CN100473114C - Camera assembly and its installation structure - Google Patents
Camera assembly and its installation structure Download PDFInfo
- Publication number
- CN100473114C CN100473114C CNB2006100673897A CN200610067389A CN100473114C CN 100473114 C CN100473114 C CN 100473114C CN B2006100673897 A CNB2006100673897 A CN B2006100673897A CN 200610067389 A CN200610067389 A CN 200610067389A CN 100473114 C CN100473114 C CN 100473114C
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- CN
- China
- Prior art keywords
- insulating body
- imaging apparatus
- camera assembly
- flexible substrate
- cylindrical portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009434 installation Methods 0.000 title 1
- 239000004020 conductor Substances 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims description 53
- 238000003384 imaging method Methods 0.000 claims description 51
- 239000012774 insulation material Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000005452 bending Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
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- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
A camera module is provided with a holding member 1 holding a lens 5; an image sensor 8 arranged oppositely to the lens 5; and an insulating base 7 arranged in a state of supporting the rear surface of this sensor 8. Since the sensor 8 is drawn out by a flexible board having a drawing-out portion 10b, a plurality of connection conductors 10a can be simultaneously connected to the sensor 8, and thus, productivity is good. In addition, since the section 10b is drawn out from a front surface portion 9b to a rear surface portion 9d through a bending portion 9c, the camera module having no disconnection in the section 10b can be obtained. The present invention provides a small and inexpensive camera module having good productivity, and a mounting structure thereof.
Description
Technical field
The present invention relates to be applicable to the camera assembly of electronic equipments such as mobile phone, and mounting structure.
Background technology
Fig. 4 represents the exploded perspective view of existing camera assembly and mounting structure thereof, what Fig. 5 represented existing camera assembly and mounting structure thereof wants portion's profile, if according to Fig. 4, Fig. 5, the structure of existing camera assembly is described, then the retaining member 51 of tubular has: top cylindrical portion 51a; With bottom cylindrical portion 51b, it is connected in this top cylindrical portion 51a, in the cylindrical portion 51a of this top lens 52 is installed.
Constitute by flat board, be provided with the insulated substrate 53 of a plurality of jogs at peripheral part, though it is not shown at this, but be provided with a plurality of conductor introductions that constitute by electric conductor above it, and be provided with this conductor introduction of connection, be positioned at the contact site of the side recess of periphery, at this central portion above insulated substrate 53, be equipped with imaging apparatus 54, be insulated substrate 53 below the imaging apparatus 54 and support.
In addition, imaging apparatus 54 is connected with conductor introduction on the insulated substrate 53 by lead (not shown), and be accommodated in bottom cylindrical portion 51b internal state with imaging apparatus 54, the bottom butt of insulated substrate 53 and bottom cylindrical portion 51b, and be configured, thereby form existing camera assembly (reference example as, patent documentation 1).
But, existing camera assembly, because imaging apparatus 54 is connected by the conductor introduction of lead with insulated substrate 53, therefore its operation bothers, productivity is poor, in addition, is provided with bonding conductor on insulated substrate 53, recess in circumferential lateral surface is provided with contact site, and therefore possible bonding conductor and contact site are at the marginal portion of insulated substrate 53 broken string.
Secondly, according to Fig. 4, Fig. 5, the mounting structure of existing camera assembly is described.On circuit substrate 55, slot 56 is installed, this slot 56 has: by the main part 57 of the ring-type that constitutes of insulation material; With contact spring 58, it is installed in the inside of this main part 57, and is made of the metallic spring material that is connected with the wiring diagram (not shown) of circuit substrate 55.
So existing camera assembly inserts in the main parts 57 with insulated substrate 53, and contact site and contact spring 58 state of contact in the side recess of insulated substrate 53, be installed on the slot 56 (reference example as, patent documentation 1).
But, the mounting structure of existing camera assembly is because the contact spring 58 of slot 56 forms the contact site of the side that is contacted with insulated substrate 53, so slot 56 laterally maximizes, and the contact spring 58 that need constitute by metallic spring material, thereby cost increase.
[patent documentation 1] spy opens communique 2004-No. 304604
Existing camera assembly, because imaging apparatus 54 is connected by the conductor introduction of lead with insulated substrate 53, therefore its operation bothers, productivity is poor, in addition, on insulated substrate 53, be provided with bonding conductor, be provided with contact site at the recess of circumferential lateral surface, therefore might bonding conductor and contact site at the edge part broken string of insulated substrate 53.
In addition, the mounting structure of existing camera assembly is because the contact spring 58 of slot 56 forms the contact site of the side that is contacted with insulated substrate 53, so slot 56 laterally maximizes, and the contact spring 58 that need constitute by metallic spring material, thereby cost increase.
Summary of the invention
Therefore, the object of the present invention is to provide good, small-sized, cheap camera assembly of productivity and mounting structure thereof.
As the first aspect that solves above-mentioned problem, be equipped with: the retaining member that keeps lens; Imaging apparatus, itself and described lens subtend and dispose; Insulating body, it disposes with the state at the back side of supporting this imaging apparatus, has the flexible substrate that distribution constitutes in the insulation material of described imaging apparatus, and this flexible substrate has: front face, its central portion are provided with the hole, are configured in the front of described imaging apparatus; Rear face, it is connected in described front face, is configured in the rear side of described insulating body via bend; Bonding conductor, it is located at described front face, is connected in described imaging apparatus; Lead division, it constitutes via the conductor that described bend is drawn out to described rear face from described front face by being connected in this bonding conductor.
In addition, constitute as second aspect, described insulating body, be provided with the recess of accommodating described imaging apparatus, form state above the top and described imaging apparatus of described insulating body with one side, the described front face of described flexible substrate with the state mounting of one side above described insulating body and described imaging apparatus described.
In addition, constitute as the third aspect, described retaining member has and is provided with plane end face, is used to accommodate the bottom cylindrical portion of described imaging apparatus, and the described front face of described flexible substrate is by described end face and described insulating body clamping.
In addition, constitute as fourth aspect, described insulating body, form quadrangle corresponding to the profile of the inside of the described bottom cylindrical portion that forms the four directions tube, and, keep the location wall and be provided with notch, with the state of described crooked position in this notch at a side of described insulating body, the peripheral part of described insulating body is entrenched in the cylindrical portion of described bottom, and described insulating body is installed in described bottom cylindrical portion.
In addition, constitute as the 5th aspect, the described rear face of described flexible substrate is bonded on the back side of described insulating body.
In addition, constitute, have: camera assembly as the 6th aspect; The circuit substrate of slot is installed, and described slot has: by the main part that constitutes of insulation material; Be installed in the contact of this main part, remain on the state of described main part with described insulating body, described lead division is connected in described contact.
In addition, constitute as the 7th aspect, described lead division is located at the following side of described rear face, and is connected in the described contact of described lead division, is arranged on the diapire of described main part.
Camera assembly of the present invention is equipped with: the retaining member that keeps lens; Imaging apparatus, itself and described lens subtend and dispose; Insulating body, it disposes with the state at the back side of supporting this imaging apparatus, has the flexible substrate that distribution constitutes in the insulation material of described imaging apparatus, and this flexible substrate has: front face, its central portion are provided with the hole, are configured in the front of described imaging apparatus; Rear face, it is connected in described front face, is configured in the rear side of described insulating body via bend; Bonding conductor, it is located at described front face, is connected in described imaging apparatus; Lead division, it constitutes via the conductor that described bend is drawn out to described rear face from described front face by being connected in this bonding conductor.
Promptly, therefore imaging apparatus can be carried out the connection to a plurality of bonding conductor of imaging apparatus simultaneously owing to draw by flexible substrate, and not only productivity is good, and, therefore can obtain lead division and not break because lead division is drawn out to rear face via bend.
In addition, insulating body is provided with the recess of accommodating imaging apparatus, form state above the top and imaging apparatus of insulating body with one side, the front face of flexible substrate with the one side state be positioned in insulating body and imaging apparatus above, therefore, the front face of flexible substrate insulating body and above the imaging apparatus formation become easy with one side to the connection of the bonding conductor of imaging apparatus.
In addition, retaining member has and is provided with plane end face, is used to accommodate the bottom cylindrical portion of imaging apparatus, and therefore the front face of flexible substrate, can obtain certain support of flexible substrate by end face and insulating body clamping.
In addition, insulating body, form quadrangle corresponding to the profile of the inside of the described bottom cylindrical portion that forms the four directions tube, and, keep the location wall and be provided with notch, with the state of described crooked position in this notch at a side of described insulating body, the peripheral part of described insulating body is entrenched in the cylindrical portion of described bottom, described insulating body is installed in described bottom cylindrical portion, and therefore, insulating body can be installed in the cylindrical portion of bottom with stable status.
In addition, because the rear face of flexible substrate is bonded on the back side of insulating body,, be easy to insertion to slot so the maintenance of rear face is stable.
In addition, the mounting structure of camera assembly of the present invention has: camera assembly; The circuit substrate of slot is installed, and slot has: by the main part that constitutes of insulation material; Be installed in the contact of this main part, remain in the state of main part with insulating body, lead division is connected in contact, therefore, form the state of lead division that contact is contacted with the following side of insulating body, compared with the existing, can realize the horizontal miniaturization of slot, and contact need not to use the spring material, thereby cheap.
In addition, lead division is located at the following side of rear face, and the contact that is connected lead division is located at the diapire of main part, therefore, lead division becomes the exterior side of flexible substrate, thereby, the part utilization of this lead division contact site at docking point can be obtained simple structure.
Description of drawings
Fig. 1 be camera assembly of the present invention want portion's profile.
Fig. 2 is the profile of 2-2 lines among Fig. 1.
Fig. 3 be camera assembly of the present invention mounting structure want portion's profile.
Fig. 4 is the exploded perspective view of existing camera assembly and mounting structure thereof.
Fig. 5 be expression existing camera assembly and mounting structure thereof want portion's profile.
Among the figure: 1-retaining member, 2-top cylindrical portion, 2a-hole, 2b-protection department, 3-bottom cylindrical portion, 3a-end face, 4-cover, 4a-hole, 5-lens, 6-infrared ray stripper, 7-insulating body, 7a-recess, 7b-notch, 7c-location wall, 8-imaging apparatus, 9-flexible substrate, 9a-hole, 9b-front face, 9c-bend, 9d-rear face, 10a-bonding conductor, 10b-lead division, 11-wiring diagram, 12-circuit substrate, 13-slot, 14-main part, 14a-diapire, 15-contact.
Embodiment
If the accompanying drawing to camera assembly of the present invention and mounting structure thereof describes, then Fig. 1 be camera assembly of the present invention want portion's profile, Fig. 2 is the profile of 2-2 lines among Fig. 1, Fig. 3 be camera assembly of the present invention mounting structure want portion's profile.
Secondly, if according to Fig. 1～Fig. 3, the structure of camera assembly of the present invention is described, the retaining member 1 that is made of the moulding product of synthetic resin etc. then has: the top cylindrical portion 2 that is made of cylinder; The protection department 2b of ring-type, it is located in this top cylindrical portion 2, has hole 2a at central portion; Bottom cylindrical portion 3, it is connected the bottom of top cylindrical portion 2, by constituting than top cylindrical portion 2 big four directions tubes; Plane end face 3, it is located in this bottom cylindrical portion 3; Cover 4, it has hole 4a at central portion, and covers the place ahead of top cylindrical portion 2.
Four jiaos of flat insulating bodies 7 by the insulation material constitutes have: the recess 7a that is arranged on upper central portion; To locate that wall 7c is retained in both ends and the notch 7b that establishes at a side, in recess 7a, contain imaging apparatus 8, be bonded on the bottom of recess 7a below the imaging apparatus 8, and supported, and the top formation of the top and imaging apparatus 8 of insulating body 7 is with the state of one side.
This insulating body 7 together is housed in the bottom cylindrical portion 3 with imaging apparatus 8, and peripheral part is chimeric with the state of the inwall that is connected to bottom cylindrical portion 3, and imaging apparatus 8 disposes with lens 5 subtends via infrared ray stripper 6.
Also have, flexible substrate 9, along the edgewise bend of insulating body 7 and be provided with bend 9c, this bend 9c is positioned at notch 7b, and rear face 9d is positioned at the rear side of insulating body 7, is bonded on the back side of insulating body 7 by binding agent.
Also have, bonding conductor 10a is made of electric conductor set in the through hole that is arranged on front face 9b, and side is connected on the imaging apparatus 8 below it, and lead division 10b, be provided in the exterior side of flexible substrate 9, rear face 9d forms the state that lead division 10b is positioned at following side.
Also have, in the above-described embodiments, the embodiment that is arranged on the exterior side of flexible substrate 9 with lead division 10b is illustrated, but also can be following mode, that is: lead division 10b is arranged on the inner face side of flexible substrate 9, and is positioned at front face 9b, lead division 10b one distolateral be that bonding conductor 10a is connected on the imaging apparatus 8, in addition, at the other end of the lead division 10b that is positioned at rear face 9d, the contact site that is made of the conductor in the through hole that is arranged on rear face 9d is set.
Secondly,, the mounting structure of camera assembly of the present invention is described, then on circuit substrate 12, slot 13 is installed, and this slot 13 has: the main part 14 that constitutes by the insulation material with wiring Figure 11 if according to Fig. 3; Be installed in the diapire 14a of this main part 14, and be connected a plurality of contacts 15 of Wiring pattern 11.
Also have, camera assembly of the present invention constitutes, insulating body 7 inserts and is installed in the main part 14 of slot 13, and, the following lead division 10b or each contact site that are positioned at the rear face 9d of flexible substrate 9 form and contact 15 state of contact, thereby camera assembly of the present invention is connected on wiring Figure 11 of circuit substrate 12.
Claims (7)
1. a camera assembly is characterized in that, is equipped with: the retaining member that keeps lens; Imaging apparatus, itself and described lens subtend and dispose; Insulating body, it is with the state at the back side of supporting this imaging apparatus and dispose,
Have the flexible substrate that is made of in the insulation material of described imaging apparatus distribution, this flexible substrate has: front face, and its central portion is provided with the hole, is configured in the front of described imaging apparatus; Rear face, it is connected in described front face, is configured in the rear side of described insulating body via bend; Bonding conductor, it is located at described front face, is connected in described imaging apparatus; Lead division, it is by being connected in this bonding conductor, constitute via the conductor that described bend is drawn out to described rear face from described front face, this lead division is positioned at the exterior side of flexible substrate, portion forms the state that lead division is positioned at following side in the back, be accommodated in the imaging apparatus in the insulating body recess and be accommodated in the bottom cylindrical portion of retaining member from the flexible substrate that imaging apparatus draws back, draw back flexible substrate from the upper face side of imaging apparatus to bottom surface side, described camera assembly is installed in the slot by the periphery wall of bottom cylindrical portion.
2. camera assembly according to claim 1 is characterized in that,
Described insulating body is provided with the recess of accommodating described imaging apparatus, form state above the top and described imaging apparatus of described insulating body with one side, the described front face of described flexible substrate with the state mounting of one side above described insulating body and described imaging apparatus described.
3. camera assembly according to claim 1 and 2 is characterized in that,
Described retaining member has and is provided with plane end face, is used to accommodate the bottom cylindrical portion of described imaging apparatus, and the described front face of described flexible substrate is by described end face and described insulating body clamping.
4. camera assembly according to claim 1 is characterized in that,
Described insulating body forms the quadrangle corresponding to the profile of the inside of the described bottom cylindrical portion that forms the four directions tube, and a side at described insulating body, keep the location wall and be provided with notch, with the state of described crooked position in this notch, the peripheral part of described insulating body is entrenched in the cylindrical portion of described bottom, and described insulating body is installed in described bottom cylindrical portion.
5. camera assembly according to claim 1 is characterized in that,
The described rear face of described flexible substrate is bonded on the back side of described insulating body.
6. the mounting structure of a camera assembly is characterized in that, has: camera assembly according to claim 1; With the circuit substrate that slot is installed,
Described slot has: by the main part that constitutes of insulation material; With the contact that is installed in this main part,
Remain on the state of described main part with described insulating body, described lead division is connected in described contact.
7. the mounting structure of camera assembly according to claim 6 is characterized in that,
Described lead division is located at the following side of described rear face, and the described contact that is connected described lead division is located at the diapire of described main part.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005086310A JP2006270568A (en) | 2005-03-24 | 2005-03-24 | Camera module and mounting structure thereof |
| JP2005086310 | 2005-03-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1838734A CN1838734A (en) | 2006-09-27 |
| CN100473114C true CN100473114C (en) | 2009-03-25 |
Family
ID=37015976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100673897A Expired - Fee Related CN100473114C (en) | 2005-03-24 | 2006-03-22 | Camera assembly and its installation structure |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006270568A (en) |
| CN (1) | CN100473114C (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7983556B2 (en) * | 2006-11-03 | 2011-07-19 | Flextronics Ap Llc | Camera module with contamination reduction feature |
| JP2009188802A (en) * | 2008-02-07 | 2009-08-20 | Olympus Corp | Imaging module |
| JP2010177569A (en) * | 2009-01-30 | 2010-08-12 | Panasonic Corp | Optical device and method of manufacturing the same |
| JP5511928B2 (en) * | 2012-10-19 | 2014-06-04 | キヤノン株式会社 | Imaging device |
| JP5498604B1 (en) * | 2013-04-17 | 2014-05-21 | エムテックスマツムラ株式会社 | Hollow package for solid-state image sensor |
| JP6111284B2 (en) * | 2015-04-28 | 2017-04-05 | エムテックスマツムラ株式会社 | Hollow package manufacturing method, solid-state imaging device manufacturing method, hollow package and solid-state imaging device |
-
2005
- 2005-03-24 JP JP2005086310A patent/JP2006270568A/en not_active Withdrawn
-
2006
- 2006-03-22 CN CNB2006100673897A patent/CN100473114C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1838734A (en) | 2006-09-27 |
| JP2006270568A (en) | 2006-10-05 |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090325 Termination date: 20130322 |