CN100539764C - Temperature controlling method in heater/cooler system and the chamber thereof - Google Patents
Temperature controlling method in heater/cooler system and the chamber thereof Download PDFInfo
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- CN100539764C CN100539764C CNB038140330A CN03814033A CN100539764C CN 100539764 C CN100539764 C CN 100539764C CN B038140330 A CNB038140330 A CN B038140330A CN 03814033 A CN03814033 A CN 03814033A CN 100539764 C CN100539764 C CN 100539764C
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- electrothermal module
- temperature
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Abstract
A kind of portable heater/cooler system comprises an electrothermal module, and it is by described module conduction current; Be connected to the heater/cooler cavity of described electrothermal module; Variable speed fan is used to blow the air on the described electrothermal module and it is blown into described chamber; Be connected to first Temperature Detector that described electrothermal module is used to measure described module temperature; Be connected to second Temperature Detector that described heater/cooler cavity is used for measuring the temperature in described chamber; And microprocessor, be used for the speed of described fan and the electric current that flows through described electrothermal module are regulated as the function of the measurement temperature in described electrothermal module and described chamber.
Description
The cross reference of related application
The application requires the U.S. Provisional Patent Application No.60/372 that submitted on April 17th, 2002,734, title be " heater/cooler system of microprocessor control ", priority, its disclosed full content is quoted in reference here.
Technical field
The present invention relates to portable, a complete heater/cooler system.
Background technology
Electrothermal module is well-known interchangeable heating/cooling element.Described electrothermal module typically has two hot transfer plates that separated by semiconductive material, and when electric current was applied to described semiconductive material, it was sent to another plate with heat from a plate.One of described plate is to serve as heating plate or coldplate depends on the direction of described electric current by described electrothermal module.For example, when described electric current flow through described electrothermal module with first direction, heat was sent to second plate from first plate, makes the second plate heating and first plate turns cold.When electric current was reversed to rightabout and flows, heat was sent to first plate from second plate, made to win the plate heating and second plate turns cold.
A lot of conventional heating/cooling systems use electrothermal module and combination of fans to be used for air cooling/heating operation.But in these systems, the speed that described fan speed and electric current flow through described electrothermal module is fixed.Fix because fan speed and electric current flow through the speed of described electrothermal module, these systems can not adapt to the system condition of variation, and are inefficient obtaining aspect the required system condition.
Therefore, need a kind of portable complete heater/cooler system, it regulates various system parameterss according to the system condition that changes, so that reach required system parameters with effective means.
Summary of the invention
A kind of portable heater/cooler system is provided in a typical embodiment of the present invention, and it comprises electrothermal module, and its conduction current is by described module; Be connected to the heater/cooler cavity of described electrothermal module; Variable speed fan is used to blow the air on the described electrothermal module and it is blown into described chamber; Be connected to first temperature sensor of described electrothermal module, be used to measure the temperature of described module; Be connected to second temperature sensor of described heater/cooler cavity, be used for measuring the temperature in described chamber; And microprocessor, be used for the speed of described fan and the electric current that flows through described electrothermal module are regulated as the function of the measurement temperature in described electrothermal module and described chamber.
In another typical embodiment, a kind of heater/cooler system comprises: the shell that limits the chamber; The electrothermal module that interrelates with described chamber; The fan of adjustable speed, described fan are arranged to the air that blows on the described electrothermal module and it are blown into described chamber; To described fan and to the power supply of described electrothermal module power supply; First temperature sensor, it is arranged to the temperature of measuring described electrothermal module; Second temperature sensor, it is arranged to the temperature of measuring in the described chamber; And microprocessor, receive the described measurement temperature in described electrothermal module and described chamber, and according to the temperature in the described chamber, the temperature of described electrothermal module, and flow through in the electric current of described electrothermal module at least one control power that is fed to described fan and the power that is fed to described electrothermal module.
According to a further aspect in the invention, a kind of method of temperature that is used for controlling the chamber that the electrothermal module that comprises with heater/cooler system interrelates is provided, described heater/cooler system also comprises: the fan of adjustable speed, described fan are arranged to the air that blows on the described electrothermal module and it are blown into described chamber; To described fan and to the power supply of described electrothermal module power supply; And microprocessor, described method comprises: provide the modular power signal from power supply to electrothermal module; Provide the fan power signal to fan; Blow the air on the described electrothermal module and it is blown into described chamber with described fan; Detect the temperature of described electrothermal module; Detect the temperature in the described chamber; Regulate described modular power signal according to the temperature in the described chamber by described microprocessor; And according to the temperature of described electrothermal module and flow through in the electric current of described electrothermal module at least one, regulate described fan power signal by described microprocessor.
More feature and advantage of the present invention, and the structure of various execution modes of the present invention describes in detail with operating in below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 shows the heater/cooler system according to the microprocessor control of preferred implementation of the present invention;
Fig. 2 shows heat-cold switch, and its change is applied to the polarity of the voltage on the electrothermal module of Fig. 1, and wherein said switch is switched to primary importance; And
Fig. 3 shows heat-cold switch, and its change is applied to the polarity of the voltage on the electrothermal module of Fig. 1, and wherein said switch is switched to the second place.
Embodiment
To go through preferred implementation of the present invention below, wherein similarly the common indication of reference number is identical, functionally similar, and/or the element of similar.Although specific exemplary embodiment has been discussed, it should be understood that this just for illustrative purposes.Those skilled in the art will be recognized assembly and the configuration that can use other under the situation that does not break away from the spirit and scope of the present invention.
Fig. 1 shows the example of the heater/cooler system of microprocessor control according to an embodiment of the present invention.Described heater/cooler system comprises the shell 5a of a conventional insulation, and it defines a heater/cooler cavity 5.Described heater/cooler cavity 5 is suitable for holding the object that will heat or cool off.Electrothermal module 1 is provided to heat or cools off air in the described chamber.Described heating or cooling are by carrying heat or cold air to obtain to described heater/cooler cavity 5 from described electrothermal module 1.Can use a fan 2 that heat or cold air are blown into the described heater/cooler cavity 5 from described electrothermal module 1.
Described low-voltage condition can be given the operator by display 12 indications that are connected to described microprocessor 6.Described display 12 also can show various other information from described microprocessor, comprises the measurement temperature in described chamber 5, the described chamber of operator input temperature required etc.Input unit, the key plate 13 that for example is connected to described microprocessor 6 can be provided, so that the operator imports the temperature required of described heater/cooler cavity or other information.
As mentioned above, described electrothermal module 1 comprises two plate (not shown)s that separated by semiconductive material.First of described two plates of described electrothermal module 1 is connected to heater/cooler cavity 5, and is operating as a coldplate or a heating plate.Described electrothermal module is operating as a heater or cooler depends on that electric current flows through the direction of these two plates.In Fig. 1, the direction that described electric current flows through described electrothermal module 1 changes by heating-cold switch 7.Described heating-cold switch 7 changes the polarity that is applied to the voltage on the described electrothermal module 1, below in conjunction with Fig. 2-3 it is explained in more detail.
Description is according to the example of the operation of the heater/cooler system of an exemplary embodiment of the present invention now.When the first plate heating of the described electrothermal module 1 that is connected to described chamber 5 or when turning cold, described fan 2 blow air are crossed described first plate and are entered described chamber 5, make hot-air or cold air be blown in the described chamber 5.Described fan 2 is the fan of a variable velocity preferably.The fan speed of described fan 2 and the current flow rate Be Controlled that enters described module 1 keep a best relation so that described fan speed is changed with the surface temperature with the variation of described first plate of module 1.For example, when described chamber 5 is used as the surface temperature of first plate of cooler and described electrothermal module 1 when cold inadequately, the fan speed of described fan 2 is set at a low velocity and turns cold with the surface that allows first plate.Otherwise, will be blown into the described chamber 5 by the hot-air of taking away from the hot surface of first plate.When the surface temperature of first plate became enough cold, then described fan speed was increased cold air is blown in the described chamber 5.The temperature in described electrothermal module 1 and described chamber 5 is measured by described electro-hot regulator 3 and 4 respectively frequently.This measurement temperature is used to change the fan speed of described fan 2 and the speed (ampere/second) that electric current flows through described electrothermal module 1, with this value of optimization to reach temperature required as by chamber 5 as described in key plate 13 input.
Described microprocessor 6 can comprise a storage area 14, its store look-up tables, comprising the measurement temperature that is used for described electrothermal module 1, the measurement temperature of described heater/cooler cavity 5, and be input to by key plate 13 by the operator described microprocessor described chamber 5 each temperature required combination fan 2 speed and to the optimum value of the current flow rate of described module 1.Described microprocessor 6 is constantly searched in described look-up table and is used in the optimum fan speed of described measurement temperature and the value of optimum current, and described fan speed and described current rate are adjusted to described value of searching.For example, when the described chamber 5 by 13 inputs of described key plate temperature required is 40 ℉, the surface temperature of first plate of described electrothermal module 1 is 50 ℉, and the measurement temperature in described chamber 5 is 75 ℉, so as fan speed as described in the look-up table as described in being stored in and as described in the optimum value of current flow rate may be respectively 2 revolutions per seconds and 0.5 ampere/second.The operation of the described system of described microprocessor 6 controls is to reach described value of searching.
As second example, when the surface temperature of first plate of described module 1 is 15 ℉, and during identical in the temperature required and previous examples of the measurement temperature in described chamber 5 and described operator input, as described in being stored in the look-up table as described in fan speed and as described in the optimum value of current flow rate may be respectively 6 revolutions per seconds and 0.5 ampere/second.Described fan speed becomes colder with the surface that allows described system wait first plate slowly in first example.When first plate became colder, such in second example as described, described fan speed was increased so that colder air can be blown off from the surface of first plate and blown into described chamber 5.
In order to control the operation of described system, described microprocessor 6 produces the module control signal that is used for the fan control signal of described fan 2 and is used for described electrothermal module 1.Described fan control signal and described module control signal can be used for changing the electric weight that is fed to described fan 2 and electrothermal module 1 from power supply 10 respectively, thereby change the temperature of described fan speed and described electrothermal module 1.The change of described electric weight can be by finishing the pulse-width modulation from the power signal of power supply 10 supply.
In disclosed execution mode, the pulse-width modulation of the described power signal from described power supply is to reach by switch 8,9.Switch 8,9 is connected between power supply 10 and electrothermal module 1 and the described fan 2.Described switch 8,9 can be the transistor of difference power controlling signal to the passage of described module 1 and described fan 2, field-effect transistor (FETs) for example, perhaps other electronic switch is to respond described fan control signal and described electrothermal module control signal.The open and close of the fan control signal control switch 9 that is produced by described microprocessor 6 is suitably to regulate described power signal according to the optimum fan speed that finds in the described look-up table 14.For example, when from the described optimum fan speed of described look-up table greater than described fan record speed the time, the pulse duration that then is used for the described power signal of described fan is increased by described microprocessor.When the pulse duration of the described power signal that is used for described fan 2 is increased, is applied to the revolving force that described fan 2 is used to increase described fan speed and is applied in the longer cycle.Elongated along with cycle that applies of described revolving force, described fan speed increases.
Similarly, the described module control signal that is produced by described microprocessor 6 is controlled the open and close of described switch 8, with according to suitably modulating described power signal from the described optimum current of described look-up table.For example, when described search optimum current greater than described module 1 record current rate the time, the pulse duration that is used for the power signal of described electrothermal module 1 is so increased by described microprocessor 6.When the duty ratio of the power signal that is used for described electrothermal module 1 is high, described control signal is connected the longer time cycle of described switch 8, so that from the supply voltage of described power supply 10 and follow electric current to be applied to the described 1 corresponding longer time cycle of module.When the duty ratio of the power signal that is used for described electrothermal module 1 was lowered, described switch 8 was disconnected longer a period of time, and electric current still less is applied to described module 1 by described switch 8.
Fig. 2-3 shows an example of heating-cold switch 7, and it has changed the polarity of the voltage of the described electrothermal module 1 that is applied to Fig. 1.By described switch 15 being slided into the primary importance among Fig. 2, the voltage of first polarity is supplied to described electrothermal module 1.By described switch 15 being slided into the second place among Fig. 3, be supplied to described module 1 with the voltage of first opposite polarity second polarity.
Although described various execution mode of the present invention above, it should be understood that they only propose for unrestricted by way of example mode.Therefore, range of the present invention and scope should not be construed as by any one above-described exemplary embodiment and limit, and should only limit according to following claim and their equivalent.
Claims (19)
1. portable heater/cooler system comprises:
Electrothermal module, its conduction current is by described module;
Be connected to the heater/cooler cavity of described electrothermal module;
Variable speed fan is used to blow the air on the described electrothermal module and it is blown into described chamber;
Be connected to first temperature sensor of described electrothermal module, be used to measure the temperature of described module;
Be connected to second temperature sensor of described heater/cooler cavity, be used for measuring the temperature in described chamber; And
Microprocessor is used for the speed of described fan and the electric current that flows through described electrothermal module are regulated as the function of the temperature in measured described electrothermal module and described chamber.
2. the system as claimed in claim 1, wherein said microprocessor produces the first pulse duration control signal that is used to control described fan speed, and the second pulse duration control signal that is used to control the temperature of described electrothermal module, the duty ratio of described first and second control signals is functions of the measurement temperature in described electrothermal module and described chamber.
3. the system as claimed in claim 1, wherein said microprocessor has a storage area that is used for store look-up tables, and described look-up table comprises a plurality of rate values that the electric current to described electrothermal module relevant with described fan speed of each combination of the measurement temperature in the measurement temperature that is used for described electrothermal module and described chamber flows; And
Wherein when the measurement temperature in described chamber and required cavity temperature not simultaneously, described microprocessor is searched the fan speed and the electric current that are used for described module and is flowed in described look-up table, and with described fan speed and mobile fan speed and the electric current slamp value of being searched that change to of electric current.
4. the system as claimed in claim 1 also comprises the heating/cold switch that is connected to described electrothermal module, and wherein said heating/cold switch is in can operate the primary importance that makes described electrothermal module heating.
5. the system as claimed in claim 1 also comprises the heating/cold switch that is connected to described electrothermal module, and wherein said heating/cold switch is in can operate the second place that makes described electrothermal module cooling.
6. heater/cooler system comprises:
Limit the shell in chamber;
The electrothermal module that interrelates with described chamber;
The fan of adjustable speed, described fan are arranged to the air that blows on the described electrothermal module and it are blown into described chamber;
To described fan and to the power supply of described electrothermal module power supply;
First temperature sensor, it is arranged to the temperature of measuring described electrothermal module;
Second temperature sensor, it is arranged to the temperature of measuring in the described chamber; And
Microprocessor, receive the described measurement temperature in described electrothermal module and described chamber, and according to the temperature in the described chamber, the temperature of described electrothermal module, and flow through in the electric current of described electrothermal module at least one control power that is fed to described fan and the power that is fed to described electrothermal module.
7. heater/cooler system as claimed in claim 6 also comprises:
Be connected first switch between described power supply and the described fan;
Be connected the second switch between described power supply and the described electrothermal module, wherein said microprocessor is controlled the open and close of described first and second switches, so that the power supply that is fed to described fan and described electrothermal module is carried out pulse-width modulation.
8. heater/cooler system as claimed in claim 6 also comprises a display that is connected to described microprocessor.
9. heater/cooler system as claimed in claim 6 also comprises an input unit, be used for from an operator receive the input and with described operator's input transfer to described microprocessor.
10. heater/cooler system as claimed in claim 7, also comprise the 3rd switch that is connected between described electrothermal module and the described power supply, described the 3rd switch can move between first and second positions, in described primary importance, the 3rd switch is supplied the voltage of first polarity to described electrothermal module, and in the described second place, the 3rd switch is to the voltage of the described electrothermal module supply and the first polarity opposite polarity.
11. heater/cooler system as claimed in claim 6 also comprises a voltage regulator that is connected between described power supply and the described microprocessor.
12. heater/cooler system as claimed in claim 7, wherein said first and second switches are power transistors.
13. heater/cooler system as claimed in claim 6, wherein said first and second temperature sensors are electro-hot regulators.
14. method of temperature that is used for controlling the chamber that the electrothermal module that comprises with heater/cooler system interrelates, described heater/cooler system also comprises: the fan of adjustable speed, described fan are arranged to the air that blows on the described electrothermal module and it are blown into described chamber; To described fan and to the power supply of described electrothermal module power supply; And microprocessor, described method comprises:
Provide a modular power signal from described power supply to described electrothermal module;
Provide a fan power signal to described fan;
Blow the air on the described electrothermal module and it blown into described chamber with described fan:
Detect the temperature of described electrothermal module;
Detect the temperature in the described chamber;
Regulate described modular power signal according to the temperature in the described chamber by described microprocessor; And
According to the temperature of described electrothermal module and flow through in the electric current of described electrothermal module at least one, regulate described fan power signal by described microprocessor.
15. method as claimed in claim 14 also comprises:
Import a cavity temperature of selecting to described microprocessor from input unit; And
Regulate described modular power signal and fan power signal according to selected cavity temperature.
16. method as claimed in claim 14, wherein said modular power signal and fan power signal are the power signals of pulse-width modulation.
17. method as claimed in claim 14 also is included in form of storage in the described microprocessor, comprising fan speed and the best current flow rate according to the best of measuring temperature in the described chamber.
18. method as claimed in claim 14 to such an extent as to comprise when the temperature of described electrothermal module is too cold can not obtain described chamber temperature required the time, reduces the temperatures warmed of the speed of described fan up to described module.
19. method as claimed in claim 14, to such an extent as to comprise that when the temperature of described electrothermal module is too warm can not obtain described chamber temperature required the time, the speed that slows down described fan cools off up to the temperature of described module.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37273402P | 2002-04-17 | 2002-04-17 | |
| US60/372,734 | 2002-04-17 | ||
| US10/280,036 | 2002-10-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1810063A CN1810063A (en) | 2006-07-26 |
| CN100539764C true CN100539764C (en) | 2009-09-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB038140330A Expired - Fee Related CN100539764C (en) | 2002-04-17 | 2003-04-17 | Temperature controlling method in heater/cooler system and the chamber thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100539764C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101545496B (en) * | 2008-03-26 | 2012-06-06 | 广东松下环境系统有限公司 | Method for controlling bathroom heating and ventilating fan |
| CN102123533A (en) * | 2010-12-30 | 2011-07-13 | 北京华进创威电子有限公司 | Method for protecting induction heating coil by using water temperature relay |
| CN103453688B (en) * | 2013-09-17 | 2015-09-30 | 北京鸿雁荣昌电子技术开发有限公司 | A kind of thermoelectric refrigerating/heatinsystem system |
| CN105716342B (en) * | 2014-12-01 | 2018-08-07 | 青岛海尔特种电冰柜有限公司 | The air-cooled cooling control method of semiconductor refrigerating equipment |
| AT516611B1 (en) * | 2015-06-23 | 2016-07-15 | Avl List Gmbh | Temperature control unit for a gaseous or liquid medium |
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2003
- 2003-04-17 CN CNB038140330A patent/CN100539764C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1810063A (en) | 2006-07-26 |
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