CN100477086C - Heat treatment method and heat treatment device - Google Patents
Heat treatment method and heat treatment device Download PDFInfo
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- CN100477086C CN100477086C CNB028296893A CN02829689A CN100477086C CN 100477086 C CN100477086 C CN 100477086C CN B028296893 A CNB028296893 A CN B028296893A CN 02829689 A CN02829689 A CN 02829689A CN 100477086 C CN100477086 C CN 100477086C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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Abstract
A heat treatment method comprising a step of accommodating a holder with a plurality of works placed in multiple stage in the vertical direction in a treatment vessel and a step of performing a predetermined heat treatment by performing heating by a heating means. A specific target amount of heat generated by the heating means for performing the heat treatment of the works is determined in advance. A heat treatment device has the heat treatment vessel and a control temperature and a correction temperature sensor which are provided in the heat treatment vessel. The correction temperature sensor comprises a protective pipe body part extending in the vertical direction and a plurality of branch pipe parts extending in the horizontal direction from the protective pipe body part. A thermocouple is disposed on each branch pipe part, and the branch pipe parts are inserted between the works in height positions different from each other.
Description
Technical field
The present invention relates to heat treatment method and annealing device.
Background technology
In the manufacture process of semiconductor device,, use various annealing devices for the semiconductor wafer as handled object is carried out processing such as oxidation, diffusion, film forming.For example, the known heat treated batch type vertical thermal processing apparatus that can once carry out a plurality of handled objects.
In this vertical thermal processing apparatus, the handled object that a plurality of handled objects are placed with predetermined distance in short transverse keeps anchor clamps to be housed in the container handling.In addition, utilize the tubular heater be located at around the container handling, utilize the caloric value of setting according to the temperature data that detects by the Temperature Detector that is located in the container handling to heat, the heat treatment that handled object is stipulated.
When semiconductor wafer is heat-treated, in order to reach uniformly membranous and film forming that characteristic is good etc., the temperature homogeneity height in the surface of each semiconductor wafer, also require to be placed on the temperature homogeneity height between the semiconductor wafer on the different mutually height and positions.For this requirement, a plurality of heating regions can be divided at above-below direction in container handling inside, by utilizing and the corresponding caloric value heating of each heating region, handled object is heat-treated.
In above-mentioned annealing device, Temperature Detector is made by quartz glass, and it is by in container handling, at upwardly extending straight tube shape protection tube be provided in the locational thermocouple corresponding with each heating region of container handling constitute in this protection tube.Like this, can detect the temperature of the position corresponding,, adjust the caloric value of tubular heating tube according to detected temperature with each heating region in the container handling.
Yet, in above-mentioned vertical thermal processing apparatus, for with position that semiconductor wafer separates on detected temperatures, in fact utilize between the temperature of detected temperature of Temperature Detector and semiconductor wafer and produce error inevitably, as a result, the temperature control that correctly carry out the tubular heater is difficult.
Summary of the invention
The present invention proposes according to above situation, its objective is to provide a kind of temperature that can detect handled object accurately, therefore can stably carry out desirable heat treated heat treatment method and can carry out the annealing device of this method reliably handled object.
A kind of heat treatment method of the present invention, it has and will keep the handled object of a plurality of handled objects to keep anchor clamps to be housed in operation in the container handling with predetermined distance in short transverse,
Make the heater that is located in the container handling by mode work and heat handled object with target caloric value, the heat treatment that handled object is stipulated thus,
The target caloric value work that the heater basis is obtained by following operation (1)～(3),
(1) makes heater work with the benchmark caloric value of setting, make the temperature of handled object become the target heating-up temperature, and, by in container handling, extending the Temperature Detector of the temperature control usefulness of configuration, detect the operation of the controlling object temperature of handled object in short transverse;
(2) Temperature Detector that utilizes the temperature correction of disposing under the state that inserts between the handled object to use detects the operation of the controlled target temperature of handled object;
(3) will control the controlling object temperature of the handled object that the Temperature Detector of usefulness detects and the controlled target temperature of the handled object that detected by the Temperature Detector that temperature correction is used compares by temperature, according to the temperature difference correction reference caloric value of controlled target temperature and controlling object temperature, the operation of decision target caloric value.
Here, so-called " consistent in fact " is meant the state of temperature difference in ± 0.5～± 1.0 ℃ of scope.
Heat treatment method of the present invention is characterized by, and when asking the target caloric value, after making heater work with the benchmark caloric value, substantially under the stable status, utilizes the Temperature Detector of temperature control usefulness to detect the controlling object temperature.
Heat treatment method of the present invention is characterized by, and when asking the target caloric value, the Temperature Detector that utilizes temperature correction to use between the mutually different handled object of height and position, detects the temperature of handled object.
Heat treatment method of the present invention is characterized by, and when asking the target caloric value, the Temperature Detector that utilizes temperature correction to use on the center of this handled object, detects the temperature of handled object.
Heat treatment method of the present invention is characterized by, and when asking the target caloric value, the Temperature Detector that utilizes temperature correction to use on the center and edge part of this handled object, detects the temperature of handled object.
Heat treatment method of the present invention is characterized by, and after obtaining the target caloric value, under the state of the Temperature Detector that does not exist temperature correction to use between the handled object, handled object is heat-treated.
A kind of annealing device of the present invention, it has:
It has: container handling;
Be placed in the container handling, under level, keep the handled object of a plurality of handled objects to keep anchor clamps with predetermined distance in short transverse;
Be located at the heater of container handling outside;
Be located in the container handling, detect the Temperature Detector of the temperature control usefulness of controlling object temperature, the temperature of this controlling object is used for the caloric value for the control heater, so that the reference when becoming the target heating-up temperature of the processing that will carry out this handled object of the temperature of handled object; With
Be located in the container handling,, detect the Temperature Detector that the temperature correction of consistent with the target heating-up temperature in fact controlled target temperature is used for the caloric value reference of proofreading and correct heater;
According to the detected controlled target temperature of the Temperature Detector that utilizes temperature correction to use with utilize the detected controlling object temperature of Temperature Detector of temperature control usefulness, utilize control section to proofread and correct the caloric value of heater.
Annealing device of the present invention is characterized by, and the Temperature Detector that temperature correction is used has the protection tube main part of the straight tube-like of extending in short transverse; Under the state that leaves mutually in short transverse, a plurality of arms that extend out from this protection tube main part, in the direction vertical respectively with the tube axial direction of protection tube main part;
On each arm, dispose thermocouple,
Each arm portion is configured to insert between the mutually different handled object of height and position.
Annealing device of the present invention is characterized by, and the protection tube main part of the Temperature Detector that temperature correction is used can be that rotate at the center with the tubular axis.
Annealing device of the present invention is characterized by, and forms cannelure on the full periphery of the base end side part of the protection tube main part in the Temperature Detector that temperature correction is used.
Annealing device of the present invention is characterized by, and becomes decompression state in the protection tube main part of the Temperature Detector that temperature correction is used and in the arm portion, simultaneously, and the sealing airtightly of the cardinal extremity of protection tube main part part.
A kind of Temperature Detector of the present invention is characterized by, and in the Temperature Detector that temperature correction is used, has
The protection tube main part of the straight tube-like of extending in short transverse and
Under the state that short transverse is left mutually, respectively from this protection tube main part, a plurality of arm portion that on the direction vertical, extends out with the tube axial direction of protection tube main part;
In each arm portion, dispose thermocouple,
Each arm portion is configured to insert between the mutually different handled object of height and position.
Adopt the present invention, when the handled object that will heat-treat is handled, when the realistic target caloric value of executing in advance, utilize and be configured in the Temperature Detector that the temperature correction between the handled object is used, detect the temperature of handled object accurately.Secondly, the temperature difference of controlled target temperature that detects according to the Temperature Detector used by temperature correction and the controlling object temperature that detects by the Temperature Detector of temperature control usefulness, proofread and correct the benchmark caloric value of heater, the target heating-up temperature with the heat treatment handled object is consistent in fact to make the controlled target temperature that the Temperature Detector used by temperature correction detects.Like this, can correctly control the caloric value of heater.
In addition, because the Temperature Detector used of temperature correction has protection tube main part and arm portion, thermocouple is configured in the arm portion, therefore can detect handled object temperature and not to the metallic pollution of handled object with produce particle etc.
Description of drawings
Fig. 1 is the sectional view of the explanation usefulness of the general configuration of an example of expression annealing device of the present invention;
Fig. 2 is the sectional view of the explanation usefulness of an example of the structure of the Temperature Detector of expression control usefulness;
Fig. 3 is the sectional view of the explanation usefulness of an example of the structure of the Temperature Detector of expression correction usefulness;
Fig. 4 is the sectional view of the explanation usefulness of an example of the hermetically-sealed construction of the Temperature Detector of expression correction usefulness shown in Figure 3;
The time dependent figure of temperature of the Temperature Detector of the Temperature Detector of the semiconductor wafer when Fig. 5 is the expression temperature stabilization, control usefulness and correction usefulness.
The crystal execution mode
Below, with reference to accompanying drawing, be example to the vertical thermal processing apparatus that handled object carries out the film forming processing to utilize the CVD method, the present invention is described.
Fig. 1 is the sectional view of the explanation usefulness of the general configuration of an example of expression vertical thermal processing apparatus of the present invention.
This vertical thermal processing apparatus has container handling (handling pipe) 11.This container handling have by extend pipe 11A in straight tube shape configuration, that the upper end is open in short transverse (above-below direction among Fig. 1) and separate the interval of regulation, double-sleeve structure of being constituted of outer tube 11B of the upper end obturation that disposes of shape with one heart around it.The following side space of container handling 11 is the charging area L.This charging area L be the zone of moving loading etc. as the semiconductor wafer of handled object on the wafer ware 17 that keeps anchor clamps as handled object described later.
Be provided with the house steward 12 that the upper end has the short garden tubular of flange portion 12A in the bottom of the outer tube 11B of this container handling 11.Be located at the lower end flange part 111 of the bottom of outer tube 11B,, utilize flange pressing plate 13, engage, make the outer tube 11B of container handling 11 become stationary state with this flange portion 12A by sealing devices (not illustrating among the figure) such as O shape circles.
The interior pipe 11A of container handling 11 extends downwards from the lower surface of outer tube 11B, under the state in inserting house steward 12, utilizes interior piping support part 14 supportings of the annular on the inner surface that is located at this house steward 12.
On the longitudinal section of the container handling 11 of this vertical thermal processing apparatus, on a sidewall of house steward 12, be equipped with and be used for importing gas supply pipe road 15 in the container handling 11 handling gas and non-active gas.This pipeline connects this house steward's 12 sidewall airtightly, extends upward in interior pipe 11A.The gas supply source that does not illustrate among the figure is connected with this gas supply pipe road 15.
In addition, on another sidewall of house steward 12, be provided with the discharge portion 16 of discharging the gas in the container handling 11, exhaust gear (not illustrating among the figure) with vacuum pump and pressure control mechanism is connected with this discharge portion 16, like this, and with the pressure of container handling 11 internal controls for regulation.
Be provided with in the above-below direction driving below the container handling 11, will keeping the wafer ware 17 of anchor clamps to move in the container handling 11 and elevating mechanism 21 as handled object from wherein taking out of.The grand mechanism 21 of this liter has the garden plate female cap body 20 of the lower ending opening 11C that opens and closes container handling 11.
Wafer ware 17 is made by highly purified quartz glass.Polylith (for example 100～150) semiconductor wafer is under level, in that up and down (for example 5.2～20.8mm) divide multistages to be placed on the wafer ware 17 with predetermined distance (spacing).
In the lid 20 that rises grand mechanism 21, under the state that connects lid 20, the supporting member 22 of the column of extending upward abreast with container handling 11 is set.Place the ware supporting member 22A of the garden plate shape of wafer ware 17 on top, integrally be installed on this supporting member 22.Supporting member 22 is connected with device of rotation driving 23 on the bottom that is installed in lid 20.
In addition, on the top of lid 20, under the state that inserts supporting member 22, the heat-preservation cylinder of being made by quartz 24 is set.
In the outside of container handling 11, surround container handling 11 around state under, be provided as and be heated to the tubular heater 30 of the heater of predetermined processing temperature being placed on semiconductor wafers in the container handling 11.
Be provided with above the container handling 11 under the state relative, with the planar shaped heater 32 of the upper surface configured in parallel of tubular heater 30 with wafer ware 17 in the container handling 11.Utilize this planar shaped heater 32 can prevent effectively from the heat release of the top of container handling 11, can be in this face, with high homogeneity heat treated semiconductor wafer.
Planar shaped heater 32 has the wire resistance heater that connects up on tabular substrate, this resistance heater is connected with control section 31.
In the container handling 11 of this vertical thermal processing apparatus, disposing the Temperature Detector 40 (be designated hereinafter simply as " control Temperature Detector ") of detection as the temperature control usefulness of the temperature of the controlling object of semiconductor wafer.Become the caloric value of the tubular heater 30 and the planar shaped heater 32 of target heating-up temperature in order to control semiconductor wafer, can be with reference to the detected value of this Temperature Detector 40.
Specifically: the Temperature Detector 40 of control usefulness connects house steward 12 lower part wall airtightly, simultaneously, be configured in the space that is roughly annular that forms between wafer ware 17 on the assigned position of placing in the container handling 11 and the interior pipe 11A, parallel with interior pipe 11A, extend in short transverse.,, extend abreast with the fore-end that the upper surface of the interior pipe 11A the Temperature Detector 40 extends out from control with the semiconductor wafer that remains on the wafer ware 17 towards the center of container handling 11.
As shown in Figure 2, control is made by transparent quartz glass with Temperature Detector 40, and it is by the fore-end protection tube that all is roughly the L font 41 of bending of (right among Fig. 2) extension in the horizontal direction; With in this protection tube 41; be configured in the position corresponding (center that for example, is equivalent to planar shaped heater 32) and corresponding with the heating region Z1～Z3 of tubular heater 30 respectively locational a plurality of (amounting to 4 in this embodiment) thermocouple 42 formations with the heating region of planar shaped heater 32.
The fore-end of protection tube 41 is a closed state, and its base end side partly utilizes encapsulant 45 sealings such as bonding agent simultaneously.The plain conductor bundle of thermocouple 42 is drawn to the outside by the sealing part.In addition, the plain conductor bundle of thermocouple 42 is connected with the input terminal of control section 31 by compensating wire.
The cardinal extremity of protection tube 41 part can seal airtightly, in addition, in order to prevent thermocouple 42 oxidations, can be in protection tube 41 filling nitrogen (N
2) wait non-active gas.
Under the state that the plain conductor bundle inserts, on each plain conductor bundle of thermocouple 42, be provided with the insulating component 44 that aluminium oxide ceramics is made.This insulating component 44 has long a plurality of bead 44A for the sleeve-like about 3mm, and these beades 44A disposes under the interconnected state of length direction.In Fig. 2, for convenience, each insulating component is represented as an insulating component.
In the container handling 11 of this vertical thermal processing apparatus, be provided with the Temperature Detector that the temperature correction of the controlled target temperature of consistent with the target heating-up temperature in fact semiconductor wafer of detection uses (following be called simply " proofread and correct and use Temperature Detector ") 50.When proofreading and correct the benchmark caloric value of tubular heater 30 and planar shaped heater 32, can be with reference to the controlled target temperature of semiconductor wafer.
As shown in Figure 3, correction has protection tube main part 52 with Temperature Detector 50; With front part at protection tube main part 52, first 53A of arm portion of Yan Shening in the horizontal direction.Protection tube main part 52 forms roughly L font with the 53A of arm portion.In addition; with first 53A of arm portion under the state that short transverse is left mutually; many (being two in the illustrated embodiment) 53B of arm portion, 53C extend out on the horizontal direction vertical with the tube axial direction of protection body 52 respectively from this protection tube main part 52.Leading section configuration thermocouple 54 at the 53A of each arm portion, 53B, 53C.Protection tube 51 is made of protection tube main part 52, the 53A of arm portion, 53B, 53C.
Under the state that the plain conductor bundle inserts, on each plain conductor bundle of thermocouple 54, be provided with the insulating component 56 that aluminium oxide ceramics is made.This insulating component 56 has long a plurality of bead 56A for the sleeve-like about 3mm, and these beades 56A disposes under the interconnected state of length direction.
The leading section of the 53A of each arm portion, 53B, 53C is divided into closed state, and simultaneously, the cardinal extremity of protection tube main part 52 partly seals.The plain conductor bundle of thermocouple 54 is drawn to the outside by the sealing part.In addition, the plain conductor bundle of thermocouple 54 is connected by the input terminal of compensating wire with control section 31.
The cardinal extremity of protection tube main part 52 part can seal airtightly, in addition, in order to prevent thermocouple 42 oxidations, can be in protection tube 51 filling nitrogen (N
2) wait non-active gas.
Particularly, as shown in Figure 4, on the base end side part of protection tube 51, encapsulants such as cement 57 are filled in the protection tube 51, form airtight hermetically-sealed construction.Under the state that inserts insulating component 56, be provided with outwardly directed continuously end construction body 60 in the end of protection tube 51.This end construction body 60 has inner surface and is provided with the auxiliary tube 61 that the quartz of heat-shrinkable tube 62 is made; Be inserted in the auxiliary tube 61 insulating component 63 of the sleeve-like of making by polytetrafluoroethylene.
In addition, on the base end side part of the protection tube main part 52 of protection tube 51,, on its full periphery, make cannelure 58 specifically at the position of the inside that is positioned at container handling 11 be positioned on the boundary member at position of outside of container handling 11.House steward 12 lower part wall is entrenched in this cannelure 58, will proofread and correct with Temperature Detector 50 to be configured in the container handling 11.
When heat treatment that semiconductor wafer is stipulated,, use and proofread and correct with Temperature Detector 50 (obtaining in enforcement under the situation of operation of target caloric value) under the situation of the target caloric value of asking tubular heater 32 in advance.
Proofreading and correct with Temperature Detector 50, is that freely rotate at the center with the tubular axis of the protection tube main part 52 that stretches out upward, obtains under the situation that the target caloric value operates in enforcement, and making protection tube main part 52 is the center rotation with the tubular axis.Like this, the 53A of each arm portion, 53B, 53C become insertion by the state between the semiconductor wafer of the height and position of the correspondence of wafer ware 17 maintenances.
The 53A of each arm portion, 53B, 53C preferably insert between the different mutually semiconductor wafer of height and position, in addition, the fore-end that disposes the 53A of arm portion, 53B, the 53C of thermocouple 54 is preferably the state that arrives the position suitable with the center of semiconductor wafer.
In addition, can dispose the center that to measure wafer simultaneously and the thermocouple of Waffer edge portion.
In illustrated embodiment, in the upper end of protection tube 51, (left among Fig. 3 to) first 53A of arm portion of extending is configured in the upper space of the wafer of the topmost that is arranged in semiconductor wafer to be processed continuously in the horizontal direction; And proofreading and correct with in the Temperature Detector 50, the 3rd 53C of arm portion that is arranged in upper/lower positions is configured in the upper space of the wafer that is arranged in semiconductor wafer foot to be processed; Second 53B of arm portion on the height level between first 53A of arm portion and the 3rd 53C of arm portion is configured in the upper space of the wafer of the center that is arranged in semiconductor wafer to be processed.
Secondly the heat treatment that semiconductor wafer is carried out, be described in the vertical thermal processing apparatus of the longitudinal type of above structure formation.
At first, in the charging area L, mobile semiconductor wafer is placed on the wafer ware 17 that is keeping the semiconductor wafer state on the ware supporting 22A.At this moment, lid 20 is at upper/lower positions.Secondly, utilize elevating mechanism 21 upwards to drive lid 20, wafer ware 17 is moved in the container handling 11 from lower ending opening 11C.Secondly, lid 20 makes the lower ending opening 11C of container handling 11 become blocked state airtightly, and exhaust apparatus work will be decompressed to authorized pressure (for example 6 * 10 in the container handling 11
-4Pa).In this case, the semiconductor wafer (dummy wafer) with simulation is placed on the placement part of the topmost of wafer ware 17 and foot.
Secondly, the target caloric value that obtains that obtains the target caloric value of setting tubular heater 30 and planar shaped heater 32 is operated.That is: proofreading and correct with Temperature Detector 50 is that rotate at the center with the tubular axis of its protection tube main part 52, between the 53A of each arm portion, the mutually different semiconductor wafer of 53B, 53C insertion height and position.Secondly, utilize the temperature of control with Temperature Detector 40 detection controlling object, and tubular heater 30 and the benchmark caloric value work of planar shaped heater 32 to set, make semiconductor wafer become the target heating-up temperature of regulation.
Then, after the controlling object temperature that is detected by control Temperature Detector 40 becomes in fact stable status, continue with Temperature Detector 40 detected temperatures.
Here, so-called " stable state in fact " is meant the state of amplitude of fluctuation in ± 0.5～± 1.0 ℃ of scope of controlling the controlling object temperature of obtaining with Temperature Detector 40 that utilize.For example, from making 32 work of tubular heater and planar shaped heater, through more than 2 hours the time, reach the ten minutes stable status usually.
To import in control section 31 by each controlled target temperature that each thermocouple 54 detections of using Temperature Detector 50 are proofreaied and correct in the temperature and the utilization of each controlling object of controlling each thermocouple 42 detections of using Temperature Detector 40.By proofreading and correct the controlled target temperature that detects with Temperature Detector 50, under the consistent in fact situation of the target heating-up temperature of process semiconductor wafers, in control section 31, contrast each corresponding height level's temperature data.
On the other hand, utilizing the controlled target temperature of proofreading and correct, under the inconsistent in fact situation of the target heating-up temperature of process semiconductor wafers, in control section 31 with Temperature Detector 50 detections, set the benchmark caloric value of tubular heater 30 and planar shaped heater 32 again, repeat above-mentioned operation.
For example, in control section 31, in the semiconductor wafer that is placed on the position corresponding with heating region Z1, according to the controlled target temperature of using Temperature Detector 50 to detect by correction with by the temperature difference of control, determine 30 pairs of target caloric values that are placed on the locational semiconductor wafer corresponding of tubular heater with the heating region Z1 of tubular heater 30 with the controlling object temperature of Temperature Detector 40 detections.
Above operation is also carried out on other heating regions Z2, Z3.
Secondly, proofread and correct with Temperature Detector 50 and rotate, become the state that between semiconductor wafer, does not have the 53A of arm portion, 53B, 53C.Then, under the state that wafer ware 17 is rotated, suitable processing gas imports in the container handling 11 for pipeline 15 from gas, semiconductor wafer is carried out to film handles.
Adopt above-mentioned vertical thermal processing apparatus, in the operation of when semiconductor wafer is heat-treated, carrying out in advance that obtains the target caloric value, can utilize and proofread and correct, detect the temperature of semiconductor wafer accurately with Temperature Detector 50.Because like this, can be according to proofreading and correct controlled target temperature that detects with Temperature Detector 50 and the temperature difference of controlling the controlling object temperature that detects with Temperature Detector 40, the correction reference caloric value, make and proofread and correct the controlled target temperature that detects with temperature detection detector 50, consistent in fact with the target heating-up temperature of heat treatment semiconductor wafer.Like this, can correctly control the caloric value of tubular heater 30 and planar shaped heater 32, therefore, can stably carry out desirable heat treatment semiconductor wafer.
In addition, under the detected temperatures stable status that control detects with Temperature Detector 40, owing to obtain the operation of target caloric value, can obtain reliably by proofreading and correct, therefore can correctly carry out the caloric value of tubular heater 30 and planar shaped heater 32 and control with the controlled target temperature of Temperature Detector 50 detections with by the correct temperature difference of controlling the controlling object temperature that detects with Temperature Detector 40.
In addition, because the 53A of each arm portion, 53B, the 53C that proofread and correct with Temperature Detector 50 are configured between the mutually different semiconductor wafer of height and position, can on height and position separately, carry out temperature control independently.Therefore, when the actual heat treatment semiconductor wafer, no matter the height and position of configuring semiconductor wafer is how, can be in fact equably, under the temperature desired state, all semiconductor wafers are heat-treated.
In addition, owing to dispose the 53A of arm portion of thermocouple 54,54,54, the fore-end arrival of 53B, 53C and the suitable position, center of semiconductor wafer, so can be in fact only detect the radiating light that sends from semiconductor wafer, therefore can be reliably, with the temperature of high accuracy detection semiconductor wafer.
In addition; because the thermocouple of proofreading and correct with Temperature Detector 50 54,54,54 is configured in the 53A of arm portion, 53B, the 53C; in other words; because the plain conductor bundle of thermocouple 54 etc. is not exposed in the atmosphere in the container handling 11; therefore, can prevent to produce particle or reliably to metallic pollution of semiconductor wafer etc.Like this, with directly thermocouple is configured on the semiconductor wafer, detect semiconductor wafer temperature situation relatively, the replacing operation of essential quartzy anchor clamps and clean processing no longer need after the operation of target setting caloric value, can advantageously carry out desirable heat treatment to semiconductor wafer.
Again owing on the full periphery of the base end side of protection tube 51 part, form cannelure 58, thus can this cannelure 58 is chimeric with house steward 12, play block.Because like this, when becoming decompression state in the container handling 11, can prevent reliably that correction from entering in the container handling 11 with Temperature Detector 50.
The above, proofreading and correct in the protection tube 51 with Temperature Detector 50 becomes non-active gas atmosphere, and protection tube 51 becomes decompression state, airtightly the cardinal extremity part of seal protection pipe 51.
In this case, when becoming decompression state in the container handling 11, even, can prevent reliably that also fragment emission is in container handling 11 when no matter which kind of reason makes protection tube 51 damaged.
In addition, in controlling, also can make same structure with Temperature Detector 40.
(experimental example)
Below, the embodiment of the vertical thermal processing apparatus of structure shown in Figure 1 is described.
With the semiconductor wafer that 25 wafer diameter are 200mm, the spacing with 15.6mm is placed to multistage at above-below direction, will place the wafer ware (17) of the dummy wafer of simulation and accommodate in the middle container handling (11) on topmost and foot.Secondly, make tubular heater (30) and planar shaped heater (32) work, make all semiconductor wafers become 800 ℃ (target heating-up temperatures) with the benchmark caloric value of setting.From beginning heating, after 2 hours, utilize control to carry out temperature detection with Temperature Detector (50) with Temperature Detector (40) and correction, is 800 ℃ by control with the controlling object temperature that Temperature Detector (40) detects, and is 803 ℃ by proofreading and correct the controlled target temperature that detects with Temperature Detector (50).
In addition, according to 3 ℃ of the temperature differences of controlled target temperature and controlling object temperature, correction reference caloric value, target setting caloric value, utilize the target caloric value of setting to make tubular heater (30) and planar shaped heater (32) work, making the controlling object temperature is 798 ℃.In this case, be 800 ℃ by the controlled target temperature of proofreading and correct with Temperature Detector (50) detection, the heat treatment that all semiconductor wafers are wished.Semiconductor wafer during temperature stabilization, control use the time dependent curve representation of temperature of Temperature Detector (50) in Fig. 5 with Temperature Detector (40) and correction.
More than, embodiments of the invention have been described, but the present invention only limits to the foregoing description, can add various changes.
For example, proofread and correct the arm number of the Temperature Detector of usefulness, position and other structure that arm inserts, have no particular limits, can be according to number, size (outside dimension) appropriate change of wanting processed handled object in the single treatment.
In addition, in the above-described embodiments, the arm portion with Temperature Detector of proofreading and correct be with the corresponding respectively state of the heating region of tubular heater under the state that disposes, but do not need to be configured on the position corresponding with the heating region of tubular heater.
Being configured in the fore-end of protection tube main part and the number and the position of the thermocouple in each arm portion has no particular limits.For example, a plurality of thermocouples of configuration in an arm portion, the state that becomes horizontal direction to leave mutually in arm portion is also passable.Particularly, the thermocouple front end can also be configured in respectively on the edge of the center of wafer and wafer.
In addition, the operation that obtains the target caloric value is to reality handled object to be processed, and carries out also passable to the handled object (dummy wafer) of simulation.
In addition, in the present embodiment, will control with Temperature Detector 40 be arranged in the pipe 11A in, also can connect heater 30,32 and detect heter temperature.
The invention is not restricted to film forming and handle, in the annealing device that carries out oxidation processes, DIFFUSION TREATMENT, annealing in process etc., also can be suitable for.
Utilize heat treatment method of the present invention, when the handled object that will heat-treat is handled, in the operation of carrying out in advance that obtains the target caloric value, can utilize to be configured in the Temperature Detector that the temperature correction between the handled object is used, detect the temperature of handled object accurately.Therefore, the temperature difference of controlled target temperature that detects according to the Temperature Detector used by temperature correction and the controlling object temperature that detects by the Temperature Detector of temperature control usefulness, proofread and correct the benchmark caloric value of heater, can make the controlled target temperature of the Temperature Detector detection of being used by temperature correction, the target heating-up temperature with the heat treatment handled object is consistent in fact.Like this, can correctly carry out the control of the caloric value of heater, therefore can stably carry out desirable heat treatment handled object.
Adopt annealing device of the present invention, owing to can carry out said method reliably, detect the temperature of handled object accurately, the result can correctly control the caloric value of heater, therefore, can stably carry out desirable heat treatment to handled object.
Claims (12)
1. a heat treatment method is characterized by, and it has and will keep the handled object of a plurality of handled objects to keep anchor clamps to be housed in operation in the container handling with predetermined distance in short transverse,
Make the heater that is located in the container handling by mode work and heat handled object with target caloric value, the heat treatment that handled object is stipulated thus,
The target caloric value work that the heater basis is obtained by following operation (1)～(3),
(1) makes heater work with the benchmark caloric value of setting, make the temperature of handled object become the target heating-up temperature, and, by in container handling, extending the Temperature Detector of the temperature control usefulness of configuration, detect the operation of the controlling object temperature of handled object in short transverse;
(2) Temperature Detector that utilizes the temperature correction of disposing under the state that inserts between the handled object to use detects the operation of the controlled target temperature of handled object;
(3) will control the controlling object temperature of the handled object that the Temperature Detector of usefulness detects and the controlled target temperature of the handled object that detected by the Temperature Detector that temperature correction is used compares by temperature, according to the temperature difference correction reference caloric value of controlled target temperature and controlling object temperature, the operation of decision target caloric value.
2. heat treatment method as claimed in claim 1 is characterized by, and when asking the target caloric value, after making heater work with the benchmark caloric value, under stable status, utilizes the Temperature Detector of temperature control usefulness to detect the controlling object temperature.
3. heat treatment method as claimed in claim 1 is characterized by, and when asking the target caloric value, the Temperature Detector that utilizes temperature correction to use between the mutually different handled object of height and position, detects the temperature of handled object.
4. heat treatment method as claimed in claim 1 is characterized by, and when asking the target caloric value, the Temperature Detector that utilizes temperature correction to use on the center of this handled object, detects the temperature of handled object.
5. heat treatment method as claimed in claim 1 is characterized by, and when asking the target caloric value, the Temperature Detector that utilizes temperature correction to use on the center and edge part of this handled object, detects the temperature of handled object.
6. heat treatment method as claimed in claim 1 is characterized by, and after obtaining the target caloric value, under the state of the Temperature Detector that does not exist temperature correction to use between the handled object, handled object is heat-treated.
7. annealing device, it has:
Container handling;
Be placed in the container handling, under level, keep the handled object of a plurality of handled objects to keep anchor clamps with predetermined distance in short transverse;
Be located at the heater of container handling outside;
Be located in the container handling, detect the Temperature Detector of the temperature control usefulness of controlling object temperature, the temperature of this controlling object is used for the caloric value for the control heater, so that the reference when becoming the target heating-up temperature of the processing that will carry out this handled object of the temperature of handled object; With
Be located in the container handling, reference during for the caloric value of proofreading and correct heater detects the Temperature Detector that the temperature correction of the controlled target temperature consistent with the target heating-up temperature is used;
According to the detected controlled target temperature of the Temperature Detector that utilizes temperature correction to use with utilize the detected controlling object temperature of Temperature Detector of temperature control usefulness, utilize control section to proofread and correct the caloric value of heater.
8. annealing device as claimed in claim 7 is characterized by, and the Temperature Detector that temperature correction is used has the protection tube main part of the straight tube-like of extending in short transverse; Under the state that leaves mutually in short transverse, respectively from this protection tube main part, in a plurality of arm portion that the direction vertical with the tube axial direction of protection tube main part extends out;
In each arm portion, dispose thermocouple,
Each arm portion is configured to insert between the mutually different handled object of height and position.
9. annealing device as claimed in claim 8 is characterized by, and the protection tube main part of the Temperature Detector that temperature correction is used can be that rotate at the center with the tubular axis.
10. annealing device as claimed in claim 8 is characterized by, and forms cannelure on the full periphery of the base end side part of the protection tube main part in the Temperature Detector that temperature correction is used.
11. annealing device as claimed in claim 8 is characterized by, and becomes decompression state in the protection tube main part of the Temperature Detector that temperature correction is used and in the arm portion, simultaneously, and the sealing airtightly of the cardinal extremity of protection tube main part part.
12. a Temperature Detector is characterized by, and in the Temperature Detector that temperature correction is used, has
The protection tube main part of the straight tube-like of extending in short transverse and
Under the state that short transverse is left mutually, respectively from this protection tube main part, in a plurality of arm portion that the direction vertical with the tube axial direction of protection tube main part extends out;
In each arm portion, dispose thermocouple,
Each arm portion is configured to insert between the mutually different handled object of height and position.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2002/010080 WO2004030058A1 (en) | 2002-09-27 | 2002-09-27 | Heat treatment method and heat treatment device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1669125A CN1669125A (en) | 2005-09-14 |
| CN100477086C true CN100477086C (en) | 2009-04-08 |
Family
ID=32040320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB028296893A Expired - Lifetime CN100477086C (en) | 2002-09-27 | 2002-09-27 | Heat treatment method and heat treatment device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN100477086C (en) |
| WO (1) | WO2004030058A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4905381B2 (en) * | 2007-02-27 | 2012-03-28 | 東京エレクトロン株式会社 | Heat treatment apparatus and heat treatment method for object to be processed |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3056776B2 (en) * | 1990-10-25 | 2000-06-26 | 東京エレクトロン株式会社 | Decompression processing apparatus and method of attaching thermocouple introduction tube to decompression processing vessel |
| JP3204699B2 (en) * | 1990-11-30 | 2001-09-04 | 株式会社東芝 | Heat treatment equipment |
| US5616264A (en) * | 1993-06-15 | 1997-04-01 | Tokyo Electron Limited | Method and apparatus for controlling temperature in rapid heat treatment system |
| JP4079582B2 (en) * | 2000-09-28 | 2008-04-23 | 株式会社日立国際電気 | Heat treatment apparatus and heat treatment method |
-
2002
- 2002-09-27 CN CNB028296893A patent/CN100477086C/en not_active Expired - Lifetime
- 2002-09-27 WO PCT/JP2002/010080 patent/WO2004030058A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004030058A1 (en) | 2004-04-08 |
| CN1669125A (en) | 2005-09-14 |
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