CN100522320C - Low temperature plasma device for treating volatile organic - Google Patents

Low temperature plasma device for treating volatile organic Download PDF

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Publication number
CN100522320C
CN100522320C CNB2007100995876A CN200710099587A CN100522320C CN 100522320 C CN100522320 C CN 100522320C CN B2007100995876 A CNB2007100995876 A CN B2007100995876A CN 200710099587 A CN200710099587 A CN 200710099587A CN 100522320 C CN100522320 C CN 100522320C
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China
Prior art keywords
reactor shell
reactor
volatile organic
ground connection
crust
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Expired - Fee Related
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CNB2007100995876A
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CN101121095A (en
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李坚
豆宝娟
梁文俊
竹涛
金毓峑
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Beijing University of Technology
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Beijing University of Technology
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Abstract

The present invention relates to a low temperature plasma device for disposing volatile organic matter and belongs to the volatile organic exhaust gas disposal field. An air inlet (1) of the device is connected with a reactor crust (10) by a gradually diffusing apparatus (2). A high pressure polar plate (4) is arranged inside the reactor crust (10), and the high pressure polar plate (4) is connected with the reactor crust (10). The high pressure pole nozzles (5) are uniformly distributed on the high pressure polar plate (4) and are used for producing the plasmas. A ground plate (7) is arranged between the high pressure polar plate (4) and the reactor crust (10). A gap is left between the ground plate (7) and the reactor crust (10) for air to pass. The air outlets (12) are arranged at two side faces of the reactor crust (10). The present invention improves the utilization rate of the plasma, and a medium baffle layer avoids occurrence of electric arc. The present invention also has the advantages of simple structure, strong applicability, high disposal efficiency and low operation charge.

Description

A kind of low-temperature plasma device of handling volatile organic matter
Technical field
The present invention relates to a kind of low-temperature plasma device of handling volatile organic matter, belong to the process field of volatile organic matter.
Background technology
Volatile organic matter (volatile organic compounds, be called for short VOCs) be the important air pollutants of a big class, be meant that saturated vapour pressure at normal temperatures surpasses boiling point under 70.91Pa, the normal pressure less than 260 ℃ organic compound, its main component is hydro carbons, oxygen hydro carbons, contain halohydrocarbon, nitrogen hydrocarbon and sulphur hydro carbons etc.The harm of VOCs mainly contains the following aspects: (1) most of VOCs have peculiar smell and poisonous, that many materials among the VOCs have is carcinogenic, teratogenesis, mutagenicity, these materials disturb the human endocrine system, have genetoxic and cause the serious consequence of " feminizing ", environmentally safe and human survival procreation constitutes a threat to; (2) under the irradiation of light, many VOCs are easy to and some oxidant generation photochemical reactions, generate photochemical fog, are detrimental to health, and influence crop growth; (3) some halogenated hydrocarbons may cause the destruction of ozone layer, as chlorofluorocarbons (CFCs) and CFC; (4) a lot of VOCs belong to inflammable, explosive compounds, produce to enterprise and cause big hidden danger.
The 4th kind of form that plasma exists as material, the aggregate of forming by charged positive corpusc(u)le, negative particle (comprising cation, anion, electronics, free radical and various active groups etc.).Low-temperature plasma degradation VOC has clearance height, easy to operate, low power consumption and other advantages as a kind of new processing method, and more traditional method demonstrates good technical advantage and development prospect, can reach removal effect preferably.Mainly comprise technology such as electron beam irradiation method, dielectric barrier discharge method, creeping discharge method and corona discharge method.Corona discharge is to use the very little electrode of radius of curvature (as needle electrode or thin-line-shaped electrode), and applies high-tension electricity on electrode, because the radius of curvature of electrode is very little, strong especially near the electric field of electrode zone, non-homogeneous discharge takes place electronics effusion negative electrode.Dielectric barrier discharge is that dielectric is inserted in the discharge space, in the dielectric barrier discharge process, dielectric plays the effect of energy storage, can avoid the generation of electric arc, be generally thread immediately discharge, make that gas discharge remains on evenly, the state of careless and sloppy, stable a plurality of little current filaments.
The patent of some relevant plasma treatment exhaust devices is disclosed in recent years.A kind of plasma waste gas purifying device is disclosed as patent 02209303.6, ion gun moving up and down is equipped with at the top of ionisation chamber, air inlet and gas outlet are located at the both sides of ionisation chamber respectively, because the plasma effective coverage that ion gun produces is limited, the effective rate of utilization of plasma is low, thereby portion gas can not or not exclusively obtain degraded, influences its treatment effeciency.Patent 200420150218.7 discloses pin-board-like treating organic wastewater by pulse discharge plasma inducting photocatalysis device, it also can be used for handling organic exhaust gas, what adopt in this device is pin-board-like electrode structure, the sparking electrode of pin type is solid or hollow, for hollow sparking electrode is common metal tube, be unfavorable for that gas discharge and air-flow spray, and influence effective utilization of plasma; The device mesolow utmost point is the metallic plate of ground connection, and does not have dielectric barrier between the high-pressure stage, forms electric arc easily, causes puncturing, and influences the normal operation of equipment, makes treatment effeciency can not get guaranteeing.
Summary of the invention
The objective of the invention is above-mentioned defective, a kind of low-temperature plasma device of handling volatile organic matter is provided for existing apparatus.This device has improved treatment of waste gas efficient, has reduced energy consumption.
To achieve these goals, the present invention has taked following technical scheme.This device mainly includes air inlet 1, flaring device 2, high-pressure polar plate 4, ground connection pole plate 7 and reactor shell 10.Wherein, air inlet 1 is fixedlyed connected with reactor shell 10 by flaring device 2, forms the passage that gas enters reative cell.In the inside of reactor shell 10, the both sides of flaring device 2 central axis a high-pressure polar plate 4 is set respectively, high-pressure polar plate 4 is connected with reactor shell 10 by insulation draw-in groove 8, the space that two high-pressure polar plates 4 and reactor shell 10 surround is an air-flow surge chamber 3, and air-flow surge chamber 3 is connected with flaring device 2.Be evenly distributed with the high-pressure stage nozzle 5 that is used to produce plasma on the high-pressure polar plate 4, be provided with ground connection pole plate 7 between high-pressure polar plate 4 and reactor shell 10 sides, ground connection pole plate 7 is connected with reactor shell 10 by draw-in groove 9, leaves the gap of 10~20mm that the gas after being used to handle passes through between ground connection pole plate 7 and the reactor shell 10.On two sides of the reactor shell 10 corresponding, be provided with gas outlet 12 with ground connection pole plate 7.
Be provided with dielectric barrier 6 between described high-pressure stage nozzle 5 and the ground connection pole plate 7.
Described dielectric barrier 6 is polyfluortetraethylene plate or micarex.
Described insulation draw-in groove 8 is the polytetrafluoroethylene (PTFE) draw-in groove.
The number of described draw-in groove 9 is greater than 2.
Apply the industrial frequency AC high voltage to high voltage discharge electrode, between high-pressure stage nozzle 5 and ground connection pole plate 7, can form severe non-uniform electric field.The corona discharge phenomenon can take place than sharp edges in high-pressure stage nozzle 5 after applying voltage is greater than discharge inception voltage, because the existence of dielectric barrier 6 between high-pressure stage nozzle 5 and the ground connection pole plate 7, corona discharge and dielectric barrier discharge are combined, avoided the generation of electric arc, make that gas discharge remains on evenly, the state of careless and sloppy, stable a plurality of little current filaments, thereby form Rotary-table plasma channel from nozzle edge to dielectric barrier, as shown in Figure 5, various active groups such as enrichment electronics, free radical in the passage.Be provided with a plurality of draw-in grooves 9 in the reactor, ground connection pole plate 7 can be inserted in the different draw-in groove 9, is used to regulate the spacing with high-pressure stage nozzle 5.Pending waste gas by air inlet 1 after flaring device 2 arrives gas buffer chambers 3, because surge chamber 3 plays the effect of plenum chamber, thereby make gas uniformly by high-pressure stage nozzle 5 ejections that are distributed on the high-pressure polar plate 4, this moment, the direction of air-flow was identical with direction of an electric field, the adjustments of gas flow velocity makes the angle of flare of air-flow angle of flare less than plasma channel, the Zone Full of pending waste gas process plasma channel, and effectively degraded within it, the clean gas after the processing is finally discharged by gas outlet 12.
The present invention has following beneficial effect:
1) volatile organic waste gas sprays with certain angle of flare from the high-pressure stage nozzle, the air-flow angle of flare is less than the angle of flare of plasma channel, gas is all through the set out Rotary-table plasma channel of dielectric barrier of the nozzle edge of associating, gas after nozzle ejection goes out through Rotary-table, make gas all pass through the plasma effective coverage, and obtain degraded within it, and improved the utilization rate of plasma, cut down the consumption of energy.
2) design high-pressure stage nozzle is beneficial to the injection of gas and effective utilization in plasma zone in the device, and nozzle edge is sharp, gas discharge easily takes place and improve its intensity.
3) the gas buffer cell structure of design in the device plays the effect of plenum chamber, can make gas more uniformly from the ejection of high-pressure stage nozzle, thereby improve treatment of waste gas efficient.
4) this device combines corona discharge and dielectric barrier discharge, has avoided the generation of electric arc at interdischarge interval, makes that gas discharge remains on evenly, the state of careless and sloppy, stable a plurality of little current filaments, is beneficial to and generates the plasma active group.
Description of drawings
Fig. 1 handles the front view of the low-temperature plasma device structure of volatile organic matter for the present invention;
Fig. 2 handles the vertical view of the low-temperature plasma device structure of volatile organic matter for the present invention;
Fig. 3 handles A-A profile among low-temperature plasma device Fig. 1 of volatile organic matter for the present invention;
Fig. 4 (a) handles the front view of the low-temperature plasma device structure mesohigh utmost point of volatile organic matter for the present invention;
Fig. 4 (b) handles the side view of the low-temperature plasma device structure mesohigh utmost point of volatile organic matter for the present invention;
Fig. 5 handles the schematic diagram that air-flow moves in the low-temperature plasma device of volatile organic matter in the plasma channel that nozzle produces for the present invention;
Among the figure: 1, air inlet; 2, flaring device; 3, gas buffer chamber; 4, high-pressure polar plate; 5, high-pressure stage nozzle; 6, dielectric barrier; 7, ground connection pole plate; 8, insulation draw-in groove; 9, draw-in groove; 10, reactor shell; 11, flange; 12, gas outlet.
The specific embodiment
Describe present embodiment in detail below in conjunction with Fig. 1~Fig. 5.
As shown in Figure 1 and Figure 2, present embodiment mainly includes air inlet 1, flaring device 2, reactor shell 10, and air inlet 1 is connected with flaring device 2 by flange 11, and flaring device 2 is fixedlyed connected with reactor shell 10.Reactor shell 10 is a rectangular structure, its internal structure is symmetrically distributed, two sides up and down in reactor shell 10 are provided with insulation draw-in groove 8 and draw-in groove 9, high-pressure polar plate 4 is connected with reactor shell 10 by insulation draw-in groove 8, it is fixing by draw-in groove 9 that dielectric barrier 6 is close to ground connection pole plate 7, leave the gap of 15mm between former and later two sides of ground connection pole plate 7 and dielectric barrier 6 and the reactor shell 10, the waste gas after being used to handle passes through.Two high-pressure polar plates 4 are air-flow surge chamber 3 with the space that reactor shell 10 surrounds, and pending waste gas is earlier through air-flow surge chamber 3, again by 5 ejections of high-pressure stage nozzle.The high-pressure stage nozzle 5 of sharp edges is evenly distributed on the high-pressure polar plate 4, its structure as shown in Figure 3, Figure 4, gas outlet 12 is arranged on two sides of reactor.
Be arranged side by side 3 draw-in grooves 9 in the present embodiment, be used to regulate the spacing of ground connection pole plate 7 and high pressure high-pressure stage nozzle 5.
Dielectric barrier 6 in the present embodiment adopts polyfluortetraethylene plate or micarex.Insulation draw-in groove 8 adopts polytetrafluoroethylmaterial material to make, in order to insulation.

Claims (4)

1, a kind of low-temperature plasma device of handling volatile organic matter, it is characterized in that: mainly include air inlet (1), flaring device (2), high-pressure polar plate (4), ground connection pole plate (7) and reactor shell (10), wherein, air inlet (1) is fixedlyed connected with reactor shell (10) by flaring device (2); In the inside of reactor shell (10), the both sides of flaring device (2) central axis a high-pressure polar plate (4) is set respectively, high-pressure polar plate (4) is connected with reactor shell (10) by insulation draw-in groove (8), the space that two high-pressure polar plates (4) and reactor shell (10) surround is air-flow surge chamber (3), and air-flow surge chamber (3) is connected with flaring device (2); Be evenly distributed with the high-pressure stage nozzle (5) that is used to produce plasma on the high-pressure polar plate (4), be provided with ground connection pole plate (7) between high-pressure polar plate (4) and the reactor shell (10), ground connection pole plate (7) is connected with reactor shell (10) by draw-in groove (9), leaves between ground connection pole plate (7) and the reactor shell (10) to be used for the gap that gas passes through; Be provided with gas outlet (12) on two sides of the reactor shell (10) corresponding with ground connection pole plate (7).
2, a kind of low-temperature plasma device of handling volatile organic matter according to claim 1 is characterized in that: be provided with dielectric barrier (6) between described high-pressure stage nozzle (5) and the ground connection pole plate (7).
3, a kind of low-temperature plasma device of handling volatile organic matter according to claim 2 is characterized in that: described dielectric barrier (6) is polyfluortetraethylene plate or micarex.
4, a kind of low-temperature plasma device of handling volatile organic matter according to claim 1 is characterized in that: described insulation draw-in groove (8) is the polytetrafluoroethylene (PTFE) draw-in groove.
CNB2007100995876A 2007-05-25 2007-05-25 Low temperature plasma device for treating volatile organic Expired - Fee Related CN100522320C (en)

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CN102085520A (en) * 2009-12-04 2011-06-08 中国科学院微电子研究所 Normal-pressure dual-medium barrier flat-opening type active radical cleaning system
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CN102310063A (en) * 2010-06-29 2012-01-11 中国科学院微电子研究所 Cleaning system for honeycomb-shaped plasma free radicals
CN102896115A (en) * 2011-07-26 2013-01-30 中国科学院微电子研究所 Novel normal-pressure medium barrier type active free radical cleaning equipment
CN102921675B (en) * 2011-08-10 2017-01-25 中国科学院微电子研究所 Novel atmospheric cleaning spray gun capable of discharging large-area plasma free radicals
CN103285718A (en) * 2013-05-16 2013-09-11 北京朗净时代环境科技有限公司 Deodorizing and sterilizing device for low-temperature plasma garbage station
CN106902620A (en) * 2015-12-23 2017-06-30 重庆工商大学 Corona-dielectric barrier discharge low-temperature plasma purification waste gas method and device
CN107020004A (en) * 2017-05-25 2017-08-08 浙江富春江环保热电股份有限公司 A kind of apparatus and method of plasmaassisted ammonia absorption coal-fired flue-gas simultaneous SO_2 and NO removal decarburization
CN108993346A (en) * 2018-08-10 2018-12-14 山东重山光电材料股份有限公司 A kind of anion bromination reactor and its application
CN111250000A (en) * 2020-03-23 2020-06-09 江苏普格机械有限公司 Central gas collecting pipe of shift converter

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