CN100420939C - Gas sensor and producing method thereof - Google Patents
Gas sensor and producing method thereof Download PDFInfo
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- CN100420939C CN100420939C CNB2004100636901A CN200410063690A CN100420939C CN 100420939 C CN100420939 C CN 100420939C CN B2004100636901 A CNB2004100636901 A CN B2004100636901A CN 200410063690 A CN200410063690 A CN 200410063690A CN 100420939 C CN100420939 C CN 100420939C
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- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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- G01N2001/4094—Concentrating samples by other techniques involving separation of suspended solids using ultrasound
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Abstract
Pt-based leads are arranged on gold alloy pads, and thermo-compression bonding is performed on gold-based bumps to sandwich and fix the leads between the bumps and the pads. The bumps are formed in a disk shape, and are six to twelve times larger than the leads in diameter, two to five times higher, and do not have any recession part in their upper surfaces. By this method, it is possible to facilitate bonding and maintain high bonding strength for a long period.
Description
Technical field
The present invention relates to gas sensor and manufacture method thereof.
Background technology
Patent documentation 1: Japanese patent of invention 3408910
Summary of the invention
Problem of the present invention is, provides a kind of the needs that the weld part of pad is covered with gold paste, no matter in direction parallel or vertical direction with substrate, and gas sensor and manufacture method thereof that can both the long term maintenance weld strength.
The present invention is a kind of gas sensor, forms heating film, gas sensing portion and pad on substrate, and this substrate is connected to outside wire bonds on above-mentioned pad, it is characterized in that,
Above-mentioned cable guide is welded between the lug boss that the pad of gold system and gold are;
Lug boss is that upper surface does not have the discoid of recess, and its diameter R and the height H from the upper surface of pad to the upper surface of lug boss with the ratio of the diameter r of lead-in wire are: 6≤R/r≤12,2≤H/r≤5.
Preferably, the diameter R of lug boss and the height H from the upper surface of pad to the upper surface of lug boss with the ratio of the diameter r of lead-in wire are: 7.5≤R/r≤11,2≤H/r≤4.
Particularly preferably be, the diameter R of lug boss and the height H from the upper surface of pad to the upper surface of lug boss with the ratio of the diameter r of lead-in wire are: 8≤R/r≤10,2.5≤H/r≤3.
Also have, preferably, above-mentioned lead-in wire connects lug boss along the upper surface of pad, lead-in wire front end above-mentioned lug boss of break-through on this pad.
The present invention is a kind of manufacture method of gas sensor again, forms heating film, gas sensing portion and pad on substrate, this substrate being connected in outside wire bonds on above-mentioned pad, it is characterized in that,
The front-end configuration of lead-in wire that is r to diameter is the front end of the golden anchor line (string) material that is used to form lug boss more than 1.5 times of r at diameter on the pad of gold system, and forming diameter is the ball below 10 times more than 5 times of r;
This ball ultrasonic heat pressure welding in above-mentioned pad, is formed the smooth lug boss of upper surface except the remnants of defeated troops of wire rod, simultaneously, above-mentioned cable guide is welded between this lug boss and pad,
And lug boss is discoid, and upper surface does not have recess, and its diameter is taken as R, and the height from the upper surface of pad to the upper surface of lug boss is taken as H, is taken as with the ratio of the diameter r of lead-in wire: 6≤R/r≤12,2≤H/r≤5.
Preferably, get 30 μ m≤r≤50 μ m, 300 μ m≤R≤440 μ m, 80 μ m≤H≤160 μ m, make above-mentioned ball and above-mentioned pad bonding by the ultrasonic heat pressure welding, and the weld load during the ultrasonic heat pressure welding is 3～6N, ultrasonic power is 3～10W, hyperacoustic application time is 50～200msec, and underlayer temperature is 200～350 ℃.
Particularly preferably be, get 320 μ m≤R≤400 μ m, 100 μ m≤H≤120 μ m, make above-mentioned ball and above-mentioned pad bonding by the ultrasonic heat pressure welding, and the weld load during the ultrasonic heat pressure welding is taken as 4～5N, ultrasonic power is taken as 7～8W, and hyperacoustic application time is taken as 100～150msec, and underlayer temperature is taken as 220～300 ℃.
In the present invention, cable guide is welded between the pad that the lug boss of gold system and gold are.And it is discoid that this lug boss is become, and upper surface does not have recess, by and the diameter ratio of lead-in wire, have the height of regulation and the diameter of regulation, thereby the scope by the resulting lug boss of ball of same size has obtained maximum weld strength.Therefore, needn't apply gold paste etc. and fire again, the manufacturing process of gas sensor is become simply, and shorten and made the needed time.Lug boss makes the lug boss of gold system because easy pad to gold system welds, and because the high-melting-point lead-in wire of the suitable Pt family of lead-in wire etc., thereby the welding of lug boss and lead-in wire is very difficult, mainly keeps lead-in wire by alloy-layer that forms or friction force between lug boss/lead-in wire.Because lug boss and pad all be that gold is, low melting point, thereby bonding simply.
Yet the weld strength of lead-in wire can reduce in time.This be because, pad is not pure gold pad, be to increase the adhesion with substrate, has adopted the billon pad of thick film.For the alloy pad, the adhesion at pad and lug boss interface, perhaps, pad is not 1 layer, but when being made up of multilayer, the adhesion of the interlayer in pad will descend.And in addition, heated substrate or make underlayer temperature variation etc. also can make the declines such as adhesion of lead-in wire and lug boss.So,, will the size of lug boss be limited in order to remedy the reduction of the adhesion that causes thus.The thin thickness of lug boss also has, if when the direction vertical with substrate stretches lead-in wire, will produce the phenomenon that goes between and stave the upper surface of lug boss and peel off.Therefore, the thickness H of lug boss is more than 2 times of diameter r of lead-in wire, if it is too thick, the ball that will form gold system for the lug boss that forms gold system will become very difficult, also has, and it is very difficult that the welding of lug boss also can become, therefore, get 2≤H≤5, preferably 2≤H≤4, most preferably 2.5≤H≤3.
If the diameter of lug boss is little, lug boss will occur and peel off from pad, perhaps pad damages, and is attached under the state of lug boss the phenomenon that lug boss and pad are peeled off in the part of pad.Though this be since the lead-in wire fully attached to this lug boss, the adhesion deficiency of lug boss and pad, therefore, lug boss is just peeled off from pad, perhaps pad is pullled and is damaged by lug boss.Because the adhesion of lug boss and pad is by the floorage decision of lug boss, so the preferred big diameter of lug boss.Certainly, if the diameter R of lug boss increases, it is very difficult that the formation of the presoma gold goal of lug boss also will become, and welding also can become very difficult.Therefore, the diameter R of lug boss is 6≤R/r≤12 with the ratio of the diameter r of lead-in wire, preferably 7.5≤R/r≤11, most preferably 8≤R/r≤10.The height of lug boss and the effect of diameter such as Figure 11～shown in Figure 14, decide by diameter ratio with lead-in wire.
If the diameter r of lead-in wire is 30～50 μ m, the diameter of lug boss and height, preferably, 300 μ m≤R≤440 μ m for example, 80 μ m≤H≤160 μ m, carry out the ultrasonic heat pressure welding for making abundant welding of this lug boss and pad and upper surface not produce recess, preferably, during the ultrasonic heat pressure welding, weld load is 3～6N, ultrasonic power is 3～10W, and hyperacoustic application time is 50～200msec, and underlayer temperature is 200～350 ℃.
Herein, most preferably, the diameter of lug boss and highly be 320 μ m≤R≤400 μ m, 100 μ m≤H≤120 μ m carry out the ultrasonic heat pressure welding for making abundant welding of this lug boss and pad and upper surface not produce recess, preferably, during the ultrasonic heat pressure welding, weld load is 4～5N, and ultrasonic power is 7～8W, hyperacoustic application time is 100～150msec, and underlayer temperature is 220～300 ℃.
Herein, if make the front end of lead-in wire connect lug boss, occur on pad, the contact area that just can make lead-in wire and lug boss is for maximum, thereby the friction force between increase lug boss and the lead-in wire increases weld strength.
Description of drawings
Fig. 1 is the vertical view of the gas sensor of embodiment;
Fig. 2 be schematically represent in the gas sensor of embodiment, lead-in wire is to the figure of the welding sequence of pad;
Fig. 3 is the substrate of expression among the embodiment and the vertical view of the configuration of lead-in wire, pad, lug boss;
Fig. 4 is the pad of expression among the embodiment and the partial side view of the relation of lug boss and lead-in wire;
Fig. 5 is the side-looking photo of embodiment;
Fig. 6 is that the gas sensor of embodiment is overlooked photo;
Fig. 7 is 300 times of electron micrographs of ball used among the embodiment;
Fig. 8 is 500 times of electron micrographs of ball used in the comparative example;
Fig. 9 is 250 times of electron micrographs of weld part of the gas sensor of comparative example;
Figure 10 is the lug boss of expression among the embodiment and the electron micrograph of the section of substrate;
The lead-in wire that Figure 11 is illustrated in during 18 months heating (500 ℃) continuously is at the performance plot perpendicular to the variation of the peel strength of the direction of substrate surface: 3 kinds in 2 150 μ m balls that each 8 of sample numbers, lug boss be 280 μ m balls (embodiment), overlap to form in vertical direction and 150 μ m balls (comparative example);
Figure 12 is illustrated in during 18 months the performance plot of the lead-in wire of heating (500 ℃) continuously in the variation of the peel strength of the direction that is parallel to substrate surface: 3 kinds in 2 150 μ m balls that each 8 of sample numbers, lug boss be 280 μ m balls (embodiment), overlap to form in vertical direction and 150 μ m balls (comparative example);
Figure 13 is illustrated in during 18 months the performance plot of the variation of the peel strength of the lead-in wire of heating (500 ℃) continuously: the diameter that forms the used ball of lug boss is,
280 μ m, 250 μ m (embodiment)
200 μ m, 150 μ m (comparative example)
The peel strength (N unit) that Figure 14 is illustrated in during 18 months continuously the lead-in wire of heating (500 ℃) is with respect to the performance plot of the height of the diameter of lug boss and lug boss.
Embodiment
Embodiment
Fig. 1～Fig. 4 represents the structure of the gas sensor 2 of embodiment.In the drawings, 4 is pedestal, and 6 is stem-for example 4, and 8 is sensor main body.Insulativity substrate 10, pad 12 and lug bosses 14 such as aluminium oxide are arranged on the sensor main body 8, and for example, 4 lead-in wires 16 are installed in four jiaos of 1 surface of substrate 10, are clipped in and install between pad 12 and the lug boss 14, and its other end for example is welded in stem 6.In addition, as shown in Figure 3, Figure 4, the front end 17 of lead-in wire connects lug boss 14, is configured on the pad 12.
Among 4 pads 12, for example 2 pads are connected in heating film 21, and other 2 pads are connected in the not shown gas sensing portion in substrate bottom surface.Also have, gas sensing portion adopts for example metal-oxide semiconductor (MOS) film or solid electrolyte film, perhaps its chip etc.Have, among the embodiment, substrate 10 is provided with 4 pads 12 again, and but, for example 3 pads or 5 pads etc. also can.
The size of each several part is described with reference to Fig. 3, Fig. 4.Substrate 10 is for example square, and its 1 limit a is for example 1.5mm, and pad 12 also is a square, and its 1 limit b is for example 0.5mm.Also have, heating film 21 is for example 0.7 * 0.7mm, and gas sensing film also is for example same substantially size.
Lead-in wire 16 for example adopts Pt or Pt-W, Pt-Fe, Pt-Ni, Pt-Cr, Pt-ZGS (making zirconia be scattered in the thing of the grain boundary of Pt), perhaps precious metal alloys silk such as Au-Pd-Mo.These alloys are because of low with the welding performance of pad 12 and lug boss 14, so mainly by being fixed with lug boss 14 formation alloy-layers or friction force.
Fig. 2 welding process of 16 of representing to go between, lead-in wire 16 is extracted out from kapillary 27, and front end enters in the pad 12, carries out the ultrasonic heat pressure welding by the ball 24 from the golden anchor line (string) material 25 of kapillary 26.Adopt the spun gold 25 of 100% gold medal substantially among the embodiment.28 is spray point, and 29 is high-voltage power supply, and 30 is switch, by the front end of wire rod 25 and the discharge between the spray point 28, forms ball 24.Can apply ultrasound wave to kapillary 26 by never illustrated ultrasound source, also be provided with not shown sucker, kapillary 26 is risen, break wire rod 25.Like this, because weak place is arranged at the top of ball 24, can break wire rod 25 from this part.Have again, substrate 10 can be heated, thereby the ultrasonic heat pressure welding of ball 24 is carried out easily.
The Pt-W silk (W is 8 weight %) that adopts diameter 40 μ m among the embodiment is as lead-in wire 16, and the spun gold that adopts the about 75 μ m of diameter is as wire rod 25.The diameter of wire rod 25 is for example 1.5～2.5 times of lead-in wire 16 diameter.And the diameter R of lug boss is 380 μ m, and the height H of lug boss is a typical example with 110 μ m.In addition, ball 24 is for example diameter 280 μ m, preferably, diameter be 200～400 μ m (with the ratio of diameter of lead-in wire be 5～10 times).2～3 times of the diameter that typically has a diameter from wire rod 25 of ball 24 but, in inventor's experiment, have been finished 2～4 times just spherical ball until the diameter of wire rod 25.
Fig. 5, Fig. 6 represent the installation situation of lead-in wire of the gas sensor of embodiment.In these figure, represent 4 lug bosses of 1 gas sensor respectively.Value X among Fig. 5, Fig. 6, Y, D obtain according to graphical analysis, and X is equivalent to the diameter of lug boss, and the Y among Fig. 5 is equivalent to the height of lug boss.D among Fig. 6 is the rectangular cornerwise length that is formed by near the boost line of drawing lug boss.As shown in Figure 5, the upper surface of lug boss is smooth, and portion can see the remnants of defeated troops of wire rod in the central.Also have, as shown in Figure 6, lug boss is discoid, and the difference of major axis and minor axis is about 10%.
Fig. 7, Fig. 8 represent used ball, and Fig. 7 is the ball that the spun gold by diameter 75 μ m makes, the about 280 μ m of diameter.Fig. 8 is the ball that the spun gold by diameter 50 μ m makes, the about 150 μ m of diameter.By the wire rod of diameter 75 μ m, except the ball of diameter 280 μ m, the ball of diameter 250 μ m and the ball of 200 μ m have also been made.Make the ball of diameter 150 μ m by the wire rod of diameter 50 μ m, this ball is carried out 1 ultrasonic heat pressure welding, make the structure of lug boss, in addition, local vertically superposed 2 balls same carry out the ultrasonic heat pressure welding, make the structure of 2 heavy lug bosses.Fig. 9 represents the section of 2 heavy lug bosses.On pad top, lead-in wire appears as circle, and in the part of lug boss, employed resin appears as the stain shape in the process that sample makes.Also have, on the top of lug boss, the remnants of defeated troops of wire rod seem that the part resembles cigarette.Figure 10 represents in the preferred embodiment (lug boss height 110 μ m, lug boss diameter 380 μ m), the electron microscope cross sectional photograph of substrate and lug boss.The upper surface of lug boss is the plane, can see the remnants of defeated troops of wire rod in the central.Horizontal line as the scale of Figure 10 is 0.2mm.
For gas sensor, the used lead-in wire of suspention substrate, diameter mostly is 30～50 μ m, but, along with the miniaturization of substrate from now on, also will consider the lead-in wire of diameter 20 μ m.Herein, diameter and the height of lug boss and the diameter ratio of lug boss that importantly goes between.For example the diameter ratio of the height of lug boss and lead-in wire is 1.2～1.3 o'clock (150 μ m balls are not carried out the ultrasonic heat pressure welding overlappingly), is going between with the rectangular direction stretching of substrate, and lead-in wire will stave the upper surface of lug boss and come off.If lug boss has adequate thickness, firmly fixedly the time, the power of supporting lead-in wire just becomes the power that acts on the interface between lug boss and the pad for lead-in wire and lug boss.Because the floorage of this power and lug boss is proportional, and lead-in wire has connected the lug boss bottom surface, thereby the contact area of lead-in wire and lug boss is certain, and the diameter of lug boss and the diameter ratio of lead-in wire just become problem.
In addition, for lug boss, its upper surface is smooth to be very important.If ultrasonic power is too big, perhaps hyperacoustic application time is oversize, and the load during ultrasonic heat pressure welding in other words is too big, will produce the recess that surrounds the wire rod remnants of defeated troops.If the generation recess will descend in the intensity of this part lug boss, lug boss just damages easily.In addition, big ball manufactures very difficult, and also needs big load and high-temperature, big in other words ultrasonic power etc. during the ultrasonic heat pressure welding.If strengthen load, substrate etc. just are easy to generate breakage.Also have, carry out the ultrasonic heat pressure welding at 250 ℃ in an embodiment, be heated to higher temperature from device and be difficult to.
Figure 11～Figure 14 represents the characteristic among the embodiment.Among Figure 11 the peel strength (vertical peel strength) when stretching lead-in wire with the rectangular direction of substrate is measured, 8 gas sensors are used in 1 measurement.Also have, sensor is heated to 500 ℃ and wear out continuously.The peel strength of vertical direction and horizontal direction is if gas sensor also leaves surplus through fall-down test etc. again, in the practicality preferably more than the 0.4N/ lead-in wire.
For the gas sensor (lug boss height 110 μ m, lug boss diameter 380 μ m) of the ball that adopts diameter 280 μ m, the initial value of vertical peel strength is 2.2N, keeps heating continuously, and this intensity will slowly descend.On the other hand, as shown in Figure 9, for overlapping 2 lug bosses that diameter is the ball of 150 μ m, can obtain the vertical peel strength of equal extent substantially, but, underspeeding of intensity is also faster than the ball that adopts diameter 280 μ m.To this, if form lug boss with the ball of 1 diameter, 150 μ m, initial vertical peel strength will surpass 1N, and but, along with use, intensity will descend, and through 18 months, the sample in practical district also can occur being lower than.Lead-in wire come off investigate, for the structure of the ball of only having used 1 150 μ m, lead-in wire staves lug boss and the situation of throwing off from upside is in the majority.By contrast, for adopting diameter is the structure of the ball of 280 μ m, 2 structures that diameter is the ball of 150 μ m have perhaps been used, mixing has: lead-in wire disconnects, lug boss damages for a certain reason, lug boss comes off from pad, in other words the part of pad be attached to lug boss and from pad come off etc.But the top that staves lug boss of finding to go between comes off.
Figure 12 be illustrated in Figure 11 the same terms under, the peel strength (horizontal peel strength) when stretching lead-in wire with the surperficial parallel direction of substrate.In this case, the lug boss of the ball that to adopt 1 diameter be 150 μ m is very little with the difference of the lug boss of the ball that adopts 2 150 μ m, use more than 12 months after, will become remarkable with the intensity difference of the lug boss of the ball that adopts diameter 280 μ m.For the lug boss of the ball that adopts diameter 280 μ m, after 12 months and the damaged reason after 18 months, belong to (after 12 months after 5/8,18 month 6/8) in the majority of pad damage.By contrast, for the ball that adopts diameter 150 μ m, no matter ball is 1 or 2, lug boss damages, perhaps go between from lug boss come off in the majority, be appreciated that lug boss floorage deficiency, the permanance of horizontal peel strength is just not enough.
Figure 13 represents the diameter and horizontal peel strength and vertical peel strength of ball.Transverse axis is with the diameter of the used wire rod of μ m unit representation and the diameter of ball, and the diameter of lug boss and the height of lug boss are by the value of not having the represented sample of black mark among Figure 14.The diameter 200 μ m of ball appear at, on the separatrix of the scope that the peel strength after 18 months has a reliability and the scope that does not have reliability.The diameter of lead-in wire is 40 μ m, more than 6 times below 8 times of the diameter that the diameter of ball preferably goes between, more than 5 times below 10 times of the diameter of wider is lead-in wire.
Figure 14 represents with respect to the height H of the diameter R of lug boss and lug boss, through the intensity of the horizontal direction after 18 months and the intensity of vertical direction.For guaranteeing that these values all surpass 1N, the height H of lug boss is necessary for more than the 80 μ m, more preferably is necessary for more than the 100 μ m.If unrestrictedly increase the height of lug boss, the formation of ball will be very difficult, and the ultrasonic heat pressure welding is also very difficult.Therefore, the value of H is preferably more than 2 below 5, more preferably more than 2 below 4, most preferably more than 2.5 below 3.The diameter R of lug boss, the diameter 40 μ m for lead-in wire must be at least more than the 240 μ m, preferably more than the 300 μ m, most preferably more than the 320 μ m.In addition, the lug boss diameter is 440 μ m, and the lug boss height is the sample of 85 μ m, has recess at the upper surface of lug boss, and therefore, the intensity of vertical direction will descend.The ratio R/r of the diameter R of lug boss and the diameter r of lead-in wire is generally 6～12, and preferably 7.5～11, most preferably more than 8 below 10.
Below the condition of ultrasonic heat pressure welding is described, ultrasonic power is big more, hyperacoustic application time is long more, it is big more to load, the heating-up temperature of substrate is high more, ultrasonic heat pressure welding self is just easy more., if these conditions are strong excessively, will produce recess sometimes on the lug boss.Also have, the raising of underlayer temperature is difficult at the textural of welder.If increase load again, just cause the damage of substrate etc. easily.On the other hand, low if ultrasonic power and application time thereof, load, underlayer temperature waited, the adhesive strength of lug boss and pad will be not enough, and that the shape that is easy to generate lug boss becomes is hemispherical, the sample of the diameter deficiency of lug boss.
The diameter r of lead-in wire is decided to be 30～50 μ m, and the diameter of lug boss is for example 300～440 μ m, 320～400 μ m more preferably, lug boss it is highly preferred that 80～160 μ m, more preferably 100～150 μ m.Form the lug boss of such diameter and height for ball by diameter 280 μ m and 250 μ m, promptly the diameter for lug boss is 300～440 μ m, it highly is the scope of 80～160 μ m, preferably, weld load during the ultrasonic heat pressure welding is 3～6N, ultrasonic power is 3～10W, and hyperacoustic application time is 50～200msec, underlayer temperature be 200～350 ℃ for well.Also have, for the diameter that makes lug boss is 320～400 μ m, it highly is 100～120 μ m, is 4～5N with selected weld load, and ultrasonic power is 7～8W, and its application time is 100～150msec, underlayer temperature be 220～300 ℃ for well.In addition, this welding condition is the condition that is used for being made by the ball of diameter 250～280 μ m the lug boss of optimum shape, is the value that is independent of the diameter of lead-in wire.
In an embodiment, can make simply experience long-time after in the horizontal direction with all high gas sensor of peel strength of vertical direction lead-in wire.
Claims (4)
1. the manufacture method of a gas sensor forms heating film, gas sensing portion and pad on substrate, this substrate being connected to outside wire bonds on described pad, it is characterized in that,
The front-end configuration of lead-in wire that is r to diameter is the front end of the golden anchor line (string) material that is used to form lug boss more than 1.5 times of r at diameter on the pad of gold system, and forming diameter is the ball below 10 times more than 5 times of r;
This ball ultrasonic heat pressure welding in described pad, is formed the smooth lug boss of upper surface except the remnants of defeated troops of wire rod, simultaneously, described cable guide is welded between this lug boss and pad,
And lug boss is discoid, and upper surface does not have recess, and its diameter is taken as R, and the height from the upper surface of pad to the upper surface of lug boss is taken as H, is taken as with the ratio of the diameter r of lead-in wire: 6≤R/r≤12,2≤H/r≤5.
2. the manufacture method of gas sensor according to claim 1 is characterized in that,
The diameter r of lead-in wire is taken as 30 μ m≤r≤50 μ m;
The diameter R of lug boss and the height H of lug boss are taken as 300 μ m≤R≤440 μ m, 80 μ m≤H≤160 μ m;
Make described ball and described pad bonding by the ultrasonic heat pressure welding, and the weld load during the ultrasonic heat pressure welding is taken as 3～6N, ultrasonic power is taken as 3～10W, and hyperacoustic application time is taken as 50～200msec, and underlayer temperature is taken as 200～350 ℃.
3. the manufacture method of gas sensor according to claim 2 is characterized in that,
Get 320 μ m≤R≤400 μ m, 100 μ m≤H≤120 μ m;
Make described ball and described pad bonding by the ultrasonic heat pressure welding, and the weld load during the ultrasonic heat pressure welding is taken as 4～5N, ultrasonic power is taken as 7～8W, and hyperacoustic application time is taken as 100～150msec, and underlayer temperature is taken as 220～300 ℃.
4. the manufacture method of gas sensor according to claim 1, it is characterized in that, in order to make the described lug boss of front end break-through of described lead-in wire, when described cable guide was welded between this lug boss and pad, the front end of described lead-in wire connected lug boss and is configured on the pad.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP276536/2003 | 2003-07-18 | ||
| JP2003276536A JP4462864B2 (en) | 2003-07-18 | 2003-07-18 | Manufacturing method of gas sensor |
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| Publication Number | Publication Date |
|---|---|
| CN1576832A CN1576832A (en) | 2005-02-09 |
| CN100420939C true CN100420939C (en) | 2008-09-24 |
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| CNB2004100636901A Active CN100420939C (en) | 2003-07-18 | 2004-07-16 | Gas sensor and producing method thereof |
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| JP (1) | JP4462864B2 (en) |
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| JP2002189011A (en) | 2000-12-21 | 2002-07-05 | Figaro Eng Inc | Gas sensor and its manufacturing method |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20050009669A (en) | 2005-01-25 |
| CN1576832A (en) | 2005-02-09 |
| KR100960849B1 (en) | 2010-06-07 |
| JP4462864B2 (en) | 2010-05-12 |
| JP2005037316A (en) | 2005-02-10 |
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