CN100456443C - Method of manufacturing an optical module - Google Patents
Method of manufacturing an optical module Download PDFInfo
- Publication number
- CN100456443C CN100456443C CNB2006101452088A CN200610145208A CN100456443C CN 100456443 C CN100456443 C CN 100456443C CN B2006101452088 A CNB2006101452088 A CN B2006101452088A CN 200610145208 A CN200610145208 A CN 200610145208A CN 100456443 C CN100456443 C CN 100456443C
- Authority
- CN
- China
- Prior art keywords
- manufacture method
- optical module
- liner
- optical element
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 title claims abstract description 150
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims description 73
- 239000004033 plastic Substances 0.000 claims description 14
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- 239000000463 material Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
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- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 206010011224 Cough Diseases 0.000 description 1
- 230000010748 Photoabsorption Effects 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
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- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
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- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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- G02B6/4244—Mounting of the optical elements
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- H01S5/00—Semiconductor lasers
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Abstract
The invention relates to a method of manufacturing an optical module capable of accurately adjusting the position of the optical element along the optical axis. The method of manufacturing an optical module having an optical element includes: (a) providing a housing having a base portion and a frame portion provided on the base portion; (b) providing a spacer on the base portion of the housing; (c) pressing the spacer to plastically deform the spacer; (d) bonding the optical element and the spacer; (e) disposing a cover member formed of a transparent substrate on the housing; and (f) providing a connector with a lens to surround the housing.
Description
Technical field
The present invention relates to a kind of manufacture method of optical module.
Background technology
Optical element as light-emitting component or light-sensitive element is owing to external environment conditions such as dust or moisture sustain damage, thereby causes performance degradation.In order to prevent such performance degradation, developing a kind of in assembly the method with the airtight sealing of optical element.For example, the disclosed airtight molding method of Japanese Unexamined Patent Application Publication 2002-534813 communique, this airtight envelope is ended method and is formed bond layer and metal level, so that the PHOTONIC DEVICE on the covered substrate.
On the other hand, when other equipment such as optical coupling optical element and optical fiber, in order to obtain good coupling efficiency, must the accurate position of adjusting the optical element on the optical axis direction.But,, therefore, be difficult to the accurate position of adjusting optical element owing to the reasons such as this body structure of assembly that can not accurate be formed for accommodating optical element.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method of optical module, can be used for the accurate position of adjusting the optical element on the optical axis direction.
In the manufacture method of the optical module that the present invention relates to, comprising: (a) prepare to have basal part and the step that is arranged at the casing of the frame section on this basal part; (b) liner is arranged at step on the basal part of above-mentioned casing; (c) make the step of its plastic deformation by pushing above-mentioned liner; And (d) make optical element be connected the step of (bonding) with above-mentioned liner.
In the manufacture method of the optical module that the present invention relates to, above-mentioned casing is made of pottery, and above-mentioned steps (a) can comprise by burning till makes frame parts that constitutes said frame portion and the incorporate step of plate member that constitutes above-mentioned basal part.
In the manufacture method of the optical module that the present invention relates to, before plastic deformation, above-mentioned liner can have the jut of projection upward.
In the manufacture method of the optical module that the present invention relates to, above-mentioned liner can be made of conductive material.
In the manufacture method of the optical module that the present invention relates to, above-mentioned optical element can have electrode on the face of above-mentioned liner one side.
In the manufacture method of the optical module that the present invention relates to, above-mentioned liner is an electric wire, and above-mentioned steps (b) can comprise: the step that forms conductive layer in the bottom of above-mentioned box inside; An end of said wires is connected in the step of above-mentioned conductive layer; The other end of said wires is connected in the step of above-mentioned conductive layer.
In the manufacture method of the optical module that the present invention relates to, above-mentioned liner has bulbous protrusion.
In the manufacture method of the optical module that the present invention relates to, also can be included in above-mentioned steps (d) afterwards with the step of lens configuration in the top of above-mentioned optical element.
In the manufacture method of the optical module that the present invention relates to, in above-mentioned steps (c), use has the Height Adjustment anchor clamps of first and second portion, when pushing above-mentioned liner by above-mentioned first, make second portion touch the upper surface of said frame portion, can control pushing thus above-mentioned liner.Wherein, the first of above-mentioned Height Adjustment anchor clamps is relative with above-mentioned basal part, and above-mentioned second portion and height upper surface relative with said frame portion is lower than above-mentioned first.
In the manufacture method of the optical module that the present invention relates to, also can be included in above-mentioned steps (a) and form the step of seal member afterwards at the upper surface of the frame section of above-mentioned casing, wherein, above-mentioned seal member is used to make the cover of above-mentioned casing and this casing to be connected (combination).
In the manufacture method of the optical module that the present invention relates to, in above-mentioned steps (c), use Height Adjustment anchor clamps with first and second portion, push above-mentioned liner by above-mentioned first, simultaneously, push above-mentioned seal member by second portion.Wherein, the first of above-mentioned Height Adjustment anchor clamps is relative with above-mentioned basal part, and above-mentioned second portion and height upper surface relative with said frame portion is lower than above-mentioned first.
In the manufacture method of the optical module that the present invention relates to, can be at the above-mentioned steps (a) and (b), and (d) afterwards, carry out above-mentioned steps (c).
In the manufacture method of the optical module that the present invention relates to, can reach (d) afterwards in above-mentioned steps (a), carry out above-mentioned steps (b) and reach (c).
In the manufacture method of the optical module that the present invention relates to, in above-mentioned steps (c), use has the Height Adjustment anchor clamps of first and second portion, push above-mentioned optical element by above-mentioned first, simultaneously, make second portion touch the upper surface of said frame portion, control pushing thus above-mentioned liner.Wherein, the first of above-mentioned Height Adjustment anchor clamps is relative with above-mentioned basal part, and above-mentioned second portion and height upper surface relative with said frame portion is lower than above-mentioned first.
In the manufacture method of the optical module that the present invention relates to, also can be included in above-mentioned steps (a) forms seal member afterwards at the upper surface of the frame section of above-mentioned casing step.The sealing parts are used to make the cover of above-mentioned casing and this casing to be connected.
In the manufacture method of the optical module that the present invention relates to, in above-mentioned steps (c), use Height Adjustment anchor clamps with first and second portion, push above-mentioned optical element by above-mentioned first, simultaneously, push above-mentioned seal member by second portion.Wherein, the first of above-mentioned Height Adjustment anchor clamps is relative with above-mentioned basal part, and second portion and height upper surface relative with said frame portion is lower than above-mentioned first.
In the manufacture method of the optical module that the present invention relates to, above-mentioned optical element comprises substrate and is formed at opticator on this substrate; Above-mentioned Height Adjustment anchor clamps have recess in above-mentioned first; In above-mentioned steps (c), push above-mentioned optical element by first, so that make above-mentioned opticator be positioned at above-mentioned recess.
Description of drawings
Fig. 1 is the profile that schematically illustrates the optical module producing method that present embodiment relates to;
Fig. 2 is the profile that schematically illustrates the optical module producing method that present embodiment relates to;
Fig. 3 is the profile that schematically illustrates the optical module producing method that present embodiment relates to;
Fig. 4 is the profile that schematically illustrates the optical module producing method that present embodiment relates to;
Fig. 5 is the profile that schematically illustrates the optical module producing method that present embodiment relates to;
Fig. 6 is the profile that schematically illustrates the optical module producing method that present embodiment relates to;
Fig. 7 is the profile that schematically illustrates the optical module that present embodiment relates to;
Fig. 8 is the profile that schematically illustrates the optical module producing method that first variation relates to;
Fig. 9 is the profile that schematically illustrates the optical module producing method that first variation relates to;
Figure 10 is the profile that schematically illustrates the optical module that first variation relates to;
Figure 11 is the profile that schematically illustrates the optical module producing method that second variation relates to;
Figure 12 is the profile that schematically illustrates the optical module producing method that second variation relates to;
Figure 13 is the profile that schematically illustrates the optical module producing method that the 3rd variation relates to; And
Figure 14 is the profile that schematically illustrates the optical module producing method that the 3rd variation relates to.
Embodiment
Below, with reference to accompanying drawing the preferred embodiments of the present invention are described.
1. at first, the manufacture method of the optical module that present embodiment is related to describes.Fig. 1 to Fig. 7 is the profile of the manufacture method of expression optical module.
(1) at first, prepare casing 10.As shown in Figure 1, casing 10 comprises basal part 12 and is arranged at frame section 14 on the basal part 12.Basal part 12 and frame section 14 are made of pottery.Constitute basal part 12 plate member, and constitute the frame parts of frame section 14 can be by the non-sintered ceramic that for example contains aluminium oxide (alumina), be that the individual layer or the multilayer of tellite constitutes.The frame parts that constitutes frame section 14 is to form porose parts on tellite.Tellite can be processed into desirable shape by die-cut mould or perforating press etc.By the quantity of employed tellite in adjustment basal part 12 and the frame section 14, but the size of adjusting tank body 10.And, on the surface of each tellite, also can wait and form distribution by printing.Constitute the plate member of basal part 12 and constitute the frame parts of frame section 14 and carry out sintering by lamination, make it form an integral body, thereby form casing 10.And, bonding for the ease of casing 10 and seal member described later 20, also can carry out surface treatment at the upper surface of the frame section 14 of casing 10.
As shown in Figure 1, casing 10 also comprises first distribution 16 and second distribution 18.After forming the hole on the plate member that is constituting basal part 12, use electric conducting material to form first distribution 16 and second distribution 18.First distribution 16 and second distribution 18 form by the mode of hole up to lower surface with the upper surface from basal part 12.At the upper surface of basal part 12, on the whole zone that second distribution 18 can be formed at optical element described later engages.
(2) below, as shown in Figure 2, seal member 20 is set at the upper surface of frame section 14.Seal member 20 is set, is used to make cover 40 described later to be connected (bond, in conjunction with) with casing 10.Seal member 20 then has no particular limits so long as be used to make casing 10 and the material that cover 40 is connected, and can comprise thermoplastic insulating properties material or metal material, for example can comprise the preliminary working product of low melting point glass.Seal member 20 uses for example rectangular box-like parts.
(3) below, as shown in Figure 3, on the basal part 12 of the inside of casing 10, be formed with liner 22a.Liner 22a has the jut of projection upward.Liner 22a is made of the material of plastically deformable, for example, can have bulbous protrusion (bump).Bulbous protrusion forms by following method: the orbicule 1st that uses the metal wire connector will be formed at the capillary front end connects (at first connecting) to casing 10, and will cut off from the metal wire of orbicule projection.At this, bulbous protrusion just be formed at basal part 12 on second distribution 18 carry out first and be connected.Liner 22a preferably is made of metal material, can be made of for example gold.Bulbous protrusion is formed at the zone that is provided with optical element 30 (with reference to Fig. 5).For example, when the base area of optical element 30 is 0.3mm * 0.3mm, form 3 * 3 bulbous protrusion that diameter is 0.1mm.
(4) below, as shown in Figure 4, push, can make liner 22a plastic deformation thus by Height Adjustment anchor clamps 60.Height Adjustment anchor clamps 60 comprise first 62 relative with liner 22a and the second portion 64 relative with frame section 14, as shown in Figure 4, have convex shape.The upper surface of first 62 is higher than the upper surface of second portion 64.The difference that Height Adjustment anchor clamps 60 are configured to the upper surface of the upper surface of first 62 and second portion 64 is random length a.The material of Height Adjustment anchor clamps 60 is so long as use gets final product not special the qualification than seal member 20 and the harder material of liner 22a.
Particularly, use Height Adjustment anchor clamps 60 to push liner 22a and seal member 20 to the direction of arrow as shown in Figure 4.Specifically, be that liner 22a pushes in first 62, second portion 64 is pushed seal member 20.Thus, form liner 22 by crushing liner 22a and making it plastic deformation, thereby, the difference in height of liner 22 and seal member 20 can be adjusted to length a.At this, when pushing liner 22a by first 62 in the Height Adjustment anchor clamps 60, make second portion 64 touch the upper surface of seal member 20.Therefore, plastic deformation also can take place owing to being crushed in seal member 20.When seal member 20 obviously is stiffer than liner 22a, plastic deformation can not take place, and limit and push liner 22a, thereby can prevent the excessive plastic deformation of liner 22a.
(5) below, as shown in Figure 5, optical element 30 is connected with liner 22.At first, apply link 24 in the mode in the gap of filling liner 22, and optical element 30 is disposed at the upper surface of liner 22 and link 24, and when applying suitable load downwards, carry out the tube core welding.As link 24, for example can use silver paste.At this, so-called suitable load is meant the load that is unlikely to make liner 22 distortion.
After the silver paste sclerosis as link 24, carry out the wire bonds of electric wire 36 and electric wire 38.Electric wire 36 is electrically connected the electrode and first distribution 16 that is formed on the substrate 32, and electric wire 38 is electrically connected the electrode and second distribution 18 that is formed on the substrate 32.
(6) below, as shown in Figure 6, cover 40 is connected by seal member 20 with casing 10.With the direction (below) of 40 basad 12 of covers when pushing, heated sealant parts 20.For example, can heat by mode from the upper surface irradiating laser of seal member 20.Cover 40 can be made of the transparency carrier of the light transmission that optical element 30 is sent or accept, and for example, is made of glass substrate.When using glass substrate, hang down melting point glass as seal member 20 by using, thereby can improve the adhesiveness of seal member 20 and cover 40 as cover 40.
(7) below, as shown in Figure 7, the connector 50 that has lens is installed on casing 10.The connector 50 that has lens comprises portion's sleeve 52 and lens 54.Be inserted with for example ferrule in the sleeve 52.Lens section 54 is arranged at the top of optical element 30, the light that collection optic part 34 is sent or from the light of outside.The connector 50 that has lens is arranged to be centered around around the frame section 14.
By above step, can make optical module 100.In the manufacture method of the optical element 100 that present embodiment relates to, use Height Adjustment anchor clamps 60 to crush liner 22a, and dispose optical element 30 thereon.Thus, the difference in height of optical element 30 and cover 40 can be adjusted to length a.Like this, adjust the distance of optical element 30 and cover 40 by precision, can the accurate distance of adjusting lens section 54 and optical element 30, therefore, can improve the controlled of light path.And then can improve the coupling efficiency of external equipments such as optical element 30 and optical fiber.
And, in the manufacture method of the optical module 100 that present embodiment relates to, because liner 22a has jut, so can carry out plastic deformation simply by Height Adjustment anchor clamps 60.Therefore, can form liner 22 with suitable height.And liner 22a is owing to being to be made of the high conductive material of heat conductivity generally, so can improve thermal diffusivity.And in the present embodiment, the electrode of optical element 30 is set at upper surface, still, also can electrode be arranged on the face (the inside) of liner 22 1 sides in contrast.Be provided with in the inside of optical element 30 electrode and when liner 22a be when constituting by conductive material, first distribution 16 or second distribution 18 can be electrically connected with optical element 30, therefore, can omit from the upper surface of optical element 30 lead-in wire Connection Step to first distribution 16 or second distribution 18.
And, by using Height Adjustment anchor clamps 60 as shown in Figure 4, can push liner 22a and seal member 20 simultaneously.Thus, can accurate adjust the difference in height of the upper surface of the upper surface of seal member 20 and liner 22, therefore, even when the height of the basal part 12 that for example can not finely tune casing 10, also can the accurate distance of adjusting between optical element 30 and the lens section 54.
In addition, in the manufacture method of the optical module that present embodiment relates to, be after seal member 20 is set, make liner 22a plastic deformation.But, also can before seal member 20 is set, make liner 22a plastic deformation in contrast.In this case, in Height Adjustment anchor clamps 60, when pushing liner 22a, make second portion 64 touch the upper surface of frame section 14 by first 62.Thus, frame section 14 restrictions are pushed liner 22a's, thereby can prevent the excessive plastic deformation of liner 22a.
2. variation
2.1 first variation
Below, the manufacture method of the optical module 200 (with reference to Figure 10) that first variation is related to describes.In the optical module 200, liner 122a is connected with second distribution 18 at two places, and is different with the optical module that present embodiment relates to.
It is identical with above-mentioned step to form liner 122a step before.Use patching machine, the orbicule that is formed at the capillary front end is carried out first with second distribution 18 be connected, then, carry out second by the other end with second distribution 18 and be connected, can obtain liner 122a as shown in Figure 8 electric wire.
Below, as shown in Figure 9, push by using Height Adjustment anchor clamps 60, make liner 122a plastic deformation and form liner 122.Subsequently, by above-mentioned step, cover 40 is set and has the connector 50 of lens, thereby can obtain optical module 200 as shown in figure 10.
Like this, because liner 122 is connected with second distribution 18 at two places, can reduces resistance, and can improve thermal diffusivity.
For the structure and the manufacturing step of the optical module except that above-mentioned 200, because identical, so omit explanation to it with the structure and the manufacturing step of above-mentioned optical module 100.
2.2 second variation
Below, the manufacture method of the optical module that second variation is related to describes.Just optical element 30 was arranged at this point on the liner 222a before pushing by Height Adjustment anchor clamps 260, the manufacture method of the optical module that second variation relates to is different with the manufacture method of the optical module that present embodiment relates to.And employed liner 222a is identical with employed liner 122a in first variation in the manufacture method of the optical module that second variation relates to, but the shape of liner 222a is not limited to this.
As shown in figure 11, after forming liner 222a, optical element 30 is disposed on the liner 222a.At this moment, the height that liner 222a is preferably formed to each liner 222a is certain, so that can flatly dispose optical element 30.And, before configuration optical element 30, also link 24 can be coated in the gap of liner 222a or upper surface.
Then, use Height Adjustment anchor clamps 260, push the substrate 32 and the seal member 20 of optical element 30.As shown in figure 12, Height Adjustment anchor clamps 260 have recess 263 in the first 262 relative with liner 222a.Particularly, push the substrate 32 of optical element 30, and push seal member 20 by second portion 264 with the zone beyond the recess 263 of first 262.
For configuration cover 40 steps later manufacture method, because the manufacture method of the optical module that relates to present embodiment is identical, so economize the explanation of coughing up it.
2.3 the 3rd variation
Below, the manufacture method of the optical module that the 3rd variation is related to describes.The manufacture method of the optical module that the 3rd variation relates to is, after forming liner 322a on the optical element 30, liner 322a is disposed on the casing 10 again, and in this, the manufacture method of the optical module that relates to present embodiment is different.
At first, as shown in figure 13, be formed with liner 322a at the back side of optical element 30.Liner 322a forms by the method identical with the formation method of liner 22a in the present embodiment.Particularly, liner 322a forms with following method: use patching machine, the orbicule that is formed at the capillary front end is carried out first with the back side of optical element 30 be connected, and will cut off from the electric wire of orbicule projection.At this, bulbous protrusion is only carried out first with the back side of substrate 32 and is connected.In addition, on the back side of substrate 32, also can be formed for driving the electrode of optical element 30.
Then, optical element 30 is disposed on the basal part 12 in the casing 10, and link 24 is coated in the gap of liner 322a or upper surface, make the liner side towards the below then, and optical element 30 is configured on second distribution 18.Then, use Height Adjustment anchor clamps 260 are pushed and are heated optical element 30, thereby optical element 30 is connected with casing 10.Because the Height Adjustment anchor clamps 260 that relate to of the 3rd variation have the identical structure of the Height Adjustment anchor clamps that relate to second variation 260, so omit explanation to it.
As mentioned above, by on optical element 30, being pre-formed liner 322a, liner 322 can be configured in the suitable location on the optical element 30.And, by pushing optical element 30, can accurately adjust the difference in height of the upper surface of the upper surface of substrate 32 of optical element 30 and seal member 20.Thus, need not to consider the thickness of substrate 32, the also adjustable lay the grain department of the Chinese Academy of Sciences divides 34 and the distance of lens section 54.
The present invention has more than and is limited to the above embodiments.For example, the present invention includes and the identical formation (for example, function, method and the formation that comes to the same thing, the perhaps identical formation of purpose and effect) of formation essence that illustrates in an embodiment.And the present invention also comprises the formation of the non-intrinsically safe part in the formation that illustrates among the displacement embodiment.And, the present invention also comprise obtain with embodiment in the formation same function effect that illustrates formation or reach the formation of identical purpose.In addition, the present invention also comprises the formation of additional known technology in the formation that illustrates in an embodiment.
Reference numeral
10 casings, 12 basal parts
14 frame sections, 16 first distributions
18 second distributions, 20 seal members
22 liners, 24 attaching parts
30 optical elements, 32 substrates
34 opticators 36,38 electric wires
40 covers 50 are with the connection part of lens
52 sleeves, 54 lens sections
60 height adjustment anchor clamps, 100 optical modules
122 liners, 200 optical modules
222 liners, 322 liners
Claims (18)
1. manufacture method that comprises the optical module of optical element comprises:
(a) step of preparation casing, wherein, described casing has basal part and the frame section that is arranged on this basal part;
(b) liner is arranged at step on the basal part of described casing;
(c) by pushing the step that makes described liner plastic deformation; And
(d) make optical element and described liner step of connecting.
2. the manufacture method of optical module according to claim 1, wherein,
Described casing is made of pottery,
Described step (a) comprises by burning till makes frame parts that constitutes described frame section and the incorporate step of plate member that constitutes described basal part.
3. the manufacture method of optical module according to claim 1, wherein, before plastic deformation, described liner has the jut of projection upward.
4. according to the manufacture method of each described optical module in the claim 1 to 3, wherein, described liner is made of conductive material.
5. the manufacture method of optical module according to claim 4, wherein, described optical element has electrode at the mask of described liner one side.
6. the manufacture method of optical module according to claim 1, wherein, described liner is an electric wire,
Described step (b) comprising:
On the bottom of described box inside, form the step of conductive layer;
One end of described electric wire is connected in the step of described conductive layer;
The other end of described electric wire is connected in the step of described conductive layer.
7. the manufacture method of optical module according to claim 1, wherein, described liner has bulbous protrusion.
8. the manufacture method of optical module according to claim 1 wherein, in described step (d) afterwards, also comprises the step of lens configuration in described optical element top.
9. the manufacture method of optical module according to claim 1, wherein, in described step (c), use has the Height Adjustment anchor clamps of first and second portion, push described liner by described first, simultaneously, make described second portion touch the upper surface of described frame section, thus, restriction is pushed described liner, wherein, described first is relative with described basal part, and described second portion and height its upper surface relative with described frame section is lower than described first.
10. the manufacture method of optical module according to claim 1, wherein, also be included in described step (a) and form the step of seal member afterwards at the upper surface of the frame section of described casing, wherein, described seal member is used to make the cover of described casing and this casing to be connected.
11. the manufacture method of optical module according to claim 10, wherein, in described step (c), use has the Height Adjustment anchor clamps of first and second portion, pushes described liner by described first, simultaneously, push described seal member by described second portion, wherein, described first is relative with described basal part, and described second portion and height its upper surface relative with described frame section is lower than described first.
12. the manufacture method of optical module according to claim 1 wherein, at described step (a) and (b), and (d) afterwards, is carried out described step (c).
13. the manufacture method of optical module according to claim 1 wherein, reaches (d) afterwards in described step (a), carries out described step (b) and reaches (c).
14. according to the manufacture method of claim 12 or 13 described optical modules, wherein,
In described step (c), use has the Height Adjustment anchor clamps of first and second portion, push described optical element by described first, simultaneously, make described second portion touch the upper surface of described frame section, thus, restriction is pushed described liner, wherein, described first is relative with described basal part, and described second portion and height its upper surface relative with described frame section is lower than described first.
15. according to the manufacture method of claim 12 or 13 described optical modules, wherein,
Also be included in described step (a) and form the step of seal member afterwards at the upper surface of the frame section of described casing, wherein, described seal member is used to make the cover of described casing and this casing to be connected.
16. the manufacture method of optical module according to claim 15, wherein,
In described step (c), use has the Height Adjustment anchor clamps of first and second portion, push described optical element by described first, simultaneously, push described seal member by described second portion, wherein, described first is relative with described basal part, and described second portion and height its upper surface relative with described frame section is lower than described first.
17. the manufacture method of optical module according to claim 14, wherein,
Described optical element comprises substrate and is formed at opticator on this substrate,
Described Height Adjustment anchor clamps have recess in described first,
In described step (c), push described optical element by described first, so that make described opticator be positioned at described recess.
18. the manufacture method of optical module according to claim 16, wherein,
Described optical element comprises substrate and is formed at opticator on this substrate,
Described Height Adjustment anchor clamps have recess in described first,
In described step (c), push described optical element by described first, so that make described opticator be positioned at described recess.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005334303A JP2007142176A (en) | 2005-11-18 | 2005-11-18 | Manufacturing method of optical module |
JP2005334303 | 2005-11-18 |
Publications (2)
Publication Number | Publication Date |
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CN1967796A CN1967796A (en) | 2007-05-23 |
CN100456443C true CN100456443C (en) | 2009-01-28 |
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CNB2006101452088A Expired - Fee Related CN100456443C (en) | 2005-11-18 | 2006-11-17 | Method of manufacturing an optical module |
Country Status (4)
Country | Link |
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US (1) | US7364372B2 (en) |
EP (1) | EP1788673A1 (en) |
JP (1) | JP2007142176A (en) |
CN (1) | CN100456443C (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007206337A (en) * | 2006-02-01 | 2007-08-16 | Seiko Epson Corp | Manufacturing method of optical module |
DE102008039147A1 (en) * | 2008-05-30 | 2009-12-03 | Osram Opto Semiconductors Gmbh | Optoelectronic module and optoelectronic device |
TWI573407B (en) * | 2013-01-14 | 2017-03-01 | 鴻海精密工業股份有限公司 | Optical communication module |
US10566468B2 (en) * | 2016-03-23 | 2020-02-18 | ams Sensors Singapore Pte. Ltd | Optoelectronic module assembly and manufacturing method |
FR3109466B1 (en) * | 2020-04-16 | 2024-05-17 | St Microelectronics Grenoble 2 | Device for supporting an electronic chip and corresponding manufacturing method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6384473B1 (en) * | 2000-05-16 | 2002-05-07 | Sandia Corporation | Microelectronic device package with an integral window |
US20020072214A1 (en) * | 1998-10-28 | 2002-06-13 | Seiko Epson Corporation | Semiconductor device and method of fabrication thereof, circuit board, and electronic equipment |
US6485993B2 (en) * | 1999-12-02 | 2002-11-26 | Teraconnect Inc. | Method of making opto-electronic devices using sacrificial devices |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0529156U (en) | 1991-09-26 | 1993-04-16 | 日本特殊陶業株式会社 | Package for thin integrated circuits |
JPH09172102A (en) | 1995-12-20 | 1997-06-30 | Ngk Spark Plug Co Ltd | Packaging ceramic lid for electronic parts and manufacturing method |
JPH1013007A (en) | 1996-03-29 | 1998-01-16 | Ngk Spark Plug Co Ltd | Wiring board with solder bump, its manufacturing method, and flattening tool |
JP3834417B2 (en) | 1998-03-17 | 2006-10-18 | 株式会社住友金属エレクトロデバイス | Package for piezoelectric device and method for manufacturing the same |
JP2000022012A (en) | 1998-06-29 | 2000-01-21 | Kyocera Corp | Electronic component device |
JP2000114413A (en) * | 1998-09-29 | 2000-04-21 | Sony Corp | Semiconductor device, its manufacture, and method for mounting parts |
US6588949B1 (en) | 1998-12-30 | 2003-07-08 | Honeywell Inc. | Method and apparatus for hermetically sealing photonic devices |
JP4085549B2 (en) | 2000-03-14 | 2008-05-14 | セイコーエプソン株式会社 | Piezoelectric device and manufacturing method thereof |
JP2001274653A (en) | 2000-03-24 | 2001-10-05 | Seiko Epson Corp | Piezoelectric device |
JP3994623B2 (en) * | 2000-04-21 | 2007-10-24 | 豊田合成株式会社 | Method for producing group III nitride compound semiconductor device |
US7150569B2 (en) | 2003-02-24 | 2006-12-19 | Nor Spark Plug Co., Ltd. | Optical device mounted substrate assembly |
TW591778B (en) * | 2003-03-18 | 2004-06-11 | Advanced Semiconductor Eng | Package structure for a microsystem |
US20050133928A1 (en) | 2003-12-19 | 2005-06-23 | Howard Gregory E. | Wire loop grid array package |
JP2007206337A (en) * | 2006-02-01 | 2007-08-16 | Seiko Epson Corp | Manufacturing method of optical module |
-
2005
- 2005-11-18 JP JP2005334303A patent/JP2007142176A/en not_active Withdrawn
-
2006
- 2006-11-15 EP EP06023735A patent/EP1788673A1/en not_active Withdrawn
- 2006-11-15 US US11/599,411 patent/US7364372B2/en not_active Expired - Fee Related
- 2006-11-17 CN CNB2006101452088A patent/CN100456443C/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020072214A1 (en) * | 1998-10-28 | 2002-06-13 | Seiko Epson Corporation | Semiconductor device and method of fabrication thereof, circuit board, and electronic equipment |
US6485993B2 (en) * | 1999-12-02 | 2002-11-26 | Teraconnect Inc. | Method of making opto-electronic devices using sacrificial devices |
US6384473B1 (en) * | 2000-05-16 | 2002-05-07 | Sandia Corporation | Microelectronic device package with an integral window |
Also Published As
Publication number | Publication date |
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EP1788673A1 (en) | 2007-05-23 |
CN1967796A (en) | 2007-05-23 |
US20070117236A1 (en) | 2007-05-24 |
US7364372B2 (en) | 2008-04-29 |
JP2007142176A (en) | 2007-06-07 |
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