CN100490105C - 一种半导体芯片的灌胶方法及模具 - Google Patents
一种半导体芯片的灌胶方法及模具 Download PDFInfo
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- CN100490105C CN100490105C CNB2007100359828A CN200710035982A CN100490105C CN 100490105 C CN100490105 C CN 100490105C CN B2007100359828 A CNB2007100359828 A CN B2007100359828A CN 200710035982 A CN200710035982 A CN 200710035982A CN 100490105 C CN100490105 C CN 100490105C
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CNB2007100359828A CN100490105C (zh) | 2007-10-29 | 2007-10-29 | 一种半导体芯片的灌胶方法及模具 |
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CNB2007100359828A CN100490105C (zh) | 2007-10-29 | 2007-10-29 | 一种半导体芯片的灌胶方法及模具 |
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CN101145528A CN101145528A (zh) | 2008-03-19 |
CN100490105C true CN100490105C (zh) | 2009-05-20 |
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Families Citing this family (6)
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CN101262757B (zh) * | 2008-04-09 | 2011-02-09 | 艾默生网络能源有限公司 | 用于对电源模块灌胶的工具及其灌胶方法 |
CN101964314B (zh) * | 2010-08-21 | 2012-02-01 | 山东开元电子有限公司 | 自校准发光二极管框架灌胶胶接方法 |
CN102683232B (zh) * | 2012-05-31 | 2015-08-19 | 无锡佰恒光电科技有限公司 | 一种半导体封装模具及其封装工艺 |
DE102015112527B4 (de) * | 2015-07-30 | 2018-11-29 | Lapmaster Wolters Gmbh | Vorrichtung und Verfahren zum Eingießen eines ringförmigen Kunststoffrahmens in eine Ausnehmung einer Läuferscheibe einer Doppelseitenbearbeitungsmaschine |
CN107785764A (zh) * | 2016-08-31 | 2018-03-09 | 南京晨光集团有限责任公司 | 一种用于灌封工艺的电连接器固定装置 |
CN112599428B (zh) * | 2020-12-11 | 2023-07-07 | 深圳平晨半导体科技有限公司 | 一种芯片封装组件 |
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Address after: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee after: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. Address before: 412001 Hunan Province, Zhuzhou Shifeng District Tian Xin North Gate Patentee before: ZHUZHOU CSR TIMES ELECTRIC Co.,Ltd. |
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Effective date of registration: 20201016 Address after: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Patentee after: Zhuzhou CRRC times Semiconductor Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. |