CN100511882C - Laser diode and producing method thereof - Google Patents
Laser diode and producing method thereof Download PDFInfo
- Publication number
- CN100511882C CN100511882C CNB2005100642451A CN200510064245A CN100511882C CN 100511882 C CN100511882 C CN 100511882C CN B2005100642451 A CNB2005100642451 A CN B2005100642451A CN 200510064245 A CN200510064245 A CN 200510064245A CN 100511882 C CN100511882 C CN 100511882C
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- pin
- laser diode
- chip
- support
- photodiode chip
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Abstract
A method for preparing laser diode includes combining photoelectric diode chip with one pin of each pin set on support in rows, superposing laser diode chip on said photoelectric diode chip, connecting two said chips to the other pin of each pin set by wiring, socketing shell with open-slot and notch slot as well as containing space at top end of on each wired pin set for finishing assembly of laser diode and then cutting off connection element between pin and each pin set on support in rows for obtaining multiple laser diode.
Description
Technical field
The present invention relates to a kind of laser diode and manufacture method thereof, be meant a kind of laser diode and manufacture method thereof that is used to optical-fibre communications that light source is provided especially.
Background technology
Opto-electronics is electronics (Electronics) and optics (Optics) to be mutually combined and a kind of application of producing.The light source that wherein is used for optical-fibre communications is based on light-emitting diode and laser diode.Because light-emitting diode has the low and more easily use advantages such as (driving with compensating circuit simpler) of cost, therefore is fit to short-distance transmission usefulness; As for laser diode have the power output height, transmission speed is fast, lighting angle is little and the narrower advantages such as (chromatic dispersion are less) of frequency spectrum, so in being fit to, the usefulness of long Distance Transmission.
Yet, though the laser diode range of application is very extensive, but it is meticulous that laser diode is made, hierarchy of skill height, the production equipment costliness, component price is but quite cheap, known laser diode structure, as shown in Figure 1, mainly be to be provided with a pedestal A, this pedestal A is provided with two perforation, an one groove A1 and a projection A2, this two perforation is respectively in conjunction with a pin B, and projection A2 also extends a pin A21 in the bottom, go up some glue in groove A1, again photodiode chip (photo diode) C is binded thereon, on projection A2, impose 300 ℃ hot melt, and another laser diode chip (laser diode) D is incorporated into projection A2, make laser diode chip (laser diode) D perpendicular to photodiode chip (photo diode) C, the crown cap E that is provided with windowpane E1 with a top covers two chips again, to finish the laser diode structure.
Yet, the manufacturing process of above-mentioned known laser diode is comparatively loaded down with trivial details, and the glutinous position of establishing of this photodiode chip and laser diode chip is all inequality with glutinous mode of establishing, and this pedestal need keep flat earlier again and put upside down, therefore making manufacturing process slack-off, is to be its topmost disappearance.
Summary of the invention
Main purpose of the present invention is in the manufacture method of the laser diode that provides a kind of and simplify manufacturing process, makes manufacturing cost to decline to a great extent.
Secondary objective of the present invention is providing a kind of manufacture method for mass-produced laser diode.
A further object of the present invention is providing a kind of in conjunction with laser diode convenient, that reduce fraction defective.
In order to achieve the above object, the step system that takes of method of the present invention comprises: what 1, photodiode chip (photo diode) is incorporated into support in a row respectively organizes a wherein pin on the pin; 2, again with stacked being incorporated on the photodiode chip of a laser diode chip (laser diode); 3, by routing to link other pin of two chips and each group pin; 4, the housing that will be provided with fluting, short slot and accommodation space be sheathed on finish routing respectively organize the pin upper end, finish the assembling of laser diode thus; And 5, the linkage section of respectively organizing between pin and the pin of support in a row is cut apart with a knife or scissors, get final product a plurality of laser diodes.
By the above-mentioned step of simplifying, make laser diode produce in a large number, and can significantly reduce manufacturing cost.
Description of drawings
Fig. 1 is the partial component decomposing schematic representation of known laser diode.
Fig. 2 is a manufacturing flow chart of the present invention.
Fig. 3 is the schematic diagram of support of the present invention in conjunction with two chips.
Fig. 4 is the action schematic diagram of the sheathed housing of support of the present invention.
Fig. 5 is the generalized section of the embodiment of the invention.
Fig. 6 is another manufacturing flow chart of the present invention.
A, pedestal A1, groove
A2, projection A21, pin
B, pin C, photodiode chip
D, laser diode chip E, crown cap
E1, windowpane 10, support
11, large tracts of land joint portion 20, photodiode chip
30, laser diode chip 40, housing
41, fluting 42, short slot
Embodiment
See also Fig. 2, manufacturing process of the present invention may further comprise the steps:
What 1, photodiode chip (photo diode) is incorporated into support in a row respectively organizes a wherein pin on the pin;
2, again with stacked being incorporated on the photodiode chip of a laser diode chip (laser diode);
3, by routing to link other pin of two chips and each group pin;
4, the housing that will be provided with fluting, short slot and accommodation space be sheathed on finish routing respectively organize the pin upper end, finish the assembling of laser diode thus; And
5, the linkage section of respectively organizing between pin and the pin of support in a row is cut apart with a knife or scissors, get final product a plurality of laser diodes.
During actual the manufacturing, earlier photodiode chip 20 is incorporated into and does not in a row cut respectively the organizing on the pin of support 10, the support 10 of present embodiment is made as a plurality of three continuous pins, and the middle pin top of this three pin is provided with a large tracts of land joint portion 11, as shown in Figure 3, because the identical event of structure is with the single structure explanation, the point gluing closes photodiode chip 20 on large tracts of land joint portion 11, it is local superimposed on photodiode chip 20 with another laser diode chip 30 to impose 300 ℃ of hot melts again, make two chips 20,30 generation part superpositions stick to be established, and makes two chips 20 by routing, 30 organize other pin conducting with each.
Please be with consulting Fig. 4～5, get the housing 40 that is provided with fluting 41, short slot 42 and accommodation space, from top to bottom be sheathed on and finish two chips, 20,30 glutinous establishing, and routing is connected between chip and pin respectively organizes the pin top, make three pins (containing large tracts of land joint portion 11), two chips 20,30 and routing place the accommodation space of housing 40, finish the making of laser diode in a row thus, and support in a row 10 is cut apart with a knife or scissors (connected section of respectively organizing between pin and three pins also will be cut apart with a knife or scissors), so can get a plurality of laser diodes, be suitable for a large amount of manufacturings.
After laser diode that this is made and power supply link, these laser diode chip 30 forward and backward two end-fires go out laser, the laser that front end sends penetrates through the fluting 41 of housing 40, and the laser that send this rear end is to receive for photodiode chip 20, to use as feedbacking.
Please consult Fig. 6 again,, comprise the following steps: for another manufacturing process of the present invention
1, the housing that will be provided with fluting, short slot and accommodation space is sheathed on respectively organizing on the pin of support in a row;
2, photodiode chip is incorporated into finish housing sheathed respectively organize a wherein pin on the pin;
3, again a laser diode chip stack is incorporated on the photodiode chip;
4, by routing to link other pin of two chips and each group pin, finish the assembling of laser diode thus; And
5, the linkage section of respectively organizing between pin and the pin of support in a row is cut apart with a knife or scissors, get final product a plurality of laser diodes.
As from the foregoing, have following practical advantage with the method for making of the present invention and the structure of making:
1, this two chip (photodiode chip and laser diode chip) is stacked on the support to overlap, not only change the binding site of two chips, further simplify manufacturing process, effectively improve known laser diode need keep flat earlier pedestal in conjunction with a chip after, pedestal is put upside down in conjunction with the loaded down with trivial details manufacturing process of another chip again.
2, because manufacturing process is easy, quick,, make manufacturing cost decline to a great extent, and laser diode stay in grade, the yield made are promoted so can produce in a large number.
The above only is preferred embodiment of the present invention, the impartial design variation of being done according to the present patent application claim scope such as, and the technology that all should be this case contains.
Claims (3)
1, a kind of manufacture method of laser diode is characterized in that, comprises the following steps:
What (1) photodiode chip is incorporated into support in a row respectively organizes wherein having on the pin of large tracts of land joint portion in the pin, and described every group of respectively organizing pin has three pins;
(2) again a laser diode chip stack is incorporated on the photodiode chip;
(3) by routing to link other pin of described photodiode chip, laser diode chip and each group pin;
(4) housing that will be provided with fluting, short slot and accommodation space be sheathed on finish routing respectively organize the pin upper end, finish the assembling of laser diode thus; And
(5) linkage section of respectively organizing between pin and the pin of support in a row is cut apart with a knife or scissors, get final product a plurality of laser diodes.
2, a kind of laser diode is characterized in that, comprises:
One support has three pins, and wherein a pin top is provided with a large tracts of land joint portion;
One photodiode chip is incorporated into the large tracts of land joint portion of described pin;
One laser diode chip, stacked being incorporated on the photodiode chip;
Two routings connect all the other two pins of described photodiode chip, laser diode chip and described support, connect lead to form; And
One is provided with the housing of fluting, short slot and accommodation space, is sheathed on the top of support, and the light that the laser diode chip is sent can penetrate through fluting.
3, a kind of manufacture method of laser diode is characterized in that, comprises the following steps:
(1) housing that will be provided with fluting, short slot and accommodation space is sheathed on respectively organizing on the pin of support in a row;
(2) photodiode chip is incorporated into finish housing sheathed respectively organize wherein having on the pin of large tracts of land joint portion in the pin, described every group of respectively organizing pin has three pins;
(3) again a laser diode chip stack is incorporated on the photodiode chip;
(4) by routing to link other pin of described photodiode chip, laser diode chip and each group pin, finish the assembling of laser diode thus; And
(5) linkage section of respectively organizing between pin and the pin of support in a row is cut apart with a knife or scissors, get final product a plurality of laser diodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100642451A CN100511882C (en) | 2005-04-12 | 2005-04-12 | Laser diode and producing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100642451A CN100511882C (en) | 2005-04-12 | 2005-04-12 | Laser diode and producing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1848563A CN1848563A (en) | 2006-10-18 |
| CN100511882C true CN100511882C (en) | 2009-07-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100642451A Expired - Fee Related CN100511882C (en) | 2005-04-12 | 2005-04-12 | Laser diode and producing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100511882C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015109788A1 (en) | 2015-06-18 | 2016-12-22 | Osram Opto Semiconductors Gmbh | arrangement |
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2005
- 2005-04-12 CN CNB2005100642451A patent/CN100511882C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN1848563A (en) | 2006-10-18 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090708 Termination date: 20190412 |
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| CF01 | Termination of patent right due to non-payment of annual fee |