CN100484644C - Coating apparatus and coating method - Google Patents
Coating apparatus and coating method Download PDFInfo
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- CN100484644C CN100484644C CNB2005100840664A CN200510084066A CN100484644C CN 100484644 C CN100484644 C CN 100484644C CN B2005100840664 A CNB2005100840664 A CN B2005100840664A CN 200510084066 A CN200510084066 A CN 200510084066A CN 100484644 C CN100484644 C CN 100484644C
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
- B05C1/14—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a travelling band
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0011—Pre-treatment or treatment during printing of the recording material, e.g. heating, irradiating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/007—Digital printing on surfaces other than ordinary paper on glass, ceramic, tiles, concrete, stones, etc.
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/0027—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using protective coatings or layers by lamination or by fusion of the coatings or layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
Abstract
The invention relates to a coating device and a coating method, which makes coating liquid coated on a substrate dried on the coated area of the substrate evenly and dried coating material have even shape in addition to avoiding the unevenness of the coating material. According to the coating method, the coating liquid containing solute and solvent is coated on the set area of the substrate and the solvent is volatilized. In the process that solute cured resin is produced on the substrate and before the coating on the set area of the substrate is finished, the environment around the coated area on the substrate is inhibitory to the volatilization of the solvent.
Description
Technical field
The present invention relates to a kind of when the manufacturing of such electronic component such as display unit of utilizing semiconductor device or liquid crystal panel or organic EL (electroluminescent) panel employed applying device and coating method.
Background technology
When the manufacturing of such electronic component such as display unit of utilizing semiconductor device and liquid crystal panel or organic EL panel, by the aqueous solution or the coating liquid that contains inorganic or organic solvent are applied on substrate, and the film that carries out on-chip functional layer and photoresist layer etc. forms.As this coating method, whirl coating and ink-jet method are arranged, cut apart coating process etc.In these coating methods, ink-jet method is used to carry out the film forming that such fine patterns such as the luminescent layer of display unit and color-filter layer are made.
When applying engineering when the manufacturing at this electronic component, the dry situation of coated coating liquid can not reach in on-chip setting regions evenly sometimes, have uneven drying and dry solidification problems such as the shape that is coated with application is different.
For example, utilizing ink-jet method to make of the applicator head ejection of solution such as organic EL ink from ink-jet coating apparatus, and under situation about applying on the glass substrate, sometimes the coated zone on glass substrate can produce uneven drying, or in coating liquid drying the generation difference in shape of solidfied material (ink).This uneven drying and the shape difference that is coated with application can bring harmful effect to the manufacturing of electronic component, so preferably suppress as much as possible.
In patent documentation 1, the coating machine ergosphere forms with liquid and carries out the dry method of making the function element about utilizing ejection method such as ink-jet method, a kind of flatness for the functional layer that obtains manufacturing has been proposed, and the shape of functional layer is checked, and accelerate or delay the method for evaporation rate of the solvent of dry engineering according to its shape.
But, the method that patent documentation 1 is recorded and narrated, for a kind of be conceived to utilize gunite on substrate the shape of each functional layer of penetrating, and want method that shape is controlled, may not on on-chip coated zone, prevent the difference of uneven drying and shape.
The spy of [patent documentation 1] Japanese Patent Laid Open Publication opens the 2003-266003 communique
Summary of the invention
The purpose of this invention is to provide in view of the above problems a kind of and form, the drying of coating liquid coated on the substrate is evenly carried out in the coated zone of substrate, and can prevent to be coated with the inequality of application, and applying device and coating method that the dried shape that is coated with application is evenly formed effectively.
Applying device of the present invention comprises: the coating liquid that will contain solute and solvent is coated in the interior coating element of on-chip setting regions; Before the coating to aforementioned on-chip setting regions finishes, make near the aforementioned on-chip coated environment in zone, remain on the environment holding unit of the environment that suppresses the aforementioned solvents volatilization; Make this regional area carry out the even dryingization unit that drying makes the even dryingization in zone of having carried out coating on the aforementioned substrate, described even dryingization unit, for at the air knife apparatus that is coated with near the outlet that is provided with gas the on-chip setting regions of aforementioned coating liquid and attracts mouthful, and this outlet gas supplied is attracted by this attractions mouth certainly.
And in applying device of the present invention, when coating element is the ink-jet coating unit, use comparatively favourable.
And, in applying device of the present invention, also have the even dryingization unit in the zone of on aforementioned substrate, having carried out coating, can further prevent the uneven drying of the area of application, and make the shape that is coated with application more even, so be favourable.
And, coating method of the present invention is that a kind of coating liquid that will contain solute and solvent is coated on the on-chip setting regions and makes solvent evaporates, and on aforementioned substrate, form the coating method of the solidfied material of solute, wherein: before the coating to aforementioned on-chip setting regions finishes, make near the environment in zone that has carried out coating on the aforementioned substrate, remain on the environment that suppresses the aforementioned solvents volatilization, utilization is arranged near the outlet and the attraction mouth of the gas of the air knife apparatus the on-chip setting regions that is coated with aforementioned coating liquid, make the outlet of gas and attract mouthful between produce air-flow partly near the coated zone, make this regional area carry out drying.
And, in coating method of the present invention, make near the environment in zone that has carried out coating on the aforementioned substrate, formation is good more than or equal to 40% of the saturated concentration of aforementioned solvents smaller or equal to 100% environment, contain under the situation of water at aforementioned coating liquid, make near the environment the coated zone on the aforementioned substrate, forming humidity is good more than or equal to 40% smaller or equal to 85% environment.
And, in coating method of the present invention, also can carry out near the environment in zone of coating on the substrate, the solvent different kinds of liquid solvents environment in formation and the aforementioned coating liquid, and before coating liquid drying coated on the substrate, the solvent in this coating liquid is replaced.
As utilize the present invention, can prevent that coating is uneven, and can make the shape that is coated with application even.
The present invention compared with prior art has tangible advantage and beneficial effect.Via as can be known above-mentioned, the invention relates to that a kind of drying of coating liquid coated on the substrate that makes evenly carries out in the coated zone of substrate, and can prevent to be coated with the inequality of application, and applying device and coating method that the dried shape that is coated with application is evenly formed effectively.This coating method applies and makes solvent evaporates at the coating liquid that will contain solute and solvent on on-chip setting regions, and on aforementioned substrate, form in the process of solidfied material of solute, in near the environment in zone that finished before the coating of aforementioned on-chip setting regions, make to have carried out on the aforementioned substrate coating.Remain a kind of environment that the volatilization of aforementioned solvents is suppressed.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Figure 1 shows that as about the applying device of an example of the present invention the stereogram of all formations of jetting applicator 1.
Fig. 2 is the key diagram of coating element of the applying device of Fig. 1.
Fig. 3 is the ideograph that is used to illustrate the evaporation mechanism that applies liquid.
Fig. 4 is the stereogram of an example with applying device of the present invention of even dryingization unit.
Fig. 5 is the stereogram of another example with applying device of the present invention of even dryingization unit.
Fig. 6 be Fig. 5 want portion's key diagram.
Figure 7 shows that the plot of the relation of placing ambiance and photoresist drying regime.
1: ink-jet coating apparatus 2: base
11: ink coating box (environment holding unit)
12: supply pipe 13: discharge pipe
21: go up facial 22:X workbench
23:Y workbench 24: objective table
25: support 26: the applicator head unit
26a: lift component 26b:L shape supporter
26c: applicator head 32: blast pipe
31: attract ventilator cowling (evenly dryingization unit)
41: air knife apparatus (evenly dryingization unit)
41a: spray with air knife nozzle 41b: attract to use the air knife nozzle
41c, 41d: conduit L: coating liquid
S: substrate
The specific embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to applying device and its specific embodiment of coating method, structure, method, step, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Below, utilize diagram that example of the present invention is described.
Figure 1 shows that as about an example of the present invention all formation stereograms of ink-jet coating apparatus 1.In with figure, set coating element on the upward face 21 of ink-jet coating apparatus 1 covering base 2, and the ink that is provided with as the environment holding unit applies box 11.On this ink coating box 11, being equipped with will be from the supply pipe 12 of the gas channeling ink coating box 11 of not shown gas supply source, and is connected ink is applied discharge pipe 13 on the exhaust apparatus that the gases in the box 11 discharge.At the desired location of ink coating box 11, be provided with the detector of gas concentration, can carry out the gas in the ink coating box 11 and the concentration of moisture and detect.Be fed into kind and the concentration of gas or the flow of humidity and gas of the gas in the ink coating box 11, can change or adjust, and kind and the concentration of gas or the flow of humidity and gas by these gases of control, can make the environment in the ink coating box 11, remain a kind of environment that the volatilization of aforementioned solvents is suppressed.
Utilize Fig. 2, the formation that this ink is applied the applying device in box 11 describes.
Be disposed with X workbench 22, Y workbench 23 on facial 21 on the base 2, and the objective table 24 of on Y workbench 23, supporting to have the substrate that will apply to keep.At this maintenance substrate S above objective table 24.The glass substrate that this substrate S uses for for example organic electroluminescence panel, but utilize the coated substrate of applying device of the present invention, be not limited to this glass substrate.
And on face 21 on the base 2, the support 25 of door shape uprightly is provided with the form of crossing over objective table 24, and on the support 25 of this shape, applicator head unit 26 is installed.This applicator head unit 26 comprises lift component 26a on the support 25 that is installed in a shape along the vertical direction movably, be installed in L shaped supporter 26b on the side of this lift component 26a, downward from the horizontal part of this L shaped supporter 26b, the applicator head 26c that installs rotationally as rotating shaft with vertical direction.
In applying device shown in Figure 2, by illustrated providing ink tube never, to with objective table 24 on the substrate S that kept supply with ink in abutting connection with the applicator head 26c of configuration, and from applicator head 26c to substrate S spraying and applying liquid, and make substrate S utilize moving and moving of X workbench 22 and Y workbench 23, can make the setting regions on the substrate S coated.
At this moment, in known techniques, as previously mentioned, sometimes from applicator head 26c ejection and on substrate S penetrate and the shape of dry ink can produce difference.Its reason is considered to, because of be coated with on the substrate ink the zone near environmental condition and different, the change of flow conditions, make the rate of drying of the ink of penetrating different in the area of application, the result is producing difference in shape.And, on on-chip zone of carrying out coating, when the substrate S on the objective table 24 is relatively moved to applicator head 26c, and when carrying out the coating of setting regions, because from initial the ink of penetrating, solvent volatilizees successively, so the solvent strength near the environment coated zone can increase gradually sometimes, make rate of drying produce difference thus, produce the difference of uneven drying and shape sometimes.
Utilize ideograph shown in Figure 3, the evaporation mechanism that utilizes ink discharge device coated coating liquid (ink) on substrate is described.Coating liquid L is the shape after applying on the substrate S just, forms the shape shown in Fig. 3 (a).This shape for example with the ink of organic EL under situation about applying on the glass substrate, in order to form ink marks by fine design producing, can be by the control of the wetability of the adjustment of the viscosity that applies liquid and substrate, and form illustrated the sort of shape.
When beginning to apply liquid L dry on substrate S, shown in Fig. 3 (b), solvent spreads to ambient atmos from the surface of coating liquid L and forms steam layer G, and in the generation convection current of the inside of coating liquid L.At this moment, specific area is big mutually with central portion for the edge part of the width of coating liquid L, and the solvent strength near the environment the edge part is also thin than central portion.Therefore, can preferentially carry out drying from edge part.As a result, shown in Fig. 3 (c), though the edge part evaporation is fast, because surface tension rises, play the effect of the coating liquid that stretches, the result is all as coating liquid, forms the recess shapes of edge part protuberance.At the volatility height of the solvent of coating in the liquid, under the too fast situation of rate of drying, dryly under this shape, finish, so coating liquid forms the solidfied material of spill.
In addition, under the suitable situation of rate of drying, proceed drying from the state of Fig. 3 (c), shown in Fig. 3 (d), many from the evaporation change of width central portion, the surface tension of central portion is risen, as all shapes of coating liquid, form and recover the such shape of original shape.Then, when the drying of edge part finishes, shown in Fig. 3 (e), only continue evaporation, play the effect that coating liquid is stretched to center position at central portion, the result, final shown in Fig. 3 (f), form the solidfied material of central part and the roughly the same height of edge part.
Like this,, and make the shape difference of resulting solidfied material by the rate of drying of coating liquid coated on substrate, and, when when the regional inner drying speed of having carried out coating produces difference, can produce the irregular of uneven drying and solidfied material shape.
Therefore, in the applying device 1 of an example of the present invention shown in Figure 1, remain the environment holding unit of the environment that suppresses solvent evaporates as near the environment in zone that coating will have been carried out on the substrate S, has ink coating box 11, and in this ink coating box 11, to on face 21 on the base 2, take in airtight conditions with applying device by maintained substrate S.And, in order to adjust the environment of this ink coating box 11, kind and the concentration of gas or the flow of humidity and gas of the gas control imports to ink coating box 11 from supply pipe 12 in, and finished before the coating of on-chip setting regions, make near the environment in zone that has carried out coating on the aforementioned substrate, remain a kind of environment that suppresses the aforementioned solvents volatilization, so on all zones in coated zone, do not produce drying or significantly delay.And, finishing the coating back by gaseous species and/or environment (gas concentration, humidity, gas flow) in the change ink coating box 11, can make coated zone carry out drying with identical condition, so be difficult to produce the difference of on-chip coating liquid local desiccation speed, therefore can prevent that coating is uneven, and can prevent the uneven homogenize of shape.
The environment that solvent evaporates in the ink coating box 11 are suppressed like this, 40% preferable for more than or equal to the saturated concentration of solvent smaller or equal to 100% environment.When utilizing solvent for the aqueous solution of water during for coating liquid, form more than or equal to the saturated concentration of solvent 40% smaller or equal to 85% environment, even the humidity of environment is good more than or equal to 40% smaller or equal to 85%.
The saturated concentration of solvent less than 40% environment under, too fast for coating liquid rate of drying, and can't obtain good shape about being coated with application.And, in applying the clean room of engineering, form humidity usually, so under the situation of the coating liquid that utilizes the aqueous solution, control can bring harmful effect to shape on the contrary than the low humidity of the humidity in the clean room and unrealistic more than or equal to 40% environment.On the other hand, the viewpoint of the volatilization during suppress setting regions applied, the solvent strength height in the environment is preferable, also can be 100% environment of solvent saturated concentration., be under the situation of the aqueous solution at coating liquid, when to form humidity be 100% environment, reach dew point in the applying device, might produce applying device electric circuit short circuit and get rusty, so preferably make humidity in the environment on be limited to 85%.In the practicality as be about 70%, then can not produce the short circuit of above-mentioned electric circuit and the problem of getting rusty, so comparatively suitable.
Then, will apply liquid after finishing coating on the setting regions of substrate, and be preferably on the zone of having carried out coating and carry out drying equably.Therefore, in applying device of the present invention, can also have the even dryingization unit in zone coated on aforementioned substrate.
Utilize stereogram shown in Figure 4. to have this evenly an enforcement of the applying device of the present invention of dryingization unit describe.In addition, in with figure for the ease of carrying out the explanation of uniforming device, ink shown in Figure 1 coating box 11 not shown in the diagram, even but in the example shown in the figure, in order to finish before the coating of aforementioned on-chip setting regions, near the environment in zone that has carried out coating on the substrate is remained a kind of environment that suppresses solvent evaporates, also be provided with ink coating box 11.And, in figure,, pay with identical symbol, and the repetitive description thereof will be omitted below to the member identical with Fig. 1 and Fig. 2.
As even dryingization unit, in applying device shown in Figure 4, make the applicator head 26c that covers applicator head unit 26 and near the attraction ventilator cowling 31 the substrate S on the objective table 24, with substrate S in abutting connection with setting.This attraction ventilator cowling 31 is in the box-shaped that has opening on the part of substrate S, and is supported by the support 25 of door shape by not shown supportive device.On illustrated attraction ventilator cowling 31, be connected with blast pipe 32 in side surface part, and, can discharge the environmental gas that attract in the cover 31 by this blast pipe 32 is connected with not shown exhaust apparatus.
So, utilize illustrated attraction ventilator cowling 31, can be to the attraction exhaust of the environmental gas part in the zone of having carried out coating on the substrate S, so the zone drying equably of coating that can make carrying out in the zone that is equivalent in attracting case 31, be capped.And, near attraction case 31,, can adjust rate of drying by not shown airspeedometer or air volume meter are set.
Applying device as shown in Figure 4 utilizes like that and attracts exhaust to carry out drying, compares with make its dry drying unit to the substrate surface jet-stream wind, because the influence scope in one's power of air-flow limited, so the air-flow around being difficult to confuse.Therefore, can not bring harmful effect, will carry out the even partly drying in dry zone and make, so comparatively favourable to carrying out zone in addition, dry zone.
Fig. 5 and Figure 6 shows that the applying device of the present invention with even dryingization unit another example all stereograms (Fig. 5) and want portion's stereogram (Fig. 6).In addition, even in Fig. 5 and Fig. 6, for the ease of carrying out the explanation of homogenising unit, ink shown in Figure 1 coating box 11 not shown in the diagram, even but in the example shown in the figure, in order to finish before the coating of aforementioned on-chip setting regions, near the environment in zone that has carried out coating on the substrate is remained a kind of environment that suppresses solvent evaporates, also be provided with ink coating box 11.And, in these diagrams,, pay with identical symbol, and the repetitive description thereof will be omitted below to the member identical with Fig. 1 and Fig. 2.
In Fig. 5 and example shown in Figure 6, evenly the dryingization unit is an air knife apparatus 41.This air knife apparatus 41 has to spray to be used air knife nozzle 41a and attracts to use air knife nozzle 41b, and utilize not shown supportive device in the face parallel, to support by the support 25 of door shape movably with substrate S, and spray with the nozzle opening of air knife nozzle 41a and attract nozzle opening form parallel to each other with this with air knife nozzle 41b, roughly with substrate S in abutting connection with configuration.On spraying with air knife nozzle 41a, be connected with another end that on not shown air blast, connects the conduit 41c of an end, attracting to be connected with another end that on not shown pump, connects the conduit 41d of an end with air knife nozzle 41b.And, by spraying gas (air) from the nozzle opening that sprays with air knife nozzle 41a, and attract with the nozzle opening of air knife nozzle 41b from attracting, can make this injection with air knife nozzle 41a with attract with producing air-flow partly near the zone coated between the air knife nozzle 41b, so can make this regional area carry out drying equably.And, under this example, though use air knife nozzle 41a gas jet partly from spraying, but attract the gas of ejection to be attracted to reclaim with air knife nozzle 41b because utilize, so can not bring harmful effect, can make the zone of wanting dry carry out even drying partly to wanting to carry out zone in addition, dry zone.
Even dryingization of the present invention unit is not limited to Fig. 4～example shown in Figure 6.For example, in applying device shown in Figure 1, also can be by finishing before the coating of on-chip setting regions, the environment that ink is applied in the box 11 remains a kind of environment that the volatilization of aforementioned solvents is suppressed, and after finishing coating, from discharge pipe 13 gas that ink applies in the box 11 is discharged, make in the ink coating box 11 and form reduced pressure atmosphere, and make coating liquid coated on the substrate carry out drying equably.
Secondly, in coating method of the present invention, also can finish before the coating of on-chip setting regions, carried out near the environment the zone of coating on aforementioned substrate, when remaining a kind of environment that the volatilization of aforementioned solvents is suppressed, make near the environment the zone of having carried out coating on the aforementioned substrate, form with aforementioned coating liquid in solvent different kinds of liquid solvents environment, and the solvent that will apply in the liquid before the coated coating liquid drying on substrate is replaced.For example, about coating liquid, sometimes as the characteristic of the desired solvent of solvent of dissolving solute, and can not be fully satisfied under a kind of solvent in the characteristic of the rate of drying that applies the desired solvent in back on the substrate.When the front and back in this coating require a plurality of characteristic, by being applied on the substrate and under the undried state at coating liquid, near the coating liquid environment is formed the saturated environment of the solvent different with the solvent of coating liquid, can apply in appearance under the not dried state of liquid, the solvent of coating liquid coated on the substrate is replaced, and can satisfy a plurality of characteristics that require.Specifically, can in ink cartridge 11, supply with the gas that forms the solvent different with the solvent of coating liquid.
Below, the embodiment that utilizes applying device of the present invention is described.
(1) in ink-jet coating apparatus shown in Figure 1, will in the tetrahydronaphthalene solvent, add the conduct coating liquid of organic EL ink 1%, and under nitrogen environment, remove and exhaust, applying (known example) in the on-chip bank (bank).Then, utilize heating plate to carry out drying.As a result, even change the coating condition in abutting connection with luminance nonuniformity in the substrate face, also form 2～7% scope.
Relative therewith, in ink-jet coating apparatus shown in Figure 1 in the process that applies in the on-chip bank, in will forming the ink coating box that saturated nitrogen supplies to applying device with tetrahydronaphthalene, and when when abundant displacement, similarly carrying out ink jet printing, drying in the coating is suppressed, the adjacency luminance nonuniformity is measured carrying out drying back by heating plate, be accommodated in 0.5%～2% scope.
(2) then, utilize the coating liquid that PEDOT is dissolved with 0.2% concentration in water, similarly apply experiment with above-mentioned (1).Utilize water as the solvent substituted-tetrahydro naphthalene that applies liquid in this experiment.As a result, thickness difference is issued to about 30% in the situation of not carrying out environment control in the face in the bank, and is relative therewith, when carrying out environment control make the temperature of ink coating box be 70% in coating, is accommodated in below 5%.
(3) in the example of above-mentioned (1), (2), before after coating finishes, heating by heating plate, as shown in Figure 5, under the state that makes a pair of air knife adjacency, when desiccant nitrogen being discharged from attract and on substrate, scanning with certain speed, though also be subjected to Influences on Wind Velocity, but present the improvement about 20～40%.
(4) then, carry out the experiment of the solvent different kinds of liquid solvents environment in formation and the coating liquid with near the environment the zone coated on the substrate.The utilization of coating liquid is dissolved colored photoresist in cyclohexanone coating liquid.Should apply liquid and on glass substrate (about 5cm angle), apply, and place in the applying device that forms the saturated environment of PEGMIA.On the other hand, as a comparative example, also carry out the experiment under the situation in the applying device that places the atmospheric environment that forms flow 0.34m/s.
The weight change of placing before and after handling is measured with precision balance.Its result such as table 1 and shown in Figure 7.
By table 1 and Fig. 7 as can be known, even be under the situation of environment of the different solvent of cyclohexanone (PEGMIA) forming with the solvent of coating liquid, also can be in long-time the inhibition drying.
As can be known from the above results, according to the present invention,, can promote to be coated with the even planarization and dry delay of application, and be easy to generate the shape uniformity that is coated with application by when applying, substrate surface being remained in the solvent environment.
In addition, be under the situation of water at solvent, when forming, be easy to generate the short circuit of rust and electric circuit because of dewfall more than or equal to 85% ambient concentration.Above-mentioned as can be known effect roughly begins to present more than or equal to 40% ambient concentration the time, reaches maximum 100% o'clock effect.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, but every content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (8)
1, a kind of applying device comprises: the coating liquid that will contain solute and solvent is coated in the interior coating element of on-chip setting regions; Before the coating to aforementioned on-chip setting regions finishes, make near the aforementioned on-chip coated environment in zone, remain on the environment holding unit of the environment that suppresses the aforementioned solvents volatilization; Make the even dryingization unit of the even dryingization in zone of having carried out coating on the aforementioned substrate, it is characterized in that:
Described even dryingization unit, at the air knife apparatus that is coated with near the outlet that is provided with gas the on-chip setting regions of aforementioned coating liquid and attracts mouthful, and this outlet gas supplied is attracted by this attractions mouth certainly.
2, applying device according to claim 1 is characterized in that wherein said coating element is the ink-jet coating unit.
3, applying device according to claim 1 and 2 is characterized in that making near the environment the zone of having carried out coating on the aforementioned substrate, form more than or equal to the saturated concentration of aforementioned solvents 40% smaller or equal to 100% environment.
4, applying device according to claim 1 and 2 is characterized in that containing under the situation of water at aforementioned coating liquid, makes near the environment the zone of having carried out coating on the aforementioned substrate, form humidity more than or equal to 40% smaller or equal to 85% environment.
5, a kind of coating method, for a kind of coating liquid that will contain solute and solvent is coated on the on-chip setting regions and makes solvent evaporates, and on aforementioned substrate, form the coating method of the solidfied material of solute, may further comprise the steps: before the coating to aforementioned on-chip setting regions finishes, make near the environment in zone that has carried out coating on the aforementioned substrate, remain on the environment that suppresses the aforementioned solvents volatilization;
It is characterized in that:
Utilization is arranged near the outlet and the attraction mouth of the gas of the air knife apparatus the on-chip setting regions that is coated with aforementioned coating liquid, make the outlet of gas and attract mouthful between produce air-flow partly near the coated zone, make this regional area carry out drying.
6, coating method according to claim 5 is characterized in that making near the environment the zone of having carried out coating on the aforementioned substrate, form more than or equal to the saturated concentration of aforementioned solvents 40% smaller or equal to 100% environment.
7, coating method according to claim 5 is characterized in that containing under the situation of water at aforementioned coating liquid, makes near the environment the zone of having carried out coating on the aforementioned substrate, form humidity more than or equal to 40% smaller or equal to 85% environment.
8, coating method according to claim 5, it is characterized in that and to have carried out near the environment in zone of coating on the aforementioned substrate, solvent different kinds of liquid solvents environment in formation and the aforementioned coating liquid, and before coating liquid drying coated on the substrate, replace the solvent in this coating liquid.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004204927 | 2004-07-12 | ||
| JP2004204927A JP4805555B2 (en) | 2004-07-12 | 2004-07-12 | Coating apparatus and coating method |
Publications (2)
| Publication Number | Publication Date |
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| CN1721082A CN1721082A (en) | 2006-01-18 |
| CN100484644C true CN100484644C (en) | 2009-05-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100840664A Active CN100484644C (en) | 2004-07-12 | 2005-07-12 | Coating apparatus and coating method |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US20060029740A1 (en) |
| JP (1) | JP4805555B2 (en) |
| KR (1) | KR100698437B1 (en) |
| CN (1) | CN100484644C (en) |
| TW (1) | TWI303998B (en) |
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-
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- 2005-07-08 TW TW094123108A patent/TWI303998B/en active
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| JP2006026463A (en) | 2006-02-02 |
| TW200605963A (en) | 2006-02-16 |
| CN1721082A (en) | 2006-01-18 |
| TWI303998B (en) | 2008-12-11 |
| US20060029740A1 (en) | 2006-02-09 |
| KR100698437B1 (en) | 2007-03-22 |
| US20120135135A1 (en) | 2012-05-31 |
| JP4805555B2 (en) | 2011-11-02 |
| KR20060050060A (en) | 2006-05-19 |
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