KR20170027145A - Organic light emitting diode display device - Google Patents

Abstract

The present invention provides an organic light-emitting diode display device capable of implementing a narrow bezel and protecting a thin film transistor from static electricity introduced from the outside. The organic light-emitting diode display device includes: a first substrate including an organic light-emitting diode disposed in a display region and a pad unit disposed in a pad region; a transparent conductive film disposed on the first substrate; an interlayer insulating film disposed on the transparent conductive film, and having a contact hole exposing the transparent conductive film in the pad region; a second substrate disposed in the display region, and bonded to the first substrate such that the second substrate faces the first substrate; a first printed circuit board disposed on the second substrate; and a flexible printed circuit board connected to the first printed circuit board and the pad unit, and mounted thereon with a driving integrated circuit, wherein a first input end of the flexible printed circuit board is connected to a ground end of the first printed circuit board, a first pad included in the pad unit is connected to the transparent conductive film exposed through the contact hole, and the first pad is connected to a first output end of the flexible printed circuit board.

Description

[0001] The present invention relates to an organic light emitting diode (OLED) display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting diode (OLED) display device, and more particularly, to an organic light emitting diode display device capable of implementing a narrow bezel and protecting a thin film transistor from static electricity introduced from the outside.

2. Description of the Related Art Currently, flat panel display devices such as plasma display panels (PDP), liquid crystal display devices (LCD), and organic light emitting diode display devices (OLED) are widely studied and used have.

Of the flat panel display devices as described above, the organic light emitting display device is a self-luminous device, and since it does not require a backlight used in a liquid crystal display device, it can be lightweight and thin.

In addition, it has superior viewing angle and contrast ratio compared with liquid crystal display devices, is advantageous in terms of power consumption, can be driven by DC low voltage, has a quick response speed, is resistant to external impacts due to its solid internal components, It has advantages.

Particularly, since the manufacturing process is simple, it is advantageous in that the production cost can be saved more than the conventional liquid crystal display device.

A driving integrated circuit (IC) of a flat panel display device includes a data driving integrated circuit and a gate driving integrated circuit. The data driving integrated circuit supplies a data signal to the data wiring. The gate driving integrated circuit The gate signal is sequentially supplied to the gate wiring.

At this time, the method of mounting the driving integrated circuit on the display panel includes a method of bonding the flexible printed circuit board on which the driving integrated circuit is mounted to the display panel, a COG (Chip On Glass) method of bonding the driving integrated circuit directly on the substrate, and the like It is known.

In addition, the flexible circuit board for mounting the driving integrated circuit may be a chip on film (COF) or a tape carrier package (TCP), and the flexible circuit board on which the driving integrated circuit is mounted may be an ACF (Anisotropic Conductive Film) And can be bonded onto the substrate.

1 is a view showing a flexible circuit board bonded to a display panel by a conventional forward bonding method.

As shown in the drawing, a conventional display panel includes a first substrate 11 and a second substrate 12 which exposes a pad region of the first substrate 11 and is disposed on the first substrate 11, A printed circuit board 15 disposed on the first substrate 11 and a second printed circuit board 15 connected to the printed circuit board 15 and a flexible printed circuit board 13 ).

Hereinafter, a method of connecting the first substrate 11 and the printed circuit board 15 with the flexible circuit board 13 using the forward bonding method will be described.

The other end of the flexible circuit board 13 is connected to the first substrate 11 so that one end of the flexible circuit board 13 mounted on the lower surface of the flexible printed circuit board 13 is led out of the first substrate 11, To the edge.

Next, the flexible circuit board 13 is bent so that one end of the flexible circuit board 13 is bonded to the printed circuit board 15 in the forward direction.

At this time, the drive integrated circuit 14 disposed on the lower surface of the flexible circuit board 13 before the flexible circuit board 13 is bonded to the printed circuit board 15 faces the upper surface of the display panel.

In addition, a portion of the flexible circuit board 13, that is, a bent portion, protrudes outside the first substrate 11 to have a protrusion.

At this time, there is a problem that cracks are generated due to stress generated when the flexible circuit board 13 is excessively tilted.

Meanwhile, in recent years, in order to realize a slim design of a final product, for example, a monitor or a TV, a display device is required to have a smaller bezel, which is defined as a width of a non-display area outside the display area Is required.

However, as described above, due to the protruding portion of the flexible circuit board 13 protruding out of the first substrate 11 when bonded to the display panel of the flexible circuit board 13 by the forward bonding method, the narrow bezel There is a problem with limit.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide an organic electroluminescent device capable of protecting a plurality of thin film transistors by accumulating electrostatic charge, And an object thereof is to provide a diode display device.

According to an aspect of the present invention, there is provided a display device including a first substrate including an organic light emitting diode disposed in a display region and a pad portion disposed in a pad region, a transparent conductive film disposed on the first substrate, An interlayer insulating film having a contact hole exposing a transparent conductive film in a pad region, a second substrate disposed in a display region and adhered to the first substrate, and a second printed circuit disposed in the upper portion of the second substrate, And a flexible printed circuit board connected to the first printed circuit board and the pad unit and having a drive integrated circuit mounted thereon, wherein the first input end of the flexible printed circuit board is connected to the ground end of the first printed circuit board, The first pad is connected to the transparent conductive film exposed through the contact hole, and the first pad is connected to the first output terminal of the flexible circuit board.

The first substrate may include a first substrate including an organic light emitting diode disposed in the display region and a pad portion disposed in the pad region. A second substrate exposed to the first substrate edge and bonded to the first substrate, An interlayer insulating film which is disposed on the transparent conductive film and exposes the transparent conductive film on the edge of the first substrate; a first printed circuit board disposed on the second substrate above the first printed circuit board; A first conductive tape arranged on an upper part of the transparent conductive film exposed by the second substrate and the interlayer insulating film to connect the second substrate and the transparent conductive film, And a second conductive tape disposed on the first printed circuit board and connected to the second substrate and a ground terminal of the first printed circuit board.

The apparatus further includes a second printed circuit board disposed on the second substrate and connected to the first printed circuit board through a flexible circuit cable.

Further, it further includes an insulating layer disposed between the second substrate and the first printed circuit board.

Further, the driving integrated circuit is disposed on the lower surface of the flexible circuit board and is seated on the insulating layer.

In addition, the flexible circuit board is made of COF (Chip On Film), the second substrate is made of a metal material, and the transparent conductive film is made of ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide).

The present invention has the effect of protecting a plurality of thin film transistors by disposing a transparent conductive film between the upper surface of the first substrate and a plurality of thin film transistors, accumulating static electricity flowing from the outside into the transparent conductive film, and discharging the static electricity to the outside.

Further, by bonding the flexible circuit board by the reverse bonding method, it is possible to prevent cracks due to stress generated when the flexible circuit board is excessively folded, and to prevent the flexible circuit board from protruding out of the first substrate Narrow bezel can be implemented.

1 is a view showing a flexible circuit board bonded to a display panel by a conventional forward bonding method.
2 is a plan view showing the back surface of the organic light emitting diode display according to the first embodiment of the present invention.
3 is a cross-sectional view taken along line IV-IV in Fig.
Fig. 4 is a view showing the flexible circuit board of Figs. 2 and 3. Fig.
5 is a plan view showing the rear surface of the organic light emitting diode display according to the second embodiment of the present invention.
FIG. 6A is a cross-sectional view taken along VI-VI of FIG. 5, and FIG. 6B is a cross-sectional view taken along VII-VII of FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

≪ Embodiment 1 >

2 is a cross-sectional view taken along the line IV-IV in FIG. 2. FIG. 4 is a cross-sectional view taken along the line II-III in FIG. 2, 1 is a view showing a flexible circuit board.

2 and 3, the organic light emitting diode display 100 according to the first embodiment of the present invention includes an organic light emitting diode (not shown) and a pad region PA disposed in a display region DP, A transparent conductive film 103 disposed on one surface of the first substrate 101 and an interlayer insulating film 105 (not shown) disposed on the transparent conductive film 103. The first conductive film 103 is formed on the first conductive film 103, A second substrate 102 disposed on the display area DP and bonded to the first substrate 101 so as to face the first substrate 101; a first printed circuit board 150 disposed on the second substrate 102; And a flexible circuit board 113 on which the integrated circuit 114 is mounted.

In addition, the second substrate 102 may be formed of a metal material, and the transparent conductive film 103 may be formed of ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide).

Accordingly, the organic light emitting diode display 100 according to the first embodiment of the present invention is implemented as a bottom emission method.

Here, the flexible circuit board 113 may be a chip on film (COF), and the flexible printed circuit board 113 may be connected to the first printed circuit board 150 and the pad portion (not shown) Respectively.

Specifically, the flexible circuit board 113 is flatly bonded onto the first substrate 101 so that the flexible circuit board 113 does not protrude out of the first substrate 101.

That is, the first end of the flexible circuit board 113 is bonded to the edge of the first substrate 101, and the second end of the flexible circuit board 113 is directed to the inside of the first substrate 101, The entire lower surface from the first end to the second end of the first and second substrates 113 and 113 faces the first and second substrates 101 and 102.

Since the flexible circuit board 113 is disposed inside the first and second boards 101 and 102 when the flexible circuit board 113 is bonded to the first and second boards 101 and 102 in the reverse direction, , The flexible circuit board 113 does not protrude out of the first substrate 101.

This prevents cracks due to stress generated when the flexible circuit board 113 is excessively tilted and prevents the flexible circuit board 113 from protruding out of the first substrate 101, A narrow bezel can be realized.

3 and 4, the drive integrated circuit 114 is mounted on the lower surface between the first and second ends of the flexible circuit board 113, An input end portion 111 which is in contact with the output end of the first printed circuit board 150 and an output end portion 112 which is in contact with the pad portion of the first substrate 101 And signal wires 111a connecting the input end 111 and the output end 112 of the flexible circuit board 113 and the drive integrated circuit 114 are disposed.

The printed circuit board 190 further includes a second printed circuit board 190 disposed on the second substrate 102 and connected to the first printed circuit board 150 through a flexible circuit cable 170.

The second printed circuit board 190 has a timing control unit 191 and a power supply unit 193 mounted thereon and is connected to the input end of the first printed circuit board 150 through a flexible circuit cable 170, .

At this time, the flexible circuit cable 170 may be a flexible flat cable (FFC).

The organic light emitting diode display 100 according to the first embodiment of the present invention further includes an insulating layer 130 disposed between the second substrate 102 and the first printed circuit board 150.

At this time, the insulating layer 130 is for insulating the second substrate 102 made of a metal material, the first printed circuit board 150 and the flexible circuit board 113 from each other.

The driving integrated circuit 114 disposed on the lower surface of the flexible circuit board 113 is seated on the insulating layer 130 so as to prevent interference that may be received from the second substrate 102 made of a metal material .

The organic light emitting diode display 100 according to the first embodiment of the present invention is a bottom emission type and includes a plurality of thin film transistors (not shown) on a first substrate 101, A plurality of thin film transistors (not shown) may be damaged by the static electricity flowing into the lower surface of the first substrate 101.

Particularly, in the case of external compensation, the sensing thin film transistor (not shown) may be damaged due to the static electricity flowing through the sensing wiring (not shown), and noise may be generated on the screen after external compensation.

The organic light emitting diode display device 100 according to the first embodiment of the present invention includes a first substrate 101 and a second substrate 101. The organic light emitting diode display 100 according to the first embodiment of the present invention includes a first substrate 101, A plurality of thin film transistors (not shown) can be protected by disposing a transparent conductive film 103 between a plurality of thin film transistors (not shown), accumulating static electricity flowing from the outside into the transparent conductive film 103, have.

The interlayer insulating film 105 has a contact hole ch for exposing the transparent conductive film 103 to the pad area PA of the first substrate 101 and has an input end 111 of the flexible circuit board 113 The first input terminal 115a of the first printed circuit board 150 is connected to the ground terminal of the output terminal of the first printed circuit board 150 and the first pad 107 included in the pad unit And the first pad 107 is connected to the first output terminal 115b of the output terminal 112 of the flexible circuit board 113. The first output terminal 115b of the flexible printed circuit board 113 is connected to the first transparent conductive film 103,

The first pad 107 may be directly connected to the transparent conductive film 103 exposed through the contact hole ch but may be formed of a conductive material disposed between the first pad 107 and the transparent conductive film 103, Or indirectly through a connection layer or connection wiring.

The static electricity accumulated in the transparent conductive film 103 is absorbed by the first pad 107 and the flexible printed circuit board 113 connected to the transparent conductive film 103 And is discharged to the ground terminal of the printed circuit board 150 through the first output terminal 115b.

≪ Embodiment 2 >

FIG. 5 is a plan view showing the rear surface of the OLED display according to the second embodiment of the present invention. FIG. 6A is a sectional view taken along line VI-VI in FIG. 5, Fig.

As shown in the drawing, an OLED display 200 according to a second embodiment of the present invention includes an organic light emitting diode (not shown) disposed in a display area DP and a pad (Not shown); a second substrate 202 which is exposed to the edge of the first substrate 201 and is adhered to and opposed to the first substrate 201; An interlayer insulating film 205 disposed on the transparent conductive film 203, a first printed circuit board 250 disposed on the second substrate 202, a first printed circuit board 250 and a pad unit (not shown), and a flexible printed circuit board 213 on which the driving integrated circuit 214 is mounted.

In addition, the second substrate 202 may be formed of a metal material, and the transparent conductive film 203 may be formed of indium tin oxide (ITO) or indium zinc oxide (IZO).

Accordingly, the organic light emitting diode display device 200 according to the second embodiment of the present invention is implemented as a bottom emission method.

Here, the flexible circuit board 213 may be a chip on film (COF), and the flexible printed circuit board 213 may be connected to the first printed circuit board 250 and the pad portion (not shown) Respectively.

More specifically, the flexible circuit board 213 is flatly bonded onto the first substrate 201 so that the flexible circuit board 213 does not protrude out of the first substrate 201.

That is, the first end of the flexible circuit board 213 is bonded to the edge of the first substrate 201, and the second end of the flexible circuit board 213 is directed to the inside of the first substrate 201, The entire lower surface from the first end to the second end of the first and second substrates 213 and 213 faces the first and second substrates 201 and 202.

Since the flexible circuit board 213 is disposed inside the first and second boards 201 and 202 when the flexible circuit board 213 is bonded to the first and second boards 201 and 202 in the reverse direction, , The flexible circuit board 213 does not protrude out of the first substrate 201.

This prevents cracks due to stress generated when the flexible circuit board 213 is excessively tilted and prevents the flexible circuit board 213 from protruding out of the first substrate 201, A narrow bezel can be realized.

And a second printed circuit board 290 disposed on the second substrate 202 and connected to the first printed circuit board 250 through the flexible circuit cable 270. [

The second printed circuit board 290 is mounted with a timing control unit 291 and a power supply unit 293. The control circuit board 290 is connected to the input end of the first printed circuit board 250 through a flexible circuit cable 270, .

At this time, the flexible circuit cable 270 may be a flexible flat cable (FFC).

The organic light emitting diode display 200 according to the second embodiment of the present invention further includes an insulating layer 230 disposed between the second substrate 202 and the first printed circuit board 250.

At this time, the insulating layer 230 is to insulate the second substrate 202 made of a metal material, the first printed circuit board 250 and the flexible circuit board 213 from each other.

The driving integrated circuit 214 disposed on the lower surface of the flexible circuit board 213 is mounted on the insulating layer 230 to prevent interference that may be received from the second substrate 202 made of a metal material .

The organic light emitting diode display 200 according to the second embodiment of the present invention includes a plurality of thin film transistors (not shown) on a first substrate 201 in a bottom emission mode. A plurality of thin film transistors (not shown) may be damaged by the static electricity flowing into the lower surface of the first substrate 201.

Particularly, in the case of external compensation, the sensing thin film transistor (not shown) may be damaged due to the static electricity flowing through the sensing wiring (not shown), and noise may be generated on the screen after external compensation.

Accordingly, in the organic light emitting diode display device 200 according to the second embodiment of the present invention, the transparent conductive film 203 is disposed between the upper surface of the first substrate 201 and a plurality of thin film transistors (not shown) A plurality of thin film transistors (not shown) can be protected by accumulating static electricity flowing from the outside into the entire film 203 and discharging the static electricity to the outside.

To this end, it further includes first and second conductive tapes 295a and 295b,

6A, the interlayer insulating film 205 exposes the transparent conductive film 203 at the edge of the first substrate 201, and the first conductive tape 295a exposes the upper surface of the second substrate 202, The second substrate 202 and the transparent conductive film 203, which are disposed on the transparent conductive film 203 exposed by the interlayer insulating film 205 and made of a metal material, are connected.

6B, the second conductive tape 295b is disposed on the second substrate 202 and on the first printed circuit board 250 to form the second printed circuit board 250 and the second printed circuit board 250. [ (Not shown).

The static electricity accumulated in the transparent conductive film 203 is transferred to the transparent conductive film 203 through the first conductive tape 295a connected to the transparent conductive film 203, The static electricity accumulated in the second substrate 202 is discharged to the ground terminal of the printed circuit board 250 through the second conductive tape 295b.

The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit of the present invention.

101, 102: first and second substrates
103: Transparent film
113: Flexible circuit board
150: printed circuit board
107: first pad

Claims (10)

A first substrate including an organic light emitting diode disposed in a display region and a pad portion disposed in the pad region;
A transparent conductive film disposed on one surface of the first substrate;
A second substrate disposed in the display area and facing the first substrate;
A first printed circuit board disposed on the second substrate; And
And a flexible circuit board connected to the first printed circuit board and the pad unit and having a drive integrated circuit mounted thereon,
Wherein the first pad of the flexible printed circuit board is connected to the ground terminal of the first printed circuit board, the first pad of the pad portion is electrically connected to the transparent conductive film, And an organic light emitting diode (OLED) display device connected to the first output terminal.
The method according to claim 1,
And a second printed circuit board disposed on the second substrate and connected to the first printed circuit board through a flexible circuit cable.
3. The method of claim 2,
An insulating layer disposed between the second substrate and the first printed circuit board,
And an organic light emitting diode (OLED) display device.
The method of claim 3,
Wherein the driving integrated circuit is disposed on a lower surface of the flexible circuit board and is seated on the insulating layer.
5. The method of claim 4,
Wherein the flexible circuit board is a COF (Chip On Film).
6. The method of claim 5,
Wherein the second substrate is made of a metal material and the transparent conductive film is made of ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide).
A first substrate including an organic light emitting diode disposed in a display region and a pad portion disposed in the pad region;
A second substrate exposing the first substrate edge and facing the first substrate;
A transparent conductive film disposed on the first substrate;
An interlayer insulating film disposed on the transparent conductive film to expose the transparent conductive film on the edge of the first substrate;
A first printed circuit board disposed on the second substrate;
A flexible printed circuit board connected to the first printed circuit board and the pad unit and having a drive integrated circuit mounted thereon;
A first conductive tape disposed on the second substrate and the transparent conductive film exposed by the interlayer insulating film to connect the second substrate and the transparent conductive film; And
And a second conductive tape disposed on the second substrate and above the first printed circuit board and connected to the second substrate and a ground terminal of the first printed circuit board,
And an organic light emitting diode (OLED) display device.
8. The method of claim 7,
And a second printed circuit board disposed on the second substrate and connected to the first printed circuit board through a flexible circuit cable.
9. The method of claim 8,
Wherein the flexible circuit board is a COF (Chip On Film).
10. The method of claim 9,
Wherein the second substrate is made of a metal material and the transparent conductive film is made of ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide).

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