CN108264359B - Ceramic heating element and preparation method thereof - Google Patents

Ceramic heating element and preparation method thereof Download PDF

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CN108264359B
CN108264359B CN201810079057.3A CN201810079057A CN108264359B CN 108264359 B CN108264359 B CN 108264359B CN 201810079057 A CN201810079057 A CN 201810079057A CN 108264359 B CN108264359 B CN 108264359B
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heating element
ceramic
ceramic heating
green body
powder
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CN108264359A (en
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王明明
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Shenzhen rijinda Technology Development Co.,Ltd.
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Dongguan Jinde New Material Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00—Producing shaped prefabricated articles from the material
    • B28B1/24—Producing shaped prefabricated articles from the material by injection moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B19/00—Machines or methods for applying the material to surfaces to form a permanent layer thereon
    • B28B19/0015—Machines or methods for applying the material to surfaces to form a permanent layer thereon on multilayered articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Composite Materials (AREA)
  • Resistance Heating (AREA)

Abstract

The present invention relates to a kind of ceramic heating elements and preparation method thereof.The preparation method of the ceramic heating element includes the following steps: for ceramic feeding to be injection moulded, obtain the first green body layer, according to weight, ceramic feeding include: 80%~90% ceramic powder, 5%~20% thermoplastic resin and 0~15% paraffin；Form circuit layer in the first green body layer using electrocondution slurry, according to weight, electrocondution slurry include 50%~90% conducting powder, 5%~40% glass powder and 5%~20% adhesive；Ceramic feeding is injected in the first green body layer for be formed with circuit layer to form the second green body layer, the second green body layer covers circuit layer, obtains laminates；Laminates are sintered in the atmosphere of protective gas, obtain ceramic heating element.Above-mentioned preparation method can be prepared that mechanical strength is preferable and the longer ceramic heating element of service life.

Description

Ceramic heating element and preparation method thereof
Technical field
The present invention relates to ceramic material fields, more particularly to a kind of ceramic heating element and preparation method thereof.
Background technique
Currently, the preparation of ceramic heating element is usually to first pass through tape casting to prepare flakiness, the then silk-screen on thin slice Circuit, then it is complex sintered with ceramic body, thin slice is easy to crack this method during the sintering process, the bad mechanical strength of product, and Adhesive property between layers is poor, influences the service life of ceramic heating element.
Summary of the invention
Based on this, it is necessary to which providing one kind can be prepared that mechanical strength is preferable and the longer ceramic heating of service life The preparation method of body.
In addition, also providing a kind of ceramic body heater.
A kind of preparation method of ceramic heating element, includes the following steps:
Ceramic feeding is injection moulded, the first green body layer is obtained, wherein according to weight, the ceramics are fed Material include: 80%~90% ceramic powder, 5%~20% thermoplastic resin and 0~15% paraffin；
Circuit layer is formed in first green body layer using electrocondution slurry, wherein described according to weight Electrocondution slurry include 50%~90% conducting powder, 5%~40% glass powder and 5%~20% adhesive；
The ceramic feeding is injected in first green body layer for being formed with the circuit layer to form the second green body layer, And second green body layer covers the circuit layer, obtains laminates；And
The laminates are sintered in the atmosphere of protective gas, obtain ceramic heating element.
The preparation method of above-mentioned ceramic heating element by using above-mentioned formula identical with the first green body layer ceramic feeding Injection moulding forms the second green body layer in the first green body layer for be formed with circuit layer, then obtained laminates are sintered, So that it is unified to shrink the firing of the first green body layer and the second green body layer, problem of Cracking is less likely to occur in sintering process, and First green body layer and the second green body layer can be sintered together well, and be contained in the electrocondution slurry that circuit layer uses above-mentioned The adhesive of content be bonded in circuit layer can well in the first green body layer before sintering, the above-mentioned content contained Glass powder can be such that circuit layer and the first green body layer, the second green body layer is sintered together well, so that between layers viscous Better performances are tied, the service life for increasing ceramic heating element is conducive to；Pottery that is above-mentioned and using above-mentioned formula in electrocondution slurry Porcelain feeding can obtain first green body layer and second green body layer of the density 60% or more by injection molding method, after sintering Density reaches 99%, further increases the mechanical strength of ceramic heating element.
In one of the embodiments, the thermoplastic resin in polyethylene, polypropylene and polystyrene at least It is a kind of.
In one of the embodiments, in the ceramic feeding, the weight percentage of the thermoplastic resin is 5% ~15%, the weight percentage of the paraffin is 5%~15%.
The conducting powder is tungsten powder in one of the embodiments,.
In one of the embodiments, before described the step of being sintered the laminates in the atmosphere of protective gas, Further include the steps that by the laminates temperature be 500 DEG C~1000 DEG C at carry out vacuum degreasing.
In one of the embodiments, in described the step of being sintered the laminates in the atmosphere of protective gas, burn Junction temperature is 1400 DEG C~1600 DEG C.
The protective gas is selected from least one of nitrogen and hydrogen in one of the embodiments,.
The ceramic powder is selected from one of alumina powder and zirconia powder in one of the embodiments,.
The glass powder is selected from Na in one of the embodiments,2O·CaO·6SiO2Glass powder, Na2O·CaO· 5SiO2Glass powder and Na2O·2CaO·6SiO2One of glass powder.
The ceramic heating element that the preparation method of above-mentioned ceramic heating element is prepared.
Detailed description of the invention
Fig. 1 is the flow chart of the preparation method of the ceramic heating element of an embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating It is thorough comprehensive.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases Any and all combinations of the listed item of pass.
As shown in Figure 1, the preparation method of the ceramic heating element of an embodiment, can be used in the ceramic heating for preparing plate Body can also prepare tubular ceramic heater.The ceramic heating element includes the following steps:
Step S110: ceramic feeding is injection moulded, and obtains the first green body layer.
Wherein, according to weight, ceramic feeding include: 80%~90% ceramic powder, 5%~20% Thermoplastic resin and 0~15% paraffin.
In a certain range, the content of ceramic powder is higher, and the consistency of ceramic heating element is higher, but works as ceramic powder Content it is excessive when, the consistency of ceramic heating element is declined, this may be because ceramic powder content it is excessive, cause to make pottery The mobility of porcelain feeding is deteriorated, and ceramic difficult forming is easy to cause layering, and blank strength is poor.Specifically, ceramic powder is selected from oxygen Change one of aluminium powder and zirconia powder.
The mobility of the too high levels of thermoplastic resin, ceramic feeding is poor, and difficult forming easily causes green body to be layered, base Body intensity is poor, too low to will affect green body dumping, is layered green body.Thermoplastic resin can by thermal softening, hardening by cooling, To realize injection moulding.Specifically, thermoplastic resin is selected from least one of polyethylene, polypropylene and polystyrene.
Paraffin can play the role of dissolving thermoplastic resin, and play certain lubricating action, be conducive to improve green body Processability.The additive amount of paraffin is too low, and the mobility of ceramic feeding is poor, and difficult forming be easy to cause heater to be layered, Blank strength is poor, excessively high to will affect green body dumping, is layered green body.
Further, in ceramic feeding, the weight percentage of thermoplastic resin is 5%~15%, the weight of paraffin Percentage composition is 5%~15%.
Step S120: circuit layer is formed in the first green body layer using electrocondution slurry.
Specifically, step S110 is carried out under conditions of 170 DEG C~190 DEG C.
Wherein, according to weight, electrocondution slurry includes 50%~90% conducting powder, 5%~40% glass Glass powder and 5%~20% adhesive.
Specifically, conducting powder is tungsten powder, and tungsten powder can guarantee not to be melted at a higher temperature.
It should be noted that conducting powder is not limited to tungsten powder, such as conducting powder can also be silver powder, however since silver powder exists It can melt under high temperature, therefore, if using silver powder as conducting powder, need using the lower ceramic powder of sintering temperature.
Glass powder is as high-temperature agglomerant.It is polar material due to conducting powder, especially tungsten powder, is difficult and ceramics are burnt First green body layer, circuit layer and the second green body layer together, and by the way that glass powder is added, are bonded in one in order to subsequent by knot It rises.Glass powder is further no sodium glass powder, the sodium in glass will affect the machine of product for low sodium glass powder or without sodium glass powder The fewer tool intensity, therefore, the sodium in glass powder the better.Specifically, glass powder is selected from Na2O·CaO·6SiO2Glass powder, Na2O·CaO·5SiO2Glass powder and Na2O·2CaO·6SiO2One of glass powder.
Adhesive is organic binder, and adhesive is as room temperature binder, so that circuit layer can be bonded in front of sintering In first green body layer.Specifically, binder is selected from one of epoxy resin and phenolic resin.
Specifically, the method for forming circuit layer in the first green body layer using electrocondution slurry is silk-screen printing.
Step S130: injecting ceramic feeding in the first green body layer for be formed with circuit layer to form the second green body layer, and Second green body layer covers circuit layer, obtains laminates.
The ceramic feeding of step S130 and the ceramic feeding of step S110 are identical.It is prepared by using identical ceramic feeding At the first green body layer and the second green body layer, in order to can preferably be bonded after subsequent first green body layer and the sintering of the second green body layer Together.Specifically, step S130 is carried out under conditions of 170 DEG C~190 DEG C.
Specifically, the second green body layer with a thickness of 0.5 millimeter~2 millimeters.
Specifically, if required ceramic heating element to be prepared is tubulose, the first green body layer is tubular body, uses conductive paste Material forms circuit layer on the outer surface of the first green body layer, and the second green body layer also is located on the outer surface of the first green body layer.
Step S140: vacuum degreasing is carried out at being 500 DEG C~1000 DEG C in temperature by laminates.
By vacuum degreasing with removal laminates in organic matter, to avoid organic matter presence and influence laminates While being sintered the performance of obtained product, circuit layer is avoided to be oxidized at high temperature.
Specifically, vacuum degree 10-3MPa~10-2MPa。
It should be noted that the purpose for passing through vacuum degreasing is the organic matter removed in laminates, which can also be saved Slightly.
Step S150: laminates are sintered in the atmosphere of protective gas, obtain ceramic heating element.
By being sintered under conditions of protective gas to laminates, while to guarantee laminates sintering, electricity is avoided Road floor is oxidized at high temperature.
Specifically, in the step of laminates being sintered, sintering temperature is 1400 DEG C~1600 DEG C.
Specifically, protective gas is selected from least one of nitrogen and hydrogen.Further, protective gas is nitrogen and hydrogen The gaseous mixture of gas.
The preparation method of above-mentioned ceramic heating element at least has the advantages that
(1) preparation method of above-mentioned ceramic heating element is fed by using the ceramics of above-mentioned formula identical with the first green body layer Material injection moulding in the first green body layer for be formed with circuit layer forms the second green body layer, then obtained laminates are burnt Problem of Cracking is less likely to occur in sintering process so that it is unified to shrink the firing of the first green body layer and the second green body layer for knot, And first green body layer and the second green body layer can be sintered together well, and contain in the electrocondution slurry that circuit layer uses upper The adhesive for stating content be bonded in circuit layer can well in the first green body layer before sintering, the above-mentioned content contained Glass powder so that the circuit layer and the first green body layer, the second green body layer is sintered together well so that between layers Adhesive property is preferable, is conducive to the service life for increasing ceramic heating element；It is above-mentioned and the above-mentioned formula of use in electrocondution slurry Ceramic feeding can obtain first green body layer and second green body layer of the density 60% or more by injection molding method, sintering Density is up to 99% afterwards, further increases the mechanical strength of ceramic heating element.
(2) it simultaneously as forming the first green body layer and the second green body layer using identical ceramic feeding, shrinks more Unanimously, production efficiency is also advantageously improved.
(3) and the preparation method of above-mentioned ceramic heating element only needs once sintered, is conducive to energy saving, improves production effect Rate.
(4) compound without suppressing (waiting static pressure etc.) using the preparation method of above-mentioned ceramic heating element, directly by infusing twice It penetrates and is just capable of forming stepped construction, be particularly suitable for the preparation of the ceramic heating element of tubulose or irregular structure；Simultaneously as above-mentioned The preparation method of ceramic heating element is compound without suppressing, it is therefore not necessary to which press device, reduces be produced into a certain extent This.
The ceramic heating element of one embodiment is prepared by the preparation method of above-mentioned ceramic heating element.The ceramic heating The ceramic segment of body consistency with higher, and there is preferable intensity, there is longer service life.
The following are specific embodiment parts (following embodiment by taking aluminium oxide ceramics as an example, and such as without spy in following embodiment Different explanation, then without containing other components not yet explicitly pointed out in addition to inevitable impurity.):
Embodiment 1
The preparation process of the ceramic heating element of the present embodiment is as follows:
(1) under conditions of 180 DEG C, ceramic feeding is injection moulded, obtains the first green body layer.Wherein, according to weight hundred Point content meter, ceramic feeding include: 85% ceramic powder, 8% thermoplastic resin and 7% paraffin, ceramic powder is oxygen Change aluminium powder, thermoplastic resin is polyethylene.
(2) using electrocondution slurry, silk-screen printing forms circuit layer in the first green body layer.Wherein, according to weight percentage Meter, electrocondution slurry includes 70% conducting powder, 15% Na2O·CaO·6SiO2Glass powder and 15% epoxy resin.
(3) under conditions of 180 DEG C, the identical ceramics of injecting step (1) in the first green body layer for be formed with circuit layer Feeding is to form the second green body layer with a thickness of 1.5 millimeters, and the second green body layer covers circuit layer, obtains laminates.
(4) by laminates temperature be 800 DEG C, vacuum degree 10-3Vacuum degreasing 1 hour under conditions of MPa.
(5) then laminates are sintered 2 hours at 1500 DEG C, obtain ceramic heating element in the atmosphere of protective gas, Protective gas is the gaseous mixture of the nitrogen that volume ratio is 1:3 and hydrogen.
The ceramic heating element of the present embodiment is tested using Archimedes drainage according to density measurement standard GB4472-84 Consistency；The present embodiment is tested using three-point bending resistance method according to ceramic material anti-reflecting bending strength test method GB/T 4741-1999 Ceramic heating element mechanical strength；GB4706.1 is required to let out using detection according to the safety general of household and similar applications electric appliance Dew current methods test leakage current of the ceramic heating element of the present embodiment in heated condition to reflect the adhesive property of each layer, If leakage current is smaller, the adhesive property of each layer is preferable.The consistency of the ceramic heating element of the present embodiment, mechanical strength and add Leakage current when Warm status is shown in Table 1.
Embodiment 2
The preparation process of the ceramic heating element of the present embodiment is similar with the preparation process of the ceramic heating element of embodiment 1, area It is not, the composition of ceramic feeding is different, and the ceramic feeding of the present embodiment includes: 80% ceramic powder, 5% thermoplastics type tree Rouge and 15% paraffin.
Consistency, mechanical strength and the heating of the ceramic heating element of the present embodiment are obtained using the identical method of embodiment 1 Leakage current when state is shown in Table 1.
Embodiment 3
The preparation process of the ceramic heating element of the present embodiment is similar with the preparation process of the ceramic heating element of embodiment 1, area It is not, the composition of ceramic feeding is different, and the ceramic feeding of the present embodiment includes: 80% ceramic powder, 15% thermoplastics type Resin and 5% paraffin.
Consistency, mechanical strength and the heating of the ceramic heating element of the present embodiment are obtained using the identical method of embodiment 1 Leakage current when state is shown in Table 1.
Embodiment 4
The preparation process of the ceramic heating element of the present embodiment is similar with the preparation process of the ceramic heating element of embodiment 1, area It is not, the composition of ceramic feeding is different, and the ceramic feeding of the present embodiment includes: 80% ceramic powder, 10% thermoplastics type Resin and 10% paraffin.
Consistency, mechanical strength and the heating of the ceramic heating element of the present embodiment are obtained using the identical method of embodiment 1 Leakage current when state is shown in Table 1.
Embodiment 5
The preparation process of the ceramic heating element of the present embodiment is similar with the preparation process of the ceramic heating element of embodiment 1, area It is not, the composition of ceramic feeding is different, and the ceramic feeding of the present embodiment includes: 88% ceramic powder, 7% thermoplastics type tree Rouge and 5% paraffin.
Consistency, mechanical strength and the heating of the ceramic heating element of the present embodiment are obtained using the identical method of embodiment 1 Leakage current when state is shown in Table 1.
Embodiment 6
The preparation process of the ceramic heating element of the present embodiment is similar with the preparation process of the ceramic heating element of embodiment 1, area It is not, the composition of ceramic feeding is different, and the ceramic feeding of the present embodiment includes: 90% ceramic powder, 5% thermoplastics type tree Rouge and 5% paraffin.
Consistency, mechanical strength and the heating of the ceramic heating element of the present embodiment are obtained using the identical method of embodiment 1 Leakage current when state is shown in Table 1.
Embodiment 7
The preparation process of the ceramic heating element of the present embodiment is as follows:
(1) under conditions of 190 DEG C, ceramic feeding is injection moulded, obtains the first green body layer.Wherein, according to weight hundred Point content meter, ceramic feeding include: 82% ceramic powder, 10% thermoplastic resin and 8% paraffin, ceramic powder is oxygen Change aluminium powder, thermoplastic resin is polypropylene.
(2) using electrocondution slurry, silk-screen printing forms circuit layer in the first green body layer.Wherein, according to weight percentage Meter, electrocondution slurry includes 50% conducting powder, 40% Na2O·CaO·5SiO2Glass powder and 10% phenolic resin.
(3) under conditions of 190 DEG C, the identical ceramics of injecting step (1) in the first green body layer for be formed with circuit layer Feeding is to form the second green body layer with a thickness of 0.5 millimeter, and the second green body layer covers circuit layer, obtains laminates.
(4) by laminates temperature be 500 DEG C, vacuum degree 10-2Vacuum degreasing 1 hour under conditions of MPa.
(5) then laminates are sintered 2 hours at 1400 DEG C, obtain ceramic heating element in the atmosphere of protective gas, Protective gas is the gaseous mixture of the nitrogen that volume ratio is 1:3 and hydrogen.
Consistency, mechanical strength and the heating of the ceramic heating element of the present embodiment are obtained using the identical method of embodiment 1 Leakage current when state is shown in Table 1.
Embodiment 8
The preparation process of the ceramic heating element of the present embodiment is as follows:
(1) under conditions of 170 DEG C, ceramic feeding is injection moulded, obtains the first green body layer.Wherein, according to weight hundred Point content meter, ceramic feeding include: 85% ceramic powder, 8% thermoplastic resin and 7% paraffin, ceramic powder is oxygen Change aluminium powder, thermoplastic resin is made of the polyethylene that mass ratio is 1:1 and polystyrene.
(2) using electrocondution slurry, silk-screen printing forms circuit layer in the first green body layer.Wherein, according to weight percentage Meter, electrocondution slurry includes 90% conducting powder, 5% Na2O·2CaO·6SiO2Glass powder and 5% epoxy resin.
(3) under conditions of 170 DEG C, the identical ceramics of injecting step (1) in the first green body layer for be formed with circuit layer Feeding is to form the second green body layer with a thickness of 2 millimeters, and the second green body layer covers circuit layer, obtains laminates.
(4) by laminates temperature be 1000 DEG C, vacuum degree 10-2Vacuum degreasing 1 hour under conditions of MPa.
(5) then laminates are sintered 2 hours at 1600 DEG C, obtain ceramic heating element in the atmosphere of protective gas, Protective gas is the gaseous mixture of the nitrogen that volume ratio is 1:3 and hydrogen.
Consistency, mechanical strength and the heating of the ceramic heating element of the present embodiment are obtained using the identical method of embodiment 1 Leakage current when state is shown in Table 1.
Embodiment 9
The preparation process of the ceramic heating element of the present embodiment is similar with the preparation process of the ceramic heating element of embodiment 1, area It is not, the composition of ceramic feeding is different, and the ceramic feeding of the present embodiment includes: 85% ceramic powder, 11% thermoplastics type Resin and 4% paraffin.
Consistency, mechanical strength and the heating of the ceramic heating element of the present embodiment are obtained using the identical method of embodiment 1 Leakage current when state is shown in Table 1.
Embodiment 10
The preparation process of the ceramic heating element of the present embodiment is similar with the preparation process of the ceramic heating element of embodiment 1, area It is not, the composition of ceramic feeding is different, and the ceramic feeding of the present embodiment includes: 85% ceramic powder, 4% thermoplastics type tree Rouge and 11% paraffin.
Consistency, mechanical strength and the heating of the ceramic heating element of the present embodiment are obtained using the identical method of embodiment 1 Leakage current when state is shown in Table 1.
Embodiment 11
The preparation process of the ceramic heating element of the present embodiment is similar with the preparation process of the ceramic heating element of embodiment 1, area It is not, the composition of ceramic feeding is different, and the ceramic feeding of the present embodiment includes: 80% ceramic powder, 18% thermoplastics type Resin and 2% paraffin.
Consistency, mechanical strength and the heating of the ceramic heating element of the present embodiment are obtained using the identical method of embodiment 1 Leakage current when state is shown in Table 1.
Embodiment 12
The preparation process substantially phase of the preparation process of the ceramic heating element of the present embodiment and the ceramic heating element of embodiment 1 Together, difference is, the composition of ceramic feeding is different, and the ceramic feeding of the present embodiment includes: 85% ceramic powder and 15% Thermoplastic resin.
Consistency, mechanical strength and the heating of the ceramic heating element of the present embodiment are obtained using the identical method of embodiment 1 Leakage current when state is shown in Table 1.
Embodiment 13
The preparation process substantially phase of the preparation process of the ceramic heating element of the present embodiment and the ceramic heating element of embodiment 1 Together, difference is, the composition of electrocondution slurry is different, and the electrocondution slurry of the present embodiment includes: 70% conducting powder and 30% Na2O·CaO·6SiO2Glass powder.
Consistency, mechanical strength and the heating of the ceramic heating element of the present embodiment are obtained using the identical method of embodiment 1 Leakage current when state is shown in Table 1.
Embodiment 14
The preparation process substantially phase of the preparation process of the ceramic heating element of the present embodiment and the ceramic heating element of embodiment 1 Together, difference is, the composition of electrocondution slurry is different, and the electrocondution slurry of the present embodiment includes: 70% conducting powder and 30% ring Oxygen resin.
Consistency, mechanical strength and the heating of the ceramic heating element of the present embodiment are obtained using the identical method of embodiment 1 Leakage current when state is shown in Table 1.
Comparative example 1
The preparation process of the ceramic heating element of comparative example 1 is as follows:
Alumina wafer green body is prepared into using ceramic feeding tape casting, in parts by weight, ceramic feeding includes: 86% alumina powder, 10% alcohol and 4% polyvinyl butyral.
The identical electrocondution slurry of silk-screen printing embodiment 1 on alumina wafer green body, to form circuit layer；
The alumina wafer green body for being formed with circuit layer and ceramic body (aluminium oxide ceramics through oversintering) are laminated, obtained Laminates, by laminates temperature be 800 DEG C, vacuum degree 10-3Vacuum degreasing 1 hour under conditions of MPa.
Then in the atmosphere of protective gas, laminates is sintered 2 hours at 1500 DEG C, obtain ceramic heating element, protected Shield gas is the gaseous mixture of nitrogen and hydrogen that volume ratio is 1:3.
Consistency, mechanical strength and the heating of the ceramic heating element of the present embodiment are obtained using the identical method of embodiment 1 Leakage current when state is shown in Table 1.
Table 1 is consistency, the caking property of mechanical strength and each layer of the ceramic heating element of embodiment 1~14 and comparative example 1 The leakage current when mechanical strength and heated condition of energy and the ceramic heating element of comparative example 1 is shown in Table 1.
Table 1
From table 1 it follows that the consistency of the ceramic heating element of embodiment 1~12 is at least 98%, mechanical strength is extremely It is less 350MPa, Leakage Current when heated condition is up to 0.4mA, i.e., each layer has preferable caking property.Wherein, embodiment The consistency of 1~8 ceramic heating element is at least 98.5%, mechanical strength at least 355MPa, Leakage Current when heated condition Up to 0.2mA, each layer have more excellent caking property.And the consistency of the ceramic heating element of comparative example 1 is 95%, it is mechanical Intensity is 330MPa, and Leakage Current when heated condition is 0.5mA, is not so good as the ceramic heating element of embodiment 1~12.
And the consistency of the ceramic heating element of embodiment 1 is 99%, mechanical strength 380MPa, no current when heated condition Leakage, and the consistency of the ceramic heating element of embodiment 13 and embodiment 14 is only 90%, mechanical strength 200MPa, heating Leakage Current when state is up to 10mA, this explanation, the addition of glass powder and epoxy resin will have a direct impact on circuit layer and first The caking property of green body layer, the second green body layer.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.

Claims (10)

1. a kind of preparation method of ceramic heating element, which comprises the steps of:
Ceramic feeding is injection moulded, the first green body layer is obtained, wherein according to weight, the ceramics feeding packet Include: 80%~90% ceramic powder, 5%~20% thermoplastic resin and 0~15% paraffin；
Circuit layer is formed in first green body layer using electrocondution slurry, wherein according to weight, the conduction Slurry include 50%~90% conducting powder, 5%~40% glass powder and 5%~20% adhesive, the adhesive is Organic binder；
The ceramic feeding is injected in first green body layer for being formed with the circuit layer to form the second green body layer, and institute It states the second green body layer and covers the circuit layer, obtain laminates；And
The laminates are sintered in the atmosphere of protective gas, obtain ceramic heating element.
2. the preparation method of ceramic heating element according to claim 1, which is characterized in that the thermoplastic resin is selected from poly- At least one of ethylene, polypropylene and polystyrene.
3. the preparation method of ceramic heating element according to claim 1, which is characterized in that in the ceramic feeding, institute The weight percentage for stating thermoplastic resin is 5%~15%, and the weight percentage of the paraffin is 5%~15%.
4. the preparation method of ceramic heating element according to claim 1, which is characterized in that the conducting powder is tungsten powder.
5. the preparation method of ceramic heating element according to claim 1, which is characterized in that the atmosphere in protective gas Before middle the step of being sintered the laminates, further include by the laminates be 500 DEG C~1000 DEG C in temperature at carry out it is true The step of empty degreasing.
6. the preparation method of ceramic heating element according to claim 1, which is characterized in that the atmosphere in protective gas In middle the step of being sintered the laminates, sintering temperature is 1400 DEG C~1600 DEG C.
7. the preparation method of ceramic heating element according to claim 1, which is characterized in that the protective gas is selected from nitrogen And at least one of hydrogen.
8. the preparation method of ceramic heating element according to claim 1, which is characterized in that the ceramic powder is selected from oxidation One of aluminium powder and zirconia powder.
9. the preparation method of ceramic heating element according to claim 1, which is characterized in that the glass powder is selected from Na2O· CaO·6SiO2Glass powder, Na2O·CaO·5SiO2Glass powder and Na2O·2CaO·6SiO2One of glass powder.
10. the ceramic heating element that the preparation method of ceramic heating element described in any one of claim 1 to 9 is prepared.
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CN109574660B (en) * 2019-01-21 2022-01-21 东莞信柏结构陶瓷股份有限公司 Ceramic powder, ceramic heating element, preparation method of ceramic heating element and application of ceramic heating element in electronic cigarette
CN112792339A (en) * 2020-12-23 2021-05-14 东莞市新饰界材料科技有限公司 Preparation method of tungsten alloy sheet

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Publication number Priority date Publication date Assignee Title
CN101754497A (en) * 2010-01-20 2010-06-23 邓湘凌 Silicon nitride heat generator and manufacturing method thereof
CN105813815A (en) * 2016-03-15 2016-07-27 惠州市吉瑞科技有限公司深圳分公司 Manufacturing method of heating unit and forming device of heating unit
CN105881700A (en) * 2016-05-26 2016-08-24 郑州中瓷科技有限公司 High-strength ceramic substrate and preparation method and production line thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101754497A (en) * 2010-01-20 2010-06-23 邓湘凌 Silicon nitride heat generator and manufacturing method thereof
CN105813815A (en) * 2016-03-15 2016-07-27 惠州市吉瑞科技有限公司深圳分公司 Manufacturing method of heating unit and forming device of heating unit
CN105881700A (en) * 2016-05-26 2016-08-24 郑州中瓷科技有限公司 High-strength ceramic substrate and preparation method and production line thereof

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