CN100443274C - Bamboo arc sheet spreading method - Google Patents

Abstract

The invention relates to a method for flattening the arc bamboo plate, wherein it cuts arc bamboo plate into arc plate with parallel edges to be put in thermal compressor with adjustable side compressor; compressing and flattening the bamboo plate; the side compressor moves along width; keeping pressure at 0.5-2.0MPa for 5min, shaping it. The invention can soften the bamboo plate, and it can flexibly adjust the width and pressure on bamboo plate; and it can improve the efficiency.

Description

The flattening method of former bamboo arcuation bamboo chip

Technical field

What the present invention relates to is a kind of flattening method to former bamboo arcuation bamboo chip.The technology field that belongs to the raw material bamboo wood.

Background technology

Because bamboo is the cane plant of a kind of circle, hollow.Therefore, for many years, in the industrial applications process of bamboo wood,, all be that the bamboo chip that is processed into equal thickness is then used with bamboo subdivision well-thought-out plan bar or thin bamboo strips used for weaving for obtaining to have the plane bamboo chip of certain width and thickness.And bamboo chip is in carrying out the equal thickness process, and the natural circular arc portion of the bamboo of must planing just can be made the plane bamboo chip of equal thickness, has caused a large amount of wastes of bamboo material like this, and the bamboo wood volume recovery is low.

Summary of the invention

The objective of the invention is in order to solve present bamboo floor production waste of raw materials big, defect of high cost, a kind of flattening method of bamboo chip is provided, it can make and to have arcuation, width carries out equal thickness processing again after 30～100 millimeters bamboo chip is by the processing of this bamboo chip flattening method, can reduce bamboo resource consumption, reduce production costs greatly.

Technical solution of the present invention: 1, the flattening method of former bamboo arcuation bamboo chip is characterized in that its processing step branch

One, will have surf green and bamboo spring and the arc bamboo chip of width parallel edges (face) such as have, and place the plane to have the hot press of adjustable side pressure mechanism;

Two, the polylith arc bamboo chip that width parallel edges (face) such as has is parallel between the pressing plate, and the outermost dual-side parallel with the bamboo chip machine direction has side pressure mechanism.

Three, hot press center platen temperature 180～220 degree make bamboo chip contact pressing plate, keep progressively increasing after 3～5 minutes pressure until flattening bamboo chip;

Four, when bamboo chip is progressively flattened, keep certain transverse pressure (0～0.2Mpa) by side pressure mechanism.

Five, bamboo chip flattens the back and continued under pressure 0.5～2.0Mpa pressurize 5 minutes, makes bamboo chip obtain typing under the pressurized state of heating.

Because the arcuation bamboo chip is subjected to the acting in conjunction of the transverse pressure of vertical plane pressure and variation in the flattening process, the feasible softening bamboo chip of constantly heating is flattened.Simultaneously, the bamboo chip of the flattening bamboo chip that a period of time can obtain finalizing the design that keep-ups pressure in press is difficult for resilience.

Advantage of the present invention: be that the plane adds gentle pressurization 1,, therefore increased the softening degree of bamboo chip and the typing degree after the bamboo chip flattening owing to what adopt.2, lateral pressure adopts adjustable side direction pressue device, can flexible adaptation bamboo chip width and the pressure of adjusting side direction to bamboo chip.3, bamboo wood softening, flatten and typing is carried out simultaneously, can improve processing throughput.4, because the arcuation bamboo chip flattens under the pressurized state of vertically heating, the intensity height of bamboo chip is difficult for resilience.

The specific embodiment:

Embodiment 1

The arc bamboo chip of 30 millimeters of arc length saw such as is cut at the bamboo chip that width has parallel edges.Place the hot press that has the side direction pressing mechanism (model zy3-130) on plane, platen temperature 180 degree progressively pressurize after keep-uping pressure under pressure 0～0.2Mpa 3 minutes until flattening bamboo chip.Bamboo chip flattens the back to be continued to keep-up pressure under pressure 0.5Mpa 5 minutes.When bamboo chip is progressively flattened, expansion along with the bamboo chip arc length, the bamboo chip width increases, at this moment, side direction pressing mechanism (model zy3-130-c) is simultaneously to the width motion, satisfying the needs that bamboo chip launches arc length (bamboo chip width), and guarantees the transverse pressure (0～0.2Mpa) to bamboo chip, make the arc bamboo chip in that to be subjected to transverse pressure and pressure at right angle flattened under acting on simultaneously, reduce or reach the few crack of bamboo chip inner surface or free from flaw flattens.Bamboo chip obtains typing after keep-uping pressure 3 minutes.

Embodiment 2

The arc bamboo chip saw of 100 millimeters of arc length is cut into the bamboo chip of width parallel edges such as having.Place the hot press that has the side direction pressing mechanism (model zy3-130) on plane, platen temperature 220 degree progressively pressurize after keep-uping pressure under pressure 0～0.2Mpa 3 minutes until flattening bamboo chip.Bamboo chip flattens the back and continued under pressure 2.0Mpa pressurize 5 minutes.When bamboo chip is progressively flattened, expansion along with the bamboo chip arc length, the bamboo chip width increases, at this moment, side direction pressing mechanism (model zy3-130-c) is simultaneously to the width motion, satisfying the needs that bamboo chip launches arc length (bamboo chip width), and guarantees the transverse pressure (0～0.2Mpa) to bamboo chip, make the arc bamboo chip in that to be subjected to transverse pressure and pressure at right angle flattened under acting on simultaneously, reduce or reach the few crack of bamboo chip inner surface or free from flaw flattens.Bamboo chip obtains typing after keep-uping pressure 4 minutes.

Embodiment 3

Will be after charing, the arc bamboo chip saw that arc length is 55 millimeters is cut into the bamboo chip of width parallel edges such as having.Place the hot press that has the side direction pressing mechanism (model zy3-130) on plane, platen temperature 200 degree progressively pressurize after keep-uping pressure under pressure 0～0.2Mpa 3 minutes until flattening bamboo chip.Bamboo chip flattens the back and continued under pressure 1.25Mpa pressurize 5 minutes.When bamboo chip is progressively flattened, expansion along with the bamboo chip arc length, the bamboo chip width increases, at this moment, side direction pressing mechanism (model zy3-130-c) is simultaneously to the width motion, satisfying the needs that bamboo chip launches arc length (bamboo chip width), and guarantees the transverse pressure (0～0.2Mpa) to bamboo chip, make the arc bamboo chip in that to be subjected to transverse pressure and pressure at right angle flattened under acting on simultaneously, reduce or reach the few crack of bamboo chip inner surface or free from flaw flattens.Bamboo chip obtains typing after keep-uping pressure 5 minutes.

Claims (1)

1, the flattening method of former bamboo arcuation bamboo chip is characterized in that technology branch following steps,

One, will have surf green and bamboo spring and the width parallel edges such as have or the arc bamboo chip of parallel surface, and place the plane to have the hot press of adjustable side pressure mechanism;

Two, the polylith arc bamboo chip that width parallel edges or parallel surface such as has is parallel between the pressing plate, and the outermost dual-side parallel with the bamboo chip machine direction has side pressure mechanism;

Three, hot press center platen temperature 180～220 degree make bamboo chip contact pressing plate, keep progressively increasing after 3～5 minutes pressure until flattening bamboo chip;

Four, when bamboo chip is progressively flattened, keep certain transverse pressure 0～0.2Mpa by side pressure mechanism;

Five, bamboo chip flattens the back and continued under pressure 0.5～2.0Mpa pressurize 5 minutes, makes bamboo chip obtain typing under the pressurized state of heating.