CN100425107C - High-speed printed circuit board with earth layer in microwave photon crystalline structure - Google Patents
High-speed printed circuit board with earth layer in microwave photon crystalline structure Download PDFInfo
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- CN100425107C CN100425107C CNB2005100112101A CN200510011210A CN100425107C CN 100425107 C CN100425107 C CN 100425107C CN B2005100112101 A CNB2005100112101 A CN B2005100112101A CN 200510011210 A CN200510011210 A CN 200510011210A CN 100425107 C CN100425107 C CN 100425107C
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Abstract
The present invention relates to the technical field of printed circuit boards (PCB), particularly to a high-speed printed circuit board with a grounding layer in a microwave photonic crystal (MPC) structure. Periodically arranged MPC units are etched on a grounding layer of the high-speed PCB board to form a two-dimensional periodic metal MPC horizontal plane, and an MPC structure is applied to the horizontal plane of a transmission line which can be a microstrip line, or a coplanar microstrip line, or back grounded coplanar microstrip line or a strip line in the high-speed PCB board. The MPC units can form a rectangle, a circle, a triangle, a lozenge, etc. and can be equivalent to the shape of a capacitor which is namely an inductance structure.
Description
Technical field
The present invention relates to the printed-board technology field, more particularly have the high-speed printed circuit board of microwave photon (MPC) grounding structure layer.
Background technology
Development of electronic technology makes that the operating rate of IC is more and more faster, and the device operating frequency is more and more higher.When the interconnect delay of signal greater than the edge signal upset threshold values time 20% the time, holding wire will present transmission line effect on PCB (printed circuit board (PCB)) plate, be that line no longer is the simple lead performance that shows lumped parameter, but present the parameter effect of distribution.At this moment because not the matching of impedance, and in different branches the transmission time inconsistent and loss, crosstalk etc., the problem of problems of Signal Integrity that the High-Speed PCB digital circuitry designs and Electro Magnetic Compatibility aspect is become is on the rise.
In the High-Speed PCB digital circuit, cause that the reason that signal integrity degenerates is many-sided, mainly contain the following aspects: the change of the signal waveform that crosstalking between (1) transmission line causes.The dielectric layer of transmission line can attract electromagnetic field to make it not to outdiffusion, and can only propagate and the generation surface wave along the ground plate surface.Along with the increase of operating frequency, surface wave is can be more and more serious and intercouple with adjacent transmission line and the noise voltage signal of not expecting that produces.Thereby exceeding certain value if crosstalk may the detonator circuit misoperation causes the system can't operate as normal.(2) the transmission line loss meeting causes that amplitude-frequency characteristic changes.In the High Speed ICs package design, the leakage that waveguide produces is a principal mode of loss.Leaking main form with surface wave or parallel template die exists.Parallel template die mainly is present in strip line or has between the ground level of coplane microstrip line of back up conductor, and all exists in whole frequency range, and surface wave mainly is present in the microstrip line, usually occurs under the upper frequency.Leaky can be along taking place in ground level and the medium in these tunnelling rays, and these losses not only reduce the amplitude of signal but also the peripheral speed of the signal that slows down, and then cause signals diverging and jitter toleration relatively poor.(3) along with system switching speed increases, electromagnetic radiation may become serious problems, and produces electromagnetic interference.Frequency may be passed through holding wire, power/ground or power/ground conducted noise up to the radiation of several gigahertzs, thus cause between a plurality of networks, between the single system chip or the performance between the multisystem reduce.(4) high order harmonic component that produces of the nonlinear device in the PCB circuit, these useless high frequency parasitic signals be consumed energy but also can have influence on the performance of entire circuit plate not only.
In solving problems of Signal Integrity and electromagnetic compatibility problem, traditional method is that the signal for different rates is provided with different wiring layers, and power supply reasonably is set, ground plane layer distributes.Simultaneously, also be an effective way that solves cross-interference issue for transmission line is provided with that bag ground or via hole can wait.But these measures can increase the number of plies of pcb board undoubtedly and improve cost and caused layer wiring amount increase together, make originally limited wiring zone more crowded.In addition, with the increase of frequency, tunnelling ray also is inevitable leaking and crosstalk by ground plane between the layer microstrip line together.So the design of electronic products of today presses for new thought, flow process, method and the technology that is different from traditional design environment, design cycle and method for designing.
Summary of the invention
The object of the present invention is to provide a kind of high-speed printed circuit board with earth layer in microwave photon crystalline structure.
In order to solve in multilayer PCB circuit board because the leakage that surface wave or parallel template die produce and crosstalking and problem such as electromagnetic compatibility, the object of the invention is to provide a kind of new ground level structure design, promptly MPC (microwave photon) structure with compact periodic arrangement is etched on the metal ground connection version, utilize MPC in certain frequency range, to have the generation that the stopband effect can suppress tunnelling ray and parasitic high order harmonic component effectively, reduce the loss of signal, and stop the propagation of noise signal on ground level at high band.When the periodic structure size of this MPC is can be with microwave wavelength comparable, the electromagnetic property of this periodic arrangement structure can be expressed with the circuit unit (electric capacity or inductance) of lump, the coupling effect of inductance and electric capacity by periodic arrangement, can produce a stopband, its centre frequency is by the unit cycle size decision of MPC, the width of stopband and the degree of depth are by the physical dimension decision of each unit, and the band edge at cut-off frequency place is very precipitous.When the width of stopband design big, the behavior of this two-dimension periodic MPC has the function of low pass filter, cycle and cell size according to the size design MPC of circuit board working signal frequency drop in the passband useful signal, high frequency crosstalk and noise signal is cut off.
The technical solution adopted for the present invention to solve the technical problems is: etching MPC unit (unit can also be the shape that rectangle, circle, triangle and prismatic etc. have the MPC effect) structure as shown in Figure 1 on each ground plane of the High-Speed PCB circuit board of multilayer, cycle that it is concrete and cellular construction size are determined according to the frequency of transmission useful signal.The MPC that is laid as shown in Figure 2.In the High-Speed PCB circuit board, high speed transmission of signals is generally by transmission such as microstrip line, coplane microstrip line and strip lines, becomes the MPC structure to solve effectively in the ground-plane design of above transmission line and crosstalks and the loss problem.
The present invention arrives the microwave photon structure applications with periodic arrangement in the structural design of high-speed printed circuit board (PCB) ground plane.
The invention has the beneficial effects as follows: the stopband effect that produces by MPC can be suppressed at surface wave and the parallel-plate mould that produces on the transmission line effectively; Can suppress because noise and the high order harmonic component that high frequency radiation and nonlinear circuit components and parts produce; Can reduce loss and the integrality of the assurance signal of crosstalking by inhibition to tunnelling ray.
Technical scheme
High-speed printed circuit board with MPC grounding structure layer, the MPC construction unit of etching periodic arrangement is formed two-dimensional and periodic metal M PC ground level on the High Speed PCB Board ground plane.
In High Speed PCB Board, on the ground level of different transmission lines, use the MPC structure.
Transmission line is the coplane microstrip line and the strip line of microstrip line, coplane microstrip line, back side ground connection.
The MPC unit can select rectangle, circle, triangle and prismatic etc. equivalence to be the shape of electric capacity one induction structure.
Description of drawings
For further specifying technology contents of the present invention, the invention will be further described below in conjunction with drawings and Examples, wherein:
Fig. 1 is wherein a kind of detail view of two-dimentional MPC construction unit.
Fig. 2 is a ground plane plot of laying the metal M PC structure of two-dimensional and periodic arrangement on dielectric layer.
Fig. 3 is in High Speed PCB Board, uses the MPC stereogram on plane structurally in the dissimilar transmission lines.
Embodiment
High-speed printed circuit board with MPC grounding structure layer, its manufacturing process is the production process of compatible modern pcb board fully.According to designing requirement, lay covering on the copper ground connection version of MPC at needs by exposure imaging and etching technics, process the plane structurally of the MPC with periodic arrangement as shown in Figure 2, the electromagnetic field mode that ends is as required selected the MPC unit, just as wherein a kind of planform that Fig. 1 gave.According to transmission line kind difference in the different layers, the configuration of this ground level and center of transmission line conductor can be by Fig. 3 (a) and (b), (c) and the transmission line structure (d) manufacture respectively microstrip line, coplane microstrip line, back side ground connection coplane microstrip line and strip line.It should be noted that distance that the via hole that processes in order to guarantee linking to each other of non-coplane stratum and center conductor will keep 3-4 cycle is in case to the structural damage of MPC stopband in pcb board.
Among Fig. 3, (a) be microstrip line; (b) be coplanar microstrip line; (c) be back side ground connection Coplanar microstrip line; (d) be strip line
The 1-center conductor, 2-microwave photon ground level, 3-dielectric layer, 4-back side ground connection Layer.
Claims (4)
1. the high-speed printed circuit board with MPC grounding structure layer is characterized in that: the MPC construction unit of etching periodic arrangement composition two-dimensional and periodic metal M PC ground level on the High Speed PCB Board ground plane.
2. the high-speed printed circuit board with MPC grounding structure layer according to claim 1 is characterized in that, in High Speed PCB Board, uses the MPC structure on the ground level of different transmission lines.
3. the high-speed printed circuit board with MPC grounding structure layer according to claim 2 is characterized in that, transmission line is the coplane microstrip line and the strip line of microstrip line, coplane microstrip line, back side ground connection.
4. the high-speed printed circuit board with MPC grounding structure layer according to claim 1 and 2 is characterized in that, the MPC construction unit is to select rectangle, circle, triangle and prismatic equivalence to be the shape of electric capacity-induction structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100112101A CN100425107C (en) | 2005-01-20 | 2005-01-20 | High-speed printed circuit board with earth layer in microwave photon crystalline structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100112101A CN100425107C (en) | 2005-01-20 | 2005-01-20 | High-speed printed circuit board with earth layer in microwave photon crystalline structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1809244A CN1809244A (en) | 2006-07-26 |
| CN100425107C true CN100425107C (en) | 2008-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100112101A Expired - Fee Related CN100425107C (en) | 2005-01-20 | 2005-01-20 | High-speed printed circuit board with earth layer in microwave photon crystalline structure |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101662885B (en) * | 2008-08-28 | 2011-09-14 | 中国科学院微电子研究所 | Method for performing gold backing on printed circuit board of Ku waveband microstrip type switch circuit |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020004307A1 (en) * | 2000-07-05 | 2002-01-10 | Nec Corporation | Photonic crystal multilayer substrate and manufacturing method thereof |
| US6465742B1 (en) * | 1999-09-16 | 2002-10-15 | Kabushiki Kaisha Toshiba | Three dimensional structure and method of manufacturing the same |
| US20020167013A1 (en) * | 2001-05-10 | 2002-11-14 | Tatsuya Iwasaki | Optoelectronic substrate |
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2005
- 2005-01-20 CN CNB2005100112101A patent/CN100425107C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6465742B1 (en) * | 1999-09-16 | 2002-10-15 | Kabushiki Kaisha Toshiba | Three dimensional structure and method of manufacturing the same |
| US20020004307A1 (en) * | 2000-07-05 | 2002-01-10 | Nec Corporation | Photonic crystal multilayer substrate and manufacturing method thereof |
| US20020167013A1 (en) * | 2001-05-10 | 2002-11-14 | Tatsuya Iwasaki | Optoelectronic substrate |
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| Publication number | Publication date |
|---|---|
| CN1809244A (en) | 2006-07-26 |
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