceramic component of the above-mentioned hot melt material of welding and above-mentioned hardware.

According to luminescent device of the present invention, because the bonding agent of bonding above-mentioned hardware and above-mentioned ceramic component is to be constituted as the hot melt material that demonstrates flexibility under the adhering state solidifying, so stress that the temperature of utilizing this hot melt material to relax to follow above-mentioned hardware and above-mentioned ceramic component rises, thus, can suppress warpage, the generation of the problem during variations in temperature that the difference because of the coefficient of linear expansion of above-mentioned hardware and above-mentioned ceramic component of the breakage of above-mentioned ceramic component (crackle) etc. causes, thereby, can use pyroconductivity to compare good metal material (being copper (Cu) typically), can realize being in a ratio of high power with existing device property as the material of above-mentioned hardware, the device property of high output.In addition, in the pore in the surface portion of the above-mentioned bonding region that above-mentioned hot melt material be impregnated in above-mentioned ceramic component,, thus, can improve the bonding force of this ceramic component and this hot melt material so above-mentioned hot melt material can be attached in the above-mentioned pore.Thereby, even the thickness of the above-mentioned hot melt material under the adhering state is thinner, also can keep cementability well, correspondingly can improve the heat conductivity of above-mentioned hot melt material.

In the manufacture method of the luminescent device relevant with the present invention, the above-mentioned hot melt material that is made to as above-mentioned bonding agent is applied on the surface portion of above-mentioned bonding region of above-mentioned ceramic component, is impregnated under the vacuum state of afore mentioned rules in the pore in the surface portion of above-mentioned bonding region of above-mentioned ceramic component.Because this hot melt material is that above-mentioned resin material is dissolved in hot melt material in above-mentioned water or the above-mentioned water-miscible organic solvent, so viscosity is little down in room temperature (for example 25 ℃), can impregnated in this pore equably, as the vacuum atmosphere air pressure in this specified vacuum state, but below the about 1kPa of illustration.Thereafter, above-mentioned hot melt material is activated because of heating and melting under the bonding temp more than the above-mentioned melt temperature between coated above-mentioned ceramic component that has flooded above-mentioned hot melt material and above-mentioned hardware, thus bonding above-mentioned ceramic component and above-mentioned hardware mutually.Like this, by with in the pore of above-mentioned hot melt material vacuum impregnation in the surface portion of the above-mentioned bonding region of above-mentioned ceramic component, can be well in conjunction with this hot melt material and this pore.Like this, can make the above-mentioned luminescent device relevant with the present invention.

Like this, owing to make the above-mentioned luminescent device relevant with the present invention according to the manufacture method of the luminescent device relevant with the present invention, so warpage of the stress that the temperature that can suppress to result to follow above-mentioned hardware and above-mentioned ceramic component rises, the generation of the problem during variations in temperature that the difference because of the coefficient of linear expansion of above-mentioned hardware and above-mentioned ceramic component of the breakage of above-mentioned ceramic component (crackle) etc. causes, thereby, pyroconductivity compares the material of good metal material as above-mentioned hardware, can realize being in a ratio of high power with existing device, the device property of high output, in addition, in the pore in the surface portion of the above-mentioned bonding region that above-mentioned hot melt material be impregnated in above-mentioned ceramic component, so above-mentioned hot melt material can be attached in the above-mentioned pore, thus, can improve the bonding force of this ceramic component and this hot melt material.Thereby, even the thickness of the above-mentioned hot melt material under the adhering state is thinner, also can keep cementability well, the luminescent device that correspondingly can improve the heat conductivity of above-mentioned hot melt material can be provided.

As the material of above-mentioned hardware, pyroconductivity is the good metal material relatively, for example except the Cu (copper) that has narrated, also can enumerate gold (Au), silver (Ag) etc.Particularly, Cu is good and less expensive aspect heat conductivity, owing to compare with such composite material such as CuW, CuMo, CuMoCu, processability is good, so can use suitably.

As the material of above-mentioned ceramic component,, for example can enumerate aluminium nitride (AlN), aluminium oxide (Al though be not limited to this ₂O ₃) etc.Above-mentioned ceramic component also can be made of a plurality of ceramic components.At this moment, mutual bonding each ceramic component of available above-mentioned hot melt material.As above-mentioned ceramic component, from the viewpoint of brittleness, processability etc., but illustration has integrally formed the material that surface portion comprises the ceramic material of pore.As the porosity of the pore in the above-mentioned ceramic component, but illustration about 5%～20%.If this pore lacks than about 5%, then be difficult to carry out the dipping of hot melt material to this pore, if than about more than 20%, then pyroconductivity descends easily.As the aperture of the pore in the above-mentioned ceramic component, though be not limited to this, the about 0.01mm～0.15mm of illustration.Have again, in the above-mentioned adhesive applicating dipping operation of the manufacture method of luminescent device of the present invention, because above-mentioned resin material is dissolved in above-mentioned water or the above-mentioned water-miscible organic solvent, so also can impregnated in equably in the fine pore of about 0.01mm～0.15mm for example.

Here the said porosity, be as by the open pore rate of JIS R1634 (computational methods of open pore rate of the assay method of the sintered density of fine ceramics, open pore rate, pottery) regulation by the value that following calculating formula calculates, be based on that the such computational methods of Archimedes's method draw:

Pb＝((W3-W1)/(W3-W2))×100

Pb: open pore rate (%)

(at this, W1: dry mass (g) (carried out after the drying with 110 ± 5 ℃ thermostats, in drier, placed the value of cooling off and having measured quality)

W2: quality in the water (g) (under the original state of immersion sample that in water, dangled with wire quality measurement and proofreaied and correct the value of the quality of anchor clamps)

W3: immersion quality (g) (from water, take out the immersion sample, removed surperficial water droplet and measured the value of quality) with wet gauze.

In addition, the aperture of pore is to utilize to be pressed into mercury in fine pore, to calculate the value that the mercury penetration method of the volume of pore is calculated according to the volume that is pressed into pressure and bulged-in mercury, specifically, the aperture of using mercury porosimeter (for example, automatic aperture 9200 types of Shimadzu Seisakusho Ltd.'s system etc.) to calculate pore.

In the manufacture method of the luminescent device relevant with the present invention, as solidifying the above-mentioned resin material that demonstrates flexibility under the adhering state in the heating and melting under than the high melt temperature of the temperature of afore mentioned rules, though be not limited to this, for example can enumerate thermoplastic elastomer and the resin combination that comprises ethylene/vinyl acetate and acrylic or methacrylic acid copolymer.In the luminescent device relevant, solidifying the above-mentioned hot melt material that demonstrates flexibility under the adhering state as being constituted as under in the heating and melting, but the illustration coefficient of elasticity is about 0.2 * 10 than the high melt temperature of the temperature of afore mentioned rules with the present invention ⁸Pa～13.0 * 10 ⁸The hot melt material of Pa, if as described later from the selected viewpoint of the material that helps coefficient of elasticity, but then illustration even more ideal be to be about 0.25 * 10 ⁸Pa～5.0 * 10 ⁸The hot melt material of Pa, ideal is to be about 1.9 * 10 ⁸Pa～3.3 * 10 ⁸The hot melt material of Pa.Such hot melt material and existing welding material, for example

Coefficient of elasticity Pa

Ag 827.7×10 ⁸

Au 780.6×10 ⁸

Cu 1274.9×10 ⁸

Zn 760.0×10 ⁸

Cd 489.4×10 ⁸

Compare, clearly good aspect flexibility.

Above-mentioned thermoplastic elastomer for example is the material that natural rubber, synthetic rubber etc. have the molecular structure that long strand gets up with the mode complexing of complexity like that, has the effect of the moderator of the stress that rises as the temperature of following above-mentioned hardware and above-mentioned ceramic component.As above-mentioned thermoplastic elastomer, but illustration styrenic elastomer, olefin elastomer, polyester elastomer, vinyl chloride elastomer, polyamide elastomer etc.Wherein, if use styrene and alkene thermoplastic elastomer, then because the coefficient of elasticity of hot melt material roughly can be included in above-mentioned " as 0.25 * 10 of even more ideal scope ⁸Pa～5.0 * 10 ⁸Pa " in, so be comparatively desirable.

The copolymer of above-mentioned ethylene/vinyl acetate and acrylic or methacrylic acid has the effect that can improve the adhesive strength of above-mentioned hardware and above-mentioned ceramic component.

Above-mentioned resin material also can comprise polyethylene.As this polyethylene, can use low-density, high density polyethylene (HDPE), have the effect of the wetability that can improve above-mentioned hot melt material.From the aspect of the wetability of above-mentioned hot melt material, it is comparatively desirable that above-mentioned resin material comprises polyethylene by this way.

Under above-mentioned resin combination comprises in the copolymer of thermoplastic elastomer, ethylene/vinyl acetate and acrylic or methacrylic acid and the polyethylene at least the situation of the copolymer of thermoplastic elastomer, ethylene/vinyl acetate and acrylic or methacrylic acid, as each components in proportions, for example, can enumerate

Thermoplastic elastomer: about 20 weight %～80 weight %

Ethylene/vinyl acetate

Copolymer with acrylic or methacrylic acid: about 10 weight %～60 weight %

Polyethylene: about 0 weight %～40 weight %

Wherein, by suitably preparing the component ratio of thermoplastic elastomer at least, the coefficient of elasticity of the above-mentioned hot melt material under the adjustable solidating adhering state.For example, if reduce thermoplastic elastomer, then coefficient of elasticity increases, if increase thermoplastic elastomer, then coefficient of elasticity reduces.

In addition, in above-mentioned resin material, can suitably be formulated in thermosetting resins such as the good thermosetting resin in thermal endurance aspect, for example polyimide resin, BT resin, polysiloxanes.As the configuration proportion of this thermosetting resin, for example can enumerate about 0.01 weight %～10 weight %.Such thermosetting resin be impregnated in the pore in the surface portion of above-mentioned bonding region of above-mentioned ceramic component, even have the effect that the temperature that for example becomes about afore mentioned rules also can be kept the adhesive strength of above-mentioned hardware and above-mentioned ceramic component.

Under situation about above-mentioned resin material being dissolved in the above-mentioned water-miscible organic solvent,,, for example can enumerate the mixed solvent of dimethyl ethyl ketone and dimethyl formamide etc. though be not limited to this as this water-miscible organic solvent.

In the manufacture method of the luminescent device relevant with the present invention, as the thickness of the above-mentioned hot melt material that on above-mentioned ceramic component, applies, but the about 20 μ m of illustration～200 μ m.In the luminescent device relevant with the present invention, as the thickness of the above-mentioned hot melt material that solidifies adhering state, but the about 0.01mm～0.10mm of illustration.If this thickness is littler than about 0.01mm, then the cementability of above-mentioned hot melt material descends easily, if bigger than about 0.10mm, then the heat conductivity of above-mentioned hot melt material descends easily.In addition, in the manufacture method of the luminescent device relevant, also can also comprise and use the coating of above-mentioned adhesive applicating dipping operation to flood the bonding agent drying process of the above-mentioned ceramic component drying of above-mentioned hot melt material with the present invention.

The luminescent device relevant with the present invention also can be used as and is provided with the light-emitting diode of light-emitting component and is configured on above-mentioned hardware or above-mentioned ceramic component.In addition, the manufacture method of the luminescent device relevant with the present invention also can also be included in the operation that light-emitting component is set on above-mentioned hardware or the above-mentioned ceramic component, to make the luminescent device that is configured as light-emitting diode.The luminescent device that is configured as light-emitting diode by this way, for example by using the such pyroconductivity of having narrated of Cu to compare the material of good metal material as above-mentioned hardware, as being in a ratio of high power, the high light-emitting diode of exporting, can realize the more characteristics of luminescence of high brightness with existing device.

In addition, the luminescent device relevant with the present invention (for example, the luminescent device that is configured as light-emitting diode) also can also possess the light transmission member (optical component that constitutes by glass, more particularly for example, glass lens), with mutual bonding above-mentioned ceramic component of above-mentioned hot melt material and above-mentioned light transmission member (for example, above-mentioned optical component).At this moment, above-mentioned hot melt material comprised above-mentioned hardware bonding and the 1st hot melt material of above-mentioned ceramic component and bonding above-mentioned light transmission member (for example, above-mentioned optical component) with the 2nd hot melt material of above-mentioned ceramic component, for example consider at bonding above-mentioned hardware and above-mentioned ceramic component and (for example be provided with semiconductor element, light-emitting component) bonding afterwards above-mentioned light transmission member (for example, above-mentioned optical component) with the situation of above-mentioned ceramic component, preferably the relation with the melt temperature b of the melt temperature a of above-mentioned the 1st hot melt material and above-mentioned the 2nd hot melt material is decided to be a＞b.By doing like this, even utilize above-mentioned the 1st hot melt material bonding utilize after above-mentioned hardware and the above-mentioned ceramic component above-mentioned the 2nd hot melt material bonding above-mentioned light transmission member (for example, above-mentioned optical component) with above-mentioned ceramic component, at the above-mentioned light transmission member that is undertaken by above-mentioned the 2nd hot melt material (for example, during above-mentioned optical component) with above-mentioned ceramic component bonding, the fusion of above-mentioned the 1st hot melt material that also can prevent above-mentioned hardware and above-mentioned ceramic component bonding.

In the manufacture method of the luminescent device relevant with the present invention, luminescent device (for example, the luminescent device that is configured as light-emitting diode) also can also possess the light transmission member (optical component that constitutes by glass for example, more particularly, glass lens), can also be included in the coating of above-mentioned adhesive applicating dipping operation and (for example flood the above-mentioned ceramic component of above-mentioned hot melt material and above-mentioned light transmission member, above-mentioned optical component) thus between under the bonding temp more than the above-mentioned melt temperature, make the mutually pottery-light transmission member bonding process of bonding above-mentioned ceramic component and above-mentioned light transmission member (for example, above-mentioned optical component) of above-mentioned hot melt material welding.

At this moment, for example consider at bonding above-mentioned hardware and above-mentioned ceramic component and (for example be provided with semiconductor element, light-emitting component) bonding afterwards above-mentioned light transmission member (for example, above-mentioned optical component) with the situation of above-mentioned ceramic component, make in the operation at above-mentioned bonding agent, make and be dissolved in water or the water-miscible organic solvent and at the 1st and the 2nd melt temperature a higher than the temperature of afore mentioned rules, (a＞b) demonstrates flexibility down heating and melting time the under solidifying adhering state the 1st and the 2nd resin material is dissolved in above-mentioned water or the above-mentioned water-miscible organic solvent to make the 1st and the 2nd hot melt material respectively as above-mentioned bonding agent b, in above-mentioned adhesive applicating dipping operation, adopt the surface portion of above-mentioned bonding region to comprise the ceramic component of surface portion of the 1st and the 2nd bonding region as above-mentioned ceramic component, coating makes the above-mentioned the 1st and the 2nd hot melt material that operation makes with above-mentioned bonding agent respectively on the surface portion of the above-mentioned the 1st and the 2nd bonding region of above-mentioned ceramic component, the the 1st and the 2nd hot melt material be impregnated in respectively in the pore in the surface portion of the above-mentioned the 1st and the 2nd bonding region of above-mentioned ceramic component, in above-mentioned ceramic-metal bonding operation, thereby between the above-mentioned ceramic component that has flooded above-mentioned the 1st hot melt material with the coating of above-mentioned adhesive applicating dipping operation and above-mentioned hardware under the 1st bonding temp more than above-mentioned the 1st melt temperature a mutual bonding above-mentioned ceramic component of welding the 1st hot melt material and above-mentioned hardware, in above-mentioned pottery-light transmission member bonding process, after bonding above-mentioned ceramic component and above-mentioned hardware with above-mentioned ceramic-metal bonding operation, at the above-mentioned ceramic component that has flooded above-mentioned the 2nd hot melt material with the coating of above-mentioned adhesive applicating dipping operation and above-mentioned light transmission member (for example, above-mentioned optical component) thus between mutually bonding above-mentioned ceramic component and above-mentioned light transmission member (for example, above-mentioned optical component) of welding the 2nd hot melt material more than above-mentioned the 2nd melt temperature b and under less than the 2nd bonding temp of above-mentioned the 1st melt temperature a.By doing like this, even utilize above-mentioned the 1st hot melt material bonding utilize after above-mentioned hardware and the above-mentioned ceramic component above-mentioned the 2nd hot melt material bonding bonding above-mentioned light transmission member (for example, above-mentioned optical component) with above-mentioned ceramic component, at the above-mentioned light transmission member that is undertaken by above-mentioned the 2nd hot melt material (for example, during above-mentioned optical component) with above-mentioned ceramic component bonding, the fusion of above-mentioned the 1st hot melt material that also can prevent above-mentioned hardware and above-mentioned ceramic component bonding.

As the temperature of afore mentioned rules, the semiconductor element that hope is provided with in luminescent device (for example, the situation that luminescent device is configured as light-emitting diode, light-emitting component below) the guarantee of work temperature, for example, can be enumerated about 100 ℃～150 ℃.At this moment, above-mentioned melt temperature can be decided to be than about 100 ℃～150 ℃ high temperature.In addition, as the above-mentioned bonding temp more than the above-mentioned melt temperature, for example, but about 180 ℃～300 ℃ of illustration.If above-mentioned bonding temp surpasses about 300 ℃, then there is the possibility of the characteristic degradation of the resin that causes constituting above-mentioned hot melt material.Have again,, in general, under about 500 ℃～800 ℃ heated condition, carried out bonding with in existing welding material bonding.About this point,,, correspondingly can suppress manufacturing cost lower so can improve the production efficiency of luminescent device because the temperature (for example, 180 ℃～300 ℃) that available ratio about 500 ℃～800 ℃ temperature in the past is fully low in the present invention is next bonding.

In the manufacture method of the luminescent device relevant with the present invention, in above-mentioned ceramic-metal bonding operation, thereby can make above-mentioned hot melt material welding bonding above-mentioned ceramic component and above-mentioned hardware mutually under the above-mentioned bonding temp and under the pressure of regulation between above-mentioned ceramic component and the above-mentioned hardware, above-mentioned bonding region surface portion at above-mentioned ceramic component comprises under the situation of above-mentioned the 1st bonding region surface portion, in above-mentioned ceramic-metal bonding operation, thereby can make the 1st hot melt material welding bonding above-mentioned ceramic component and above-mentioned hardware mutually under above-mentioned the 1st bonding temp and under the pressure of regulation between above-mentioned ceramic component and the above-mentioned hardware.

In addition, in above-mentioned pottery-light transmission member bonding process, can be (for example at above-mentioned ceramic component and above-mentioned light transmission member, above-mentioned optical component) thus between mutually bonding above-mentioned ceramic component and above-mentioned light transmission member be (for example making above-mentioned hot melt material welding under the above-mentioned bonding temp and under the pressure of regulation, above-mentioned optical component), above-mentioned bonding region surface portion at above-mentioned ceramic component comprises under the situation of above-mentioned the 2nd bonding region surface portion, in above-mentioned pottery-light transmission member bonding process, behind can be in above-mentioned ceramic-metal bonding operation bonding above-mentioned ceramic component and the above-mentioned hardware, at the above-mentioned ceramic component that has flooded above-mentioned the 2nd hot melt material with the coating of above-mentioned adhesive applicating dipping operation and above-mentioned light transmission member (for example, above-mentioned optical component) thus between make the 2nd hot melt material welding mutually bonding above-mentioned ceramic component and above-mentioned light transmission member (for example, above-mentioned optical component) under above-mentioned the 2nd bonding temp and under the pressure of regulation.

As the pressure of afore mentioned rules, though be not limited to this, illustration about 9.8 * 10 ⁴Pa～294.2 * 10 ⁴Pa (1kg/cm ²～30kg/cm ²).

At this, if the bonding agent of 2 liquid formulas of the general most use of observation use or thermosetting etc. impregnated in the situation of ceramic material pore with vacuum mode as bonding agent, then begin owing to being hardened in the vacuum impregnation of this bonding agent, so must under the state that through this bonding agent sticky object is coated on the ceramic material, carry out vacuum impregnation, under the state that by this way sticky object is coated on the ceramic material, the irregular etc. of the bond layer of air when the pore of ceramic material breaks away from taken place, can not carry out vacuum impregnation well, cause the decline of cementability easily.

About this point, in the manufacture method of the luminescent device relevant with the present invention, with vacuum mode above-mentioned hot melt material impregnated in the above-mentioned ceramic component back and then comprising under the situation of above-mentioned bonding agent drying process, above-mentioned ceramic component is being carried out after the vacuum impregnation after the drying, be provided with above-mentioned hardware (and then be above-mentioned light transmission member (for example, above-mentioned optical component)) under the situation, this light transmission member is set (for example, this optical component), by being heated to above-mentioned bonding temp, be provided with above-mentioned ceramic component and above-mentioned hardware (and then be above-mentioned light transmission member (for example, above-mentioned optical component)) under the situation, can carry out bonding with this light transmission member (for example, this optical component).

In the luminescent device relevant with the present invention, for example under situation about being configured as being provided with the light-emitting diode of light-emitting component, in order to realize above-mentioned the 2nd purpose, preferably above-mentioned light-emitting component is arranged to protrude 0.5mm～2mm from the edge part top of above-mentioned hardware or above-mentioned ceramic component.By doing like this, easily the light that penetrates from above-mentioned light-emitting component side is sent in the outside, correspondingly can utilize light efficiently.In addition, for example under the situation that above-mentioned light-emitting diode is used in illumination etc., promptly use lens etc. that the light from above-mentioned light-emitting component is carried out optically focused, also can suppress the reverberation that reflected by above-mentioned ceramic component from above-mentioned light-emitting component side fully, correspondingly can reduce the irregular generation of optically focused.Thereby, can effectively utilize from the light of light-emitting component side ejaculation efficiently and in the irregular few mode of optically focused.

The arrangements of components member that also can be configured this light-emitting component is provided with above-mentioned light-emitting component on above-mentioned hardware or above-mentioned ceramic component.As this arrangements of components member, be called sub-fixture typically.But illustration comprises the sub-fixture of the miniature circuit that has formed circuitous pattern.The for example available aluminium nitride of this sub-fixture (AlN), aluminium oxide (Al ₂O ₃) etc. heat conductivity constitute than higher ceramic material.Constituting with ceramic material under the situation of above-mentioned sub-fixture, the part of this sub-fixture as above-mentioned ceramic component can constituted.

Only on above-mentioned hardware or above-mentioned ceramic component, being provided with under the situation of above-mentioned light-emitting component, cause the decline of heat conductivity, so the thermal diffusivity that dispels the heat from the heat of above-mentioned light-emitting component is descended easily through the said elements layout structure.Thus, preferably increase the said elements layout structure and the area that is in contact with one another above-mentioned hardware or above-mentioned ceramic component.On the other hand, in the said elements layout structure, the light that injects to this arrangements of components member side from the side of the above-mentioned light-emitting component that disposed is not covered by this arrangements of components member.If consider these situations, then preferably the said elements layout structure is formed along with the configuration side towards above-mentioned light-emitting component is the thin truncated cone shape in end.As the shape of said elements layout structure of this moment, but illustration lateral plan (seeing from the side) for trapezoidal cube shaped or in so trapezoidal cube shaped chamfered portion be formed stair-stepping shape.Have, the angle of inclination of said elements layout structure for example preferably is about 10 °～30 ° again.Here said angle of inclination refers to along each limit of the end face of said elements layout structure with respect to this end face and is the face that vertically the extends angle with the inclined-plane formation.

In addition, in the said elements layout structure, do not covered by this arrangements of components member in order to make the light from the side of the above-mentioned light-emitting component that is disposed, the size with above-mentioned light-emitting component is approximate as far as possible preferably to make the face of the above-mentioned light-emitting component of configuration.For example, can enumerate the situation that the said elements layout structure has when having disposed above-mentioned light-emitting component the face from the edge part of this light-emitting component along the wide 0.1mm～0.5mm of peripheral direction and disposed above-mentioned light-emitting component at this face.By doing like this, can be used to light (for example, in about 5 ° scope, injecting to the light of said elements layout structure side) from above-mentioned light-emitting component side from above-mentioned light-emitting component side.

As mentioned above, according to constituting luminescent device in the following manner: the said elements layout structure be formed be the thin truncated cone shape in end along with configuration side towards above-mentioned light-emitting component in, the said elements layout structure has that the edge part from this light-emitting component has disposed above-mentioned light-emitting component along the face of the wide 0.1mm～0.5mm of peripheral direction and at this face when having disposed above-mentioned light-emitting component, both can suppress decline, can improve the thermal diffusivity that dispels the heat to from the heat of above-mentioned light-emitting component again from the ejaculation efficient of the light of the side of above-mentioned light-emitting component.

As above-mentioned light-emitting component,, illustration is about 1mm but having area ²～9mm ²The light-emitting component of cube shaped of light-emitting area of square or rectangular.Size as above-mentioned light-emitting component, specifically, if the length of an opposite side is decided to be c ', the length of another opposite side is decided to be d ', though then be not limited thereto, but in the time of can being illustrated in c '=1mm, d '=1mm～9mm, when c '=2mm, d '=1mm～4mm, when c '=3mm, d '=1mm～3mm etc.

But, make from the heat of above-mentioned light-emitting component and said elements layout structure and demonstrate saturability to the thermal diffusivity of outside heat radiation with respect to the size of the face of above-mentioned hardware that above-mentioned light-emitting component is set or above-mentioned ceramic component through above-mentioned hardware or above-mentioned ceramic component.In other words, even increase the area of the face of above-mentioned hardware or above-mentioned ceramic component a lot, also just increase the improvement that package dimension is difficult to help thermal diffusivity.Therefore, wish the minimal package dimension that regulation is necessary.

For example, the luminescent device relevant with the present invention as narrating as the situation of using the higher metal material of the such thermal conductivity ratio of Cu to be configured and have area in employing and be about 1mm as the light-emitting diode that can carry out high power, high output of the material of above-mentioned hardware ²～9mm ²The situation of light-emitting component as above-mentioned light-emitting component of cube shaped of light-emitting area of square or rectangular under, be 81mm but above-mentioned hardware of illustration or above-mentioned ceramic component have area ²～144mm ²And the face of the square or rectangular that the shape of above-mentioned light-emitting area that comprises above-mentioned light-emitting component is such is provided with the situation of above-mentioned light-emitting component on this face.According to the luminescent device that is configured by this way, both can keep making from the heat of above-mentioned light-emitting component and said elements layout structure through above-mentioned hardware or above-mentioned ceramic component, can realize necessary minimal package dimension again to the thermal diffusivity of outside heat radiation.As the size of above-mentioned hardware or above-mentioned ceramic component, specifically, if the length of an opposite side is decided to be c, the length of another opposite side is decided to be d, though then be not limited thereto, in the time of can being illustrated in c=9mm～12mm, d=9mm～12mm etc.

In addition, in order to realize above-mentioned the 3rd purpose, the lighting device relevant with the present invention possesses the luminescent device of the invention described above or luminescent device that manufacture method of the present invention is made and the positive and negative at least pair of terminal that this luminescent device is powered, it is characterized in that: above-mentioned terminal has the first terminal that supports above-mentioned luminescent device from the side and/or supports second terminal of above-mentioned luminescent device from an interarea side, and at least one side in the above-mentioned the first terminal and second terminal clamps above-mentioned luminescent device.

If constitute like this, then, can support luminescent device securely because terminal contacts with the interarea side and/or the side end face of luminescent device, so both can power, can prevent the rotation of luminescent device again to luminescent device.Moreover, since with the contact area that had in the past relatively increased luminescent device and terminal, so can be by the thermal diffusivity of lighting device.In addition, utilize spring leaf to clamp the interarea or the side of luminescent device, improve the elasticity of suitably adjusting spring leaf, it is easy that the loading and unloading of luminescent device become.Thereby, can easily carry out the reparation of the part of the luminescent device in the lighting device.

In addition, utilize heat transfer unit to support above-mentioned luminescent device from another interarea side.If constitute like this, then, can make the lighting device of high brightness owing to further improved the thermal diffusivity of luminescent device.

In addition, the luminous sightingpiston side and the reflecting surface of above-mentioned luminescent device are opposed.If constitute like this, then can make the lighting device that can on desirable direction, shine the light that comes selfluminous element.

In addition, above-mentioned reflecting surface is made of metal material.If constitute like this, then can further improve the reflectivity in the reflecting surface.

In addition, above-mentioned reflecting surface is to being dispelled the heat by the heat of above-mentioned heat transfer unit transmission.If constitute like this, then can further improve the thermal diffusivity of lighting device.

New feature of the present invention is nothing more than the special content of putting down in writing in the scope of accompanying technical scheme, but about structure and content the two, by with other purpose or feature combines and read following detailed explanation with accompanying drawing, can understand the present invention better and the present invention is made an appraisal.

Description of drawings

Fig. 1 is the summary exploded side figure as the light-emitting diode of an example of the luminescent device relevant with the present invention.

Fig. 2 is the summary exploded perspective view of the light-emitting diode shown in Fig. 1.

Fig. 3 is the summary section of the light-emitting diode shown in Fig. 1 and Fig. 2.

Fig. 4 (A) is the figure that the angle of inclination of the sub-fixture of explanation is used, and Fig. 4 (B) is the figure that the light-emitting component of explanation use in embodiment 2 is used.

Fig. 5 is the curve chart of characteristic that the contact area of the angle of inclination of sub-fixture and temperature rising value and Cu member and sub-fixture is shown.

Fig. 6 is the curve chart that package area-temperature characterisitic is shown.

Fig. 7 is the schematic oblique view of the luminescent device 100 that uses in the lighting device relevant with embodiments of the invention 1.

Fig. 8 is the schematic oblique view of terminal 20a, the 20b of the lighting device relevant with this embodiment.

Fig. 9 is the schematic oblique view that the state on terminal 20a, the 20b of the lighting device relevant with this embodiment that luminescent device 100 is installed in is shown.

Figure 10 is a schematic oblique view of seeing the lighting device 40 relevant with embodiments of the invention 2 from frontal.

Figure 11 is a schematic oblique view of seeing the lighting device relevant with this embodiment 40 from back side direction.

Figure 12 is the schematic oblique view of the lighting device 60 relevant with embodiments of the invention 3.

Figure 13 is the schematic oblique view of the lighting device 70 relevant with another embodiment of the present invention 3.

Figure 14 is the schematic oblique view of the luminescent device 100A that uses in the lighting device relevant with various embodiments of the present invention.

Figure 15 has been to use the schematic oblique view of the lighting device 80 of the luminescent device 100A shown in Figure 14.

Part or all of accompanying drawing is to describe according to the performance with the summary that is illustrated as purpose, not necessarily is limited to relative size or the position verily described in the reality of the key element shown in this place.

Embodiment

Below, on one side with reference to accompanying drawing, the embodiment relevant with the present invention is described on one side.

Fig. 1 is that Fig. 2 is the summary exploded perspective view of the light-emitting diode 10 shown in Fig. 1 as the summary exploded side figure of the light-emitting diode 10 of an example of the luminescent device relevant with the present invention.In addition, Fig. 3 is the summary section of the light-emitting diode 10 shown in Fig. 1 and Fig. 2.

Light-emitting diode (below, be also referred to as LED) 10, as shown in Fig. 1 to Fig. 3, possess encapsulation ceramic component 1, light-emitting component 2, light transmission member 4, heat transmission hardware 5 and hot melt material 6.

Ceramic component 1 by overlapped (be AlN, Al in this example by pottery respectively ₂O ₃Deng) member and sub-fixture (example of the arrangements of components member) 1c of the 1st and the 2nd tabular component 1a, the 1b that constitute constitute.The 1st tabular component 1a be given size (in this example, about 9mm～the 12mm in a limit (e=among Fig. 2), the tabular component of the square or rectangular of the about 9mm in another limit (f=among Fig. 2)～12mm), have bottom surface 1c than sub-fixture 1c " bigger the 1st peristome 1a ' of rectangle of size; the size on the two relative limits of the 2nd tabular component 1b is measure-alike with the two corresponding limits of the 1st tabular component 1a; the size on two limits of being left is littler than the size on two limits of the correspondence of the 1st tabular component 1a, has the 2nd big peristome 1b ' of size than the 1st peristome 1a ' of the 1st tabular component 1a.Have, in this example, the 1st is identical with the material of the 2nd tabular component 1a, 1b again.

In this example, sub-fixture 1c is the fixture of miniature circuit of circuitous pattern etc. that comprised the formation that is called as the sub-fixture that light-emitting component 2 is installed, with AlN, Al ₂O ₃Constitute than higher ceramic material etc. heat conductivity.This sub-fixture 1c is formed along with the installation side towards light-emitting component 2 is the thin truncated cone shape in end, specifically, be among Fig. 1 to Fig. 3 the such lateral plan (seeing from the side) of diagram for trapezoidal cube shaped or in so trapezoidal cube shaped chamfered portion be formed stair-stepping shape.In this example, the ceramic material of sub-fixture 1c and the above-mentioned the 1st and the 2nd tabular component 1a, 1b are the porous materials that the ceramic material that comprises surface portion has formed pore h on the whole, and the porosity of pore h and aperture are about 5%～20% and 0.01mm～0.15mm in this example respectively.In order farthest to improve pyroconductivity in this scope, preferably making the porosity is 5%.

In addition, as shown in Figure 3, in this example, sub-fixture 1c has when light-emitting component 2 has been installed the wide face 1c ' of (figure middle distance i=) about 0.1mm～0.5mm from the edge part of light-emitting area 2a along peripheral direction, in order to avoid cover light L2, on this face 1c ', light-emitting component 2 has been installed from the side of the light-emitting component of being installed 2 with sub-fixture 1c.And the 1st peristome 1a ' that connects the 1st tabular component 1a is provided with sub-fixture 1c on hardware 5.

Light-emitting component 2 is to have area (length c ' * d ' among Fig. 2) to be about 1mm in this example ²～9mm ²(for example, when c '=2mm, the light-emitting component of the cube shaped of the light-emitting area 2a of the square or rectangular of d '=1mm～4mm), as shown in Figure 3, sub-fixture 1c through being installed edge part top A (in other words, being the top of the 2nd tabular component 1b) mode with protrusion (figure middle distance g=) about 0.5mm～2mm from ceramic component 1 on hardware 5 is provided with this light-emitting component 2 discretely.By this light-emitting component 2 being supplied with the power of regulation, light L1, L2 are penetrated from the light-emitting area 2a and the light emission side 2b of this light-emitting component 2 respectively.At this moment, light-emitting component 2 follows this luminous and generate heat, and thus, the temperature of LED10 rises.

Light transmission member 4, as shown in Fig. 1 to Fig. 3, in this example, it is the dome-type glass lens that has formed the semi-spherical shape of hollow, approximate centre portion when making light transmission member 4 become sphere has disposed under the situation of light source, can roughly be radially through light transmission member 4 from the light of this light source and penetrate.This light transmission member 4 has adhesive portion 4a on all ends.In this adhesive portion 4a, the height at top of sub-fixture 1c that cans be compared to the installed surface that becomes light-emitting component 2 from the height of counting with the edge part top A of the opposed interarea of bonding plane of the 2nd hot melt material 6b most is low.That is, as shown in Figure 3, distance h is set preferably.Thus, penetrate and do not covered from the part of the dome-type glass lens of light transmission member 4 from the light L2 of light emission side 2b by the adhesive portion 4a of light transmission member 4 and the 2nd hot melt material 6b.Thereby, can effectively utilize the light L2 that penetrates from the side of light-emitting component 2.In addition, be preferably in and utilize the 2nd hot melt material 6b to come bonding light transmission member 4 in the such inert gas atmosphere of nitrogen.Thus, in the part of the hollow of light transmission member 4, enclose inert gas, in the part of hollow, sneak into moisture can not resembling in air when bonding.Thereby (for example, silver paste) harmful effect is so can make the high luminescent device of reliability for light-emitting component 2 or as the electroconductive member of the bonding agent of this light-emitting component 2 owing to eliminated moisture.In addition, if the material of light transmission member has light transmission, then be not particularly limited, except glass lens, the hybrid resin etc. of these resins that can use good inorganic matter or polysilazane resin, epoxy resin, carbamide resin, the fluororesin aspect light resistance of silicon gel etc. and comprise more than one at least is at good light transmittance resin aspect the weatherability.In addition, also can in the light transmission member, disperse all members such as agent, pigment, fluorescent material according to the agent of use interpolation viscosity increment, light.For example, disperse agent, can enumerate barium titanate, titanium oxide, aluminium oxide, silica, silicon dioxide, powdered whiting, precipitated calcium carbonate and comprise the mixture of at least a above these materials as light.In addition, the shape of light transmission member 4 is not limited to this, for example can make the concave-convex lens shape or see shape that is roughly oval or the shape that multiple these combination of shapes are got up from luminous sightingpiston side.

In this example, hardware 5 is made of the Cu as pyroconductivity comparison good metal material, and (c among Fig. 2 * d) is 81mm to have area ²～144mm ²(during c=9mm～12mm, the face of d=9mm～12mm) and comprise the face 5a of the such square or rectangular of the shape of light-emitting area 2a of light-emitting component 2 is provided with light-emitting component 2 through sub-fixture 1c on this face 5a.Have, in this example, the 1st tabular component 1a's of the size of hardware 5 and ceramic component 1 is measure-alike again.

Hot melt material 6 is constituted as than the temperature of stipulating (in this example, about 100 ℃～150 ℃) demonstrate flexibility solidifying under the adhering state heating and melting time under the high melt temperature, a face 5a that comprises hardware 5 bonding and a face of ceramic component 1 are (in other words, the face of the 1st tabular component 1a and the bottom surface 1c of sub-fixture 1c ") the 1st hot melt material 6a and the 2nd hot melt material 6b of another face (in other words; the face of the 2nd tabular component 1b) of the adhesive portion 4a of bonding light transmission member 4 and ceramic component 1, the pass of the melt temperature b of the melt temperature a of the 1st hot melt material 6a and the 2nd hot melt material 6b is a＞b.In addition, in this example, the coefficient of elasticity of hot melt material 6 is 0.2 * 10 ⁸Pa～13.0 * 10 ⁸Pa, thickness is about 0.01mm～0.10mm.If this thickness is littler than about 0.01mm, then the cementability of hot melt material 6 descends easily, if bigger than about 0.10mm, then the heat conductivity of hot melt material 6 descends easily.

And, the 1st hot melt material 6a be impregnated among the pore h in the surface portion of bonding region of a face of ceramic component 1, the 2nd hot melt material 6b be impregnated among the pore h in the surface portion of bonding region of another face of ceramic component 1.In addition, on another face of the 1st tabular component 1a, formed positive side power supply 7 and the minus side power supply 8 that is connected with outer electrode.In addition, with the 1st hot melt material 6a mutually bonding the 1st tabular component 1a and the 2nd tabular component 1b, also the 1st hot melt material 6a can be impregnated among the pore h of surface portion of bonding region of the 1st and the 2nd tabular component 1a, 1b.

According to the above LED10 that has illustrated, because bonded metal member 5 is to be constituted as the hot melt material 6 that demonstrates flexibility under the adhering state solidifying with the bonding agent of ceramic component 1, utilize this hot melt material 6, can relax the stress of the temperature rising of following hardware 5 and ceramic component 1, thus, can suppress warpage, the generation of the problem during variations in temperature that the difference because of hardware 5 and the coefficient of linear expansion of ceramic component 1 of the breakage of ceramic component 1 (crackle) etc. causes, thereby, as metal material, can use pyroconductivity to compare the good metal material (in this example, be Cu), as being in a ratio of high power with existing device, the light-emitting diode of high output can be realized the more characteristics of luminescence of high brightness.In addition, in the pore h in the surface portion of the bonding region that hot melt material 6 be impregnated in ceramic component 1,, thus, can improve the bonding force of ceramic component 1 and hot melt material 6 so hot melt material 6 is combined with pore h.Thereby, even it is thinner to solidify the thickness of the hot melt material 6 under the adhering state, also can keep cementability well, correspondingly can improve the heat conductivity of hot melt material 6.

In addition, because the pass of the melt temperature a of the 1st hot melt material 6a and the melt temperature b of the 2nd hot melt material 6b is a＞b, even so for example utilizing the 1st hot melt material 6a bonded metal member 5 to utilize bonding light transmission member 4 of the 2nd hot melt material 6b and ceramic component 1 with ceramic component 1 and after being provided with light-emitting component 2, when the light transmission member that undertaken by the 2nd hot melt material 6b 4 and ceramic component 1 bonding, also can prevent the fusion of hardware 5 bonding with the 1st hot melt material 6a of ceramic component 1.

In addition, in LED10, owing to be provided with this light-emitting component 2 discretely in the mode of protruding apart from the about 0.5mm～2mm of g=,, correspondingly can utilize light efficiently so directly send easily to the outside from the light L2 of the light emission side 2b ejaculation of light-emitting component 2 from the edge part top A of ceramic component 1.In addition, for example under the situation that LED10 is used in illumination etc., promptly use light transmission member 4 grades that light L1, the L2 that comes self-emission device 2 carried out optically focused, also can suppress the reverberation that reflected by ceramic component 1 from the light emission side 2b of light-emitting component 2 fully, correspondingly can reduce the irregular generation of optically focused.Thereby, can effectively utilize from the light L2 of the side 2b ejaculation of light-emitting component 2 efficiently and in the irregular few mode of optically focused.

Moreover, according to LED10, because sub-fixture 1c is formed along with the installation side towards light-emitting component 2 is the thin truncated cone shape in end, has when light-emitting component 2 has been installed the wide face 1c ' of the about 0.1mm～0.5mm of i=simultaneously from the edge part of light-emitting area 2a along peripheral direction, on this face 1c ', light-emitting component 2 has been installed, so for example can use the light L2 that in about 5 ° scope, injects to sub-fixture 1c side from the side 2b of light-emitting component 2.Thereby, both can suppress to come the decline of ejaculation efficient of light of the side 2b of self-emission device 2, can improve the thermal diffusivity that the heat of coming self-emission device 2 is dispelled the heat again.

Moreover, in LED10, because light-emitting component 2 is to have area to be about 1mm ²～9mm ²The light-emitting component of cube shaped of light-emitting area of square or rectangular, it is 81mm that the hardware 5 that is made of Cu has area ²～144mm ²Face and comprise the face 5a of the such square or rectangular of the shape of light-emitting area 2a of light-emitting component 2, on this face 5a, be provided with light-emitting component 2, so both can keep the heat that makes self-emission device 2 and sub-fixture 1c through hardware 5 or ceramic component 1 to the thermal diffusivity of outside heat radiation, can realize necessary minimal package dimension again.

Secondly, the Production Example of the LED10 shown in the key diagram 1 to Fig. 3.

When making this LED10, at first, make and (for example be dissolved in water or water-miscible organic solvent, the mixed solvent of dimethyl ethyl ketone and dimethyl formamide) solidifying the resin material that demonstrates predetermined flexibility under the adhering state heating and melting time in and under than the high melt temperature of temperature (at this, being 150 ℃) of regulation is dissolved in above-mentioned water or the above-mentioned water-miscible organic solvent to make hot melt material 6 as above-mentioned bonding agent.If further specify, the situation of bonding light transmission member 4 and ceramic component 1 after then considering bonded metal member 5 and ceramic component 1 and being provided with light-emitting component 2, at this, with thermoplastic elastomer, ethylene/vinyl acetate and ethylene/acrylic acid copolymer and polyethylene are dissolved in above-mentioned water or the above-mentioned water-miscible organic solvent, add polyimides therein as thermosetting resin, mix equably, make like this and will solidify down the 1st resin combination that demonstrate flexibility under the adhering state in the heating and melting at the 1st melt temperature a (=250 ℃) higher and be dissolved in the 1st hot melt material 6a in above-mentioned water or the above-mentioned water-miscible organic solvent than 150 ℃.Moreover, with thermoplastic elastomer, ethylene/vinyl acetate copolymer and ethylene/acrylic acid copolymer and polyethylene are dissolved in above-mentioned water or the above-mentioned water-miscible organic solvent, add polyimides therein as thermosetting resin, mix equably, make like this with higher than 150 ℃ and than low the 2nd melt temperature b (=180 ℃) of the 1st melt temperature a (=250 ℃) (a＞b) is solidifying the 2nd resin combination that demonstrates flexibility under the adhering state down in the heating and melting and is being dissolved in the 2nd hot melt material 6b in above-mentioned water or the above-mentioned water-miscible organic solvent.

Each components in proportions of above-mentioned the 1st resin combination, at this be,

Thermoplastic elastomer: about 24.9 weight % (limiting viscosities: 1.2dl/g)

Ethylene/vinyl acetate copolymer: about 24.9 weight %

Ethylene/acrylic acid copolymer: about 24.9 weight %

Polyethylene: about 24.9 weight %

Polyimides: about 0.3 weight %

Each components in proportions of above-mentioned the 2nd resin combination, at this be,

Thermoplastic elastomer: about 24.9 weight % (limiting viscosities: 0.6dl/g)

Ethylene/vinyl acetate copolymer: about 24.9 weight %

Ethylene/acrylic acid copolymer: about 24.9 weight %

Polyethylene: about 24.9 weight %

Polyimides: about 0.3 weight %

In this example, as thermoplastic elastomer, used the thermoplastic elastomer of phenylethylene, more particularly, this thermoplastic elastomer is " SIS ", as the 1st resin combination, used the resin combination of limiting viscosity (η) 1.2dl/g, the resin combination that has used limiting viscosity (η) 0.6dl/g is as the 2nd resin combination.At this, in the 1st resin combination and the 2nd resin combination " melt temperature is different ", be that the limiting viscosity (η) by thermoplastic elastomer decides.In other words, the relation of " limiting viscosity (η) little-big " has realized " low-Gao of melt temperature ".Like this, in this example, (in the thermoplastic elastomer of the material of identical type) realized " low-Gao of melt temperature " by changing limiting viscosity (η) in the 1st resin combination and the 2nd resin combination, become for a change the structure of limiting viscosity (η), but also can be in the 1st resin combination and the 2nd resin combination the kind of material by changing thermoplastic elastomer realize.Promptly, in the 1st resin combination and the 2nd resin combination, even use the thermoplastic elastomer of different materials, or (in the thermoplastic elastomer of the material of identical type) use the thermoplastic elastomer of different limiting viscosities (η), can both realize " low-Gao of melt temperature ".Have, above-mentioned " limiting viscosity (η) " is the value that is decided by JIS K7367-3 again, according to this JIS K7367-3, is " viscosity during 135 ℃ of certain organic solvent ", can utilize the Ubbelohde viscosimeter to obtain.

Secondly, coating hot melt material 6 on the surface portion of the bonding region of ceramic component 1 makes this hot melt material 6 impregnated under the specified vacuum state among the pore h in the surface portion of above-mentioned bonding region of ceramic component 1 simultaneously.If further specify, then prepare not shown vacuum tank, in this vacuum tank, at the face of the 1st tabular component 1a and the bottom surface 1c of sub-fixture 1c " the surface portion of the 1st bonding region on coating the 1st hot melt material 6a; coating the 2nd hot melt material 6b on the surface portion of the 2nd bonding region of the face of the 2nd tabular component 1b simultaneously;, become the specified vacuum state by the vacuum atmosphere that becomes below the 1kPa to reducing pressure in this vacuum tank.Then, the 1st and the 2nd hot melt material 6a, 6b be impregnated among the pore h in the surface portion of the above-mentioned the 1st and the 2nd bonding region of ceramic component 1 (1a, 1b, 1c).Make ceramic component 1 drying of coated hot melt material 6 (6a, 6b) thereafter.

Coated dipping the 1st hot melt material 6a and make the 1st hot melt material 6a drying the face of the 1st tabular component 1a and the bottom surface 1c of sub-fixture 1c " and hardware 5 between make the 1st hot melt material 6a welding under and the pressure at afore mentioned rules lower at the 1st bonding temp more than the 1st melt temperature a (=250 ℃) (be 250 ℃ at this); Mutual bonded ceramics member 1 and hardware 5; And then behind bonding ceramic component 1 and hardware 5; Coated dipping the 2nd hot melt material 6b and make the 2nd hot melt material 6b drying the face of the 2nd tabular component 1b and light-transmitting member 4 between more than above-mentioned the 2nd melt temperature b (=180 ℃) and make the 2nd hot melt material 6b welding under and the pressure at afore mentioned rules lower less than the 2nd bonding temp of above-mentioned the 1st melt temperature a (=250 ℃) (be 180 ℃ at this), mutually bonded ceramics member 1 and light-transmitting member 4. At this moment, the thickness of the 1st and the 2nd hot melt material 6a, the 6b of coating is decided to be 20 μ m～200 μ m on ceramic component 1, and afore mentioned rules pressure is decided to be 9.8 * 10⁴Pa～294.2 * 10 ⁴Pa.

As above illustrated, in this Production Example, the hot melt material 6 that is made to as bonding agent is applied on the surface portion of above-mentioned bonding region of ceramic component 1, is impregnated under the vacuum state of afore mentioned rules among the pore h in the surface portion of above-mentioned bonding region of ceramic component 1.Because this hot melt material 6 is that above-mentioned resin combination is dissolved in material in above-mentioned water or the above-mentioned water-miscible organic solvent, thus little in room temperature (for example, 25 ℃) time viscosity, can impregnated in equably among this pore h.Thereafter, between coated ceramic component 1 that has flooded hot melt material 6 and hardware 5 under the bonding temp more than the above-mentioned melt temperature hot melt material 6 because of heating and melting is activated, thereby bonded ceramics member 1 and hardware 5 mutually.Like this, by with among the pore h of hot melt material 6 vacuum impregnations in the surface portion of the above-mentioned bonding region of ceramic component 1, can be well in conjunction with this hot melt material 6 and this pore h.Like this, but the LED10 shown in the shop drawings 1 to Fig. 3.

According to above-mentioned Production Example, because the LED10 shown in the shop drawings 1 to Fig. 3, so can relax the stress of the temperature rising of following hardware 5 and ceramic component 1, thus, can suppress warpage, the generation of the problem during variations in temperature that the difference because of hardware 5 and the coefficient of linear expansion of ceramic component 1 of the breakage of ceramic component 1 (crackle) etc. causes, thereby, material as hardware 5, can use pyroconductivity to compare the good metal material (in this example, be copper (Cu)), as being in a ratio of high power with existing device, the light-emitting diode of high output can be realized the more characteristics of luminescence of high brightness.In addition, in the pore h in the surface portion of the bonding region that hot melt material 6 be impregnated in ceramic component 1,, thus, can improve the bonding force of ceramic component 1 and hot melt material 6 so hot melt material 6 is combined with pore h.Thereby, even it is thinner to solidify the thickness of the hot melt material 6 under the adhering state, also can keep cementability well, the luminescent device 10 of the heat conductivity that correspondingly can improve hot melt material 6 can be provided.

In addition, in above-mentioned Production Example, owing under the 1st bonding temp more than above-mentioned the 1st melt temperature a (is 250 ℃ at this), make the 1st hot melt material 6a welding with mutual bonded ceramics member 1 and hardware 5, behind bonding ceramic component 1 and hardware 5, more than above-mentioned the 2nd melt temperature b and (make the 2nd hot melt material 6b welding under above-mentioned the 2nd bonding temp (is 180 ℃ at this) of a＞b) with mutual bonded ceramics member 1 and light transmission member 4 less than above-mentioned the 1st melt temperature a, even event is bonding light transmission member 4 and ceramic component 1 after bonded metal member 5 and ceramic component 1, when the light transmission member that undertaken by the 2nd hot melt material 6b 4 and ceramic component 1 bonding, also can prevent the fusion of hardware 5 bonding with the 1st hot melt material 6a of ceramic component 1.

Moreover, in above-mentioned Production Example, since can be bonding down in the temperature (is 180 ℃ or 250 ℃ at this) fully lower than in the past about 500 ℃～800 ℃ such temperature, so can improve the production efficiency of luminescent device 10, correspondingly can suppress manufacturing cost lower.

Moreover, bonding agent at the 2 liquid formulas of using general most use or thermosetting etc. impregnated under the situation of ceramic material as bonding agent with vacuum mode, because being hardened in the vacuum impregnation of this bonding agent begins, so must under the state that through this bonding agent sticky object is coated on the ceramic material, carry out vacuum impregnation, under the state that by this way sticky object is coated on the ceramic material, the irregular etc. of the bond layer of air when the pore of ceramic material breaks away from taken place, can not carry out vacuum impregnation well, cause the decline of cementability easily, but in above-mentioned Production Example, for hot melt material 6, in vacuum impregnation in ceramic component 1 and carried out being provided with after the drying hardware 5 and light transmission member 4, by being heated to above-mentioned bonding temp, but bonded ceramics member 1 and hardware 5 or light transmission member 4.

(embodiment 1)

Secondly, owing to use the LED10 shown in Fig. 1 to Fig. 3, about the sub-fixture 1c among this LED10, the temperature of research LED10 rises and the bottom surface 1c of sub-fixture 1c " and the contact area of the face 5a of Cu member 5 for the relation at angle of inclination, so below describe.Have, the angle of inclination of sub-fixture 1c as shown in Fig. 4 (A), is the angle (being θ among the figure) that the face R that vertically extends with respect to this end face 1c ' along each limit of the end face 1c ' of sub-fixture 1c and inclined-plane S constitute again.

At this, the material of ceramic component 1 is AlN, size e * f is 9mm * 12mm, the size c ' of light-emitting component 2 * d ' is 1mm * 2mm, height r ' is decided to be 100 μ m, the end face 1c ' of sub-fixture 1c is the wide i=0.2mm from the edge part of light-emitting component 2 along peripheral direction, and in addition, the thickness of the hot melt material 6a of bonding sub-fixture 1c and Cu member 5 is decided to be 15 μ m.Moreover the size c of Cu member 5 * d is 9mm * 12mm, and height r is decided to be 2mm, and the tilt angle theta of sub-fixture 1c is changed.At this moment, light-emitting component 2 has been dropped into 2.5W.

The characteristic of the contact area of the tilt angle theta of sub-fixture 1c shown in Figure 5 and temperature rising value and Cu member 5 and sub-fixture 1c.As shown in Figure 5, along with tilt angle theta becomes big, though thermal diffusivity becomes well the bottom surface 1c of sub-fixture 1c " and the contact area of the face 5a of Cu member 5 increased.But from the viewpoint of cost etc., the above-mentioned contact area of sub-fixture 1c (in other words, being the size of sub-fixture 1c) is preferably less.If consider this thermal diffusivity and contact area, tilt angle theta preferably is about 10 °～30 °.

(embodiment 2)

Secondly, because the light-emitting component 2 that uses the LED10 research LED10 shown in Fig. 1 to Fig. 3 and the temperature difference ((the temperature T j of light-emitting component 2)-(the temperature T cu-plate of Cu member 5)) of Cu member 5 are for the size c * d of the Cu member 5 among this LED10 (in other words, be package area) relation, so below describe.At this, except the size of the tilt angle theta of light-emitting component 2, sub-fixture 1c and Cu member 5 and ceramic component 1, with embodiment 1 be same.As shown in Fig. 4 (B), light-emitting component 2 has been decided to be side by side 2 in length and breadth * 4 size c " * d "=1mm * 1mm, height r ' be decided to be the luminescence chip (Dice) of 100 μ m, the tilt angle theta of sub-fixture 1c is decided to be 20 °, as package area, make the size c * d of Cu member 5 and the size e * f of ceramic component 1 be changed to 5mm * 5mm=25mm ², 7mm * 7mm=49mm ², 9mm * 9mm=81mm ², 12mm * 12mm=144mm ², 15mm * 15mm=225mm ²At this moment, light-emitting component 2 has been dropped into 10W.

Package area-temperature characterisitic shown in Figure 6.As shown in Figure 6, along with the increase of package area c * d, though thermal diffusivity become well, even package area c * d than about 9mm square=81mm ²～12mm is square=144mm ²Greatly, thermal diffusivity does not have great changes yet.Thereby package area c * d preferably is about 81mm as can be known ²～144mm ²

As above illustrated, according to the present invention, the generation of the problem in the time of can suppressing variations in temperature that the difference because of the coefficient of linear expansion of above-mentioned hardware and above-mentioned ceramic component of the breakage (crackle) etc. of warpage, ceramic component causes, thereby, material as above-mentioned hardware, can use relatively good metal material of pyroconductivity, the luminescent device and the manufacture method thereof that can realize being in a ratio of with existing device the device property of high power, high output can be provided.

In addition, the present invention is for example in that can provide under the situation about being configured as being provided with the light-emitting diode of light-emitting component can be efficiently and effectively utilize the luminescent device of the light that penetrates from the side of light-emitting component in the irregular few mode of optically focused.

Secondly, the embodiment of the lighting device relevant with the present invention is described.

" embodiment 1 of lighting device "

Fig. 7 is illustrated in the outward appearance oblique view of the luminescent device 100 that uses in the lighting device relevant with embodiment of the present invention 1.Luminescent device 100 is to utilize the manufacture method of the above-mentioned luminescent device relevant with the present invention to make.The positive side power supply 7 of the luminescent device 100 of the present embodiment and minus side power supply 8 face one side that not only is set at the 1st tabular component 1a in addition, and be separately positioned on corresponding side one side.

Fig. 8 illustrates the schematic oblique view of terminal 20a, the 20b relevant with the present embodiment.Terminal 20a, 20b are the positive and negative at least a pair of terminals that is made of conductive material that contacts with minus side power supply 8 with the positive side power supply 7 of luminescent device 100 respectively and luminescent device 100 supply powers are used.Moreover terminal 20a, 20b have as the first terminal 21a, the 21b of the spring leaf of clamping luminescent device 100 from the side at least and support the second terminal 22a, the 22b of luminescent device 100 from an interarea side.In more detail, the first terminal 21a, 21b and the second terminal 22a, 22b be in base portion 25a, the 25b place branch of terminal 20a, 20b, respectively on the direction of the luminescent device 100 that has been mounted from each base portion 25a, 25b extension.By making such structure, in to luminescent device 100 supply powers, can firmly fix luminescent device 100.In addition, the terminal in the present embodiment has the terminal that luminescent device 100 is installed on an end, have the terminal 23a, the 23b that are connected with outer electrode on another end.

Terminal 23a, the 23b of the present embodiment, such as shown in Figure 8, by being that the such shape of wider width is provided with on the vertical direction at interarea with respect to luminescent device 100, but be not limited to this, also can make at the interarea with respect to luminescent device 100 is the such shape of wider width on the direction of level.In addition, terminal 20a, 20b the part of terminal, for example as shown in Figure 8 like that near the part place base portion 25a, 25b have on installation direction and can position such shape 24a, 24b luminescent device 100.

Fig. 9 is shown schematically in the oblique view that the lighting device 30 of luminescent device 100 has been installed on terminal 20a, the 20b relevant with the present embodiment.In Fig. 9, have elasticity as the first terminal 21a, the 21b of spring leaf with respect to the direction of clamping luminescent device 100, clamp luminescent device 100 securely from the side.In addition, luminescent device 100 is placed on the tabular heat transfer unit 31, dispels the heat from the back side one side of luminescent device 100.At this, the back side place that is preferably in lighting device 30 carries out bending to heat transfer unit 31, so that can dispel the heat on the direction of the heat dissipation of reflector element etc.By doing like this, can improve the thermal diffusivity of lighting device.

" embodiment 2 of lighting device "

Figure 10 schematically illustratedly sees the oblique view of the form of the lighting device 40 relevant with the present embodiment 2 from frontal, and Figure 11 is an oblique view of seeing the state of lighting device 40 from back side direction.For the lighting device relevant 40, utilize the packaging body 41 of shaping resin etc. to cover a part and the luminescent device 100 of terminal with the present embodiment.Also utilize with the lighting device shown in Figure 10 and Figure 11 40 as lighting device with the reflector element combination.In addition, as shown in Figure 11, the part of heat transfer unit 31 is exposed in the back side of lighting device 40, by being connected with the reflector element that externally is provided with, can dispel the heat in the reflecting surface of reflector element.

In addition, the moulding material of the packaging body 41 that uses in the present embodiment is not particularly limited, and can use liquid crystal polymer, polyphthalamide resin, polybutylene terephthalate (PBT) known up to now all thermoplastic resins such as (PBT).In addition, for reflection efficiently comes the light of selfluminous element, can be in the packaging body formed parts Chinese white such as mixed oxidization titanium etc.

" embodiment 3 of lighting device "

Figure 12 is the oblique view of the relevant lighting device 60 of schematically illustrated and the present embodiment 3.Lighting device 60 in the present embodiment is except the structure of terminal 60a, 60b and above-mentioned embodiment 1 and 2 same lighting devices.Terminal 60a, the 60b relevant with the present embodiment only powers from the side one side support luminescent device 100 of luminescent device 100.

As shown in Figure 12, the lighting device 60 relevant with the present embodiment has positive and negative pair of terminal 60a, 60b, utilizes this two-terminal to clamp luminescent device 100 from the side.Terminal 60a, 60b become following shape: extend along the side of luminescent device 100 with the side of this side adjacency respectively from base portion 65a, 65b spring leaf 61a, 61b and braking parts 64a, 64b, and then have terminal part 63a, 63b continuous with braking parts 64a, 64b, that can be connected with external electrode terminals.The bearing of trend of terminal part 63a, the 63b that can be connected with external electrode terminals is an approximate vertical with respect to the side of luminescent device 100.At this, the part of terminal 60a, 60b is made as the spring leaf 61a, the 61b that have the such shape of elasticity on the direction of clamping luminescent device 100, between terminal 60a, 60b, embed luminescent device 100.In addition, (for example, 60a) contact with the positive side power supply 7 that is provided with on a side of luminescent device 100, negative terminal (for example, 60b) contacts with the minus side power supply 8 that is provided with on another side of luminescent device 100 positive terminal.In addition, each of 60a, 60b with the direction of this parallel sided on become the shape of wider width so that obtain bigger contact area with respect to the side of luminescent device 100.In addition, each of 60a, 60b and above-mentioned embodiment 1 and 2 are same, have terminal part 63a, the 63b that can be connected with outer electrode, the wider width of this terminal part on the direction vertical with the interarea of luminescent device 100.

(terminal)

The terminal (20a, 20b or 60a, 60b) relevant with above-mentioned each embodiment contacts with the power supply that is provided with in the side of luminescent device one side and interarea one side, is the member that is made of the conductive material that supports this luminescent device in the illumination apparatus supply power securely.Moreover, positive and negative pair of terminal is set, positive terminal and negative terminal have respectively as making it to have elasticity in case from the side direction clamp luminescent device spring leaf the first terminal and support second terminal of luminescent device from interarea one side.Perhaps, positive terminal and negative terminal are respectively to have to make it to have elasticity so that the first terminal of the spring leaf of luminescent device is clamped and supported to direction from the side.By supporting luminescent device from interarea direction and/or side surface direction by this way, can firmly fix luminescent device, can prevent the rotation that causes because of vibration from the outside.At this, not only make the first terminal have elasticity, and make second terminal also have elasticity, utilize the heat transfer unit of this second terminal and placement luminescent device, can make the structure of clamping this luminescent device from the interarea direction of luminescent device.By making such structure, can firmly fix light-emitting device more, can prevent the rotation that causes because of vibration from the outside.

In addition, the terminal in the present embodiment has the terminal that luminescent device is installed on an end, has the terminal that is connected with outside electrode on another end.Compare with square end, the shape that can change the terminal that is connected with outside electrode is provided with, so that corresponding with the shape of the electrode of outside.In addition, terminal can position such shape having on its part installing on the direction of luminescent device.For example, positive and negative pair of terminal has respectively along the braking parts 24a of the side of luminescent device, 24b, 64a, 64b, fixes like this and supports luminescent device, and it is not moved on installation direction.For example utilize the Punching Technology and the Bending Processing of metal plate to form such shape.

For terminal, consider electrical conductivity and elasticity, can select various materials, can form with various sizes.As the material of such terminal,, also can suitably use the material of the metal plating of on the surface of copper or phosphor bronze sheet, having carried out silver, palladium or silver, gold etc. etc. except using individually the copper.Carrying out by this way under the situation of metal plating, owing to improved the reflection of light rate of sending from luminescent device 100, the light that has improved lighting device takes out efficient, so be comparatively desirable.

(heat transfer unit)

Heat transfer unit 31 in above-mentioned each embodiment is to place member luminescent device, that the heat that takes place from luminescent device is transmitted towards heat dissipation direction from the back side one side of luminescent device.For example heat transfer unit can be made the metal plate or the heat pipe of copper or aluminium etc.Particularly in above-mentioned each embodiment, the heat pipe that can be used as the heat transfer unit use is for example to have enclosed water in the metal tube that the metal material by copper or aluminium etc. constitutes, the chlorine fluorohydrocarbon, replace the chlorine fluorohydrocarbon, the heat of fluoride etc. is carried the material of the working solution of usefulness, be by repeating the heat transfer member that following work has realized high heat conductivity: working solution is heated and becomes steam in going into hot portion (high-temperature portion), move and liquefaction is dispelled the heat to radiating part (low temperature side) by its steam, this working solution that has liquefied utilizes capillarity and turns back to into hot portion.

In above-mentioned each embodiment, can consider the direction of being dispelled the heat or radiating effect and the shape of heat transfer unit is made various shapes and size.For example, as shown in Figure 9, being made to flat heat transfer unit 31 from extending towards the direction of terminal part 23a, the 23b that can be connected with external electrode terminals with opposed position, the back side of luminescent device 100, is the right angle towards heat dissipation direction by bending halfway.In addition, also can be as the lighting device shown in Figure 13 70, can make with opposed position, the back side of luminescent device 100 on the shape spent by bending 180.

(reflector element)

In the lighting device in above-mentioned each embodiment, for reflector element with the surface that can use as reflecting surface, be provided with this reflecting surface opposed to each other with the luminous sightingpiston of luminescent device, make from the light of this luminescent device irradiation with reflecting surface and reflect in desirable direction.The reflecting surface of reflector element is processed as concave, and for example being preferably in aluminium is the metal plating of carrying out that silver is electroplated on the reflecting surface of material or the surface etc.Electroplate by carrying out silver, can improve the reflection of light rate.In addition, has the function that makes the heat of sending through heat transfer unit from luminescent device reject heat to the outside of lighting device from the behind of lighting device.

For reflector element, consider the size of thermal diffusivity, the reflectivity in reflecting surface and luminescent device or output etc., can select various materials, can form with various sizes.That is, the output of luminescent device is high more, then can increase reflector element more.The end of heat transfer unit is connected on the reflector element, owing to make the heat of sending from luminescent device reject heat to the outside efficiently, so heat conductivity is well comparatively desirable.The concrete heat conduction degree of such reflector element is 0.01cal/ (s) (cm ²) (℃/be comparatively desirable more than cm), that even more ideal is 0.5cal/ (s) (cm ²) (℃/cm) more than.

As the material of reflector element, except can using individually the aluminium, can suitably use the metal plating of on the surface of copper, aluminium or phosphor bronze sheet, having carried out silver, palladium or silver, gold etc. or scolding tin plating etc.Carrying out by this way under the situation of silver-colored plating, owing to improved the reflection of light rate of sending from luminescent device, the light that has improved lighting device takes out efficient, so be comparatively desirable.

As above illustrated because lighting device of the present invention is good aspect thermal diffusivity, so can shine with high brightness.In addition, because the performance of anti-mechanical oscillation from the outside is also very strong, so can make the high lighting device of reliability.

According to such reason, the lighting device relevant with the present invention is not limited to general illumination, and the vehicle mounted that for example also can be used as the lamp etc. of car throws light on and utilizes.

More than, for suitable form the present invention has been described with certain detailed degree, but the present disclosed content of the form that this is suitable should change aspect the details of structure to some extent, under the situation that does not break away from scope of invention and thought, can realize the combination of each key element or the variation of order.

For example, in each embodiment (Fig. 9, Figure 10, Figure 12 and Figure 13) of above-mentioned lighting device, used the luminescent device relevant (luminescent device 100), but be not limited to this, for example, also can use the luminescent device 100A shown in Figure 14 with the present invention.For luminescent device 100A shown in Figure 14, light-emitting component is fixed on insulation isolation part 101 pairs of positive and negative pair of conductive figures (positive electrode 102 and negative electrode 103) carried out each other having connected to conductivity the electrode and the electroconductive member pattern of this light-emitting component on the interarea of the substrate that insulation isolates.At this, utilizing for example is that the conductivity lead-in wire of material carries out being electrically connected of light-emitting component and electroconductive member pattern with Au, but also makes the positive and negative pair of electrodes and the electroconductive member pattern that can make in the same one side side setting of light-emitting component opposed, directly engages through electroconductive member.In addition, from as luminous sightingpiston one side of an interarea of substrate side, electroconductive member is carried out positive and negative insulation each other isolate and dispose electroconductive member pattern to substrate.In addition, light transmission member 104 is that the hard polyorganosiloxane resin is configured as hemispheric member.Here said " interarea " for luminescent device, particularly for substrate, supposes the installed surface that refers to luminous sightingpiston direction or luminescent device, for flat terminal, supposes the side's that the mode with wider width that refers to forms face.

If illustrate in greater detail luminescent device 100A,, directly or through heat conductivity substrate light-emitting component is installed as sub-fixture then for the insulating properties substrate that has added electroconductive member pattern by electroconductive member.At this, as electroconductive member, for example use gold, silver, copper etc., utilize metal plating on the insulating properties substrate, to form as electroconductive member pattern.As the insulating properties substrate, mainly utilize the glass epoxy resin substrate.In addition, also can make the structure that has engaged the substrate of luminescent device 100A with insulative resin, so that to the isolation of insulating of positive and negative a pair of opposed metal plate.

In addition, as light-emitting component, use led chip.Can consistently use a plurality of these led chips with the output of luminescent device 100A, can make various shapes and configuration, so that can obtain desirable optical characteristics.

The kind of led chip is not particularly limited, but under the situation of common use fluorescent material, preferably has the semiconductor light-emitting elements of the active layer that can send the wavelength that can encourage this fluorescent material.As such semiconductor light-emitting elements, can enumerate various semiconductors such as ZnSe or GaN, can send the nitride-based semiconductor (In that the short wavelength of activating fluorescent material can be luminous efficiently but can suitably enumerate _xAl _yGa _1-X-YN, 0≤X, 0≤Y, X+Y≤1).Above-mentioned nitride-based semiconductor also can contain boron or phosphorus as required.As semiconductor structure, can enumerate have MIS knot, homostyructure, heterostructure or the double-heterostructure of PIN knot or pn knot etc.According to material or its mixed crystal degree of semiconductor layer, can select various emission wavelengths.In addition, also can make single quantum well structure or the multiple quantum trap structure that forms in the film of generation quantum effect in active layer.

Under the situation of having used nitride-based semiconductor, can suitably use the material of sapphire, spinelle, SiC, Si, ZnO, GaN etc. as the semiconductor substrate.For with the good good nitride-based semiconductor of batch process formation crystallinity, preferably use sapphire substrate.On this sapphire substrate, can use mocvd method to wait and form nitride-based semiconductor.For example, on sapphire substrate, form the nitride-based semiconductor that the resilient coating of GaN, AlN, GaAlN etc. and formation thereon have the pn knot.In addition, for substrate, behind the semiconductor layer, also can be removed stacked.

As the example of light-emitting component with the pn knot that has used nitride-based semiconductor, the 1st covering that can enumerate in order on resilient coating stacked the 1st contact layer that forms with n type potassium nitride, form with n type aluminium nitride, potassium, the active layer that forms with indium nitride, potassium, the 2nd covering that forms with p type aluminium nitride, potassium and with the double-heterostructure of the 2nd contact layer of p type potassium nitride formation etc.Nitride-based semiconductor demonstrates n type conductivity under plain state.Make in formation under the situation of desirable n type nitride-based semiconductor of luminous efficiency raising etc., preferably suitably import Si, Ge, Se, Te, C as n type dopant.On the other hand, under the situation that forms p type nitride-based semiconductor, Zn, Mg, Be, Ca, Sr, Ba etc. as p type dopant are mixed.Owing to for nitride-based semiconductor, only be difficult to realize the p typeization, so behind importing p type dopant, preferably utilize the heating of stove or plasma irradiating etc. to make its low resistanceization by the doping p-type dopant.After forming electrode,, can form the light-emitting component that constitutes by nitride-based semiconductor by cutting into shaped like chips from semiconductor wafer.In addition, if utilize composition to form by SiO ₂The insulating properties diaphragm that constitutes then can form the luminescent device of miniaturization with high reliability so that the bonding part of each electrode is exposed and the integral body of cladding element.

In luminescent device 100A, send under the situation of mixed light of white group, consider with from the complementary color relation of the emission wavelength of fluorescent material or the mis-behave of translucent resin etc., the emission wavelength of light-emitting component is that 400nm is above to being comparatively desirable below the 530nm, 420nm above to 490nm with next even more ideal.In order further to improve excitation, the luminous efficiency of light-emitting component and fluorescent material respectively, 450nm is above to ideal below the 475nm.Have again, utilize and the combination that comparatively is difficult to because of the member of ultraviolet ray mis-behave, also can use with than the short wavelength zone of short ultraviolet range of 400nm or visible light light-emitting component as the main light emission wavelength.

The luminescent device 100A that has below illustrated can use in the lighting device of each above-mentioned embodiment, but also can use the embodiment of the lighting device 80 shown in Figure 15 as other lighting device.Lighting device 80 has from the substrate of interarea side support luminescent device 100A and the positive and negative pair of terminal that luminescent device 100A is powered.If illustrate in greater detail, the installed surface that then utilizes the interarea of positive and negative a pair of two-terminal and place the member (for example heat transfer unit) of luminescent device is clamped the substrate of luminescent device 100A from the interarea direction, particularly for each of positive and negative pair of terminal, the substrate interarea along luminescent device 100A extends from base portion 85a, 85b respectively for support portion 82a, 82b, moreover braking parts 84a, 84b extend along the substrate side surfaces of luminescent device 100A respectively.Moreover, formed terminal part 83a, the 83b that can be connected continuously with braking parts 84a, 84b with external electrode terminals.The bearing of trend of terminal part 83a, the 83b that can be connected with external electrode terminals is roughly vertical with the substrate side surfaces of luminescent device 100A.At this, the shape of positive and negative pair of terminal made on the direction of the substrate of clamping luminescent device 100A, have the such spring shape of elasticity, the light transmission member 104 of luminescent device 100A is embedded between two-terminal, so that position.For example, positive and negative pair of terminal has spring leaf 81a, the 81b that the part of metal plate is separately constituted by bending on the substrate interarea direction of luminescent device 100A, and spring leaf 81a, 81b extend on different directions from each other respectively.In addition, contact with the positive electrode 102 of the interarea side that on the substrate of luminescent device 100A, is provided with at the spring leaf 81a that is provided with on the plus end, on the other hand, spring leaf 81b that on negative terminal, is provided with and negative electrode 103 contact in identical interarea side.In addition, with the shape of terminal form respectively with the direction of this main surface parallel on the shape of wider width so that increase contact area for the substrate of luminescent device 100A.In addition, same with each embodiment of above-mentioned lighting device, terminal has terminal part 83a, the 83b that can be connected with outer electrode respectively, this terminal part with the direction of the substrate main surface parallel of luminescent device 100A on wider width.

In addition, be preferably on the heat transfer unit through heat conductivity substrate placement luminescent device 100A.The heat conductivity substrate has the function that the heat that will take place from luminescent device 100A passes to heat transfer unit.Consider the output of thermal diffusivity, light source etc., the heat conductivity substrate can be formed all size.Luminescent device 100A contacts with heat transfer unit through the heat conductivity substrate.Thereby, rejecting heat to the heat transfer unit side efficiently in order to make the heat of sending from luminescent device 100A, the heat conductivity of heat conductivity substrate well is comparatively desirable.Concrete heat conduction degree is 0.01cal/ (s) (cm ²) (℃/be comparatively desirable more than cm), that even more ideal is 0.5cal/ (s) (cm ²) (℃/cm) more than.

As the material of such heat conductivity substrate, except using pottery, copper, aluminium or phosphor bronze sheet individually, can suitably use the material of the metal plating of on these metallic surfaces, having carried out silver-colored, palladium or silver, gold etc. or scolding tin plating etc.

Claims (14)

1. luminescent device possesses the encapsulation that is made of pottery with ceramic component and the light transmission member with light transmission mutually bonding with this ceramic component, it is characterized in that:

The circumference of this light transmission member and above-mentioned ceramic component are bonding mutually with bonding agent,

Light-emitting component is arranged at heat radiating metal member or above-mentioned ceramic component by the arrangements of components member that disposes this light-emitting component,

The circumference top of above-mentioned light transmission member is lower than the upper surface of said elements layout structure.

2. the luminescent device described in claim 1 is characterized in that:

The light-emitting diode that forms by on above-mentioned ceramic component light-emitting component being set constitutes.

3. the luminescent device described in claim 2 is characterized in that:

The dome-shaped glass lens of the semi-spherical shape that above-mentioned light transmission member is a hollow is constructed such that the light of the light source of comfortable central part configuration to be radial ejaculation.

4. the luminescent device described in claim 2 is characterized in that:

Above-mentioned light-emitting component is arranged to protrude 0.5mm～2mm from the circumference top of above-mentioned ceramic component.

5. the luminescent device described in claim 1 is characterized in that:

The said elements layout structure forms along with the configuration side towards above-mentioned light-emitting component is the thin truncated cone shape in end.

6. the luminescent device described in claim 1 is characterized in that:

The said elements layout structure has following, the above-mentioned light-emitting component of configuration on this face, this face when having disposed above-mentioned light-emitting component from the circumference of this light-emitting component along the wide 0.1mm of going out of peripheral direction～0.5mm.

7. the luminescent device described in claim 2 is characterized in that:

Above-mentioned light-emitting component is cube shaped, and having area is 1mm ²～9mm ²The light-emitting area of square or rectangular.

8. the luminescent device described in claim 7 is characterized in that:

Above-mentioned ceramic component has the face of square or rectangular of the shape of the above-mentioned light-emitting area that comprises above-mentioned light-emitting component, and the area of this face is 81mm ²～144mm ², on this face, be provided with above-mentioned light-emitting component.

9. lighting device, it possesses the luminescent device described in the claim 1 and to the positive and negative at least pair of terminal of this luminescent device power supply, it is characterized in that:

Above-mentioned each terminal clips above-mentioned luminescent device.

10. the lighting device described in claim 9 is characterized in that:

Above-mentioned each terminal has the first terminal that supports above-mentioned luminescent device from the side and supports second terminal of above-mentioned luminescent device from upper face side,

The first terminal of above-mentioned each terminal clips above-mentioned luminescent device.

11. the lighting device described in claim 9 is characterized in that:

Above-mentioned luminescent device side below it utilizes heat transfer unit to support.

12. the lighting device described in claim 9 is characterized in that:

The luminous sightingpiston side and the reflecting surface of above-mentioned luminescent device are opposed.

13. the lighting device described in claim 12 is characterized in that:

Above-mentioned reflecting surface is made of metal material.

14. the lighting device described in claim 12 is characterized in that:

Above-mentioned reflecting surface is to being dispelled the heat by the heat of above-mentioned heat transfer unit transmission.

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