CN100445712C - Temperature measurement circuit with correction by translating a switching reference level - Google Patents
Temperature measurement circuit with correction by translating a switching reference level Download PDFInfo
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Abstract
Description
技术领域 technical field
本发明系涉及一种温度测量电路,尤其涉及一种通过平移模拟到数字转换电路的转换参考电平而实现误差校正功能的温度测量电路。The invention relates to a temperature measurement circuit, in particular to a temperature measurement circuit which realizes error correction function by shifting the conversion reference level of the analog to digital conversion circuit.
背景技术 Background technique
由于二极管组件的半导体pn接面或晶体管组件的基极与射极间的半导体pn接面两端所呈现的电位差与流经其间的电流彼此相关联并且为温度的函数,所以在集成电路技术领域中广泛利用此半导体pn接面来检测温度。图1显示了现有的温度测量电路10的电路组成示意图。典型地,温度测量电路10被设置来监测外界系统20的温度。举例而言,外界系统20为一计算机、电子装置、或特定的电路区域,其中设有可提供一半导体pn接面以检测温度的热传感器21。如图所示,热传感器21由一pnp双载子晶体管所实施,其基极与射极间之半导体pn接面用以检测温度。Since the potential difference between the semiconductor pn junction of the diode component or the semiconductor pn junction between the base and the emitter of the transistor component and the current flowing through it are related to each other and are a function of temperature, in integrated circuit technology This semiconductor pn junction is widely used in the field to detect temperature. FIG. 1 shows a schematic circuit diagram of a conventional temperature measurement circuit 10 . Typically, the temperature measurement circuit 10 is configured to monitor the temperature of an
在温度测量电路10中,电流源电路11的开关S1与S2由控制电路12决定导通与不导通,以便分别允许不同的电流I1与I2施加至热传感器21。假设电流I1施加至热传感器21所造成的基极与射极间之电位差为VBE1而电流I2施加至热传感器21所造成的基极与射极间之电位差为VBE2,则计算电路13使电位差VBE1与VBE2彼此相减后可得到下列方程式(1):In the temperature measurement circuit 10 , the switches S 1 and S 2 of the
其中K为波兹曼(Boltzmann)常数、T为绝对温度、q为基本电荷、Re为射极的串联寄生电阻、Rb为基极的串联寄生电阻、并且β为晶体管的增益系数(gain)。因此,计算电路13所产生的电位差ΔVBE是一随温度变化而可代表温度的模拟信号。随后,模拟到数字转换电路(analog-to-digital converter,ADC)14使此模拟温度信号转换成一数字温度信号。where K is the Boltzmann constant, T is the absolute temperature, q is the elementary charge, R e is the series parasitic resistance of the emitter, R b is the series parasitic resistance of the base, and β is the gain coefficient of the transistor (gain ). Therefore, the potential difference ΔV BE generated by the
从方程式(1)可知,热传感器21的串联寄生电阻Re与Rb引起一与温度无关的常数项,亦即(I1-I2)(Re+Rb/β)。为了消除此种串联寄生电阻Re与Rb所造成的误差,现有技术通常使用三种或更多种不同的电流,依序激发相同的热传感器21,以期望实现准确的温度测量结果。然而,使用三种或更多种不同的电流的现有激发方式不仅造成操作频率迅速增大而且更导致不必要的能量消耗与温度变动。即使在操作频率维持固定的条件下,更多种不同的电流的依序激发方式将不可避免地延长每次温度测量循环所需的时间,因而降低温度测量电路10的反应速度。It can be known from equation (1) that the series parasitic resistances Re and R b of the
另一方面,温度测量电路10实际上所测量的是其上形成有热传感器21的半导体基板的温度,而此测量结果可能与外界系统20的真正代表性温度并不相同。举例而言,当外界系统20是一计算机时,人们有兴趣的通常是测量外界系统20的散热板22的温度,而非设置有热传感器21的半导体基板的温度。在此情况中,外界系统20的制造商提供有关散热板22与热传感器21的基板间存在的温度差异数据ΔT,以便现有的温度测量电路10将其储存于一缓存器15中。随后,加法电路16将模拟到数字转换电路14的数字输出与缓存器15中的温度差异数据ΔT彼此相加,以便产生一最终的温度信号Tmp。On the other hand, what the temperature measurement circuit 10 actually measures is the temperature of the semiconductor substrate on which the
发明内容 Contents of the invention
有鉴于前述问题,本发明的目的在于提供一种温度测量电路,通过平移模拟到数字转换电路的转换参考电平而实现误差校正功能。In view of the aforementioned problems, the object of the present invention is to provide a temperature measurement circuit, which realizes the error correction function by shifting the conversion reference level of the analog-to-digital conversion circuit.
依据本发明的一方面,提供一种温度测量电路,具有一电流激发电路、一计算电路、一校正值产生电路、以及一模拟到数字转换电路。电流激发电路依序施加至少二个电流至一热传感器,使得该热传感器对应地产生至少二个输出信号。响应于该至少二个输出信号,计算电路计算出一模拟温度信号,其代表该热传感器所检测到的一温度。校正值产生电路产生一校正值。模拟到数字转换电路依据一转换参考电平而将该模拟温度信号转换成一数字温度信号。该转换参考电平依据该校正值而平移调整。According to one aspect of the present invention, a temperature measurement circuit is provided, which has a current excitation circuit, a calculation circuit, a correction value generation circuit, and an analog-to-digital conversion circuit. The current excitation circuit sequentially applies at least two currents to a thermal sensor, so that the thermal sensor generates at least two output signals correspondingly. In response to the at least two output signals, the calculation circuit calculates an analog temperature signal representing a temperature detected by the thermal sensor. The correction value generating circuit generates a correction value. The analog-to-digital conversion circuit converts the analog temperature signal into a digital temperature signal according to a conversion reference level. The conversion reference level is shifted and adjusted according to the calibration value.
该热传感器具有一半导体pn接面,使得该至少二个电流依序流经该半导体pn接面而在其上分别产生至少两个电位差,作为该至少二个输出信号。该校正值是通过该电流激发电路依序施加至少三个电流至该热传感器而计算出,使得该校正值用以修正该模拟温度信号的一常数项误差。该热传感器系设置于一外界系统的一基板中。该校正值由该外界系统所提供,以修正该热传感器所检测到的该温度与该外界系统的一代表性温度之间的一差异。The thermal sensor has a semiconductor pn junction, so that the at least two currents flow through the semiconductor pn junction in sequence to generate at least two potential differences thereon as the at least two output signals. The correction value is calculated by sequentially applying at least three currents to the thermal sensor through the current excitation circuit, so that the correction value is used to correct a constant term error of the analog temperature signal. The thermal sensor is disposed in a substrate of an external system. The correction value is provided by the external system to correct a difference between the temperature detected by the thermal sensor and a representative temperature of the external system.
依据本发明的另一方面,提供一种温度测量方法,具有下列步骤。首先,依序施加至少二个电流至一热传感器,使得该热传感器对应地产生至少二个输出信号。响应于该至少二个输出信号而计算出一模拟温度信号,其代表该热传感器所检测到的一温度。产生一校正值。依据一转换参考电平而将该模拟温度信号转换成一数字温度信号。该转换参考电平依据该校正值而平移调整。According to another aspect of the present invention, a method for measuring temperature is provided, comprising the following steps. Firstly, at least two currents are sequentially applied to a thermal sensor, so that the thermal sensor generates at least two output signals correspondingly. An analog temperature signal representing a temperature detected by the thermal sensor is calculated in response to the at least two output signals. Generate a calibration value. The analog temperature signal is converted into a digital temperature signal according to a conversion reference level. The conversion reference level is shifted and adjusted according to the correction value.
依据本发明的另一方面,提供一种电流激发电路,用以激发一热传感器。该电流激发电路具有一测量电流源电路、一校正电流源电路、一校正控制电路、以及一测量控制电路。测量电流源电路提供一第一测量电流和一第二测量电流。校正电流源电路提供一校正电流。校正控制电路允许该第一测量电流、该第二测量电流、与该校正电流依序施加至该热传感器,用以测量有关于该热传感器的一常数项误差。测量控制电路允许该第一测量电流和该第二测量电流依序施加至该热传感器,用以测量该热传感器的一温度。该校正控制电路比该测量控制电路更早被激活以进行该常数项误差的测量。According to another aspect of the present invention, a current excitation circuit for exciting a thermal sensor is provided. The current excitation circuit has a measurement current source circuit, a correction current source circuit, a correction control circuit, and a measurement control circuit. The measurement current source circuit provides a first measurement current and a second measurement current. The correction current source circuit provides a correction current. The calibration control circuit allows the first measurement current, the second measurement current, and the calibration current to be sequentially applied to the thermal sensor for measuring a constant-term error related to the thermal sensor. The measurement control circuit allows the first measurement current and the second measurement current to be sequentially applied to the thermal sensor for measuring a temperature of the thermal sensor. The correction control circuit is activated earlier than the measurement control circuit for the measurement of the constant term error.
附图说明 Description of drawings
图1显示了现有的温度测量电路的电路组成示意图;Fig. 1 has shown the circuit composition schematic diagram of existing temperature measurement circuit;
图2显示了依据本发明的温度测量电路的电路组成示意图;Fig. 2 has shown the circuit composition schematic diagram according to the temperature measurement circuit of the present invention;
图3(A)至3(C)显示了依据本发明的计算电路的操作状态图;Fig. 3 (A) to 3 (C) has shown the operating state chart according to the computing circuit of the present invention;
图4显示了依据本发明的平移校正型模拟到数字转换电路的操作原理示意图;以及4 shows a schematic diagram of the operation principle of the translation correction type analog-to-digital conversion circuit according to the present invention; and
图5显示依据了本发明的模拟到数字转换电路的例子的详细电路图。FIG. 5 shows a detailed circuit diagram of an example of an analog-to-digital conversion circuit according to the present invention.
主要组件符号说明Explanation of main component symbols
10、温度测量电路 11、电流源电路10.
12、控制电路 13、计算电路12.
14、模拟到数字转换电路(ADC) 15、缓存器14. Analog to digital conversion circuit (ADC) 15. Register
16、加法电路 20、外界系统16.
21、热传感器 22、散热板21.
30、温度测量电路 31、测量电流源电路30.
32、校正电流源电路 33、测量控制电路32. Correction
34、校正控制电路 35、计算电路34.
36、校正值产生电路36. Correction value generating circuit
37、平移校正型模拟到数字转换电路(ADC)37. Translation correction type analog to digital conversion circuit (ADC)
41、乘法器 42、加法器41.
43、校正缓存器 51、取样/调变电路43.
52、时脉产生器 53、计数器52.
54、除频器 55、输出缓存器54.
AM、差动放大器 Ca~Cd、电容AM, differential amplifier C a ~ C d , capacitance
CF、校正值 CLK、时脉信号CF, correction value CLK, clock signal
I1,I2、测量电流 I3、校正电流I 1 , I 2 , measuring current I 3 , correcting current
Rb,Re、串联寄生电阻 RST、重设信号R b , Re e , series parasitic resistance RST, reset signal
S1,S2,S3,Sa~Sd、开关 Tmp、温度测量结果S 1 , S 2 , S 3 , S a ~ S d , switch Tmp, temperature measurement results
VBE、基极与射极间的电位差 dΔVBE、常数项误差V BE , potential difference between base and emitter dΔV BE , constant term error
ΔT、温度差异数据ΔT, temperature difference data
具体实施方式 Detailed ways
下文中的说明与附图将使本发明的前述与其它目的、特征、与优点更明显。兹将参照附图详细说明依据本发明的较佳实施例。The foregoing and other objects, features, and advantages of the present invention will be more apparent from the following description and accompanying drawings. Preferred embodiments according to the present invention will now be described in detail with reference to the accompanying drawings.
图2显示了依据本发明的温度测量电路30的电路组成示意图。在温度测量电路30中,一种电流激发电路由一测量电流源电路31、一校正电流源电路32、一测量控制电路33、以及一校正控制电路34所共同构成。测量电流源电路31具有第一和第二测量电流I1与I2,分别经由开关S1与S2而供应至热传感器21的射极。校正电流源电路32具有一个校正电流I3,经由开关S3而供应至热传感器21的射极。在温度测量电路30开始测量热传感器21的温度前,校正控制电路34必须先被激活以控制第一和第二测量电流I1与I2以及校正电流I3依序施加至热传感器21。假设电流I1、I2、与I3对于热传感器21所造成的基极与射极间的电位差分别为VBE1、VBE2、与VBE3,则计算电路35可计算出一方程式(2)所下所示:FIG. 2 shows a schematic diagram of the circuit composition of the
现在再假设电流I1、I2、与I3间满足下列比例条件(3):Now assume that the following proportionality condition (3) is satisfied among the currents I 1 , I 2 , and I 3 :
I1∶I2∶I3=A2∶A∶1 (3)I 1 : I 2 : I 3 = A 2 : A : 1 (3)
即第一测量电流I1为第二测量电流I2的A倍,并且第二测量电流I2为校正电流I3的A倍,其中A大于零,则方程式(2)可更进一步简化成如下所示的方程式(4):That is, the first measurement current I1 is A times the second measurement current I2 , and the second measurement current I2 is A times the correction current I3 , wherein A is greater than zero, then the equation (2) can be further simplified as follows Equation (4) shown:
因此,借着校正电流I3的帮助,计算电路35可有效地检测出由串联寄生电阻Re与Rb所造成的常数项误差dΔVBE。随后,此常数项误差dΔVBE传送至校正值产生电路36用以产生校正值CF。在一较佳实施例中,此校正值CF是在任何温度测量循环开始之前必须预先测定妥当,以提供后续所有温度测量循环的误差校正使用。Therefore, with the help of the correction current I 3 , the calculating
图3(A)至3(C)显示依据本发明的计算电路35在检测常数项误差dΔVBE时的操作状态图。在图3(A)中,开关Sa导通、开关Sb导通、开关Sc使电容Cc耦合至差动放大器AM的非反相输入端(+)、并且开关Sd使电容Cd耦合至差动放大器AM的反相输入端(-)。此外,开关S1导通且开关S2与S3都不导通,因而仅允许第一测量电流I1施加至热传感器21而产生基极与射极间的第一电位差VBE1。在此第一阶段中,由于差动放大器AM的非反相输入端(+)与反相输入端(-)处的电压都为零,所以差动放大器AM的输出电压Vout(1)为零。在图3(B)中,开关Sa与Sb都变为不导通。此外,开关S2导通且开关S1与S3都不导通,因而仅允许第二测量电流I2施加至热传感器21而产生基极与射极间的第二电位差VBE2。在此第二阶段中,由于差动放大器AM的非反相输入端(+)与反相输入端(-)处的电压都为(VBE1-VBE2)/2,故差动放大器AM的输出电压Vout(2)为(VBE1-VBE2)。在图3(C)中,开关Sc变成使电容Cc耦合至差动放大器AM的反相输入端(-),并且开关Sd变成使电容Cd耦合至差动放大器AM的非反相输入端(+)。此外,开关S3导通且开关S1与S2都不导通,因而仅允许校正电流I3施加至热传感器21而产生基极与射极间的第三电位差VBE3。在此第三阶段中,差动放大器AM的输出电压Vout(3)变为(VBE1-VBE2)-(VBE2-VBE3),即所欲检测的方程式(2)与(4)的常数项误差dΔVBE。3(A) to 3(C) are diagrams showing the operation state of the
请注意依据本发明中的校正电流源电路32与校正控制电路34在完成前述的常数项误差dΔVBE的检测测程序并输出至校正值产生电路36后,即停止操作。换而言之,在进行温度测量循环时,温度测量电路30仅使用测量控制电路33控制测量电流源电路31依序施加第一和第二测量电流I1与I2至热传感器21。因此,计算电路35在温度测量循环中的操作状态仅局限于图3(A)与3(B)。在满足比例条件(3)且已测得方程式(4)的常数项误差dΔVBE的情况下,计算电路35所获得的基极与射极间的电位差ΔVBE可表示如下:Please note that the correction
因此,依据本发明中,利用第一与第二测量电流I1与I2所获得的电位差ΔVBE只要被平移调整了一个常数项误差dΔVBE与比例因子A/(A-1)的乘积,即可产生正确的温度测量结果。由于此常数项误差dΔVBE已经预先经由校正电流I3的协助而检测出并储存于校正值产生电路36,故无需于每一温度测量循环中再反复重新检测。Therefore, according to the present invention, the potential difference ΔV BE obtained by using the first and second measurement currents I 1 and I 2 only needs to be translated and adjusted by the product of a constant term error dΔV BE and the proportional factor A/(A-1) , to produce correct temperature measurements. Since the constant term error dΔV BE has been previously detected and stored in the correction
除了常数项误差dΔVBE之外,校正值产生电路36也可接收由外界系统20所提供的有关热传感器21与散热板22间的温度差异数据ΔT。由于常数项误差dΔVBE与温度差异数据ΔT都属于可平移校正的误差,故校正值产生电路36可将其整合成单一的校正值CF。基于此校正值CF,平移校正型模拟到数字转换电路37决定适当的转换参考电平。图4显示依据本发明的平移校正型模拟到数字转换电路37的操作原理示意图。广泛地说,模拟到数字转换电路37依据一预定的取样频率对于所接收的模拟信号Alg进行取样。随后,所取样而得的模拟结果在数学概念上可视为经由数字对应轴Dx而转换成一数字信号,其中此数字信号的实际值取决于转换参考电平REF的相对位置。举例而言,如图4所示,原始的转换参考电平REF向下方平移了一校正值CF后而形成一平移后的转换参考电平REF_S。对于原始的转换参考电平REF而言,模拟样本AS转换成数字信号Dgtl。唯有对于平移后的转换参考电平REF_S而言,模拟样本AS转换成数字信号Dgt2。因此,通过平移转换参考电平REF的方式,平移校正型模拟到数字转换电路37可有效地在模拟到数字的转换过程中进行常数项误差dΔVBE与温度差异数据ΔT的校正而获得一正确的温度测量结果,无需额外进行习现有的加法运算程序。In addition to the constant term error dΔV BE , the correction
图5显示依据本发明的模拟到数字转换电路37的例子的详细电路图。取样/调变电路51依据时脉产生器52所提供的时脉信号CLK而对于从计算电路35而来的基极与射极间的电位差ΔVBE进行取样,并将取样结果调变成一脉冲序列信号。举例而言,取样/调变电路51得由一Delta-Sigma模拟到数字调变器所实施,因而此脉冲序列信号系模拟样本所对应的数字信号。从取样/调变电路51而来的脉冲序列信号施加至计数器53。在一预定的周期内,计数器53计数所接收到的脉冲序列信号中的脉冲数目。由于计数器53的计数方式是从一计数基准值开始向上递增计数,故平移调整此计数基准值的效果即等同于平移调整计数器53所计算而得的计数结果,因此本发明人将此技术原理应用于温度测量结果的常数项误差校正上。FIG. 5 shows a detailed circuit diagram of an example of an analog-to-
具体而言,计数器53的计数基准值由校正值产生电路36所提供的校正值CF所决定。在校正值产生电路36中,从计算电路35而来的常数项误差dΔVBE经由乘法器41乘上比例因子A/(A-1),且随后经由加法器42而与从外界系统20而来的温度差异数据ΔT相加,以合成所期望的单一校正值CF并储存于校正缓存器43内。换而言之,图5所示的实施例通过平移调整计数器53的计数基准值而实现图4的平移转换参考电平REF的目的。另一方面,除频器54将时脉产生器52的时脉信号CLK除频,以产生一较低频率的重设信号RST。在一实施例中,除频器54所产生的重设信号RST的频率将时脉产生器52的时脉信号CLK的频率除以1024而得。因此,在时脉信号CLK经过1024个周期后,计数器53会被重设回到计数基准值,以便重新开始计数。同样地,此计数基准值由校正值产生电路36所提供的校正值CF所决定。此外,计数器53在时脉信号CLK的1024个周期内所计数而得的结果传送至输出缓存器55,作为温度测量结果Tmp而输出至外界。此温度测量结果Tmp也依据重设信号RST的频率而更新。Specifically, the counting reference value of the
虽然本发明已借助于较佳实施例作为例示加以说明,应该了解:本发明不限于此所公开的实施例。相反地,本发明意欲涵盖对于本领域普通技术人员而言明显的各种修改与相似配置。因此,权利要求的范围应根据最广的诠释,以包容所有此类修改与相似配置。While the present invention has been described by way of illustration of preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. On the contrary, the invention is intended to cover various modifications and similar arrangements apparent to those skilled in the art. Accordingly, the scope of the claims should be accorded the broadest interpretation to embrace all such modifications and similar arrangements.
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