CN100539131C - Electronic element packaging structure - Google Patents
Electronic element packaging structure Download PDFInfo
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- CN100539131C CN100539131C CN 200710194721 CN200710194721A CN100539131C CN 100539131 C CN100539131 C CN 100539131C CN 200710194721 CN200710194721 CN 200710194721 CN 200710194721 A CN200710194721 A CN 200710194721A CN 100539131 C CN100539131 C CN 100539131C
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- substrate
- packaging structure
- adhesive body
- electronic element
- element packaging
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
The invention relates to a kind of electronic element packaging structure, at least comprise first substrate, electronic component, first adhesive body, second substrate, many connecting lines and second adhesive body, wherein first substrate comprises top surface at least and with respect to the basal surface of top surface, has a plurality of connection pads on the top surface.Electronic component is arranged on first substrate, and electrically connects so far a little connection pads.First adhesive body is arranged on first substrate, in order to coated electric components.Second substrate is arranged on first adhesive body, and wherein second substrate has center projections portion and surrounding edge portion.Connecting line is arranged in the surrounding edge portion, and is electrically connected to first substrate.Second adhesive body is arranged in first substrate and the surrounding edge portion, in order to coat above-mentioned connecting line, first adhesive body and surrounding edge portion.
Description
Technical field
The present invention relates to a kind of electronic element packaging structure, particularly relevant for a kind of electronic element packaging structure with substrate of center projections portion.
Background technology
Along with the progress of science and technology and consumer's expectation, impel consumption electronic products to develop towards compact direction continuously, cause each electronic component in the electronic product or spare part module also must cooperate with its size make littler, or towards the direction of three-dimension packaging structure go the development, with the demand on realistic.So there is a kind of stacking type system packaging structure to be developed now, be in order to more electronic component to be set in limited space.
Seeing also Fig. 1, is the generalized section of known stacking type system packaging structure.This stacking type system packaging structure comprises first substrate 100, second chip 110, passive device 112, first adhesive body 120, second substrate 130, many connecting lines 140, second adhesive body 150 and first chips 160 at least, wherein be that the basal surface 100b that is provided with a plurality of first connection pad, 102, the first substrates 100 is provided with a plurality of tin balls 104 on the top surface 100a of first substrate 100.Second chip 110 is arranged on the top surface 100a of first substrate 100 with passive device (passive component) 112, and electrically connects so far a little first connection pads 102 by connecting line 114 and conducting element 116 respectively.First adhesive body 120 is arranged on first substrate 100, and coats second chip 110 and passive device 112 fully.The second surface 130b of second substrate 130 is arranged on first adhesive body 120, and the first surface 130a of second substrate 130 is provided with a plurality of second connection pads 136.Connecting line 140 is arranged on second connection pad 136 on the first surface 130a of second substrate 130, and is electrically connected to first connection pad 102 on first substrate 100.Second adhesive body 150 is arranged on the first surface 130a of the top surface 100a of first substrate 100 and second substrate 130, in order to second connection pad 136 on the part first surface 130a that coats these a little connecting lines 140, first adhesive body 120 and second substrate 130.First chip 160 is arranged on the first surface 130a of second substrate 130 with passive device 112, and is electrically connected to second connection pad 136 by conductive projection 162.
In above-mentioned stacking type system packaging structure, because the structure of second adhesive body 150 must protrude from outside the first surface 130a of second substrate 130, could coat the connecting line 140 that electrically connects first substrate 100 and second substrate 130 fully, therefore in the manufacture procedure of adhesive of this stacking type system packaging structure, its employed dies with epoxy compound needs extra special design, could make second adhesive body 150 of moulding can coat connecting line 140 fully, so cause the cost of employed dies with epoxy compound in the manufacture procedure of adhesive to improve, and then cause the cost of manufacture procedure of adhesive to increase.
This shows that above-mentioned existing electronic element packaging structure obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that electronic element packaging structure exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.
Because the defective that above-mentioned existing electronic element packaging structure exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of electronic element packaging structure of new structure, can improve general existing electronic element packaging structure, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcome the defective that existing electronic element packaging structure exists, and a kind of electronic element packaging structure of new structure is provided, make it overcome the cost problem of higher of above-mentioned existing encapsulation procedure, reaching the purpose that reduces manufacturing cost, thereby be suitable for practicality more.
An aspect of of the present present invention is to provide a kind of electronic element packaging structure, by a substrate with center projections portion is provided, and connecting line is arranged in the surrounding edge portion of this substrate, and make adhesive material be coated in the surrounding edge portion of this substrate, so just can not need to change the design of dies with epoxy compound, so as to the problem of the cost increase that solves encapsulation procedure.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of electronic element packaging structure according to the present invention's proposition, at least comprise: one first substrate, wherein this first substrate comprises a top surface and with respect to a basal surface of this top surface, this second surface and this top surface face each other, and have a plurality of connection pads on this top surface at least; At least one first electronic component is arranged on this first substrate, and wherein this first electronic component is electrically connected to those connection pads; One first adhesive body is arranged on this first substrate, and coats this first electronic component; One second substrate, be arranged on this first adhesive body, wherein this second substrate comprises a first surface at least and with respect to a second surface of this first surface, has a center projections portion and a surrounding edge portion on this first surface, and the height of this center projections portion is greater than this surrounding edge portion; Many connecting lines are arranged in this surrounding edge portion of this second substrate, and are electrically connected to this first substrate; And one second adhesive body, be arranged in this surrounding edge portion of this first substrate and this second substrate, and coat this surrounding edge portion of above-mentioned connecting line, this first adhesive body and this second substrate.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid electronic element packaging structure also comprises at least: one second electronic component, be arranged in this center projections portion of this second substrate, and wherein this second electronic component is electrically connected to this center projections portion.
Aforesaid electronic element packaging structure, wherein the material of this first adhesive body is polyimides (Polyimide) or epoxy resin (Epoxy).
Aforesaid electronic element packaging structure, wherein local this top surface that covers this first substrate of this first adhesive body.
Aforesaid electronic element packaging structure, wherein this first adhesive body covers this second surface comprehensively.
Aforesaid electronic element packaging structure, wherein the area size of this second substrate is less than the area size of the top surface of this first substrate.
Aforesaid electronic element packaging structure, wherein above-mentioned connecting line is apart from the height of this top surface of this first substrate height less than this top surface of this first substrate of surface distance of this center projections portion of this second substrate.
Aforesaid electronic element packaging structure, wherein the material of this second adhesive body is polyimides or epoxy resin.
Aforesaid electronic element packaging structure, wherein the upper surface of this second adhesive body flushes with the first surface that is positioned at this center projections portion.
Aforesaid electronic element packaging structure, wherein this center projections portion more comprises at least one groove.
Aforesaid electronic element packaging structure also comprises an adhesive-layer and is located between this first adhesive body and this second substrate.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, major technique of the present invention thes contents are as follows:
According to a most preferred embodiment of the present invention, this electronic element packaging structure comprises first substrate, electronic component, first adhesive body, second substrate, many connecting lines and second adhesive body at least, wherein first substrate comprises top surface at least and with respect to the basal surface of top surface, has a plurality of connection pads on the top surface.Electronic component is arranged on first substrate, and wherein electronic component is electrically connected to above-mentioned connection pad.First adhesive body is arranged on first substrate, in order to coated electric components.Second substrate is arranged on first adhesive body, and wherein second substrate comprises first surface at least and with respect to the second surface of first surface, have a center projections portion and a surrounding edge portion on the first surface, and the height of center projections portion is greater than surrounding edge portion.Many connecting line is arranged in the surrounding edge portion, and is electrically connected to first substrate.Second adhesive body is arranged in first substrate and the surrounding edge portion, in order to coat above-mentioned connecting line, first adhesive body and surrounding edge portion.According to a preferred embodiment of the present invention, above-mentioned electronic component can for example be active member or passive device.
By technique scheme, electronic element packaging structure of the present invention has following advantage at least:
Use above-mentioned electronic element packaging structure, owing to provide a kind of top substrate layer with center projections portion, can be used to be provided with connecting line and adhesive material in the surrounding edge portion of this top substrate layer, so when carrying out manufacture procedure of adhesive, just do not need additionally to change the design of dies with epoxy compound, the problem that increases so as to the cost that solves encapsulation procedure.So the present invention compares with known packaging structure, the manufacture method of packaging structure of the present invention does not only need to change the design of dies with epoxy compound, more can significantly reduce the cost of manufacture procedure of adhesive.
In sum, the electronic element packaging structure of special construction of the present invention, it has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it all has bigger improvement on product structure or function, have large improvement technically, and produced handy and practical effect, and more existing electronic element packaging structure has the multinomial effect of enhancement, thereby be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the generalized section of known stacking type system packaging structure.
Fig. 2 is the generalized section of electronic element packaging structure according to a preferred embodiment of the present invention.
Fig. 3 is the generalized section of the electronic element packaging structure of another preferred embodiment according to the present invention.
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of electronic element packaging structure, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
See also Fig. 2, be the generalized section of according to a preferred embodiment of the present invention electronic element packaging structure.This electronic element packaging structure comprises first substrate 200, first electronic component (for example being active member 210 and passive device 212), first adhesive body 220, second substrate 230, many connecting lines 240, second adhesive body 250 and second electronic components (for example being memory body chip 260 and passive device 212) at least, wherein first substrate 200 comprises top surface 200a and at least with respect to the basal surface 200b of top surface 200a, top surface 200a is provided with a plurality of first connection pads 202, and basal surface 200b is provided with a plurality of tin balls 204.First electronic component is arranged on the top surface 200a of first substrate 200, and is electrically connected to first connection pad 202.In the present embodiment, this active member 210 is the Application Specific Integrated Circuit chip, and this passive device 212 is electric capacity and resistance, and is electrically connected to first connection pad 202 by connecting line 214 and tin ball 216 respectively, so be not limited thereto, other electronic component also can use.First adhesive body 220 is arranged on the top surface 200a of first substrate 200, in order to coat active member 210 and passive device 212.In addition, the local top surface 200a that cover first substrates 200 of first adhesive body 220, and comprehensive the second surface 230b that covers.In the present embodiment, the material of this first adhesive body 220 is polyimides (Polyimide) or epoxy resin (Epoxy), so is not limited thereto, and other encapsulating material also can use.In addition, the area size of this first adhesive body 220 is less than the area size of top surface 200a.Second substrate 230 is arranged on first adhesive body 220, set-up mode for example is provided with an adhesive-layer (not shown) between first adhesive body 220 and second substrate 230, wherein second substrate 230 comprises first surface 230a and at least with respect to the second surface 230b of first surface 230a, and from Fig. 2, this second surface 230b and this top surface 200a face each other, have a center projections portion 232 and a surrounding edge portion 234 on the first surface 230a, the height of this center projections portion 232 is greater than this surrounding edge portion 234, and is respectively equipped with second connection pad 236 in center projections portion 232 and the surrounding edge portion 234.In the present embodiment, because the area size of second substrate 230 equals the area size of first adhesive body 220, so the area size of second substrate 230 is less than the area size of first substrate 200.Many connecting line 240 is arranged on second connection pad 236 of surrounding edge portion 234, and is electrically connected to first connection pad 202 of first substrate 200.In the present embodiment, these a little connecting lines are gold thread, so are not limited thereto, and the connecting line of other materials also can use.What deserves to be mentioned is that the height of the top surface 200a of these a little connecting line 240 distances first substrates 200 is less than the height of the top surface 200a of first surface 230a distance first substrate 200 of the center projections portion 232 of second substrate 230.Second adhesive body 250 is arranged in the surrounding edge portion 234 of the top surface 200a of first substrate 200 and second substrate 230, in order to coat these a little connecting lines 240, first adhesive body 220 and surrounding edge portion 234.In the present embodiment, center projections portion 232 coplines of the upper surface 250a of this second adhesive body 250 and second substrate 230, promptly the upper surface 250a of second adhesive body 250 flushes with the first surface 230a that is positioned at center projections portion 232.In addition, the material of this second adhesive body 250 is polyimides or epoxy resin, so is not limited thereto, and other encapsulating material also can use.Second electronic component is arranged in the center projections portion 232 of second substrate 230, and is electrically connected to center projections portion 232.In the present embodiment, this second electronic component is chip 260 and passive device 212, and is electrically connected to second connection pad 236 in the center projections portion 232 by tin ball 262, so is not limited thereto, and other electronic component also can use.
See also Fig. 3, illustrate generalized section according to the electronic element packaging structure of another preferred embodiment of the present invention.The difference of the electronic element packaging structure of this electronic element packaging structure and Fig. 2, only be that center projections portion 232 is provided with at least one groove 270, this groove 270 is in order to prevent when forming second adhesive body 250, adhesive material may be via the slit (not illustrating) between the center projections portion 232 of the mould (not illustrating) and second substrate 230, infiltration flows on the first surface 230a of center projections portion 232 of second substrate 230, and the adhesive material that institute may cause covers the situation generation of second connection pad 236.
In brief, electronic element packaging structure of the present invention, it is characterized in that providing a kind of top substrate layer with center projections portion, and utilize the surrounding edge portion of top substrate layer that connecting line and adhesive material are set, so when carrying out manufacture procedure of adhesive, just do not need additionally to change the design of dies with epoxy compound, the problem that increases so as to the cost that solves encapsulation procedure.So the present invention compares with existing packaging structure, the manufacture method of packaging structure of the present invention does not only need to change the design of dies with epoxy compound, more can significantly reduce the cost of manufacture procedure of adhesive.
By the preferred embodiment of the invention described above as can be known, use electronic element packaging structure of the present invention, its advantage is equally to be to use existing manufacturing method thereof to make, only be by utilizing a kind of substrate to replace existing substrate, can producing electronic element packaging structure of the present invention with center projections portion.Thus, encapsulating structure of the present invention does not only need to change the encapsulation procedure of existing encapsulating structure, more can reduce the manufacturing cost of encapsulation procedure.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (11)
1, a kind of electronic element packaging structure is characterized in that comprising at least:
One first substrate, wherein this first substrate comprises a top surface at least and with respect to a basal surface of this top surface, has a plurality of connection pads on this top surface;
At least one first electronic component is arranged on this first substrate, and wherein this first electronic component is electrically connected to those connection pads;
One first adhesive body is arranged on this first substrate, and coats this first electronic component;
One second substrate, be arranged on this first adhesive body, wherein this second substrate comprises a first surface and at least with respect to a second surface of this first surface, this second surface and this top surface face each other, have a center projections portion and a surrounding edge portion on this first surface, the height of this center projections portion is greater than this surrounding edge portion;
Many connecting lines are arranged in this surrounding edge portion of this second substrate, and are electrically connected to this first substrate; And
One second adhesive body is arranged in this surrounding edge portion of this first substrate and this second substrate, and coats this surrounding edge portion of described connecting line, this first adhesive body and this second substrate.
2, electronic element packaging structure as claimed in claim 1 is characterized in that also comprising at least:
One second electronic component is arranged in this center projections portion of this second substrate, and wherein this second electronic component is electrically connected to this center projections portion.
3, electronic element packaging structure as claimed in claim 1, the material that it is characterized in that this first adhesive body is polyimides or epoxy resin.
4, electronic element packaging structure as claimed in claim 1 is characterized in that local this top surface that covers this first substrate of this first adhesive body.
5, electronic element packaging structure as claimed in claim 1 is characterized in that this first adhesive body covers this second surface comprehensively.
6, electronic element packaging structure as claimed in claim 1 is characterized in that the area size of the area size of this second substrate less than the top surface of this first substrate.
7, electronic element packaging structure as claimed in claim 1 is characterized in that described connecting line is apart from the height of this top surface of this first substrate height less than this top surface of this first substrate of surface distance of this center projections portion of this second substrate.
8, electronic element packaging structure as claimed in claim 1, the material that it is characterized in that this second adhesive body is polyimides or epoxy resin.
9, electronic element packaging structure as claimed in claim 1 is characterized in that the upper surface of this second adhesive body flushes with the first surface that is positioned at this center projections portion.
10, electronic element packaging structure as claimed in claim 1 is characterized in that this center projections portion more comprises at least one groove.
11, electronic element packaging structure as claimed in claim 1 is characterized in that also comprising an adhesive-layer and is located between this first adhesive body and this second substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710194721 CN100539131C (en) | 2007-11-29 | 2007-11-29 | Electronic element packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710194721 CN100539131C (en) | 2007-11-29 | 2007-11-29 | Electronic element packaging structure |
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| CN101179069A CN101179069A (en) | 2008-05-14 |
| CN100539131C true CN100539131C (en) | 2009-09-09 |
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| CN 200710194721 Active CN100539131C (en) | 2007-11-29 | 2007-11-29 | Electronic element packaging structure |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2882396B2 (en) * | 1997-03-24 | 1999-04-12 | 日本電気株式会社 | Semiconductor device |
| CN2470959Y (en) * | 2001-02-26 | 2002-01-09 | 胜开科技股份有限公司 | Piling type image detector |
| CN2524375Y (en) * | 2001-11-27 | 2002-12-04 | 胜开科技股份有限公司 | Spherical grid array metal ball integrated circuit package assembly |
| CN2603517Y (en) * | 2002-12-27 | 2004-02-11 | 胜开科技股份有限公司 | Semiconductor chip stacking structure |
| CN2613047Y (en) * | 2003-03-11 | 2004-04-21 | 胜开科技股份有限公司 | Stacking packaging assembly for integrated circuit |
| CN101026144A (en) * | 2006-02-24 | 2007-08-29 | 日月光半导体制造股份有限公司 | Radiating type stereo package structure and its manufacturing method |
| CN101075596A (en) * | 2007-05-25 | 2007-11-21 | 日月光半导体制造股份有限公司 | Piled semiconductor packing structure and its production |
-
2007
- 2007-11-29 CN CN 200710194721 patent/CN100539131C/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2882396B2 (en) * | 1997-03-24 | 1999-04-12 | 日本電気株式会社 | Semiconductor device |
| CN2470959Y (en) * | 2001-02-26 | 2002-01-09 | 胜开科技股份有限公司 | Piling type image detector |
| CN2524375Y (en) * | 2001-11-27 | 2002-12-04 | 胜开科技股份有限公司 | Spherical grid array metal ball integrated circuit package assembly |
| CN2603517Y (en) * | 2002-12-27 | 2004-02-11 | 胜开科技股份有限公司 | Semiconductor chip stacking structure |
| CN2613047Y (en) * | 2003-03-11 | 2004-04-21 | 胜开科技股份有限公司 | Stacking packaging assembly for integrated circuit |
| CN101026144A (en) * | 2006-02-24 | 2007-08-29 | 日月光半导体制造股份有限公司 | Radiating type stereo package structure and its manufacturing method |
| CN101075596A (en) * | 2007-05-25 | 2007-11-21 | 日月光半导体制造股份有限公司 | Piled semiconductor packing structure and its production |
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| CN101179069A (en) | 2008-05-14 |
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