CN100442024C - 一种耐高温耐高压陶瓷应变片传感器及其封装固化方法 - Google Patents
一种耐高温耐高压陶瓷应变片传感器及其封装固化方法 Download PDFInfo
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- CN100442024C CN100442024C CNB2006101052460A CN200610105246A CN100442024C CN 100442024 C CN100442024 C CN 100442024C CN B2006101052460 A CNB2006101052460 A CN B2006101052460A CN 200610105246 A CN200610105246 A CN 200610105246A CN 100442024 C CN100442024 C CN 100442024C
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- 238000005538 encapsulation Methods 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000012360 testing method Methods 0.000 claims abstract description 7
- 239000003822 epoxy resin Substances 0.000 claims description 47
- 229920000647 polyepoxide Polymers 0.000 claims description 47
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 37
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 238000003756 stirring Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 238000000465 moulding Methods 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 6
- 238000005255 carburizing Methods 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 5
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- 230000000694 effects Effects 0.000 description 8
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- 238000009413 insulation Methods 0.000 description 2
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- 229920002545 silicone oil Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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CNB2006101052460A CN100442024C (zh) | 2006-12-22 | 2006-12-22 | 一种耐高温耐高压陶瓷应变片传感器及其封装固化方法 |
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CNB2006101052460A CN100442024C (zh) | 2006-12-22 | 2006-12-22 | 一种耐高温耐高压陶瓷应变片传感器及其封装固化方法 |
Publications (2)
Publication Number | Publication Date |
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CN1995926A CN1995926A (zh) | 2007-07-11 |
CN100442024C true CN100442024C (zh) | 2008-12-10 |
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CNB2006101052460A Expired - Fee Related CN100442024C (zh) | 2006-12-22 | 2006-12-22 | 一种耐高温耐高压陶瓷应变片传感器及其封装固化方法 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102221430B (zh) * | 2010-04-13 | 2013-07-10 | 精量电子(深圳)有限公司 | 一种微熔粘接应变片的方法 |
CN102221326B (zh) * | 2010-04-13 | 2013-09-18 | 精量电子(深圳)有限公司 | 一种使用微熔技术制造应变片传感器的方法 |
CN108827136B (zh) * | 2018-04-16 | 2019-07-02 | 西南石油大学 | 一种利用废旧热固性树脂制备柔性应变传感器的方法 |
CN109693450A (zh) * | 2019-01-17 | 2019-04-30 | 杭州专色数码科技有限公司 | 墨囊及具有该墨囊的喷墨打印设备 |
CN114773057B (zh) * | 2022-05-25 | 2023-05-02 | 国网智能电网研究院有限公司 | 压电陶瓷及用于变压器局部放电检测的接触式超声传感器 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2625891Y (zh) * | 2003-06-11 | 2004-07-14 | 陆效忠 | 全包围封装换能器 |
JP2004343658A (ja) * | 2003-05-19 | 2004-12-02 | Matsushita Electric Ind Co Ltd | 超音波送受波器とその製造方法及びそれを用いた超音波流量計 |
CN1583928A (zh) * | 2004-05-27 | 2005-02-23 | 哈尔滨工程大学 | 环氧树脂灌封胶 |
CN1595059A (zh) * | 2004-06-23 | 2005-03-16 | 中国科学院地质与地球物理研究所 | 岩体工程模型体内超声测试换能器 |
CN1767225A (zh) * | 2005-09-23 | 2006-05-03 | 中国人民解放军国防科学技术大学 | 组合式超声波换能器 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004343658A (ja) * | 2003-05-19 | 2004-12-02 | Matsushita Electric Ind Co Ltd | 超音波送受波器とその製造方法及びそれを用いた超音波流量計 |
CN2625891Y (zh) * | 2003-06-11 | 2004-07-14 | 陆效忠 | 全包围封装换能器 |
CN1583928A (zh) * | 2004-05-27 | 2005-02-23 | 哈尔滨工程大学 | 环氧树脂灌封胶 |
CN1595059A (zh) * | 2004-06-23 | 2005-03-16 | 中国科学院地质与地球物理研究所 | 岩体工程模型体内超声测试换能器 |
CN1767225A (zh) * | 2005-09-23 | 2006-05-03 | 中国人民解放军国防科学技术大学 | 组合式超声波换能器 |
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CN1995926A (zh) | 2007-07-11 |
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