CN100481277C - Diffluence resistor and making method thereof - Google Patents
Diffluence resistor and making method thereof Download PDFInfo
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- CN100481277C CN100481277C CNB2004100423322A CN200410042332A CN100481277C CN 100481277 C CN100481277 C CN 100481277C CN B2004100423322 A CNB2004100423322 A CN B2004100423322A CN 200410042332 A CN200410042332 A CN 200410042332A CN 100481277 C CN100481277 C CN 100481277C
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- resistive element
- back side
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- electrodes
- insulating barrier
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- 238000000034 method Methods 0.000 title claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 38
- 230000004888 barrier function Effects 0.000 claims description 29
- 238000009413 insulation Methods 0.000 claims description 15
- 238000005452 bending Methods 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000007767 bonding agent Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 238000009966 trimming Methods 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract 1
- 230000000630 rising effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229920006038 crystalline resin Polymers 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
- Details Of Resistors (AREA)
Abstract
Provided is a shunt resistor that can avoid an increase in the surface temperature of a resistor, has a small number of components, and can be manufactured easily. An insulating layer 3 is formed to cover a surface 1a of the resistor 1. Two electrodes 5, 5 are formed to have a connection section 11 that is along a rear 1b of the resistor 1 and is connected to the rear 1b, and an extension section 13 for radiating heat extended along the side of the resistor 1 and along the surface of the insulating layer 3. The two electrodes 5, 5 oppose on the insulating layer 3 to allow the end section of the extension section 13 for heat radiation to form a gap G for trimming between them.
Description
Technical field
The present invention relates to big shunt resistor of a kind of caloric value and manufacture method thereof.
Background technology
Resemble more powerful resistor 1W, the 2W as processing, having known has shunt resistor.For example, the spy opens 2001-No. 93701 shunt resistors shown in the communique resistor main body that has two electrodes at the two ends of plate-shape metal system resistive element is configured in the ceramic housing.
But there is following problem in this shunt resistor: when the surface temperature of resistive element rises, the phenomenons such as high frequency characteristics reduction of shunt resistor can take place, the electrical characteristic of shunt resistor is exerted an influence.
Summary of the invention
The objective of the invention is to: a kind of rising that can suppress the surface temperature of resistive element is provided, and the shunt resistor that utilizes the less parts of number just can simply make.
Another object of the present invention is to: the shunt resistor manufacture method that the shunt resistor that a kind of surface temperature of utilizing the less parts of number just can produce simply in batches can to suppress resistive element rises is provided.
The shunt resistor that becomes improvement object of the present invention possesses: the plate-shape metal system resistive element with upper surface and back side; At least two metallic electrodes that are connected with resistive element.In the present invention, this shunt resistor possesses the insulating barrier of the upper surface that covers resistive element, and at least one electrode has: along the back side of resistive element and the connecting portion that is connected with the back side; Along the side of resistive element and the heat transmission extension that extends along the surface of insulating barrier.In the present invention, distribute the heat of resistive element, thereby can suppress the rising of the surface temperature of resistive element by the heat transmission extension.Therefore, can prevent that the situation that similar high frequency characteristics reduction etc. influences the electrical characteristic of shunt resistor from taking place.Particularly in the present invention, owing to utilize the part of electrode to form the heat transmission extension,, just can obtain to suppress the shunt resistor of the surface temperature rising of resistive element so do not need to increase the number of parts, do not need to increase job step.
The number of the electrode of the number of electrode, formation heat transmission extension and the size of heat transmission extension are arbitrarily, but when electrode number is two, preferably on two electrodes, form the heat transmission extension respectively, make the end of two heat transmission extensions relative on insulating barrier with the state in gap between them, to form finishing (trimming).Like this, form trim part, carry out the adjustment of the resistance value of resistive element easily by the gap between the end of the heat transmission extension of two electrodes.This trim part can be by skive blade cutting or illuminating laser beam wait and form.
Shunt resistor of the present invention preferably also has cover, and this cover covers the heat transmission extension, and is not electrically connected with the heat transmission extension.Like this, utilize cover can prevent the shunt resistor electric leakage.Certainly, the preferred use of this cover does not hinder the parts of the radiating effect of heat transmission extension.And, can be being covered with the state that makes that at least the back side of electrode is exposed that is set to.Particularly, cover can have the heat transmission extension that covers two electrodes and make the shape that expose at the back side of two electrodes.Can use this cover bonding agent to be fixed at least on the heat transmission extension of two electrodes.
Shunt resistor of the present invention preferably also has so that the state that the connecting portion of two electrodes exposes covers the insulation coat at the resistive element back side.If have this insulation coat, then can prevent the semiconductor fusing diffusion on the figure of bonding land (ラ Application De) and contact with resistive element.
Shunt resistor of the present invention for example can be made according to the following steps.At first, a pair of formation electrode is connected with plate-like portion on the both ends at the resistive element back side (connection operation), before or after welding, utilizes insulating barrier to cover the upper surface (insulation covering process) of resistive element by welding.Then with a pair of formation electrode with plate-like portion along the side at the both ends of resistive element and along the surperficial bending (bending operation) of insulating barrier.In this case, preferably a pair of formation electrode with plate-like portion, with surface portion that the back side of resistive element is connected on form groove, this groove is positioned at the outside of side of the correspondence of resistive element, with the side in abutting connection with and extend along the side.If form this groove, in the bending operation, carry out bending along groove, then will easily carry out bending and do not damage a pair of formation electrode plate-like portion.
Description of drawings
Fig. 1 (A) and (B) be the vertical view and the right side view of the shunt resistor of an embodiment of the invention.
Fig. 2 is the profile along the II of Fig. 1 (A)-II line.
Fig. 3 (A)～(G) is the figure of the manufacture method of explanation shunt resistor shown in Figure 1.
Fig. 4 is the stereogram of the test form of explanation shunt resistor shown in Figure 1.
Fig. 5 is the profile of the shunt resistor of another embodiment of the present invention.
Symbol description
1: resistive element; 3: insulating barrier; 5: electrode; 7: cover; 9: the insulation coat; 11: connecting portion; 13: heat transmission extension 101: form the electrode plate-like portion; 102: hoop (hoop) parts; 103: frame section; 105: the insulation support portion; G: gap.
Embodiment
Below, the shunt resistor of the execution mode that present invention will be described in detail with reference to the accompanying.
Fig. 1 (A) and (B) be the vertical view and the right side view of the shunt resistor of an embodiment of the invention, Fig. 2 is the profile along the II of Fig. 1 (A)-II line.Shown in each figure, the shunt resistor of this example has: resistive element 1; Insulating barrier 3; Two electrodes 5,5 that are connected with resistive element 1; Cover 7 and insulation coat 9.Resistive element 1 is the rectangular plate shape of (that is, the upper surface) 1a that has the surface and back side 1b, is formed by copper alloy.The resistive element 1 of this example has the resistance value of 10m Ω.The surperficial 1a of resistive element 1 is covered more than or equal to the insulating barrier 3 of 0.05mm approximately by the thickness that is made of the strong epoxy resin of thermal endurance.Two electrodes the 5, the 5th, nickel plating forms by copper coin is implemented, and they are formed by bending has connecting portion 11 and the heat transmission extension 13 integrally formed with this connecting portion 11 respectively.The connecting portion separately 11,11 of two electrodes 5,5 is connected with this back side 1b along the back side 1b of resistive element 1 near two relative limits of rectangle resistive element 1.In this example, shown in the dotted line of Fig. 1,5 position S that form a line on two relative limits along resistive element 1 ... the place is connected connecting portion 11,11 respectively by means of spot welds with the back side 1b of resistive element 1.Heat transmission extension 13 is formed the radiating part 15 that extends along the surface of insulating barrier 3 and along the side wall portion 17 of the wherein a pair of side of insulating barrier 3 and resistive element 1 by bending.On insulating barrier 3, two radiating part 15,15 ends separately dispose relatively with the state across clearance G.Like this, the surperficial 1a of two radiating parts 15,15 by insulating barrier 3 and resistive element 1 is most of relative.Clearance G has the width dimensions that finishing is passed through with skive blade, in manufacturing process, by this clearance G, utilizes the cutting of skive blade that resistive element 1 is repaired.In addition, filling is used for cover 7 bonding agents described later 18 that are fixed on the heat transmission extension 13 in this clearance G.
The shunt resistor of this example is made according to the following steps.At first, shown in Fig. 3 (A), prepare to have many groups form electrodes with plate-like portion to 101,101 metallic hoop component 102.This hoop component 102 has at least integratedly: continuous frame section 103, many groups are formed electrodes be connected to many groups connecting portion on the frame section 103 to 104,104 with plate-like portion to 101,101.Frame section 103 has: be connected to form electrode with plate-like portion to 101,101 main 103a; Be parallel to the assisted parts 103b that the main 103a of portion extends; The connecting portion 103c that connects main 103a of portion and assisted parts 103b.And, form electrode and be configured in the main 103a of portion, assisted parts 103b and the connecting portion 103c institute area surrounded 101,101 with plate-like portion.In addition, form electrode with plate-like portion to 101,101 surface portion on, be formed with groove 101a on the part of bending in the operation in the back ...And, use on plate-like portion 101 and the main 103a of portion at the formation electrode, be formed with respectively across mutual approaching protuberance 101b, the 103d in gap.In addition, in this figure, only illustrate the part (two groups form electrode with plate-like portion to 101,101) of metallic hoop component 102, but on this metallic hoop component 102, can form many groups form electrodes with plate-like portion to 101,101.
Then, shown in Fig. 3 (B), will form electrode with the state of plate-like portion to 101,101 electric insulations under, form the insulation support portion of being supported by frame section 103 105 respectively, cover protuberance 101b, 103d.Then, shown in Fig. 3 (C), with resistive element 1 be configured to cross over form electrode with plate-like portion to the state between 101,101 the relative pair of end portions.Be bonded together by the back side of means of spot welds pair of end portions and resistive element 1.
Then, shown in Fig. 3 (D), at the surface-coated coatings formation insulating barrier 3 of resistive element 1.And, shown in Fig. 3 (E), will form electrode and cut off from a pair of connecting portion 104,104 101,101 with plate-like portion.Then, remove assisted parts 103b from frame section 103.Afterwards, to form electrode with plate-like portion to 101,101 along groove 101a, 101a bending, make it along the side of resistive element 1 and the surface of insulating barrier 3, and make form electrode with plate-like portion to 101,101 end with the state that forms clearance G (Fig. 3 (F)) relatively.
Then, shown in Fig. 3 (G), use skive blade, formation electrode after bending with plate-like portion to above the part of the insulating barrier 3 that exposes between 101,101 the pair of end portions, resistive element 1 to insulating barrier 3 and these insulating barrier 3 belows carries out cut, on resistive element 1, form trim slots 1c, carry out the resistance value adjustment.In this example, form electrode and be supported on the frame section 103 with state of insulation by insulation support portion 105 101,101, so can under the state of frame section 103 supports resistors, carry out the resistance value adjustment with plate-like portion.Then, cut off protuberance 101b, remove of the support of the 105 pairs of a pair of formation electrodes in insulation support portion with plate-like portion.Then, use bonding agent will cover 7 be fixed on the heat transmission extension 13 after, the assigned position on the 1b of the back side of resistive element 1 forms the coat 9 that insulate, and finishes the manufacturing of shunt resistor.
Then, make the shunt resistor (embodiment) of this example and do not have the heat transmission extension with insulating barrier and other structures shunt resistor (comparative example) identical with the shunt resistor of this example tested.Specifically as shown in Figure 4,, each shunt resistor R is connected the surface temperature the when surface temperature that is determined under the various power central portion P of each shunt resistor after the energising is stablized with C2 with copper figure C1 with scolding tin in order to connect copper figure C1 and C2.Table 1 illustrates this measurement result.
Table 1
Can know that according to table 1 shunt resistor of this example is compared with the shunt resistor of comparative example, can reduce the surface temperature of central portion.
In addition, in shunt resistor shown in Figure 1, on two electrodes 5,5, form the heat transmission extension 13 of same length respectively, but the length dimension of the heat transmission extension separately of two electrodes is arbitrarily.In addition, can certainly only on the electrode 35B of two electrode 35A, 35B, form the heat transmission extension 43 that almost completely covers resistive element 1 and insulating barrier 3 as shown in Figure 5.
According to the present invention, distribute the heat of resistive element by the heat transmission extension, can suppress the rising of the surface temperature of resistive element.Therefore, can prevent that the situation that similar high frequency characteristics reduction etc. influences the electrical characteristic of shunt resistor from taking place.Particularly in the present invention, utilize the part of electrode to form the heat transmission extension,, just can obtain to suppress the shunt resistor of resistive element surface temperature rising so do not need to increase the number of parts, do not need to increase job step.
Claims (9)
1. a shunt resistor possesses: the plate-shape metal system resistive element with upper surface and back side; At least two metallic electrodes that are connected with described resistive element is characterized in that,
The insulating barrier that possesses the described upper surface that covers described resistive element,
At least one described electrode has: along the described back side of described resistive element and the connecting portion that is connected with the described back side; Along the side of described resistive element and the heat transmission extension that extends along the surface of described insulating barrier.
2. a shunt resistor possesses: the plate-shape metal system resistive element with upper surface and back side; At least two metallic electrodes that are connected with described resistive element is characterized in that,
The insulating barrier that possesses the described upper surface that covers described resistive element,
Two described electrodes have respectively: along the described back side of described resistive element and the connecting portion that is connected with the described back side; Along the side of described resistive element and the heat transmission extension that extends along the surface of described insulating barrier.
3. a shunt resistor possesses: the plate-shape metal system resistive element with upper surface and back side; At least two metallic electrodes that are connected with described resistive element is characterized in that,
The insulating barrier that possesses the described upper surface that covers described resistive element,
Two described electrodes have respectively: along the described back side of described resistive element and the connecting portion that is connected with the described back side; Along the side of described resistive element and the heat transmission extension that extends along the surface of described insulating barrier,
The end of the described heat transmission extension of described two electrodes, between them, to form the state of finishing, relative on described insulating barrier with the gap.
4. as claim 1,2 or 3 described shunt resistors, it is characterized in that,
Also have cover, this cover covers described heat transmission extension, and is not electrically connected with described heat transmission extension.
5. shunt resistor as claimed in claim 4 is characterized in that,
Described cover is configured to make at least the state that expose at the back side of described electrode.
6. as claim 2 or 3 described shunt resistors, it is characterized in that,
Also have cover, this cover has the described heat transmission extension that covers described two electrodes and makes the shape that expose at the back side of described two electrodes,
Use bonding agent, described cover is fixed at least on the described heat transmission extension of described two electrodes.
7. as claim 2 or 3 described shunt resistors, it is characterized in that,
Also have the insulation coat, this insulation coat covers the described back side of described resistive element so that the state that the described connecting portion of described two electrodes exposes.
8. the manufacture method of a shunt resistor, this shunt resistor possesses: the plate-shape metal system resistive element with upper surface and back side; The pair of metal system electrode that is connected with described resistive element, this manufacture method are characterised in that to have following operation:
Connect operation:, a pair of formation electrode is connected to the both ends at the described back side of described resistive element with plate-like portion by welding;
Insulation covering process: before or after described welding, utilize insulating barrier to cover the described upper surface of described resistive element;
The bending operation: with described a pair of formation electrode with plate-like portion along the side at the both ends of described resistive element and along the surperficial bending of described insulating barrier.
9. the manufacture method of shunt resistor as claimed in claim 8 is characterized in that,
Described a pair of formation electrode with plate-like portion, with surface portion that the described back side of described resistive element is connected on be formed with groove, this groove is positioned at the outside of described side of the correspondence of described resistive element, with described side in abutting connection with and extend along described side,
In described bending operation, carry out bending along described groove.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003143924A JP4128106B2 (en) | 2003-05-21 | 2003-05-21 | Shunt resistor and manufacturing method thereof |
| JP143924/2003 | 2003-05-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1574115A CN1574115A (en) | 2005-02-02 |
| CN100481277C true CN100481277C (en) | 2009-04-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100423322A Expired - Fee Related CN100481277C (en) | 2003-05-21 | 2004-05-20 | Diffluence resistor and making method thereof |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4128106B2 (en) |
| CN (1) | CN100481277C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI645423B (en) * | 2018-03-14 | 2018-12-21 | 國巨股份有限公司 | Method for manufacturing shunt resistor |
| TWI645424B (en) * | 2018-03-26 | 2018-12-21 | 國巨股份有限公司 | Method for manufacturing shunt resistor |
| CN111465999A (en) * | 2017-12-12 | 2020-07-28 | Koa株式会社 | Method for manufacturing resistor |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102768888B (en) * | 2011-05-04 | 2015-03-11 | 旺诠科技(昆山)有限公司 | Micro-resistor device and manufacturing method thereof |
| JP5545334B2 (en) * | 2012-09-13 | 2014-07-09 | ダイキン工業株式会社 | Electronic circuit equipment |
| WO2014208223A1 (en) * | 2013-06-25 | 2014-12-31 | 日本特殊陶業株式会社 | Knocking sensor |
| DE102017207713A1 (en) | 2017-05-08 | 2018-11-08 | Robert Bosch Gmbh | Shunt resistor for detecting the state of an electrical energy storage unit |
| US10438729B2 (en) * | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
-
2003
- 2003-05-21 JP JP2003143924A patent/JP4128106B2/en not_active Expired - Lifetime
-
2004
- 2004-05-20 CN CNB2004100423322A patent/CN100481277C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465999A (en) * | 2017-12-12 | 2020-07-28 | Koa株式会社 | Method for manufacturing resistor |
| CN111465999B (en) * | 2017-12-12 | 2022-04-15 | Koa株式会社 | Method for manufacturing resistor |
| TWI645423B (en) * | 2018-03-14 | 2018-12-21 | 國巨股份有限公司 | Method for manufacturing shunt resistor |
| US10839991B2 (en) | 2018-03-14 | 2020-11-17 | Yageo Corporation | Method for manufacturing shunt resistor |
| TWI645424B (en) * | 2018-03-26 | 2018-12-21 | 國巨股份有限公司 | Method for manufacturing shunt resistor |
| US10818418B2 (en) | 2018-03-26 | 2020-10-27 | Yageo Corporation | Method for manufacturing shunt resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4128106B2 (en) | 2008-07-30 |
| CN1574115A (en) | 2005-02-02 |
| JP2004347429A (en) | 2004-12-09 |
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