CN100474117C - Photo-etching machine off-axis level and focusing detection control system and implement method thereof - Google Patents
Photo-etching machine off-axis level and focusing detection control system and implement method thereof Download PDFInfo
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- CN100474117C CN100474117C CNB2006100297742A CN200610029774A CN100474117C CN 100474117 C CN100474117 C CN 100474117C CN B2006100297742 A CNB2006100297742 A CN B2006100297742A CN 200610029774 A CN200610029774 A CN 200610029774A CN 100474117 C CN100474117 C CN 100474117C
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Abstract
The utility model discloses a monitoring system of photoetching machine off-axis level and focusing detection, comprising a group of confocal photodetectors, a date processor and a silicon wafer platform controller. Whether the detector is at the pinpointed focus or not is judged by relative intensity of lights reflected by every detector of the confocal photodetectors. In exposure, generate commands to the silicon wafer platform controller to compensate difference based on data collected by the data processor. Distribution of surface levelness of the silicon wafer in an exposed area is surveyed and fed back . The invention also discloses an implementation of the system. The invention can reliably detect an upper surface of the silicon wafer to reduce a focus deviation of the silicon wafer caused by level detection.
Description
Technical field
The present invention relates to a kind of semiconductor manufacturing facility, be specifically related to a kind of lithographic equipment, relate in particular to a kind of photo-etching machine off-axis level and focusing detection control system, this system is applicable to that the needs of virtually any size do the lithographic equipment from the premeasuring of axle silicon chip, also is suitable for the lithographic equipment of two silicon slice platforms of virtually any size.In addition, the invention still further relates to the implementation method of this photo-etching machine off-axis level and focusing detection control system.
Background technology
The level of existing silicon slice platform of photo-etching machine and focusing are surveyed and control relies on the detection to the reflection angle of glancing incidence light on the silicon chip plane to realize.As shown in Figure 1, silicon slice under test 2 is arranged on the silicon slice platform of photo-etching machine 1, incident light 6 reflects the reflected light 7 that the back forms on silicon slice platform of photo-etching machine 1, surveyed by reflected light position sensor 11.Incident light can be more than one among Fig. 1, and among this figure in order to illustrate, only drawn one.Because present glancing incidence angle is generally between 70 to 78 degree, and the upper surface reflectivity in this scope has only 17% to 22%, that is to say the upper space that still has most of incident light energy to pass silicon chip and deeply wherein, as photoresist.To postchannel process, because the thickness of intermetallic dielectric layer constantly adds up, the light that is used to survey the upper surface upright position may go deep into hundreds of nanometer even darker, and surface location is surveyed and just existed very mistake.Experience shows that this error may cause the upright position error in judgement of maximum hundreds of nanometers.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of photo-etching machine off-axis level and focusing detection control system, and this system can detect the silicon chip upper surface reliably, to reduce level detection silicon chip is made departing from of focal length.For this reason, the present invention also provides the implementation method of above-mentioned photo-etching machine off-axis level and focusing detection control system.
For solving the problems of the technologies described above, the invention provides a kind of photo-etching machine off-axis level and focusing detection control system, this system comprises:
One group of confocal optics detector array is used to collect the light distribution data;
A data processor is connected with confocal optical detector array by data line, is used to collect light distribution data that the confocal optics detector array collects and these data are handled;
A silicon slice platform controller is connected with data processor by data line;
Judge that according to catoptrical relative intensity in each detector of confocal optics detector array whether silicon chip plane at this detector position is at pinpointed focus, the data of collecting according to data processor when exposure are sent instruction to the silicon slice platform controller, with the compensation difference, measure the also distribution of feedback exposure zone silicon chip surface levelness.
Described one group of confocal optics detector array is made up of at least three detectors.
Described detector comprises: high numerical aperture lens, single-mode fiber, fiber optic splitter, incident light coupled system, reflected light detection system, the termination of described single-mode fiber in detector is positioned at the back focus of described high numerical aperture lens, the front focus of described high numerical aperture lens overlaps with the silicon slice under test platform, described incident light coupled system comprises lighting source and condenser lens, and described reflected light detection system comprises light intensity detector.
Described incident light is visible light or non-visible light, and as infrared light or ultraviolet light, this lambda1-wavelength is complementary with described single-mode fiber specification.
The present invention also provides the implementation method of a kind of above-mentioned photo-etching machine off-axis level and focusing detection control system, may further comprise the steps: at first, the horizontal pinpointed focus of obtaining each exposure area distributes, and judges that according to catoptrical relative intensity in each detector whether silicon chip plane at this detector position is at pinpointed focus; Secondly, data processor is handled the light intensity of all detectors; Then, the data of collecting according to data processor when exposure are sent instruction to the silicon slice platform controller, with the compensation difference.
The horizontal pinpointed focus of obtaining described each exposure area by the vertical step-scan of silicon slice platform distributes.
The vertical step-scan of described silicon slice platform may further comprise the steps: step 1, silicon slice platform move to relative position away from the confocal optics detector array earlier; Step 2, silicon slice platform is towards the step-scan of confocal optics detector array column direction; Step 3, to the position of platform of each vertical direction, detector system is gathered reflective light intensity and is distributed; Step 4, after the been scanned, the upper space of the corresponding system in the very big position of the reflective light intensity that the confocal optics detector array runs into for the first time.
Position decentering focal distance described in the step 1 is not less than the twice of system's maximum focusing degree of depth.
Step-scan described in the step 2, wherein each step is not more than the spatial resolution of needed vertical direction.
Compare with prior art, the present invention has following beneficial effect: because confocal method has sensitive vertical direction resolution, the present invention can detect the silicon chip upper surface reliably, and the influence that not reflected by the deep layer lower surface, to reduce level detection silicon chip is made departing from of focal length, reduce the error that surface location is surveyed, avoid the upright position error in judgement that causes by this error.
Description of drawings
Fig. 1 is existing litho machine level detection principle schematic;
Fig. 2 is the device synoptic diagram of photo-etching machine off-axis level of the present invention and focusing detection control system;
Fig. 3 is the structural representation of confocal optics detector array of the present invention.
Embodiment
The present invention is further detailed explanation below in conjunction with drawings and Examples.
As shown in Figure 2, the present invention utilizes confocal detection method to have the principle of very high vertical direction detection accuracy, has designed a kind of photo-etching machine off-axis level and focusing detection control system that is different from prior art.This detection control system comprises 3, one data processors 15 of one group of confocal optics detector array and a silicon slice platform controller 1 (silicon slice under test 2 is arranged on it), and this silicon slice platform controller 1 is the silicon slice platform controller on the existing litho machine.Wherein, confocal optics detector array 3 is connected with data processor 15, data processor 15 and silicon slice platform controller 1 are connected by data line, and the light distribution data that confocal optics detector array 3 is collected are collected and handled by data processor 15 through data transmission bus 14.
As shown in Figure 3, each detector in the confocal optics detector array 3 is made up of a high numerical aperture lens 8 and a single-mode fiber 4.One end of this single-mode fiber 4 is on the back focus 9 of above-mentioned high numerical aperture lens, and silicon slice under test 2 surfaces on the front focus 10 of above-mentioned high numerical aperture lens and the silicon slice platform controller 1 overlap.Above-mentioned single-mode fiber 4 rear ends connect a fiber optic splitter 5, and other two optical fiber of fiber optic splitter 5 couplings thus.Incident light 6 enters this detection control system from lighting source and condenser lens module 12 by one these two optical fiber, focuses on silicon chip 2 surfaces through above-mentioned high numerical aperture lens 8.If silicon chip 2 surface locations overlap with the front focus 10 of above-mentioned high numerical aperture lens, the light of process silicon chip 2 surface reflections will reenter above-mentioned single-mode fiber according to the opposite direction of original optical path.We just can record the intensity of reflected light 7 by another root optical fiber of fiber optic splitter 5 by light intensity detector 13.If silicon chip 2 planes are not in front focus 10 positions of above-mentioned high numerical aperture lens, reflected light 7 just can not focus in its back focus 9 positions through the projection of above-mentioned high numerical aperture lens 8, thereby can not be coupled into to greatest extent in the above-mentioned single-mode fiber 4, we will collect the signal of the reflected light 7 that reduces.
Because the confocal method that uses needs twice through same optical aperture, its detection light distribution is more serious than common optical system with spatial distributions, can obtain very high resolution in vertical direction.This system makes detection photoresist upper surface and is not subjected to the influence of deep layer lower surface reflection to become possibility.
The present invention is by installing additional or the confocal level detector array that changes the outfit is realized level detection to the silicon chip upper surface possessing from the axle amount of giving a forecast litho machine.Wherein a kind of embodiment is as follows:
Do level detection at silicon slice platform under the state of axle, its basic procedure is as follows:
To each exposure area:
(1) silicon slice platform moves to from detector array upright position farthest, and this position distance center focal length should be not less than the twice of system's maximum focusing degree of depth.
(2) silicon slice platform is towards the stepping of detector array column direction, and detector array is measured and the record reflective light intensity.
(3) all record first intensity maxima when all detectors, silicon slice platform stops scanning, the upper surface of the corresponding silicon chip of this maximum value.
(4) data processor is handled the light intensity of all detectors, determines best upright position of silicon slice platform and pitch angle, and feeds back in the silicon slice platform of photo-etching machine controller.
(5) level detection is finished.
Claims (10)
1, a kind of photo-etching machine off-axis level and focusing detection control system is characterized in that this system comprises:
One group of confocal optics detector array is used to collect the light distribution data;
A data processor is connected with confocal optical detector array by data line, is used to receive light distribution data that the confocal optics detector array collects and these data are handled;
A silicon slice platform controller is connected with data processor by data line;
Judge that according to catoptrical relative intensity in each detector of confocal optics detector array whether silicon chip plane at this detector position is at pinpointed focus, the data of collecting according to data processor when exposure are sent instruction to the silicon slice platform controller, with the compensation difference, measure the also distribution of feedback exposure zone silicon chip surface levelness.
2, photo-etching machine off-axis level according to claim 1 and focusing detection control system is characterized in that described one group of confocal optics detector array is made up of at least three detectors.
3, photo-etching machine off-axis level according to claim 1 and focusing detection control system, it is characterized in that, described detector comprises: high numerical aperture lens, single-mode fiber, fiber optic splitter, incident light coupled system, reflected light detection system, the termination of described single-mode fiber in detector is positioned at the back focus of described high numerical aperture lens, the front focus of described high numerical aperture lens and silicon slice under test planes overlapping, described incident light coupled system comprises lighting source and condenser lens, and described reflected light detection system comprises light intensity detector.
4, photo-etching machine off-axis level according to claim 3 and focusing detection control system is characterized in that described incident light is visible light or non-visible light, and this lambda1-wavelength is complementary with described single-mode fiber specification.
5, photo-etching machine off-axis level according to claim 4 and focusing detection control system is characterized in that described incident light is infrared light or ultraviolet light.
6, the implementation method of each described photo-etching machine off-axis level of a kind of claim 1-5 and focusing detection control system, it is characterized in that, may further comprise the steps: at first, the horizontal pinpointed focus of obtaining each exposure area distributes, and judges that according to catoptrical relative intensity in each detector whether silicon chip plane at this detector position is at pinpointed focus; Secondly, data processor is handled the light intensity of all detectors; Then, the data of collecting according to data processor when exposure are sent instruction to the silicon slice platform controller, with the compensation difference.
7, the implementation method of photo-etching machine off-axis level according to claim 6 and focusing detection control system is characterized in that, the horizontal pinpointed focus of obtaining described each exposure area by the vertical step-scan of silicon slice platform distributes.
8, the implementation method of photo-etching machine off-axis level according to claim 7 and focusing detection control system, it is characterized in that, the vertical step-scan of described silicon slice platform may further comprise the steps: step 1, silicon slice platform move to relative position away from the confocal optics detector array earlier; Step 2, silicon slice platform is towards the step-scan of confocal optics detector array column direction; Step 3, to the position of platform of each vertical direction, detector system is gathered reflective light intensity and is distributed; Step 4, after the been scanned, the upper space of the corresponding system in the very big position of the reflective light intensity that the confocal optics detector array runs into for the first time.
9, the implementation method of photo-etching machine off-axis level according to claim 8 and focusing detection control system is characterized in that, the position decentering focal distance described in the step 1 is not less than the twice of system's maximum focusing degree of depth.
10, the implementation method of photo-etching machine off-axis level according to claim 8 and focusing detection control system is characterized in that, the step-scan described in the step 2, and wherein each step is not more than the spatial resolution of needed vertical direction.
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