CN100536039C

CN100536039C - Method for preparing radial glass packaged thermosensitive resistor

Info

Publication number: CN100536039C
Application number: CNB2006100358873A
Authority: CN
Inventors: 张竞峰
Original assignee: GUANGZHOU PANYU DATONG ELECTRONICS CO Ltd
Current assignee: GUANGZHOU PANYU DATONG ELECTRONICS CO Ltd
Priority date: 2006-06-07
Filing date: 2006-06-07
Publication date: 2009-09-02
Anticipated expiration: 2026-06-07
Also published as: CN1921031A

Abstract

The invention relates to a production of thermal-sensitive resistance packed by radial glass. Wherein, it positions the glass tube with clamper; the chip is inside the glass frame; the clamper positions the copper-coated iron and nickel alloy wire; it uses clamper to sheath the copper-coated iron and nickel alloy wire into glass frame; makes the silver layer of chip parallel with copper-coated iron and nickel alloy wire, between two copper-coated iron and nickel alloy wires to be pushed; the silver layer of chip, the silver layer of copper-coated iron and nickel alloy wire and the glass frame contact each other, via high-temperature packed, to be radial glass packed product, the invention uses chemical device to correct copper-coated iron and nickel alloy wire, plate silver layer, sheath glass frame, and mount the glass frame, with simple operation, high efficiency, and high yield.

Description

Method for preparing radial glass packaged thermosensitive resistor

Technical field

Method for preparing radial glass packaged thermosensitive resistor of the present invention belongs to the thermistor field.

Background technology

Radial glass packaged thermosensitive resistor is mainly used in the temperature control and the temperature detection of household electrical appliance, the temperature monitoring of business automation equipment and temperature-compensating, the temperature control and the check of industry, medical treatment, food processing equipment, liquid level indication and flow measurement, aspects such as battery of mobile phone.At present the domestic production radial glass packaged thermosensitive resistor mostly is manual operations, and production efficiency is low, and quality fluctuation is big, and consistency is relatively poor, and qualification rate is low, and the main cause that is difficult to enter large-scale production is limited by the cooperation assembling of Dumet wire-glass shell-chip.

Summary of the invention

The cooperation packaging technology that the objective of the invention is to avoid weak point of the prior art and a kind of Dumet wire, glass shell, chip are provided is finished the assembling of radial glass packaged thermosensitive resistor.

The objective of the invention is to reach by following measure, Dumet wire is carried out alignment, determine length, wherein one of Dumet wire, print the silver slurry, behind sintering, form the favorable conductive layer, frock clamp is finished the location of glass tube, chip is placed in the glass shell, and frock clamp positions Dumet wire, utilizes frock clamp that Dumet wire is packed into glass shell, the silver layer of chip is parallel with Dumet wire, along advancing to glass shell between two Dumet wire, closely contact between chip silver layer and Dumet wire silver layer and the glass shell, after finishing, through the high temperature encapsulation, obtain radially glass packaging finished product.Finish the assembling of Dumet wire-glass shell-chip.

The technological process of radial glass packaged thermosensitive resistor of the present invention is as follows:

---------the assembling of Dumet wire, the glass shell---assembling of chip---high temperature encapsulation---product inspection of anchor clamps on anchor clamps, the glass shell on the Dumet wire of silver layer and curing on the Dumet wire of Dumet wire sizing alignment cutting.

The present invention adopts mechanized equipment to finish the alignment of Dumet wire, go up silver layer, packs into glass shell, and the assembling of finishing glass shell, and is easy to operate, the production efficiency height, and quality is good, consistency height, qualification rate height.

Description of drawings

Accompanying drawing 1 is for printing the Dumet wire after silver is starched.

Accompanying drawing 2 is the encapsulation lower clamping fixture.

Accompanying drawing 3 is the part of encapsulation upper clamping fixture schematic diagram.

Accompanying drawing 4 is encapsulation upper clamping fixture schematic diagram.

Accompanying drawing 5 is accompanying drawing 4 side schematic views.

Accompanying drawing 6 is encapsulation lower clamping fixture schematic diagram.

Accompanying drawing 7 is the upper and lower mould assembling of encapsulation anchor clamps schematic diagram.

Accompanying drawing 8 is the upper and lower mould assembling of encapsulation anchor clamps schematic diagram.

Accompanying drawing 9 is chip assembling schematic diagram.

Embodiment

The invention will be further described below in conjunction with accompanying drawing embodiment.

As shown in Figure 1, the Dumet wire 1 after the alignment, the silver layer 2 of Dumet wire, choosing Dumet wire is ф 0.15-ф 0.5mm, adopts automatic aligning fixed length cutting apparatus, and Dumet wire is carried out alignment, determines length, wherein one of Dumet wire, print the silver slurry, behind sintering, form the favorable conductive layer.Earlier Dumet wire is fixed on the stationary fixture, stays the certain-length on the left side.Move to stationary fixture with mobile anchor clamps, and clamp Dumet wire, unclamp stationary fixture then.Mobile anchor clamps return, and add certain power diametrically, and at this moment stationary fixture clamps.Set the position of cutter, cut off Dumet wire.Mobile anchor clamps unclamp.Repetition can obtain the Dumet wire of equal length.

Dumet wire is come on the mould, clamp with offset plate.The end that Dumet wire is exposed is put certain thickness silver slurry into vertically downward, allows Dumet wire one end print and goes up the silver slurry.

After oven dry in 80 ~ 120 ℃/8 ~ 15 minutes, die flip is kept flat for 90 °.Take off offset plate.Together with the burning infiltration of mould through 600 ℃ ~ 800 ℃.Allow the silver slurry be closely linked with Dumet wire.

As shown in Figure 2, glass shell is assemblied on the frock clamp, glass tube 4 external forms are ф 0.6-0.9mm * L1.2-2.0mm, and glass tube is placed in the frock clamp counterdie 3, finish the location of glass tube at the frock clamp counterdie.

Chip adopts domestic raw materials synthetic with solid phase method, obtains through batch mixing, pre-burning, ball milling, moulding, sintering, cutting, Yin Yin, scribing.Size range is H 0.25-0.35mm, and L * W is 0.4-0.6mm.

As shown in Figure 3, anchor clamps on the Dumet wire are placed on the Dumet wire 1 that produces silver slurry 2 in the upper clamping fixture 5, and frock clamp is clamped Dumet wire.

Shown in accompanying drawing 4, accompanying drawing 5, accompanying drawing 6, accompanying drawing 7, frock clamp patrix 5 and frock clamp counterdie 3 are formed, and at frock clamp patrix two ends groove 12 are arranged, and die tip has groove 13 on frock clamp, and top groove 13 is dovetail grooves.The frock clamp patrix is contained on the guide rail by the top groove.The fixed strip 14 of fixed position is put in the groove at mould two up and down.Edge direction vertically upward promotes counterdie then.

Shown in accompanying drawing 8, accompanying drawing 9, the assembling of Dumet wire 1, glass shell 4, utilize frock clamp patrix 3 silver layer of chip 6 is parallel with Dumet wire 1,, make closely to contact between chip silver layer and Dumet wire silver layer 2 and the glass shell along advancing to glass shell 4 between two Dumet wire with counterdie 5.Finish the assembling of Dumet wire, chip and glass shell.

After finishing,, temperature 600-800 ℃, obtain radially glass packaging finished product through the high temperature encapsulation.

Claims

1, a kind of method for preparing radial glass packaged thermosensitive resistor, Dumet wire is carried out alignment, determine length, wherein one of Dumet wire, print the silver slurry, behind sintering, form the favorable conductive layer, Dumet wire, the assembling of glass shell, the assembling of chip, through the high temperature encapsulation, obtain radially glass packaging finished product, it is characterized in that frock clamp finishes the location of glass tube, chip is placed in the glass shell, frock clamp positions Dumet wire, the silver layer of chip is parallel with Dumet wire, and along advancing to glass shell between two Dumet wire, frock clamp packs into glass shell with Dumet wire, closely contact between chip silver layer and Dumet wire silver layer and the glass shell, finish the assembling of Dumet wire-glass shell-chip.

2, method for preparing radial glass packaged thermosensitive resistor according to claim 1, it is characterized in that glass shell is assemblied on the frock clamp, glass tube is placed in the frock clamp counterdie, and the Dumet wire that produces the silver slurry is placed in the upper clamping fixture, and frock clamp is clamped Dumet wire.

3, method for preparing radial glass packaged thermosensitive resistor according to claim 1, it is characterized in that frock clamp patrix and frock clamp counterdie composition, at frock clamp patrix two ends groove is arranged, die tip has groove on frock clamp, and fixed strip is put in the groove of both mold ends up and down.