CN100470744C - Optical element packaging method and its packaging structure - Google Patents
Optical element packaging method and its packaging structure Download PDFInfo
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- CN100470744C CN100470744C CNB2006101085619A CN200610108561A CN100470744C CN 100470744 C CN100470744 C CN 100470744C CN B2006101085619 A CNB2006101085619 A CN B2006101085619A CN 200610108561 A CN200610108561 A CN 200610108561A CN 100470744 C CN100470744 C CN 100470744C
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Abstract
An optical component encapsulation method is provided, which comprises the following procedures: first of all, provide a basal material and configure a plurality of optical components on the surface of the basal material; the basal material is provided with at least two first contraposition patterns; then, provide a spacing material; the spacing material is provided with a plurality of openings and at least two through holes; then, point the plurality of openings to the plurality of optical components by utilizing the plurality of first contraposition patterns and through hole; then, join the basal material and the spacing material; then, provide a glass basal plate with at least two second contraposition patterns; finally, join the spacing material and the glass basal plate by utilizing the plurality of second contraposition patterns and through hole.
Description
[technical field]
The invention relates to a kind of method for packing and encapsulating structure, and particularly relevant for a kind of method for packing and structure of optical element.
[background technology]
Projector's industry development so far, (Digital Micromirror Device is DMD) with LCOS (LiquidCrystal On Silicon) reflection type liquid crystal projection to so-called digital micromirror elements from iconoscope (CRT), amorphous silicon (a-Si), polysilicon (p-Si) for technology.With the market viewpoint, along with projector's development of technology, projector's product is because volume is little, in light weight, easy to carry, adding that the mobile computer performance constantly promotes day by day increases with sales volume and popularizes, and then it is in fashion also to drive the multimedia bulletin, make script just based on projector's product in office automation (OA) market, following except the consumer electronics market development, also will cut so-called PC market.Shadow casting technique makes rapid progress, and in all optical elements, is the spare part of most critical with the projection chip.
Fig. 1 is the encapsulating structure figure of existing projection chip.Please refer to Fig. 1, projection chip 11 must be packaged in the gap that material 12 produces between base material 10 and glass substrate 13 at interval, and then the penetrable glass substrate 13 of light passes in and out projection chips 11, and can reach the effect of protection projection chip 11.When encapsulation, earlier projection chip 11 is arranged on the substrate 10, material 12 at interval is set around projection chip 11, press from both sides top glass substrate 13 again.In case, can pressing finish encapsulation through after the contraposition.
Yet base material 10, interval material 12 can't carry out contraposition with glass substrate 13 threes.In the conventional package processing procedure, the contraposition processing procedure utilize usually charge coupled cell (Charge Coupled Device, CCD).Because in the encapsulating structure of projection chip 11, the excesssive gap between base material 10 and the glass substrate 13, charge coupled cell can't capture the loci on base material 10 and the glass substrate 13 simultaneously, cause the accurately problem of contraposition.In addition, in case product can't contraposition, follow-up cutting processing procedure is also uncontrollable, has a strong impact on follow-up processing procedure and product yield.
[summary of the invention]
The object of the present invention is to provide a kind of method for packing and structure of optical element, can improve the problem that to utilize the photo-sensitive cell contraposition in the prior art.
According to purpose of the present invention, the present invention proposes a kind of method for packing of optical element, comprises step: a base material (a) is provided, and its surface is provided with several optical elements, and this base material has at least two first pair of bit patterns; (b) provide material at interval, this interval material has several openings and at least two perforations; (c) utilize aforementioned first pair of bit patterns and perforation to do contraposition, aforementioned opening corresponding to optical element, and is engaged this base material and this interval material according to this; (d) provide glass substrate, it has at least two second pair of bit patterns; And (e) utilize aforementioned second pair of bit patterns and aforementioned perforation to do contraposition, and engage this interval material and this glass substrate according to this.
According to purpose of the present invention, the present invention proposes a kind of optical package, and it comprises base material, optical element, interval material and glass substrate.Base material has first pair of bit patterns, and optical element is arranged on the base material.Material is pressed on the base material at interval, and material has some openings and perforation at interval, and opening is corresponding to optical element, and first pair of bit patterns is corresponding to perforation.Glass substrate is pressed on the material of interval, and glass substrate has second pair of bit patterns corresponding to perforation.
The present invention forms perforation in the material of interval, and forms corresponding pattern on glass substrate and base material.Thus, photo-sensitive cell can see through glass substrate and perforation carries out automation contraposition processing procedure, neither needs to buy more new plant and equipment, more can continue to use original board and encapsulate.Moreover optical element can accurately be controlled successive process through after the accurate contraposition of said method, and improves process rate.
[description of drawings]
Fig. 1 is the encapsulating structure figure of existing projection chip.
Fig. 2 A to Fig. 2 H is the encapsulation flow chart according to the optical element of preferred embodiment of the present invention.
[embodiment]
See also Fig. 2 A to Fig. 2 H, it shows the encapsulation flow chart according to the optical element of preferred embodiment of the present invention.The method for packing of the optical element of present embodiment comprises the following steps.At first, shown in Fig. 2 A, provide base material 100, its surface is provided with several optical elements 110, and base material 100 has at least two first pair of bit patterns 102,104.Base material 100 is the CMOS wafer preferably.Simultaneously, shown in Fig. 2 B, provide material 120 at interval, material 120 has several openings 125 and at least two perforations 122,124 at interval.Material 120 preferably utilizes crystal round etching to form at interval, and it is as described below that it forms step in detail.In the process of making the interval material, wafer is provided, and on wafer, forms the patterning photoresist layer, at last again according to the optical pattern resistances layer, crystal round etching is gone out several openings 125 and at least two perforations 122,124.
Afterwards, utilize several first pair of bit patterns 102,104 and several perforations 122,124 to do contraposition, several openings 125 corresponding to several optical elements 110, shown in Fig. 2 C, and are engaged base material 100 and interval material 120 according to this.In more detail, at first photo-sensitive cell is focused on the base material 100 and the intersection of material 120 at interval, photo-sensitive cell for example be charge coupled cell (Charge Coupled Device, CCD).Afterwards, adjust the relative position of base material 100 and interval material 120, several openings 125 are corresponded respectively to several optical elements 110.Please refer to Fig. 2 D, it is the profile according to the hatching 2D-2D ' among Fig. 2 C.The opening 125 of material 120 makes optical element 110 be arranged in material 120 and base material 100 formed grooves at interval towards optical element 110 at interval.Then, fine setting is the relative position between material 120 and the base material 100 at interval, and utilize photosensitive elements sense with several first pair of bit patterns 102,104 corresponding in several perforations 122,124, shown in Fig. 2 C.That is to say, can detect first pair of bit patterns 102, in the time of can detecting first pair of bit patterns 124 through perforation 124, promptly finish contraposition when photo-sensitive cell sees through perforation 122.After contraposition is finished, just pressing base material 100 and material 120 at interval at last.
Moreover, glass substrate 130 is provided, it has at least two second pair of bit patterns 132,134, shown in Fig. 2 E.Glass substrate 130 is glass wafer preferably.Then, utilize several second pair of bit patterns 132,134 and several perforations 122,124 to do contraposition, and engage material 120 and glass substrate 130 at interval according to this, shown in Fig. 2 F.On operating, at first photo-sensitive cell is focused on the intersection of interval material 120 and glass substrate 130, adjust the relative position of interval material 120 and glass substrate 130 then.Simultaneously, utilize photosensitive elements sense with two second pair of bit patterns 132,134 corresponding in two perforations 122,124, shown in Fig. 2 F.That is to say, can detect second pair of bit patterns 132 when being arranged in 122, the second pairs of bit patterns 134 of perforation and being arranged in perforation 124, promptly represent contraposition when photo-sensitive cell penetrates glass substrate 130.After contraposition is finished, at interval material 120 and glass substrate 130 of pressing just at last.Please refer to Fig. 2 G, it is according to the profile of the packaging part among Fig. 2 F along hatching 2G-2G '.After this step was finished, material 120 was pressed on the base material 100 at interval, and the opening 125 of interval material 120 is corresponding to optical element 110, and glass substrate 130 is pressed on the material 120 of interval.
Say that further the present invention carries out contraposition after also can overlapping base material, interval material and glass substrate together again.As long as photo-sensitive cell is focused between base material and the interval material, or between interval material and the glass substrate, just can distinguish contraposition, also will reach identical effect at last.
At last, shown in Fig. 2 H, the method for packing of the optical element of present embodiment also comprises step: the base material that cutting has engaged, interval material and glass substrate, and form several optical packages according to this.Like this, finish the encapsulation of optical element, and one of them optical package that utilizes the said method encapsulation to form comprises base material 100, optical element 110, interval material 120 and glass substrate 130.Base material 100 has first pair of bit patterns 102, and optical element 110 is arranged on the base material 100.At interval material 120 is pressed on the base material 100, and material 120 has opening 125 and perforation 122 at interval, opening 125 corresponding to 110, the first pairs of bit patterns 102 of optical element corresponding to perforation 125.Glass substrate 130 is pressed on the material 120 of interval, and glass substrate 130 has second pair of bit patterns 132 corresponding to perforation 122.Thus, optical element 110 for example is a dmd chip, just the light that sees through glass substrate 130 incidents can be reflected further or reflect.
In addition, base material 100 is CMOS wafer (CMOS wafer) preferably, and material 120 preferably utilizes crystal round etching to form at interval, and glass substrate 130 is glass wafer (glass wafer) preferably.Thus, from put base material, etching at interval material, put glass substrate and all can finish at existing encapsulation board to contraposition.
The method for packing of the disclosed optical element of the above embodiment of the present invention and structure can be improved the problem that can't utilize the photo-sensitive cell contraposition traditionally.Owing to must add material at interval during the encapsulation of optical element, allow strut a segment distance between base material and the glass substrate, with ccontaining optical element.And the method that contraposition is adopted during traditional encapsulation is applied and is used.Present embodiment forms perforation in the material of interval, and forms corresponding pattern on glass substrate and base material.Thus, photo-sensitive cell can see through glass substrate and perforation carries out automation contraposition processing procedure, neither needs to buy more new plant and equipment, more can continue to use original board and encapsulate.Moreover optical element can accurately be controlled successive process through after the accurate contraposition of said method, and improves process rate.
Claims (8)
1. the method for packing of an optical element, it is characterized in that: it comprises: a base material is provided, and its surface is provided with several optical elements, and this base material has the step of at least two first pair of bit patterns; One interval material is provided, and this interval material has the step of several openings and at least two perforations; Utilize first pair of bit patterns and perforation to do contraposition, aforementioned opening corresponding to aforementioned optical element, and is engaged the step of this base material and this interval material; One glass substrate is provided, and it has the step of at least two second pair of bit patterns; And utilize second pair of bit patterns and aforementioned perforation to do contraposition, and engage the step of this interval material and this glass substrate.
2. method for packing as claimed in claim 1 is characterized in that: provide the step of this interval material also to comprise: the step that a wafer is provided; On this wafer, form the step of a patterning photoresist layer; And, this crystal round etching is gone out the step of several openings and at least two perforations according to this patterning photoresist layer.
3. method for packing as claimed in claim 1 is characterized in that: the step that engages this base material and this interval material also comprises: the step that a photo-sensitive cell is focused on the intersection of this base material and this interval material; Adjust the relative position of this base material and this interval material, those openings are corresponded respectively to the step of those optical elements; Utilize this photosensitive elements sense with those first pair of bit patterns corresponding to the step in those perforations; And the step of this base material of pressing and this interval material.
4. method for packing as claimed in claim 1 is characterized in that: the step that engages this interval material and this glass substrate also comprises: the step that a photo-sensitive cell is focused on the intersection of this interval material and this glass substrate; Adjust the step of the relative position of this interval material and this glass substrate; Utilize this photosensitive elements sense with these second pair of bit patterns corresponding to the step in these perforations; And the step of interval material and this glass substrate is somebody's turn to do in pressing.
5. as claim 3 or 4 described method for packing, it is characterized in that: aforementioned photo-sensitive cell is a charge coupled cell.
6. method for packing as claimed in claim 1 is characterized in that: it also comprises base material, interval material and glass substrate that cutting has engaged, and forms the step of several optical packages.
7. optical package, it is characterized in that: it comprises the base material with first pair of bit patterns; Be arranged at the optical element on this base material; Be pressed on the interval material on this base material, this interval material has opening and perforation, and this opening is corresponding to aforementioned optical element, and aforementioned first pair of bit patterns is corresponding to this perforation; And being pressed on glass substrate on this interval material, this glass substrate has second pair of bit patterns corresponding to aforementioned perforation.
8. optical package as claimed in claim 7 is characterized in that: aforementioned interval material is to be formed by a crystal round etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101085619A CN100470744C (en) | 2006-07-21 | 2006-07-21 | Optical element packaging method and its packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101085619A CN100470744C (en) | 2006-07-21 | 2006-07-21 | Optical element packaging method and its packaging structure |
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| Publication Number | Publication Date |
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| CN101110372A CN101110372A (en) | 2008-01-23 |
| CN100470744C true CN100470744C (en) | 2009-03-18 |
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| CNB2006101085619A Active CN100470744C (en) | 2006-07-21 | 2006-07-21 | Optical element packaging method and its packaging structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104613379B (en) * | 2015-02-06 | 2017-12-26 | 东莞佰鸿电子有限公司 | A kind of sapphire printed circuit board (PCB) LED lamp and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2370567Y (en) * | 1999-01-20 | 2000-03-22 | 日月光半导体制造股份有限公司 | Base for semiconductor packaging |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2370567Y (en) * | 1999-01-20 | 2000-03-22 | 日月光半导体制造股份有限公司 | Base for semiconductor packaging |
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| CN101110372A (en) | 2008-01-23 |
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