CN100429778C - Image sensor module - Google Patents
Image sensor module Download PDFInfo
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- CN100429778C CN100429778C CNB2005100598016A CN200510059801A CN100429778C CN 100429778 C CN100429778 C CN 100429778C CN B2005100598016 A CNB2005100598016 A CN B2005100598016A CN 200510059801 A CN200510059801 A CN 200510059801A CN 100429778 C CN100429778 C CN 100429778C
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- image sensor
- pedestal
- holding part
- glass substrate
- sensor module
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Abstract
The present invention discloses an image sensor module which comprises a base and an image sensor and a lens group which are arranged in the base. An abutting part provided with a plurality of naked inner leading pins is formed on the junction of an upper containing part and a lower containing part which penetrate in the base, and the inner leading pins extend outward to form outer leading pins with large spacing to be connected with a circuit board. The image sensor is formed by directly arranging image sensing wafers on a glass baseplate by the wafer coating technology (Flip Chip), the abutting part can be abutted by the glass baseplate when the image sensor is arranged in the base, the inner leading pins on the abutting part are electrically connected with leading pin lines of the glass baseplate, and then a lens group is assembled in the upper containing part to fix the image sensor to enable the image sensor module to become thin and bring convenience for assembly and manufacture.
Description
Technical field
The present invention relates to a kind of image sensor module, refer to a kind of slimming especially and be convenient to the image sensor module assembling and make.
Background technology
Shown in the 7th figure, structural representation for the image sensor module commonly used, it is that an image sensing wafer 82 is set on a crystal cup 81, and the pin 811 of crystal cup 81 is connected with image sensing wafer 82 routings, encapsulate these crystal cups 81 and form image sensor 8 with a frame 83 and a glass cover-plate 84 again, and installing one microscope base 91 on this image sensor 8, in this microscope base 91 and spiral shell be provided with a lens barrel 92, and be equiped with eyeglass 93 in this lens barrel 92.
Image sensing wafer 82 essential routings owing to image sensor 8 in the aforesaid image sensor module connect, and make manufacture craft comparatively complicated, and the integral thickness of image sensor 8 is difficult to reach the requirement of slimming.For reaching the requirement of slimming, industry just someone is developed the image sensor modular structure of slimming, as No. 572528 novel patent of image sensor modular construction of TaiWan, China patent announcement, promptly as shown in Figure 8, it mainly is that most spaced sheet metals 72 are set in pedestal 71, one depression 73 is formed on these substrate 71 bottoms, be packaged with an image sensing wafer 74 in the depression 73, this image sensing wafer 74 and each sheet metal 72 are electrically connected, and being provided with a room 75, these pedestal 71 tops communicate with this depression 73, these room 75 bottoms are equiped with a glass cover-plate 76, and this room 75 is to establish a lens barrel 77 for spiral shell, be equiped with eyeglass 78 in the lens barrel 77, form the image sensor modular construction by this.
The novel patent of aforesaid image sensor modular construction mainly is that crystal cup in the traditional structure and frame are omitted, and directly this image sensing wafer 74 is encapsulated in the pedestal 71.So structural design can reduce the integral thickness of image sensor module really, but also has following point relatively:
1,,, just finishes the canned program of image sensing wafer 74 again from room 75 these glass cover-plates 76 of installing of pedestal 71 because this image sensing wafer 74 is to be encapsulated in earlier in the depression 73 of pedestal 71.But because the image sensing district of image sensing wafer 74 is position sides at contiguous this glass cover-plate 76, in other words, the image sensing district of image sensing wafer 74 exposes before this glass cover-plate 76 is not installed, easy like this image sensing district of image sensing wafer 74 is on the make polluted, and form defective products.
2, because this image sensing wafer 74 is just to encapsulate the back test after being encapsulated in pedestal 71,, then can scrap and must put in order group, and increase manufacturing cost because of image sensing wafer 74 can't take out together with pedestal 71 in case find defective products.
3,,, just finish the canned program of image sensing wafer 74 again from room 75 these glass cover-plates 76 of installing of pedestal 71 because this image sensing wafer 74 is to be encapsulated in earlier in the depression 73 of pedestal 71.So canned program is quite complicated, and is unfavorable for a large amount of manufacture crafts of making.
4, because this glass cover-plate 76 is packed into by the room 75 of pedestal 71, therefore must between depression 73 and room 75, design a retaining edge 79 and abut against the location for this glass cover-plate 76, and this retaining edge 79 has certain thickness, easy speech, so structural design still has necessity of being improved again to the requirement of slimming.
And in technical field of liquid crystal displays, there is a technology that has been generalized use to be called Flip Chip (Flip Chip), so-called Flip Chip is a kind of wafer to be set directly at technology on the glass plate, and glass plate be provided with lead-in wire can be for electrically connecting with wafer.Lead-in wire in the Flip Chip is very careful, at 3.5mm
2The glass periphery lead-in wire up to tens of can be set.If Flip Chip is migrated to the image sensor module, though can thickness be minimized because of directly wafer being arranged at, but the lead-in wire in the Flip Chip is but because of the too careful difficulty that combines with circuit board (PCB or FPC) that causes, therefore, the technology of Flip Chip being diverted to the mass production of image sensor module is not arranged as yet at present.
The inventor develops the mass production technology that Flip Chip can be diverted to the image sensor module finally through research constantly.
Summary of the invention
Main purpose of the present invention is to solve the above problems, and a kind of image sensor module that makes the image sensor module reach slimming and be convenient to assemble, make is provided.
For reaching aforementioned purpose, image sensor module of the present invention comprises:
One pedestal, these pedestal central authorities have a containing hole that runs through this pedestal, this containing hole has on one holding part and holding part once, and the basal area of this time holding part is the basal area less than holding part on this, make this upper and lower holding part intersection form a lean against part, and be provided with most exposed interior pins in this lean against part, pin extends to this pedestal outer rim and forms most outer pins for being connected with circuit board in each;
One image sensor, it has the image sensing wafer that a glass substrate and directly is arranged at this glass substrate, the shape of this glass substrate is to match with the transverse shape of holding part on this, and this time holding part is can be ccontaining for this image sensing wafer, and the one side that this glass substrate combines with this image sensing wafer is laid with most pin circuits for electrically connecting with this image sensing wafer, can abut against for this glass substrate by this lean against part when making this image sensor be placed in the containing hole of this pedestal, and make the pin circuit electric connection of pin and this glass substrate on this lean against part each;
One lens group, this lens group has an adapter section, and the shape of this adapter section is to match with the cross section of holding part on this, makes this lens group can be incorporated into the last holding part of this pedestal by this adapter section, and fixes this image sensor.
Glass substrate in this image sensor is to combine setting with Flip Chip with image sensing wafer, be about to described wafer and be set directly on the glass substrate, and this glass substrate be provided with lead-in wire can for and described wafer electrically connect.
Wherein, the last holding part of this containing hole and the section of following holding part can all be square, and the section of the adapter section of this glass substrate, image sensing wafer and lens group also correspondence be square.
Wherein, this lens group includes a lens mount, and the outer rim of this lens mount forms aforesaid adapter section, and this lens mount and be combined with a lens barrel, in this lens barrel and be provided with an eyeglass.
Wherein, be spirally connected between this lens mount and this lens barrel and make and to adjust the eyeglass in this lens barrel and the distance of this image sensor by rotating this lens barrel.
Wherein, the periphery of this pedestal apical margin holding part on this more can be provided with most trips, when being installed on this holding part in this lens group, can fix this lens mount by each trip.
Wherein, should outer pin be the root edge that extends to this pedestal respectively, make pedestal can be set at board top surface.
Wherein, should outer pin be the apical margin that extends to this pedestal respectively, and make this pedestal can be incorporated into the bottom surface of circuit board, and this circuit board offers a perforation to last holding part that should pedestal, makes this image sensor and this lens group can be by the last holding part of this punching machine in this pedestal.
Wherein, the outer pin of each of this pedestal is to run through this pedestal downwards, and extends a suitable length and form the form of pin, for passing the default jack of circuit board, and can carry out welding job by the bottom surface of this circuit board.
Its invention mainly is image sensing wafer directly to be provided with on this glass substrate with Flip Chip (lipChip) form image sensor, and the last holding part that provides in this pedestal is provided with most exposed interior pins with the lean against part that following holding part confluce forms, can abut against the location for glass substrate by this lean against part when allowing image sensor be placed in this pedestal, and make the pin circuit electric connection of pin and glass substrate on the lean against part each, and pin is to stretch out and form the bigger outer pin of spacing for being connected with circuit board in each of this pedestal, and by the lens group of the last holding part that is mounted on pedestal image sensor is fixed.
Description of drawings
The invention will be further described below in conjunction with accompanying drawing.
Fig. 1 is a decomposition cross-sectional schematic of the present invention
Fig. 2 is a combination cross-sectional schematic of the present invention
Fig. 3 is a 3-3 line cutaway view among the 1st figure
Fig. 4 is the cross-sectional schematic of second embodiment of the invention
Fig. 5 is the cross-sectional schematic of third embodiment of the invention
Fig. 6 is the cross-sectional schematic of fourth embodiment of the invention
Fig. 7 is the structural representation of the image sensor module commonly used
Fig. 8 is existing another kind of image sensor modular construction schematic diagram
Embodiment
See also Fig. 1 to Fig. 3, the image sensor module of present embodiment, it comprises:
One pedestal 1, these pedestal 1 central authorities have a containing hole 11 that runs through this pedestal 1, this containing hole 11 has on one holding part 111 and holding part 112 once, and the basal area of this time holding part 112 is the basal areas less than holding part on this 111, make on this, following holding part 111,112 intersections form a lean against part 12, and be provided with most exposed interior pins 13 in this lean against part 12, pin 13 is to extend to this pedestal 1 outer rim and form most outer pins 14 for being connected with circuit board 4 in each, in the present embodiment, each outer pin 14 is the root edges that extend to this pedestal 1, and pedestal 1 is set on the circuit board 4.
One image sensor 2, it has a glass substrate 21 and combines an image sensing wafer 22 that is arranged at this glass substrate 21 with Flip Chip (FlipChip), the shape of this glass substrate 21 is to match with the transverse shape of holding part 111 on this, the section that should go up holding part 111 and this time holding part 112 in present embodiment all is square, this time holding part 112 is can be ccontaining for this image sensing wafer 22, and the one side that this glass substrate 21 combines with this image sensing wafer 22 is laid with most pin circuits 211 for electrically connecting with this image sensing wafer 22, can abut against for these glass substrates 21 by this lean against part 12 when making this image sensor 2 be placed in the containing hole 11 of this pedestal 1, and make that the pin circuit of pin 13 and this glass substrate 21 electrically connects on this lean against part 12 each.
One lens group 3, this lens group 3 includes a lens mount 31, the outer rim of this lens mount 31 forms an adapter section 311, and be combined with a lens barrel 32 in the mode of being spirally connected in this lens mount 31, in this lens barrel 32 and be provided with an eyeglass 33, and the shape of the adapter section 311 of this lens mount 31 is to match with the cross section of holding part 111 on this, make this lens group 3 can be incorporated into the last holding part 111 of this pedestal 1 by this adapter section 311, and fix this image sensor 2, simultaneously can be by adjust the distance of this eyeglass 33 and this image sensor 2 by this lens barrel 32 of rotation.
See also Fig. 3, this creation is in order to overcome lead-in wire in the Flip Chip (FlipChip) because of the too careful difficulty that combines with circuit board (PCB or FPC) that causes, so the pin circuit of the glass substrate 21 of corresponding image sensor 2 is provided with pin 13 in the majority on the lean against part 12 in pedestal 1, and pin 13 is to extend out to this pedestal 1 outer rim just to form outer pin 14 in each, just can make each outer pin 14 have bigger contact area and the spacing of 14 of each outer pins is strengthened by such extension amplification, thus, the outer pin 14 of on the pedestal 1 each just can be directly welded on the circuit board 4, that is this pedestal 1 can be fixedly welded on the circuit board in advance.
Moreover, because image sensor 2 is to use Flip Chip in conjunction with this glass substrate 21 and image sensing wafer 22, therefore, the thickness of whole image sensor 2 can be effectively by thinning, and at assembling process image sensing wafer 22 can not take place yet and suffer pollution problems.
And before being installed on this pedestal 1, this image sensor 2 can on this lean against part 12, coat tin cream, make image sensor 2 installing and compressed the last holding part 111 that is fixed in pedestal 1 by lens group 3 after, can allow pin circuit and each interior pin 13 on the glass substrate 21 of image sensor 2 positively electrically connect.In a single day, therefore, when in test, finding that image sensor 2 has defective products,, do not scrap and do not need as prior art, to put in order group just can change image sensor 2 merely because this image sensor 2 is compressed the last holding part 111 that is fixed in pedestal 1 by lens group 3 yet.
In sum, the present invention can reach slimming really, be convenient to organize the effect of unloading, making by aforesaid structure.
Certainly, still there are many examples in the present invention, therebetween the only variation on the details.See also Fig. 4, it is the second embodiment of the present invention, wherein the periphery of this pedestal 1A apical margin holding part 111A on this more is provided with most trip 15A, when being installed on this holding part 111A in this lens group 3, can fix this lens mount 31A by each trip 15A, and make pedestal 1A, image sensor 2A and the firm combination of lens group 3A three fix, so also can reach identical effect with aforementioned first embodiment.
See also Fig. 5, it is the third embodiment of the present invention, wherein the outer pin 14B of each of this pedestal 1B is the apical margin that extends to this pedestal 1, and make this pedestal 1B can be incorporated into the bottom surface of circuit board 4B, and this circuit board 4B offers a perforation 41B to last holding part 111B that should pedestal 1B, make this image sensor 2B and this lens group 3B can be installed on the last holding part 111B of this pedestal 1, make the thickness of circuit board 4B and pedestal 1B overlapping, and can further reach the effectiveness of slimming by this 41B that bores a hole
See also Fig. 6 again, it is the fourth embodiment of the present invention, wherein the outer pin 14C of each of this pedestal 1C runs through this pedestal 1C downwards, and extend a suitable length and form the form of pin, for passing the default jack 42C of circuit board 4C, and can carry out welding job by the bottom surface of this circuit board 4C, so can reach identical effect equally, and can make the image sensor module reduce the chance of contact high temperature with aforementioned first embodiment.
Claims (9)
1, a kind of image sensor module, it is characterized in that: it comprises:
One pedestal, these pedestal central authorities have a containing hole that runs through this pedestal, this containing hole has on one holding part and holding part once, and the basal area of this time holding part is the basal area less than holding part on this, make this upper and lower holding part intersection form a lean against part, and be provided with a plurality of exposed interior pins in this lean against part, pin extends to this pedestal outer rim and forms a plurality of outer pins for being connected with circuit board in each;
One image sensor, it has the image sensing wafer that a glass substrate and directly is arranged at this glass substrate, the shape of this glass substrate is to match with the transverse shape of holding part on this, and this time holding part is can be ccontaining for this image sensing wafer, and the one side that this glass substrate combines with this image sensing wafer is laid with a plurality of pin circuits for electrically connecting with this image sensing wafer, can abut against for this glass substrate by this lean against part when making this image sensor be placed in the containing hole of this pedestal, and make the pin circuit electric connection of pin and this glass substrate on this lean against part each;
One lens group, this lens group has an adapter section, and the shape of this adapter section is to match with the cross section of holding part on this, makes this lens group can be incorporated into the last holding part of this pedestal by this adapter section, and fixes this image sensor.
2, image sensor module according to claim 1, it is characterized in that: the glass substrate in this image sensor is to combine setting with Flip Chip with image sensing wafer, be about to described wafer and be set directly on the glass substrate, and this glass substrate be provided with lead-in wire can for and described wafer electrically connect.
3, image sensor module according to claim 1 is characterized in that: the last holding part of this containing hole and the section of following holding part all are square, and the section of the adapter section of this glass substrate, image sensing wafer and lens group also correspondence be square.
4, image sensor module according to claim 1, it is characterized in that: this lens group includes a lens mount, and the outer rim of this lens mount forms aforesaid adapter section, and this lens mount more is combined with a lens barrel, more is provided with an eyeglass in this lens barrel.
5, image sensor module according to claim 4 is characterized in that: being spirally connected between this lens mount and this lens barrel makes and to adjust the eyeglass in this lens barrel and the distance of this image sensor by rotating this lens barrel.
6, image sensor module according to claim 4 is characterized in that: periphery that this pedestal apical margin promptly should be gone up holding part more is provided with a plurality of trips, when being installed on this holding part in this lens group, can fix this lens mount by each trip.
7, image sensor module according to claim 1 is characterized in that: should outer pin be the root edge that extends to this pedestal respectively, and make pedestal can be set at board top surface.
8, image sensor module according to claim 1, it is characterized in that: should outer pin be the apical margin that extends to this pedestal respectively, and make this pedestal can be incorporated into the bottom surface of circuit board, and this circuit board offers a perforation to last holding part that should pedestal, makes this image sensor and this lens group can be by the last holding part of this punching machine in this pedestal.
9, image sensor module according to claim 1, it is characterized in that: the outer pin of each of this pedestal is to run through this pedestal downwards, and extend a length and form the form of pin, for passing the default jack of circuit board, and can carry out welding job by the bottom surface of this circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100598016A CN100429778C (en) | 2005-03-31 | 2005-03-31 | Image sensor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100598016A CN100429778C (en) | 2005-03-31 | 2005-03-31 | Image sensor module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1841756A CN1841756A (en) | 2006-10-04 |
| CN100429778C true CN100429778C (en) | 2008-10-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100598016A Expired - Fee Related CN100429778C (en) | 2005-03-31 | 2005-03-31 | Image sensor module |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4055761A (en) * | 1975-03-14 | 1977-10-25 | Nippon Kogaku K.K. | Light receiving device for photoelectric conversion element |
| US6359740B1 (en) * | 2000-09-20 | 2002-03-19 | San Hua Tien Precision Circuit Co., Ltd. | Image capturing device |
| US20040149885A1 (en) * | 2003-02-04 | 2004-08-05 | Simon Shiau | Injection molded image sensor module |
| US20050006732A1 (en) * | 2003-02-18 | 2005-01-13 | Stmicroelectronics Sa | Semiconductor package containing an integrated-circuit chip supported by electrical connection leads |
| CN1588154A (en) * | 2004-07-06 | 2005-03-02 | 今湛光学科技股份有限公司 | Taking-up lens of image sensor and its assembly producing method |
| US20050062083A1 (en) * | 2003-09-24 | 2005-03-24 | Irving You | Image sensor module |
| CN1601752A (en) * | 2003-09-22 | 2005-03-30 | 株式会社瑞萨科技 | Method for mfg.solid image senser element |
-
2005
- 2005-03-31 CN CNB2005100598016A patent/CN100429778C/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4055761A (en) * | 1975-03-14 | 1977-10-25 | Nippon Kogaku K.K. | Light receiving device for photoelectric conversion element |
| US6359740B1 (en) * | 2000-09-20 | 2002-03-19 | San Hua Tien Precision Circuit Co., Ltd. | Image capturing device |
| US20040149885A1 (en) * | 2003-02-04 | 2004-08-05 | Simon Shiau | Injection molded image sensor module |
| US20050006732A1 (en) * | 2003-02-18 | 2005-01-13 | Stmicroelectronics Sa | Semiconductor package containing an integrated-circuit chip supported by electrical connection leads |
| CN1601752A (en) * | 2003-09-22 | 2005-03-30 | 株式会社瑞萨科技 | Method for mfg.solid image senser element |
| US20050062083A1 (en) * | 2003-09-24 | 2005-03-24 | Irving You | Image sensor module |
| CN1588154A (en) * | 2004-07-06 | 2005-03-02 | 今湛光学科技股份有限公司 | Taking-up lens of image sensor and its assembly producing method |
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| Publication number | Publication date |
|---|---|
| CN1841756A (en) | 2006-10-04 |
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Granted publication date: 20081029 |