CN100502634C - Component installation quality analysis method and analyzing apparatus - Google Patents
Component installation quality analysis method and analyzing apparatus Download PDFInfo
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- CN100502634C CN100502634C CN 200510091110 CN200510091110A CN100502634C CN 100502634 C CN100502634 C CN 100502634C CN 200510091110 CN200510091110 CN 200510091110 CN 200510091110 A CN200510091110 A CN 200510091110A CN 100502634 C CN100502634 C CN 100502634C
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Abstract
The invention provides a component installation quality analysis method which presumes primary causes for defect generation and outputs countermeasure indication by considering adjacent components. The component installation quality analysis method of the invention is as follows: a component installation quality analysis device (30) receives installation position information which is measured before implementation of welding treatment, namely installation quality information, and information of nonconforming positions which are checked out after the welding treatment, namely unsatisfactory quality generation information, extracts analysis object information from the information, analyzes accumulatively the extracted analysis object information, determines installation treatment which becomes primary causes for unsatisfactory quality from the installation treatment on nonconforming positions and on installation positions close to the nonconforming positions, and outputs the countermeasure indication which is used for indicating improvement of the installation treatment.
Description
Technical field
The present invention relates to the electronic unit hookup wire that electronic unit etc. is installed on the circuit board carry out the defective generation of installation quality main cause analysis and by taking adequate measures more to improve the method and apparatus of installation quality.
Background technology
Past, install at the assigned position on the circuit board on the hookup wire of electronic unit, generation part is not installed on the assigned position or soldering tin amount or shape do not reach specified states or the like defective phenomenon is installed sometimes.This takes place installs underproof reason and has a lot.
For example, current, along with miniaturization, the slimming of electronic goods, the interval that requires to be installed in the parts on the circuit board reduces day by day.If on such circuit board with the high-density installation parts, then because the influence of parts adjacent parts when installing, production part offset sometimes etc.As a result, cause installation defective sometimes.
And, under defective situation of taking measures, for the defective happening part of checking out in the final inspection after installation take measures (for example referring to non-patent literature 1) to this installation.
Figure 14 is expressed as and infers main cause that installation quality defective in the past takes place and the histogram of reference.
As shown in the drawing, with reference to the histogram of the rejected region accumulative total of checking out in the final inspection after installation, the field operation personnel begin it is taken measures from the many positions of defective generation number of packages.
＜non-patent literature 〉
" circuit board hookup wire with manufacturing information management system (PCB-REALM I1CS) " (the 57th volume is commented on by Toshiba, No.4 (2002), P47～P50)
But the problem that exists in the method in above-mentioned past is: the parts at the position of generation defective are subjected to the influence of adjacent component and occur installing under the underproof situation when parts are installed, can not improve the quality.
Especially, only depend on the welding inspection machine that constitutes hookup wire to carry out under the situation of final inspection, can not grasp the state when checking, so, the problem that exists is: the influence of adjacent parts during owing to installing component, and can not judge the parts at the position that defective takes place and whether install defective.
And, even on hookup wire, be equipped with the installation check machine, also just to having or not of parts etc., and to being that the check result of unit is added up respectively with parts, in the case, the problem of existence is: because same as described above, and can not improve the quality.
That is to say that the problem of existence is: be not that the adjacent component of the main cause that produces defective is directly taken measures, but directly the parts at the position that produces defective taken measures, so can not solve the main cause that produces defective.
Summary of the invention
Therefore, The present invention be directed to the problems referred to above and the scheme that proposes, its purpose is to provide a kind of parts installation quality analytical method and parts installation quality analytical equipment of inferring the main cause that produces defective that adjacent component is also taken into account.
＜solution 1 〉
In order to achieve the above object, relate to a kind of parts installation quality analytical method of the present invention, the installation quality that is installed on the electronic unit on the circuit board analyzed, it is characterized in that, comprise following operation:
(1) abstraction process, (a) the position of electronic unit is installed on circuit board as the installation position, the information of the installation position of implementing to measure before the soldering as installation quality information, (b) being decided to be position off quality in the installation position as defective position, the information at the defective position of implementing to check out after the soldering as generation information off quality, (c), (d) from above-mentioned generation information off quality and above-mentioned installation quality information, extract above-mentioned analytic target information under the situation of information as analytic target information of defective position and the installation position that is adjacent;
(2) analysis procedure adds up the analytic target information of extracting by every circuit board, and the association between each analytic target information is analyzed;
(3) infer operation,, infer whether during the installation at defective position handled and the installation of the installation position that is adjacent handled any is main cause off quality according to analysis result; And
(4) countermeasure indication output operation, output are used to indicate carries out improved countermeasure indication to the installation processing of being inferred.
So, when the generation installation is defective, can infer to produce underproof basic reason, promote it is taken measures.
＜solution 2 〉
Moreover above-mentioned generation information off quality also can be represented off quality by the parts unit that is installed on the circuit board.
＜solution 3 〉
Moreover above-mentioned generation information off quality is divided into a plurality of stages by the installation quality standard.
So, in fact by taked corrective measure before the generation installation is defective, it is defective to prevent installation in advance.
Parts installation quality analytical equipment of the present invention, installation quality to the circuit board of joining at the enterprising luggage of the hookup wire with fitting machine is analyzed, have: the installation quality information receiver, the position of on the circuit board electronic unit being installed as the installation position, will be received as installation quality information in the information of the installation position of implementing on the hookup wire to measure before the soldering; And generation information receiver off quality, being decided to be position off quality in the installation position as defective position, the information that will implement the defective position checked out after the soldering on hookup wire receives as generation information off quality; Extraction element extracts defective position and the information of the installation position that is adjacent, as analytic target information from generation information off quality and installation quality information; Analytical equipment adds up the analytic target information of extracting by every circuit board, and the association between each analytic target information is analyzed; Apparatus for predicting according to analysis result, infers whether some during the installation at defective position handled and the installation of the installation position that is adjacent handled is main cause off quality; And countermeasure indication output device, output is used to indicate carries out improved countermeasure indication to the installation processing of being inferred.
The invention effect
As mentioned above, utilize the present invention, when the generation installation is defective, suitably infer the parts that underproof real main cause takes place, can avoid to promote the raising of quality based on mistake defective countermeasure presumably.
Description of drawings
Fig. 1 is the figure of structure of the hookup wire of the expression parts installation quality analytical equipment that utilizes one embodiment of the present invention.
Fig. 2 is the functional block diagram of functional structure that expression utilizes the parts installation quality analytical equipment of one embodiment of the present invention.
Fig. 3 (a) and (b) are figure of data structure of the installation action condition of expression an embodiment of the present invention.
Fig. 4 (a) and (b) are figure of data structure of the installation quality information of expression an embodiment of the present invention.
Fig. 5 (a)～(d) is the figure of data structure of the generation information off quality of expression an embodiment of the present invention.
Fig. 6 is the flow chart of order that expression relates to the parts installation quality analytical method of an embodiment of the present invention.
Fig. 7 is that expression utilizes the fitting machine of an embodiment of the present invention to come the synoptic diagram of an example of the action of installing component.
Fig. 8 (a)～(f) is the synoptic diagram that produces the underproof reason of installation quality in the hookup wire of expression an embodiment of the present invention.
Fig. 9 (a)～(c) is the synoptic diagram that produces the underproof process of installation quality in the hookup wire of expression an embodiment of the present invention.
Figure 10 (a)～(c) is the synoptic diagram that produces the underproof process of installation quality in the hookup wire of expression an embodiment of the present invention.
Figure 11 (a)～(d) is that expression will be corresponding to the installation quality information of generation information off quality figure by every circuit board accumulative total and the result that analyzes.
Figure 12 (a)～(d) is that expression will be corresponding to the installation quality information of generation information off quality figure by every circuit board accumulative total and the result that analyzes.
Figure 13 is that expression is as the indication of the countermeasure of an embodiment of the present invention and the figure of the content of output.
Figure 14 is expressed as to infer the defective main cause of installation quality in the past and the curve chart of reference.
Embodiment
Following with reference to accompanying drawing, describe embodiments of the present invention in detail.
＜hookup wire 〉
Fig. 1 has represented to use the structure of hookup wire of the parts installation quality analytical equipment of an embodiment of the present invention.
As shown in the drawing, hookup wire 1 has: printing machine 2, fitting machine 4, installation check machine 5, bonding machine 6 and welding inspection machine 7.
Fitting machine 4 is installed to electronic unit on the assigned position of circuit board according to installation action condition 31.
5 pairs of installment states that are installed in the electronic unit on the circuit board of installation check machine are checked.For example, not shown CCD, the row detector etc. of utilizing are obtained the image at the position of installing component.Then, according to check result, establishment installation quality information 32 outputs to parts installation quality analytical equipment 30 to the installation quality information of having worked out 32.
6 pairs of electronic units that are installed on the circuit board of bonding machine weld.
7 pairs of welded conditions that are welded on the electronic unit on the circuit board of installation check machine are checked.For example, not shown CCD, the row detector etc. of utilizing are obtained the image at the position of welding assembly.Then,, work out generation information 33 off quality, the generation information of having worked out 33 off quality is outputed to parts installation quality analytical equipment 30 according to check result.
Parts installation quality analytical equipment 30 is read installation action condition 31 from fitting machine 4.And, receive from the installation quality information 32 of installation check machine 5 outputs; Reception is from the generation information 33 off quality of welding inspection machine 7 outputs.According to installation action condition 31, installation quality information 32, generation information 33 off quality, analyze main cause off quality again, though not shown, by output equipment, on-the-spot operating personnel is exported in countermeasure indication 34.
And the field operation personnel are according to this countermeasure indication 34, are that the installation action condition is revised to the condition of work of fitting machine 4 etc., so that eliminate generation main cause off quality.
And, on circuit board 10, printed the differentiation numbering 9 that is used to specify this circuit board.In addition, in printing machine 2, fitting machine 4, installation check machine 5, bonding machine 6 and welding inspection machine 7, read this differentiation numbering and can determine circuit board or the Insp'd circuit board produced.
And,, also can select the hookup wire that has linked a plurality of fitting machines 4 for use for replacing hookup wire 1.In the case, also can share the electronic unit of on circuit board, installing by many fitting machines.Moreover installation check machine 5 also is assembled in the hookup wire 1 sometimes.And,, also can adopt the visual inspection operation of being undertaken by the operator for replacing installation check machine 5.Equally, in hookup wire 1, under the situation of unassembled welding inspection machine 7, also can adopt the visual inspection operation of being undertaken by the operator.
＜parts installation quality analytical equipment 〉
Fig. 2 is the functional block diagram that the function of the parts installation quality analytical equipment of expression one embodiment of the present invention constitutes.
As shown in the drawing, parts installation quality analytical equipment 30 has: mounting condition input part 41, measurement result input part 42, check result input part 43, main cause analysis portion 44 off quality, main cause supposition portion 45 and countermeasure indication efferent 46.
Erection sequence when mounting condition input part 41 receiving-members are installed and the condition of work of erection unit, the installation action conditions such as shape of object parts.The installation action condition that has received is sent to main cause analysis portion 44 off quality.
Measurement result input part 42 receives the installment state after installing has been carried out the installation quality information of measuring.The installation quality information that has received is sent to main cause analysis portion 44 off quality.
Check result input part 43 receives the defective information of installation quality of hookup wire.The defective information of the installation quality that has received is sent to the analysis of causes off quality portion 44.
Main cause analysis portion 44 off quality receives the installation action condition from mounting condition input part 41, obtain installation quality information from measurement result input part 42, obtain information off quality from check result input part 43, these information are added up, and extract feature.
Defective main cause is inferred according to the result who extracts by main cause supposition portion 45, about becoming the parts of main cause, notifies quality countermeasure instruction unit.
The data structure of＜installation action condition 〉
Fig. 3 (a) and (b) are represented the data structure of the installation action condition of an embodiment of the present invention.
As shown in the drawing, installation action condition 31 is made of NC program 81 and condition of work storehouse 82.
Shown in Fig. 3 (a), for NC program 81, to each NC program setting discernible NC program name.And numbering etc. is chewed in erection sequence, channel number, work storehouse, X coordinate, Y coordinate, angle, box numbering, suction, is made of the record of setting at the scene.
Erection sequence is represented the erection sequence of parts.
Channel number is represented the numbering to the electronic unit distribution that will install.
Maneuver library is represented the title of condition of work database.
X coordinate, Y coordinate and angle are illustrated in position and the state of installing on the circuit board.
The numbering of wrapping box is carried out in the expression of box numbering to the conveyer belt of supply part.
Suction is chewed the suction of using when the numbering expression is installed and is chewed.
Shown in Fig. 3 (b), condition of work database 82, library name, part dimension, suction are chewed kind, are inhaled and chew speed, setting height(from bottom) correction, installation timing, adsorption site correction etc. up and down, by constituting at each on-the-spot record of setting.
Library name represents to be assigned to the title of each group of each parts.
The X-direction of part dimension (X, Y) expression parts and the size of Y direction.
Suction is chewed classification and is represented to inhale the kind of chewing.
Speed represents to inhale the speed when chewing up and down up and down.
Height correction when setting height(from bottom) is proofreaied and correct the expression installation.
Timing when regularly expression is installed is installed.
Center when adsorption site correction expression chews adsorption element with suction
The data structure of＜installation quality information 〉
Fig. 4 (a) and (b) are represented the data structure of the installation quality information of one embodiment of the present invention.
As shown in the drawing, image 84 constitutes installation quality information by metrical information 83 with when measuring.
Shown in Fig. 4 (a), 83 pairs of metrical informations are distributed to the circuit board numbering of each circuit board and are set, and the moment of being checked is carried out record constantly as checking.And, channel number, X grid deviation, Y grid deviation, angular deviation, picture number are made of the record of setting at the scene.
X grid deviation, Y grid deviation and angular deviation represent before the parts welding constantly, with respect to the departure of appointed installation site etc.
The numbering that each captured image distributed when picture number was represented measurements such as the CCD that utilizes outfit in the installation check machine 5.
Shown in Fig. 4 (b), be set with the image encoding of distributing to each image when measuring during measurement on the image 84.And, write down the image of having taken.
The data structure of＜generation information off quality 〉
The data structure of the generation information off quality of Fig. 5 (a)～(d) expression one embodiment of the present invention.
Shown in Fig. 5 (a) and (b), the generation information off quality of numbering " 03120105 " about circuit board is made of image 86 defective classification information 85 and inspection.
Shown in Fig. 5 (a), be set with the circuit board numbering of distributing to each circuit board in the defective classification information 85, the checked moment is carried out record constantly as checking.And channel number, defective classification and picture number are by constituting at each on-the-spot record of setting.
Channel number represents to take place the parts at the position of defective, and defective FRU promptly takes place.
The kind of expression such as defective classification such as substandard products defect state.
The numbering that each image that picture number is represented to take when being checked by CCD that are equipped with in the welding inspection machine 7 etc. distributes.
Shown in Fig. 5 (b), be set with the picture number of distributing to each image when checking during inspection in the image 86.And, record the image that is taken.
Equally, shown in Fig. 5 (c), (d), about the generation information off quality of circuit board numbering " 03120251 " by defective kind of information 87 and when checking image 88 constitute.
And the generation information off quality shown in the generation information off quality shown in Fig. 5 (a) and Fig. 5 (c) is that parts are substandard products, is defective, and its difference is as follows.
(a) image 86 can be confirmed that parts become on the position of substandard products and leaves scolding tin when checking.Therefore, can infer and to cause obstruction to the installation of adjacent component, cause parts to become substandard products.
(b) image 88 can confirm that the scolding tin on the position of substandard products parts partly peels off when checking.Therefore, can infer that may be that adjacent component collides and destroyed installation, causes the substandard products parts.
＜parts installation quality analytical method 〉
The action of the parts installation quality analytical equipment 30 of said structure then, is described.
Fig. 6 is the flow chart of process of the parts installation quality analytical method of expression an embodiment of the present invention.
As shown in the drawing, after beginning on the hookup wire 1 to produce, measurement result input part 42 receives the parts that are installed in the fitting machine 4 installation site side-play amount before welding or the installation quality information (action A101) of the image of installment state etc. from installation check machine 5.
And mounting condition input part 41 receives at this moment the erection sequence and the operation condition of erection unit, becomes the installation action conditions such as shape of the product of object.(action A102).
And the installation action condition can not changed usually aborning at any time, so, also can when the change condition, correspondingly import.
Secondly, produce in the inspection of check result input part 43 after welding and install under the underproof situation, receive this generation information off quality (action A103) from welding inspection machine 7.
Then, analyze (action A104), whether generation number of packages off quality has been surpassed standard value judged (action N101) by 44 pairs of installation quality information of main cause analysis portion off quality, installation action condition, generation information off quality.
The position offset of the front of 44 pairs of generation parts off quality of main cause analysis portion off quality distributes or produces installation diagram picture when defective etc. and extracts and accumulative total (action A105).Moreover, about the parts adjacent with generation part off quality similarly to the distribution of position offset with produce installation diagram picture when defective etc. and extract and accumulative total (action A106).
And mutual possibility of interference between two parts is inferred according to the defective kinds of information of this accumulated result and generation information off quality by main cause supposition portion 45, and infers the parts (action A107) of defective main cause.According to the mounting condition of the parts that are judged as defective main cause, infer the main cause (action A108) that produces defective.
The correction that countermeasure indication efferent 46 is exported the rejected region of inferring in main cause supposition portion 45 is as countermeasure indication (action A109).
If below certain number of packages, then consideration reduces the increase of the number of quality countermeasure to the underproof number of packages of generation, does not take the quality countermeasure at certain as far as possible.Certainly, also can omit this condition, when generation is defective, all take some countermeasures.
＜action example 〉
At this, in conjunction with the action of concrete example explanation parts installation quality analytical equipment.
At first, the installing component this point is described.
＜install routine 〉
Fig. 7 be the expression an embodiment of the present invention come the synoptic diagram of the action example of installing component with fitting machine.
As shown in the drawing, in fitting machine 4, (parts 20 (R101) of supply such as テ-プ) are inhaled chews 21 absorption maintenances, and is installed on the assigned position of circuit board 10 by conveyer belt.
＜underproof reason takes place 〉
Fig. 8 is the synoptic diagram that produces the underproof reason overview of installation quality on the hookup wire of expression an embodiment of the present invention.
Shown in Fig. 8 (a) and (b), usually inhale when chewing 21 adsorption elements 20 (R101), under the situation of the central portion that does not produce position deviation ground adsorption element 20 (R101), in the time of on the assigned position on being installed to circuit board 10, inhale chew 21 and parts 20 all can not touch adjacent parts 22.
But, shown in Fig. 8 (c), (d), when 21 adsorption elements 20 (R101) are chewed in suction, under the situation of the end that does not produce posture deviation ground adsorption element 20, when party is installed in it on the assigned position on circuit board 10, inhales sometimes and chew 21 and disturb adjacent parts 22 (R102).
And, shown in Fig. 8 (e), (f), when 21 adsorption elements 20 are chewed in suction, produce the posture deviation, under the situation of a part of having adsorbed parts 20, in the time of on the assigned position on being installed in circuit board 10, chewed the adjacent parts 22 of parts 20 meeting interference of 21 absorption sometimes by suction.
And, can not produce these defectives usually.But, when 21 adsorption elements 20 are chewed in suction,, may produce above-mentioned defective owing to position restriction condition etc., inhale and chew 21 the suction or the supply condition of parts 20 (R101) etc. and change.
Fig. 9 (a)～(c) is the synoptic diagram that produces the underproof process of installation quality on the hookup wire of expression an embodiment of the present invention.
At first, shown in Fig. 9 (a), comprising that solder printing 11 has carried out on the circuit board 10 of solder printing parts 20 being installed.At this moment parts 20 (R101) produce the posture deviation and are mounted.
Secondly, shown in Fig. 9 (b), when parts 22 (R102) were installed on the adjacent position of parts 20 (R101), parts 22 and generation posture deviation and the parts 20 (R101) that are mounted disturbed mutually, can not be installed on the correct position.
Then, shown in Fig. 9 (c), when welding, utilize and aim at phenomenon automatically,, become qualified products in that parts 20 (R101) are installed on the tram.
So-called " aiming at phenomenon automatically " is meant the phenomenon that the surface tension of utilizing the scolding tin that has melted is come automatic aligning parts installation site.
Figure 10 (a)～(c) is illustrated in the synoptic diagram that produces the underproof process of installation quality on the hookup wire of an embodiment of the present invention.
At first, shown in Figure 10 (a), for example comprise solder printing 11, parts 20 (R101) have been installed on the circuit board 10 that carries out solder printing in the contact portion.At this moment parts 20 (R101) are not produced posture skew ground installation.
Secondly, shown in Figure 10 (b), at parts 22 (R102) and parts 20 (R101) when installing, parts 20 (R101) with desire to disturb mutually with posture deviation mounted component 22 (R102), and its installation site is offset.
At this moment, parts 20 (R101) for example the parts in solder printing 11 install and under the state of a part of peeling off solder printing 11, to install the vestige 14.Parts 22 (R102) are installed with the posture deviation.
Then, shown in Figure 10 (c), when welding, in that parts 22 (R102) are installed on the tram, become qualified product by automatic aligning phenomenon.
At this, about the supposition in the main cause supposition portion 45, utilize the accumulated result of the installation quality information of accumulative total in main cause analysis portion 44 off quality, describe.
One of＜supposition example 〉
At first, for example (referring to Fig. 3) shown in the installation action condition installing parts 20 (R101) afterwards, is considered as having installed parts 22 (R102).Moreover, shown in Fig. 9 (a)～(c), suppose that going up generation at parts 22 (R102) installs defective.And, in the case, will carry out the Figure 11 that the results are shown in of accumulative total to the installation quality information of generation information off quality (referring to Fig. 5 (a)).
The result that Figure 11 (a)～(d) expression will add up and analyze by every circuit board the installation quality information of generation information off quality.
Figure 11 (a) expression is to the accumulated result of each installation site of parts 20,22 (R101, R102).
Shown in Figure 11 (a), accumulated result 51 is the results that the installation site of mounted component on the circuit board 20 (R101) pressed each circuit board accumulative total.Accumulated result 52 is the results that the installation site of the parts 22 (R102) adjacent with parts 20 (R101) carried out accumulative total by every circuit board respectively.
The contour of the 2 dimension normal distributions of determining according to accumulated result 51,52 is watched in Figure 11 (b) expression from above.
Shown in Figure 11 (b), distribution 53 is 2 dimension normal distributions of determining according to accumulated result 51.Distribution 54 is 2 dimension normal distributions of determining according to accumulated result 52.And, according to distributing in 53,54 as can be seen parts 20 (R101) deflection back mounted component 22 (R102) side.That is to say that the installation site of parts 20 (R101) is moved to parts 22 (R102) lateral deviation.
The installation quality of the parts 22 (R102) that Figure 11 (c) expression is adjacent with parts 20 (R101).
Shown in Figure 11 (c), circular mark 55 is illustrated in the represented position of circular mark and parts 20 (R101) has been installed the installation quality of mounted component 22 (R102) is defective afterwards.Warning triangle 56 is illustrated in the represented position of warning triangle and parts 20 (R101) has been installed the installation quality of mounted component 22 (R102) is defective afterwards.In fact, in the position of leaving parts 22 (R102), under the situation that install the position of being represented by warning triangle, the installation quality of the parts 22 (R102) adjacent with parts 20 (R101) is defective especially in the drawings.
Image when Figure 11 (d) expression is measured the position of installing component 20,22 (R101, R102).
Shown in Figure 11 (d), the graphical analysis result from image 58 when measuring also can confirm parts 22 (R101) deflection parts 22 (R102) side.And, on solder printing 11, can not confirm parts installation vestige.
Following (a) and (b) 2 points are inferred according to above situation by main cause supposition portion 45.And, be estimated as parts 22 (R102) and produce the erection stage that underproof main cause is parts 20 (R101).
(a) surpass under the situation of threshold value to the amount that parts 22 (R102) lateral deviation is moved from the precalculated position of installing at parts 20 (R101), can be speculated as the installation that parts 20 (R101) hinder parts 22 (R102).
(b) because the result who carries out graphical analysis according to image 58 when measuring can not confirm parts vestige is installed, so be speculated as not installing component 22 (R102).
＜infer example two
In addition, for example,, suppose before parts 22 (R102) are installed, to have installed parts 20 (R101) as installation action condition (referring to Fig. 3).And, shown in Figure 10 (a)～(c), go up generation at parts 20 (R101) and install defective.And, in the case, will add up the installation quality information of generation information off quality (referring to Fig. 5 (b)) and obtain the results are shown in Figure 12.
The result that Figure 12 (a)～(d) expression will add up and analyze by every circuit board the installation quality information of generation information off quality.
Figure 12 represents by every circuit board accumulative total generation information off quality and the result that analyzes.
The result of accumulative total is carried out in Figure 12 (a) expression to each installation site of parts 20,22 (R101, R102).
Shown in Figure 12 (a), accumulated result 61 is to be installed in the result of the installation site of the parts 20 (R101) on the circuit board by each circuit board accumulative total.Accumulated result 62 is the results that the installation site of the parts 22 (R102) adjacent with parts 20 (R101) pressed every circuit board accumulative total.
The contour of the 2 dimension normal distributions of determining according to accumulated result 61,62 is watched in Figure 12 (b) expression from above.
Shown in Figure 12 (b), distribution 63 is 2 dimension normal distributions of determining according to accumulated result 61.Distribution 64 is 2 dimension normal distributions of determining according to accumulated result 62.
And according to distributing 63,64 as can be seen, parts 22 (R102) are displaced to first mounted component 20 (R101) side.That is to say that the installation site of parts 22 (R102) is moved to parts 20 (R102) lateral deviation.
The installation quality of the parts 20 (R102) that Figure 12 (c) expression is adjacent with parts 22 (R102).
Shown in Figure 12 (c), it is defective that circular mark 65 is illustrated in the installation quality of 20 (R101) that the represented position upper mounting component 22 (R102) of circular mark installs before.Warning triangle 66 is illustrated in the represented position installing component 22 (R102) of warning triangle, and the installation quality of institute's mounted component 20 (R101) is defective before.In fact near position parts 20 (R101), under the situation of being installed by the represented position of warning triangle, the installation quality of the parts 20 (R101) adjacent with parts 22 (R102) is defective especially in the drawings.
Image during measurement on the position of Figure 12 (d) expression installing component 20,22 (R101, R102).
Shown in Figure 12 (d), the graphical analysis result from image 68 when measuring can confirm that also parts 22 (R102) are offset to parts 20 (R101).And, on solder printing 11, can confirm parts installation vestige 44.
Main cause supposition portion 45 infers following (a) and (b) 2 points according to above situation.And, infer out parts 20 (R101) and produce the erection stage that underproof main cause is parts 22 (R102).
(a) surpass under the situation of threshold value to the amount that parts 20 (R101) lateral deviation is moved from the precalculated position of installing at parts 22 (R102), can be speculated as the installation that parts 22 (R102) hinder parts 20 (R101).
(b) because the result who carries out graphical analysis according to image 68 when measuring can confirm parts vestige is installed, so be speculated as installing component 20 (R101).
＜countermeasure indication 〉
Figure 13 represents to indicate and the content of output as the countermeasure of an embodiment of the present invention.
As shown in the drawing, countermeasure indication efferent 46 output countermeasure indication informations 89, this countermeasure indication information 89 comprises: channel number, defective kind, defective main cause and countermeasure indication etc.
For example, under the situation shown in Fig. 5 (a) and (b), about mounted component 22 (R102) in the circuit board numbering " 03120105 ", if (for example confirm the installation action condition, referring to Fig. 3), then the operation condition storehouse for example is parts 20 (R101), R103 etc., and all the other are with identical with base part, and library name is " 0603R ".
And, produce one of underproof main cause and be, when in fitting machine 4 (referring to Fig. 1) with inhaling when chewing adsorption element 20 (R101), chew the site error at center with respect to suction.
Moreover shown in Figure 11 (b), owing to the absorption deviation to parts 20 (R101), parts 22 (R102) produce off quality.That is to say, can infer and chew the position deviation at center and parts 22 (R102) produce the defective relation that has with respect to suction.
According to above-mentioned situation, be conceived to the box numbering and inhale the difference of chewing numbering.46 outputs of countermeasure indication efferent are chewed relevant countermeasure indication with box or suction, and for example the replacing of box is indicated and inhaled the countermeasures such as cleaning of chewing and indicate.
＜sum up
As described abovely like that utilize the parts installation quality analytical equipment 30 of execution mode, the defective generation of the parts substandard products that produce indirectly for the past etc. also can be inferred the underproof main cause of generation, can receive the countermeasure indication corresponding with it.
＜other 〉
And, parts are installed vestige and also can be detected like this, promptly in main cause supposition portion, for example by the image of being taken by colored CCD is carried out graphical analysis, extract part of carrying out solder printing and the portion boundary of having peeled off solder printing, extract the part that both sides, border color changes, detect.
And, generation information off quality also can be to have different multiple criterions, promptly be judged as the underproof criterion except actual, do not reach underproof degree as yet in addition but can be judged as quality and be in the degradating trend, the defective generation information that input is judged with these criterions, carry out same analysis, take some countermeasures, can prevent to produce the defective of reality in advance.
And, generation information off quality can be not yet according to the testing result of CCD that welding inspection machine 7 possessed etc., but, be input in the parts installation quality analytical equipment according to the result of visual inspection etc.
Moreover, the formation portion more than 1～2 of component parts installation quality analytical equipment, both can be provided to hookup wire separately and independent device also can be assembled in the hookup wire.
And the formation portion more than 1～2 of component parts installation quality analytical equipment also can utilize the software program of being carried out by computer (hereinafter referred to as parts installation quality routine analyzer) to realize.
And parts installation quality analytical equipment is the computer system with CPU (CPU (central processing unit)), RAM (random access memory), ROM (read-only memory), HD (hard disk), network interface.Moreover OS (operating system) and parts installation quality routine analyzer are installed on the HD.And, also can realize the formation portion more than 1～2 of component parts installation quality analytical equipment by at OS execution unit installation quality in service routine analyzer.
Moreover, parts installation quality routine analyzer also can record on the recording medium that computers such as optical record medium (for example CD-ROM etc.), magnetic recording medium (for example HD etc.), magneto-optic recording medium (for example MO etc.), semiconductor memory (for example ROM etc.) can read, and is carried out by other computer systems.Perhaps, also can be to be recorded on the HDD (hard disk drive) set in the computer system that connects by network, carry out by other computer systems that read by network.
Utilizability on the industry
The present invention especially can use as parts installation quality analytical method etc.
Claims (9)
1, a kind of parts installation quality analytical method is analyzed the installation quality that is installed on the electronic unit on the circuit board, it is characterized in that, comprises following operation:
Abstraction process, (a) the position of electronic unit is installed on circuit board as the installation position, the information of the installation position of implementing to measure before the soldering as installation quality information, (b) being decided to be position off quality in the installation position as defective position, the information at the defective position of implementing to check out after the soldering as generation information off quality, (c), (d) from above-mentioned generation information off quality and above-mentioned installation quality information, extract above-mentioned analytic target information under the situation of information as analytic target information of defective position and the installation position that is adjacent;
Analysis procedure adds up the analytic target information of extracting by every circuit board, and the association between each analytic target information is analyzed;
Infer operation,, infer whether during the installation at defective position handled and the installation of the installation position that is adjacent handled any is main cause off quality according to analysis result; And
Countermeasure indication output operation, output are used to indicate carries out improved countermeasure indication to the installation processing of being inferred.
2, parts installation quality analytical method as claimed in claim 1 is characterized in that: above-mentioned generation information off quality is represented off quality by the parts unit that is installed on the circuit board.
3, parts installation quality analytical method as claimed in claim 1 is characterized in that: above-mentioned generation information off quality is divided into a plurality of stages by the installation quality standard.
4, parts installation quality analytical method as claimed in claim 1 is analyzed the installation quality of the circuit board of joining at the enterprising luggage of hookup wire, it is characterized in that, also comprises:
Installation quality message pick-up operation will receive as above-mentioned installation quality information in the information of the installation position of implementing on the hookup wire to measure before the soldering; And
Generation message pick-up operation off quality, the information that will implement the defective position checked out after the soldering on hookup wire receives as generation information off quality.
5, parts installation quality analytical method as claimed in claim 1 is characterized in that, above-mentioned parts installation quality analytical method also comprises:
Measure operation, implementing to measure the installation position before the soldering; And
Check operation, after implementing soldering, check the installation position,
Above-mentioned installation quality information is the information of the installation position measured in above-mentioned measurement operation,
Above-mentioned generation information off quality is the information at the defective position checked out in checking operation.
6, a kind of parts installation quality analytical equipment is analyzed the installation quality of the circuit board of joining at the enterprising luggage of the hookup wire with fitting machine, it is characterized in that having:
The installation quality information receiver as the installation position, will receive the position of on the circuit board electronic unit being installed in the information of the installation position of implementing on the hookup wire to measure before the soldering as installation quality information; And
Generation information receiver off quality, being decided to be position off quality in the installation position as defective position, the information that will implement the defective position checked out after the soldering on hookup wire receives as generation information off quality;
Extraction element extracts defective position and the information of the installation position that is adjacent, as analytic target information from generation information off quality and installation quality information;
Analytical equipment adds up the analytic target information of extracting by every circuit board, and the association between each analytic target information is analyzed;
Apparatus for predicting according to analysis result, infers whether some during the installation at defective position handled and the installation of the installation position that is adjacent handled is main cause off quality; And
Countermeasure indication output device, output are used to indicate the installation processing that quilt is inferred to carry out improved countermeasure indication.
7, parts installation quality analytical equipment as claimed in claim 6 is characterized in that: above-mentioned generation information off quality is represented off quality by the component unit that is installed on the circuit board.
8, parts installation quality analytical equipment as claimed in claim 6 is characterized in that: above-mentioned generation information off quality is divided into a plurality of stages by the installation quality standard.
9, a kind of hookup wire has on circuit board the fitting machine that electronic unit is installed, and the installation quality of the electronic unit installed on the circuit board that assembles on the above-mentioned fitting machine is analyzed, and it is characterized in that having:
Measurement mechanism before implementing soldering, will be installed the position of electronic unit and measure as the installation position on circuit board;
The installation quality information receiver receives the information of measured installation position as installation quality information;
Testing fixture after implementing soldering, is checked as defective position being decided to be position off quality in the installation position;
Generation information receiver off quality receives the information at tested defective position of finding as generation information off quality; And
Extraction element extracts defective position and the information of the installation position that is adjacent, as analytic target information from generation information off quality and installation quality information;
Analytical equipment adds up the analytic target information of extracting by every circuit board, and the association between each analytic target information is analyzed;
Apparatus for predicting according to analysis result, infers whether some during the installation at defective position handled and the installation of the installation position that is adjacent handled is main cause off quality; And
Countermeasure indication output device, output are used to indicate the installation processing that quilt is inferred to carry out improved countermeasure indication.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004258946A JP4020900B2 (en) | 2004-09-06 | 2004-09-06 | Component mounting quality analysis method and component mounting quality analysis device |
| JP258946/2004 | 2004-09-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1747648A CN1747648A (en) | 2006-03-15 |
| CN100502634C true CN100502634C (en) | 2009-06-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510091110 Expired - Fee Related CN100502634C (en) | 2004-09-06 | 2005-08-08 | Component installation quality analysis method and analyzing apparatus |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4020900B2 (en) |
| CN (1) | CN100502634C (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007081318A (en) * | 2005-09-16 | 2007-03-29 | Omron Corp | Method and device for outputting inspection result, program for outputting inspection result, and record medium on which program for outputting inspection result is recorded |
| JP4896855B2 (en) * | 2007-11-14 | 2012-03-14 | ヤマハ発動機株式会社 | Component mounting system |
| CN103597920B (en) * | 2011-05-31 | 2016-06-29 | 富士机械制造株式会社 | To base board operation assisting system and to base board operation support method |
| TWI595963B (en) * | 2015-08-18 | 2017-08-21 | Machvision Inc | Automatic feeding device |
| JP6734722B2 (en) * | 2016-07-22 | 2020-08-05 | 株式会社Ｆｕｊｉ | Quality control system |
| CN110023861B (en) * | 2016-08-22 | 2023-01-13 | 罗伯特·博世有限公司 | System and method for monitoring a manufacturing plant |
| KR102484442B1 (en) * | 2016-12-08 | 2023-01-02 | 한화정밀기계 주식회사 | Chip Mounter |
| WO2019146004A1 (en) * | 2018-01-23 | 2019-08-01 | 株式会社Ｆｕｊｉ | Correspondence relationship generation device |
| JP7349596B2 (en) * | 2018-12-27 | 2023-09-25 | パナソニックＩｐマネジメント株式会社 | Substrate processing system |
| US20220142025A1 (en) * | 2019-03-27 | 2022-05-05 | Fuji Corporation | Analysis device |
| CN115423803B (en) * | 2022-10-19 | 2023-03-24 | 武汉中关村硬创空间科技有限公司 | Assembly detection method, device, equipment and storage medium |
-
2004
- 2004-09-06 JP JP2004258946A patent/JP4020900B2/en not_active Expired - Fee Related
-
2005
- 2005-08-08 CN CN 200510091110 patent/CN100502634C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1747648A (en) | 2006-03-15 |
| JP4020900B2 (en) | 2007-12-12 |
| JP2006073961A (en) | 2006-03-16 |
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