CN100452932C - Organic electro photoluminescence device, and assembly method - Google Patents
Organic electro photoluminescence device, and assembly method Download PDFInfo
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- CN100452932C CN100452932C CNB2005100734576A CN200510073457A CN100452932C CN 100452932 C CN100452932 C CN 100452932C CN B2005100734576 A CNB2005100734576 A CN B2005100734576A CN 200510073457 A CN200510073457 A CN 200510073457A CN 100452932 C CN100452932 C CN 100452932C
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Abstract
The present invention relates to an organic electroluminescent device which comprises a basal plate, an organic light emitting diode, a sealing cover with a circuit and a flexible circuit board. The assembling method for the organic electroluminescent device comprises the steps that firstly, the organic light emitting diode is formed on the basal plate; secondly, the sealing cover is covered on the organic light emitting diode; thirdly, the circuit is formed on the upper surface of the sealing cover; finally, the basal plate and the circuit are electrically connected by the flexible circuit board.
Description
Technical field
The present invention relates to a kind of Organic Light-Emitting Device (Organic ElectroluminescentDevice) and assembly method thereof, particularly relate to a kind of Organic Light-Emitting Device and assembly method of circuit being located at the cap upper surface.
Background technology
Along with the progress of low temperature polycrystalline silicon (LTPS) technology, (System on Panel, SOP or System on Glass SOG) become the development priority of each panel factory at present with circuit integrated systematization panel on panel.But existing board only can make the live width of LTPS-TFT reach 3 μ m～4 μ m, if the littler live width that just must buy more exposure bench in addition and develop 1 μ m that the systematization panel will be made.Yet,, still need certain area to hold circuit on the panel, so that this type of panel is difficult for reaching the requirement of miniaturization even dwindled live width.
Existing systematization panel (SOG) is that display elements such as Organic Light Emitting Diode or thin-film transistor and other circuit element such as RAM, CPU etc. are made on the same plate base.The problem of this way maximum is that the area of systematization panel can become big because having increased many peripheral circuits, is difficult for satisfying the trend of customer requirement miniaturization.
Be depicted as existing organic electroluminescence panel vertical view as Figure 1A.Panel 10 comprises: a substrate 11, a cap 12, organize a peripheral circuit 13 and a flexible printed wiring board 14 more.Substrate 11 left ends engage with flexible printed wiring board 14, and its inside is that an active region 121 covers thereon with cap 12.Around the active region 121 is an extension area 122, has many group peripheral circuits 13 in the extension area 122.
Shown in Figure 1B and Fig. 1 C, be respectively the AA section of Figure 1A and the end view of BB section.Active region 121 inside on substrate 11 have an Organic Light Emitting Diode 15, are protected with cap 12.Because peripheral circuit 13 is made on the same substrate 11 with Organic Light Emitting Diode 15, along with the size of shared substrate 11 areas of the circuit element of peripheral circuit 13 or the width demand of its cabling, make active region 121 have more the area of extension area 122 on every side unavoidablely.
Yet Organic Light Emitting Diode is self-luminous, does not need as the backlight module printing opacity in the one side of cap 12.And cap 12 tops have than large tracts of land, as long as through suitably planning, again by day by day ripe circuit element joining technique, for example: routing encapsulation (Chip on PCB), winding engage (TapeAutomatic Bonding, TAB), glass flip chip (Chip on Glass, COG) and membrane of flip chip (COF) can smoothly peripheral circuit 13 be transplanted to cap 12 upper surfaces and reach the purpose of removing extension area 122 areas.
Summary of the invention
Main purpose of the present invention is to provide a kind of assembly method of Organic Light-Emitting Device, and the area that makes full use of on the cap plans that circuit is to dwindle the panel area.
Another object of the present invention is to provide a kind of Organic Light-Emitting Device, has a circuit on its cap.The integrated circuit that system is required moves to the cap top as elements such as RAM, CPU, again with the element on flexible printed wiring board electric connection substrate and the cap;
Assembly method basic step of the present invention comprises: a substrate is provided, an Organic Light Emitting Diode is set on substrate.Then covering an encapsulation is placed on the Organic Light Emitting Diode.Subsequently, form the upper surface of a circuit pattern in cap; Wherein, described circuit pattern in described cap upper surface, and provides a flexible circuit board with the low-temperature polysilicon film technology growth, to electrically connect substrate and circuit.
The Organic Light-Emitting Device of finishing with the said method assembling comprises: a substrate, an Organic Light Emitting Diode, a cap and a flexible circuit board.Wherein Organic Light Emitting Diode is arranged at the upper surface of substrate.Cap is covered on the Organic Light Emitting Diode, and the cap upper surface has a circuit pattern; Wherein, described circuit pattern with the low-temperature polysilicon film technology growth in described cap upper surface.Circuit on substrate and the cap electrically connects by flexible circuit board.
Description of drawings
Figure 1A is the vertical view of existing organic electroluminescence panel;
Figure 1B is the AA cross sectional side view of Figure 1A;
Fig. 1 C is the BB cross sectional side view of Figure 1A;
Fig. 2 A-2E is the assembly method schematic diagram of Organic Light-Emitting Device of the present invention;
Fig. 3 is second preferred embodiment of Organic Light-Emitting Device of the present invention;
Fig. 4 is the vertical view of Fig. 2 E or structure shown in Figure 3.
The main element symbol description
10 organic electroluminescence panels, 23 drier
11 substrates, 24 circuit
12 caps, 25 memories
121 active regions, 26 microprocessors
122 extension areas, 27 chips
13 peripheral circuits, 28 flexible circuit boards
14 flexible printed wiring boards, 281 abutting ends
15 Organic Light Emitting Diodes, 282 abutting ends
151 electrodes, 29 frame glue
152 electrodes, 30 Organic Light-Emitting Device
20 Organic Light-Emitting Device, 31 drive circuits
21 chip for driving, 311 thin-film transistors
22 caps, 312 metallic circuits
Embodiment
The spy in conjunction with the accompanying drawings, describe Organic Light-Emitting Device of the present invention and assembly method thereof in detail: the basic step of Organic Light-Emitting Device assembly method of the present invention comprises: a substrate is provided, and forms an Organic Light Emitting Diode on substrate.Then covering an encapsulation is placed on the Organic Light Emitting Diode.Subsequently, form the upper surface of a circuit, and provide a flexible circuit board to electrically connect substrate and circuit in cap.Enumerating preferred embodiment is described as follows:
Fig. 2 A-2E is depicted as the assembly method schematic diagram of Organic Light-Emitting Device of the present invention.Method of the present invention comprises: a substrate 11 is provided, and forms an Organic Light Emitting Diode 15 on substrate 11, and the side of a chip for driving 21 in Organic Light Emitting Diode 15 is provided.Then cover a cap 22 on Organic Light Emitting Diode 15, cap 22 inboards are set up a drier 23 usually.Subsequently, form a circuit 24 in the upper surface of cap 22.It should be noted that the circuit element that forming circuit 24 is required, for example: memory 25, microprocessor 26 or other have the upper surface that the chip (chip) of specific function or chipset (chipset) 27 etc. all are arranged on cap 22.After finishing above-mentioned steps, pass through a flexible circuit board 28 again to electrically connect the circuit 24 on substrate 11 and the cap 22.
In a better embodiment, cap 22 adopts glass material or is plastic material.Above-mentioned various circuit element can the low-temperature polysilicon film technology directly be grown up in cap 22 upper surfaces, or utilizes other circuit element joining technique to be engaged on the circuit node.For example circuit element is made on the wafer in advance, after the cutting encapsulation, (Chip on Glass COG) waits the circuit element joining technique to engage or be adhered on the cap 22 with glass flip chip again.Wherein, the glass flip chip mode is that directly (Anisotropic Conductive Film ACF) is bonding on the circuit node of glass packaging lid 22 through anisotropic conductive film to cover crystal type with chip for driving 21.
Fig. 2 E is depicted as Organic Light-Emitting Device of the present invention.Finish the Organic Light-Emitting Device 20 of assembling with said method, comprise at least: a substrate 11, an Organic Light Emitting Diode 15, a cap 22 and a flexible circuit board 28.Organic Light Emitting Diode 15 is arranged at the upper surface of substrate 11, and it has two electrodes 151,152 and an electric hole injection/transport layer, a luminescent layer; One electronics injection/transport layer is positioned between two electrodes 151,152.Common and substrate 11 electrodes in contact are anode, if but anti-phase type (inverted) Organic Light-Emitting Device, then first growth negative electrode is on substrate.The material of electrode 151,152 can be metal materials such as indium oxide (ITO) or Al, Mg, Ag, Ca, Ba.Cap 22 is covered on the Organic Light Emitting Diode 15, and the cap upper surface has a circuit 24 and comprises circuit elements such as a memory 25, a microprocessor 26 or other functional chip 27, drier 23 is arranged with pre-moisture proof, oxidation and external impact and the cap lower surface is additional.Cap 22 materials can be glass or plastics.Substrate 11 is to electrically connect by flexible circuit board 28 with circuit 24 on the cap 22, binds by a frame glue 29 (sealant) between the two and keeps suitable spacing.
Figure 3 shows that another embodiment of Organic Light-Emitting Device of the present invention.Organic Light-Emitting Device 30 directly is laid in the chip for driving 21 that drive circuit 31 on the substrate 11 replaces above-mentioned Organic Light Emitting Diode 15 by one.Drive circuit 31 comprises that one is formed at the thin-film transistor element 311 on the substrate 11, LTPS-TFT for example, and be laid in metallic circuit 312 on the substrate.In addition, all the other installation step are with identical shown in Fig. 2 A-2E.
Figure 4 shows that the vertical view of Fig. 2 E or structure shown in Figure 3.Please compare Figure 1A and Fig. 4, the circuit 24 among Fig. 4 comprises the metallic circuit that circuit system elements such as the peripheral circuit 13 shown in Figure 1A, memory 25, microprocessor 26 and connected storage 25, microprocessor 26 are required.After peripheral circuit 13 is moved to cap 22 tops, can removes the most area of extension area 122 among Figure 1A, and dwindle the whole front panel area.
In Figure 1A, the other end of flexible printed wiring board 14 engages with a motherboard (not icon), and the motherboard top has circuit system elements such as memory, microprocessor.In Fig. 4, then the circuit system element is moved to cap 22 tops, and engage with substrate with an end 281 of flexible printed wiring board 28, the other end 282 engages with circuit 24 on the cap 22.In other words, promptly be the function that cap 22 has motherboard simultaneously concurrently.
Method provided by the present invention and device and prior art relatively possess following properties and advantage mutually:
Circuit is arranged on the cap of Organic Light-Emitting Device, can significantly reduce the area of panel.
Can make full use of the area planning circuit on the cap, can increase transistorized quantity simultaneously, accomplish the circuit such as the CPU of higher-order.
Need not buy more board and dwindle live width, therefore can promote yield to clamp-on face plate edge.
Above content is preferred embodiment of the present invention only, is not to be used for limiting practical range of the present invention, and all variation with modification according to the equivalence that the present invention did all should be included in the protection range of the present invention.
Claims (9)
1. the assembly method of an Organic Light-Emitting Device is characterized in that, comprising:
One substrate is provided;
Form an Organic Light Emitting Diode on described substrate;
Covering an encapsulation is placed on the described Organic Light Emitting Diode;
Form the upper surface of a circuit pattern in described cap, wherein, the pattern of described circuit with the low-temperature polysilicon film technology growth in described cap upper surface; And
Provide a flexible circuit board with described substrate of electrically connect and described circuit.
2. the method for claim 1 is characterized in that, also comprises forming an integrated circuit component in described cap upper surface.
3. the method for claim 1 is characterized in that, also comprising provides a microprocessor to be engaged in described cap upper surface.
4. the method for claim 1 is characterized in that, also comprises with Flip Chip engaging the circuit node of a circuit element in the upper surface of described cap.
5. an Organic Light-Emitting Device is characterized in that, comprising:
One substrate;
One Organic Light Emitting Diode is arranged at the upper surface of described substrate;
One cap is covered on the described Organic Light Emitting Diode, and the cap upper surface has a circuit pattern; Wherein, the pattern of described circuit with the low-temperature polysilicon film technology growth in described cap upper surface; And
One flexible circuit board electrically connects the circuit on described substrate and the described cap.
6. device as claimed in claim 5 is characterized in that, described cap upper surface also is provided with a memory.
7. device as claimed in claim 5 is characterized in that, described cap upper surface also is provided with a microprocessor.
8. device as claimed in claim 5 is characterized in that, the material of described cap is a glass.
9. device as claimed in claim 5 is characterized in that, the material of described cap is plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100734576A CN100452932C (en) | 2005-05-30 | 2005-05-30 | Organic electro photoluminescence device, and assembly method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100734576A CN100452932C (en) | 2005-05-30 | 2005-05-30 | Organic electro photoluminescence device, and assembly method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1874623A CN1874623A (en) | 2006-12-06 |
| CN100452932C true CN100452932C (en) | 2009-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100734576A Active CN100452932C (en) | 2005-05-30 | 2005-05-30 | Organic electro photoluminescence device, and assembly method |
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| CN (1) | CN100452932C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104712922B (en) * | 2013-12-11 | 2017-03-15 | 力志国际光电股份有限公司 | Organic light-emitting diode illuminator |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002151250A (en) * | 2000-11-07 | 2002-05-24 | Nippon Avionics Co Ltd | Plane luminous panel and its manufacturing method |
| JP2004078107A (en) * | 2002-08-22 | 2004-03-11 | Samsung Nec Mobile Display Co Ltd | Organic electroluminescent display device having impact absorbing structure |
| JP2004234938A (en) * | 2003-01-29 | 2004-08-19 | Nippon Seiki Co Ltd | Organic el display device |
| CN1568112A (en) * | 2003-06-19 | 2005-01-19 | 铼宝科技股份有限公司 | Organic electroluminescent panel device |
| JP2005116339A (en) * | 2003-10-08 | 2005-04-28 | Sony Corp | Display device |
-
2005
- 2005-05-30 CN CNB2005100734576A patent/CN100452932C/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002151250A (en) * | 2000-11-07 | 2002-05-24 | Nippon Avionics Co Ltd | Plane luminous panel and its manufacturing method |
| JP2004078107A (en) * | 2002-08-22 | 2004-03-11 | Samsung Nec Mobile Display Co Ltd | Organic electroluminescent display device having impact absorbing structure |
| JP2004234938A (en) * | 2003-01-29 | 2004-08-19 | Nippon Seiki Co Ltd | Organic el display device |
| CN1568112A (en) * | 2003-06-19 | 2005-01-19 | 铼宝科技股份有限公司 | Organic electroluminescent panel device |
| JP2005116339A (en) * | 2003-10-08 | 2005-04-28 | Sony Corp | Display device |
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| Publication number | Publication date |
|---|---|
| CN1874623A (en) | 2006-12-06 |
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