CN100443634C - Solution formulation for passivation technology for aluminum alloy containing silicon, copper, and magnesium - Google Patents
Solution formulation for passivation technology for aluminum alloy containing silicon, copper, and magnesium Download PDFInfo
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- CN100443634C CN100443634C CNB2005101009930A CN200510100993A CN100443634C CN 100443634 C CN100443634 C CN 100443634C CN B2005101009930 A CNB2005101009930 A CN B2005101009930A CN 200510100993 A CN200510100993 A CN 200510100993A CN 100443634 C CN100443634 C CN 100443634C
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- magnesium
- aluminum alloy
- copper
- siliceous
- passivation technology
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Abstract
The invention discloses a passivation solution formula of aluminium alloy with silicon, copper and magnesium, which comprises the following parts: 20-40% nitrate, 0.05-0.2% sodium fluoride, 0.05-0.1% surface activator and residual deionized water, wherein these materials are passivated under 20-30 Deg C for 1-3min.
Description
Technical field
The present invention relates to the treatment technology of metallic surface, be specifically related to the solution formula of the passivation technology for aluminum alloy of a kind of siliceous, copper, magnesium.
Background technology
Aluminium alloy is more active, and its surface is easy to oxidation in air, is easy to corrosion in strongly acidic solution, has limited being extensive use of of aluminium alloy.Usually aluminium alloy all needs to carry out the surface passivation processing before use; method commonly used is in weakly acidic solution it to be carried out surface passivation to handle; its principle is to utilize oxide compound or other compound generation chemical reaction of acid ion and aluminum alloy surface, generates soluble material and generates protective film in aluminum alloy surface.
The employed passivating solution of traditional passivation technology is the mixing solutions of nitric acid and hydrofluoric acid; can effectively form layer protecting film through the aluminum alloy surface after this solution-treated; strengthen its corrosion resistance nature; but because hydrofluoric acid has very big hazardness to human body; and can discharge a large amount of obnoxious flavoures in treating processes, the harm health of operators reaches environment is polluted.
Summary of the invention
The object of the present invention is to provide the solution formula of the passivation technology for aluminum alloy of a kind of siliceous, copper, magnesium, solve exist in the prior art because of being detrimental to health of using that hydrofluoric acid brings and cause problem such as environmental pollution.
The solution formula of the passivation technology for aluminum alloy of a kind of siliceous, copper provided by the invention, magnesium is characterized in that each component and the weight percent thereof that comprise are:
Nitric acid 20～40%;
Sodium Fluoride 0.05～0.2%;
Tensio-active agent 0.05～0.1%;
The deionized water surplus.
Preferably, each component and weight percent thereof are in the above-mentioned prescription:
Nitric acid 40%;
Sodium Fluoride 0.2%;
Tensio-active agent 0.1%;
The deionized water surplus.
Preferably, each component and weight percent thereof are in the above-mentioned prescription:
Nitric acid 20%;
Sodium Fluoride 0.05%;
Tensio-active agent 0.05%;
The deionized water surplus.
Preferably, each component and weight percent thereof are in the above-mentioned prescription:
Nitric acid 35%;
Sodium Fluoride 0.1%;
Tensio-active agent 0.05%;
The deionized water surplus.
In the above-mentioned prescription, the tensio-active agent that is adopted is Sodium dodecylbenzene sulfonate or sodium lauryl sulphate.
When using the solution of the passivation technology for aluminum alloy of siliceous, copper, the magnesium through preparing provided by the invention that aluminium alloy is carried out Passivation Treatment, its processing parameter is: 20～30 ℃ of temperature, 1～3 minute treatment time.
Implement the solution formula of the passivation technology for aluminum alloy of siliceous, copper provided by the invention, magnesium, its beneficial effect is, replaced hydrofluoric acid with Sodium Fluoride in the prescription, avoided the harm of hydrofluoric acid to human body, and in use can not discharge harmful gas in a large number, reduced environmental pollution, simultaneously economical and efficient.
Embodiment
Below in conjunction with specific embodiment in detail the present invention is described in detail.
Embodiment 1
With the Al-alloy parts surface of siliceous, copper, magnesium polish, polishing, degreasing, immerse down in the passivating solution that contains 40% nitric acid, 0.2% Sodium Fluoride, 0.1% Sodium dodecylbenzene sulfonate and surplus deionized water in room temperature (25 ℃) then and carry out Passivation Treatment, 1 minute time, promptly obtain aluminum alloy surface through passivation.
Embodiment 2
With the Al-alloy parts surface of siliceous, copper, magnesium polish, polishing, degreasing, immerse down in the passivating solution that contains 20% nitric acid, 0.05% Sodium Fluoride, 0.05% sodium lauryl sulphate and surplus deionized water at 20 ℃ then and carry out Passivation Treatment, 3 minutes time, promptly obtain aluminum alloy surface through passivation.
Embodiment 3
With the Al-alloy parts surface of siliceous, copper, magnesium polish, polishing, degreasing, immerse down in the passivating solution that contains 35% nitric acid, 0.1% Sodium Fluoride, 0.05% Sodium dodecylbenzene sulfonate and surplus deionized water at 30 ℃ then and carry out Passivation Treatment, 2 minutes time, promptly obtain aluminum alloy surface through passivation.
Claims (6)
1. the solution formula of the passivation technology for aluminum alloy of siliceous a, copper, magnesium is characterized in that each component and the weight percent thereof that comprise are:
Nitric acid 20～40%;
Sodium Fluoride 0.05～0.2%;
Tensio-active agent 0.05～0.1%;
The deionized water surplus.
2. the solution formula of the passivation technology for aluminum alloy of siliceous, copper according to claim 1, magnesium is characterized in that each component and the weight percent thereof that comprise are:
Nitric acid 40%;
Sodium Fluoride 0.2%;
Tensio-active agent 0.1%;
The deionized water surplus.
3. the solution formula of the passivation technology for aluminum alloy of siliceous, copper according to claim 1, magnesium is characterized in that each component and the weight percent thereof that comprise are:
Nitric acid 20%;
Sodium Fluoride 0.05%;
Tensio-active agent 0.05%;
The deionized water surplus.
4. the solution formula of the passivation technology for aluminum alloy of siliceous, copper according to claim 1, magnesium is characterized in that each component and the weight percent thereof that comprise are:
Nitric acid 35%;
Sodium Fluoride 0.1%;
Tensio-active agent 0.05%;
The deionized water surplus.
5. according to the solution formula of the passivation technology for aluminum alloy of any described siliceous, copper, magnesium in the claim 1～4, it is characterized in that the tensio-active agent in the described prescription is Sodium dodecylbenzene sulfonate or sodium lauryl sulphate.
6. according to the solution formula of the passivation technology for aluminum alloy of any described siliceous, copper, magnesium in the claim 1～4, it is characterized in that, that use prepares is siliceous, when the solution of the passivation technology for aluminum alloy of copper, magnesium carries out Passivation Treatment, processing parameter is: 20～30 ℃ of temperature, treatment time 1～3min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101009930A CN100443634C (en) | 2005-11-08 | 2005-11-08 | Solution formulation for passivation technology for aluminum alloy containing silicon, copper, and magnesium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101009930A CN100443634C (en) | 2005-11-08 | 2005-11-08 | Solution formulation for passivation technology for aluminum alloy containing silicon, copper, and magnesium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1962939A CN1962939A (en) | 2007-05-16 |
| CN100443634C true CN100443634C (en) | 2008-12-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005101009930A Expired - Fee Related CN100443634C (en) | 2005-11-08 | 2005-11-08 | Solution formulation for passivation technology for aluminum alloy containing silicon, copper, and magnesium |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103834939A (en) * | 2012-11-27 | 2014-06-04 | 汉达精密电子(昆山)有限公司 | Aluminum alloy surface passivation liquid and processing method thereof |
| CN110565083A (en) * | 2019-10-24 | 2019-12-13 | 徐州市国艺铝合金包装箱有限公司 | Solution suitable for aluminum alloy passivation process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11193481A (en) * | 1998-01-05 | 1999-07-21 | Japan Aviation Electron Ind Ltd | Acidic liquid etchant of aluminum alloy or die-cast aluminum |
| CN1556246A (en) * | 2004-01-08 | 2004-12-22 | 中国国际海运集装箱（集团）股份有限 | Chromium less deactivation liquid |
| CN1594651A (en) * | 2004-06-22 | 2005-03-16 | 广州市集胜化工有限公司 | Trivalent chromium pearl opal passivator for galvanizing and manufacturing method thereof |
| US20050095754A1 (en) * | 2003-11-04 | 2005-05-05 | Lg.Philips Lcd Co., Ltd. | Method for fabricating liquid crystal display device |
| CN1623010A (en) * | 2002-03-05 | 2005-06-01 | 日本帕卡濑精株式会社 | Treating liquid for surface treatment of aluminum or magnesium based metal and method of surface treatment |
-
2005
- 2005-11-08 CN CNB2005101009930A patent/CN100443634C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11193481A (en) * | 1998-01-05 | 1999-07-21 | Japan Aviation Electron Ind Ltd | Acidic liquid etchant of aluminum alloy or die-cast aluminum |
| CN1623010A (en) * | 2002-03-05 | 2005-06-01 | 日本帕卡濑精株式会社 | Treating liquid for surface treatment of aluminum or magnesium based metal and method of surface treatment |
| US20050095754A1 (en) * | 2003-11-04 | 2005-05-05 | Lg.Philips Lcd Co., Ltd. | Method for fabricating liquid crystal display device |
| CN1556246A (en) * | 2004-01-08 | 2004-12-22 | 中国国际海运集装箱（集团）股份有限 | Chromium less deactivation liquid |
| CN1594651A (en) * | 2004-06-22 | 2005-03-16 | 广州市集胜化工有限公司 | Trivalent chromium pearl opal passivator for galvanizing and manufacturing method thereof |
Non-Patent Citations (4)
| Title |
|---|
| 铝合金化学镀镍预处理新工艺. 尹国光.表面技术，第33，卷第2期. 2004 |
| 铝合金化学镀镍预处理新工艺. 尹国光.表面技术，第33，卷第2期. 2004 * |
| 铝材及铝制品的化学抛光处理(4). 冯承才.轻金属，第8期. 1996 |
| 铝材及铝制品的化学抛光处理(4). 冯承才.轻金属，第8期. 1996 * |
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| CN1962939A (en) | 2007-05-16 |
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Granted publication date: 20081217 Termination date: 20111108 |