CN100388064C - Laser preparing structure and method - Google Patents
Laser preparing structure and method Download PDFInfo
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- CN100388064C CN100388064C CNB2006100912116A CN200610091211A CN100388064C CN 100388064 C CN100388064 C CN 100388064C CN B2006100912116 A CNB2006100912116 A CN B2006100912116A CN 200610091211 A CN200610091211 A CN 200610091211A CN 100388064 C CN100388064 C CN 100388064C
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Abstract
The present invention relates to a laser patching structure which comprises a first metallic layer, an isolating layer and a second metallic layer, wherein the first metallic layer is provided with at least one servicing wire; the isolating layer covers the first metallic layer; the second metallic layer is arranged on the isolating layer and comprises at least one signal wire which is interlaced with and overlaps the servicing wire, and a dummy club is formed in the overlap region and is arranged on the side edge with no signal transfer according to the plan of the servicing wire.
Description
Technical field
The present invention is meant a kind of laser preparing structure and method of simplifying Hotfix and improving the repairing quality especially relevant for a kind of laser preparing structure and method.
Background technology
The viewing area of LCD is by the data line of multirow and staggered the forming of gate line of multiple row, wherein between two adjacent data lines and two adjacent gate lines, form a pixel region, LCD is by the light and shade of the signal controlling pixel region internal transistor of data line and gate line, to reach the effect of show image picture.
See also shown in Figure 1, it is the synoptic diagram of available liquid crystal display, LCD 1 comprises glass substrate 10 among the figure, viewing area in the middle of it is by the data line of multirow and staggered the forming of gate line of multiple row, the signal wire 2 of Fig. 1 can be that data line also can be a gate line, but for convenience of explanation, the signal wire among the figure 2 is a data line; A plurality of drive IC 3 are located at the edge of glass substrate 10, the signal output of each one of drive IC 3 may command or one or more signal wire 2; The outside of glass substrate 10 then is to be provided with circuit board 4, and it is connected with drive IC 3 and external power source respectively.
Yet, signal wire 2 is in the process of making, might cause broken string because of particle contamination, shown in the C district of Fig. 1, in case the broken string phenomenon takes place, and the signal on the signal wire 2 goes down with regard to the transmission of having no idea to continue, this moment is not if do suitable repairing, to make that the following pixel region in C district all can't show image, and then have influence on picture quality.
Please consult shown in Figure 1 once more; prior art has influence on picture quality for fear of signal wire 2 because of broken string; in the process of making, have arrangement and the design of maintenance thread (Rescue Line) usually; the maintenance thread of glass substrate 10 can optionally design one or more; for example R1 among the figure and R2, it intermeshes with signal wire 2 and is positioned at different metal levels.Generally speaking, maintenance thread R1, R2 normally are positioned at the first metal layer M1, and through the channel (Pass) of drive IC 3 inside and circuit 5,6 or circuit 5a, the 6a of circuit board 4, extend the other end of signal wire 2 again along the edge, edge of glass substrate 10, signal wire 2 then is to be positioned at the second metal level M2, then is to utilize a separation layer to be intercepted between the two.
When signal wire 2 needs to repair because broken string takes place at the P point, as long as utilize signal wire 2 and the maintenance thread R1 welding of laser welding technology with the A district, and with the signal wire 2 in B district and maintenance thread R1 welding, at this moment, the signal of drive IC 3 can see through maintenance thread R1 and be sent to the following signal wire 2 of P point.Thus, originally the pixel region of signal wire 2 P point below can't show image, but can't show image at a pixel region that is left P point place through after repairing, and the result will promote the picture quality of LCD 1 widely.
See also shown in Fig. 2 A～2D, it carries out the synoptic diagram of laser preparing to the A district signal wire 2 of Fig. 1 for prior art, for ease of carrying out laser bonding, signal wire 2 can form the bigger weld pad of an area 21 (Welding Pad) with the staggered part of patch cord R1, this weld pad 21 is extended to both sides by signal wire 2, shown in Fig. 2 A and Fig. 2 B.When carrying out laser bonding; with manual type laser alignment weld pad 21 is formed solder joint 8; to finish the laser bonding of signal wire 2 and patch cord R1; the left that passes to patch cord R1 for fear of signal forms unnecessary load (loading) and in order to reduce the resistance-capacitance value (RC) of LCD again; after laser bonding, can implement the patch cord R1 cut-out of cut 81 usually again, shown in Fig. 2 C and Fig. 2 D with weld pad 21 lefts.
As shown in the above description, prior art is when carrying out laser preparing, and the program that must carry out comprises once or once above laser bonding and once or once above cut that its process is quite loaded down with trivial details.In addition, when carrying out laser bonding, aim at for the ease of operator with manual type, the weld pad of signal wire both sides must strengthen, but if increase pad area then resistance-capacitance value (RC) also can strengthen, its result will make and the signal attenuation aggravation reduce success rate of mending.
Therefore, how to improve at the shortcoming of prior art, and propose preferable laser preparing structure and method, to simplify the laser preparing program and can not increase whole resistance-capacitance value (RC), real is the target that the anxious desire of present stage research staff solves.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of laser preparing structure, and this structure can not increase the resistance-capacitance value.
Another object of the present invention is to provide a kind of laser repairing method, this method can be simplified the laser preparing program.
For reaching the above object, the disclosed laser preparing structure of the present invention comprises the first metal layer, and it has at least one maintenance thread; Separation layer is covered on the first metal layer; Second metal level, be arranged on this separation layer, this second metal level comprises that the maintenance thread of at least one signal wire and the first metal layer is overlapping, and forms lug in the overlapping region, and wherein lug is located at the planning that maintenance thread one side and this side and no signal transmit.
Above-mentioned laser preparing structure is arranged among the LCD, and this LCD has at least one drive IC and be electrically connected with an end of signal wire, and the other end of this signal wire then is to be connected with an ESD device.In addition, this signal wire can be a data line, is electrically connected to the drain electrode of the thin film transistor (TFT) of this LCD, and in addition, this signal wire can be a gate line also, is electrically connected to the grid of this thin film transistor (TFT).
The disclosed laser repairing method of the present invention, its step comprises: at first form the first metal layer, this first metal layer has at least one maintenance thread; On this first metal layer, cover a separation layer; Form second metal level on this separation layer again, wherein this second metal level comprises at least one signal wire and is overlapping with this maintenance thread; Side in this overlapping region forms lug, and wherein this maintenance thread is in the planning of this side and no signal transmission; Again this lug is carried out laser bonding cutting off this maintenance thread, and connect the maintenance thread of this lug and overlapping thereof.
As shown in the above description, laser preparing structure provided by the present invention only forms lug in a side of signal wire, must form lug in both sides with respect to prior art, and the area of laser preparing structure of the present invention is less, the resistance-capacitance value is lower, effectively reduces the signal attenuation degree.
Again, as shown in the above description, laser repairing method provided by the present invention, lug at signal wire one side carries out laser bonding and cutting, its need carry out the laser preparing program one time, must carry out repeatedly laser bonding with respect to prior art and can finish laser preparing with cutting, the present invention can simplify the laser preparing program.
For making advantage of the present invention and the spirit can be further revealed, cooperate graphic work one to describe in detail now as after.
Description of drawings
Fig. 1 is the synoptic diagram of the LCD of prior art;
Fig. 2 A～2D is prior art is carried out laser preparing to the A district signal wire of Fig. 1 a synoptic diagram;
Fig. 3 A～3D is the synoptic diagram of the disclosed laser preparing structure of the present invention;
Fig. 4 A～4B is the synoptic diagram that the B district that the present invention is directed to Fig. 1 of prior art carries out laser preparing;
Fig. 5 is the process flow diagram of laser repairing method of the present invention;
Fig. 6 A～6B is the laser preparing structure synoptic diagram of maintenance thread when parallel with signal wire and overlapping;
Fig. 7 is the process flow diagram of the laser repairing method when parallel with signal wire and overlapping as maintenance thread.
The primary clustering symbol description
1～LCD, 2～signal wire
3～drive IC, 4～circuit board
5a, 5b～ circuit 6a, 6b～circuit
7～separation layer, 8～solder joint
9～ESD device, 10～glass substrate
21～weld pad, 22～lug
61～the first lugs, 62～the second lugs
81,82～welding bead
R1～first patch cord the R2～second patch cord
Embodiment
The laser preparing structure and the method that the present invention is directed to the shortcoming of prior art and propose, contrast for convenience of explanation and with prior art, the present invention is with among Fig. 1, and the laser preparing structure in A district and B district and method are most preferred embodiment, but not with this embodiment as interest field of the present invention.
See also shown in Fig. 3 A～3D, it is the disclosed laser preparing structure synoptic diagram of the present invention, the laser preparing structure that it is improved at the A district of Fig. 1 of prior art.
See also shown in Fig. 3 A～3B, laser preparing structure of the present invention comprises that the first metal layer M1 is formed on the glass substrate 10, has at least one maintenance thread R1, separation layer 7 is covered on the first metal layer M1, the second metal level M2 is arranged on this separation layer 7, it comprises at least one signal wire 2 and is overlapping with the maintenance thread R1 of the first metal layer M1, and forms lug 22 in the overlapping region, and wherein lug 22 is located on the side of maintenance thread R1 no signal transmission planning (being the right among the figure).
See also shown in Fig. 3 C～3D, when signal wire 2 need carry out laser preparing because broken string takes place, only need alignment of lugs 22 to carry out laser bonding, make the signal wire 2 and the patch cord R1 on the left side form conducting, and open circuit with the patch cord R1 formation on the right.The mode of the laser bonding that the present invention adopted has two kinds, and with this separation layer of laser ablation of low power density, again with this lug of laser bonding of high power density and the maintenance thread of overlapping thereof, this mode must be passed through the twice laser ablation procedure to one earlier.Its second be with directly with the laser of high power density, remove this separation layer simultaneously and weld the maintenance thread of this lug and overlapping thereof, this mode only need be through one laser ablation procedure.
See also shown in Fig. 4 A, the 4B, it is the disclosed laser preparing structure synoptic diagram of the present invention, the laser preparing structure that its B district that is directed to Fig. 1 of prior art improves.Usually an end of signal wire 2 is electrically connected with drive IC, the other end then is to be electrically connected with ESD device 9, its purpose mainly is to be subjected to the interference of static for fear of LCD and to have influence on the quality of picture, but, increase the signal attenuation degree because the existence of ESD device 9 also can increase the resistance-capacitance value of LCD.
Therefore, if through finding that signal wire 2 can be subjected to electrostatic interference after the test, then laser preparing structure can be designed to shown in Fig. 4 A, this structure not only can repair signal line 2 and can be made ESD device 9 can bring into play anlistatig function.Otherwise, if signal wire 2 no antistatic necessity, then laser preparing structure can be designed to shown in Fig. 4 B, this structure not only can repair signal line 2 and simultaneously ESD device 9 is cut off the load (loading) of reduction signal wire.
See also shown in Figure 5ly, it is the disclosed laser repairing method process flow diagram of the present invention, and its step comprises: at first form the first metal layer, this first metal layer has at least one maintenance thread (S51); On this first metal layer, cover separation layer (S52); On this separation layer, form second metal level again, wherein this second metal level comprise at least one signal wire and with this maintenance thread be overlapping (S53); Side in this overlapping region forms lug, and wherein this maintenance thread is in this side no signal transmission planning (S54); Again this lug is carried out laser bonding cutting off this maintenance thread, and connect the maintenance thread (S55) of this lug and overlapping thereof.
The mode of laser bonding has two kinds, and with this separation layer of laser ablation of low power density, again with this lug of laser bonding of high power density and the maintenance thread of overlapping thereof, this mode must be passed through the twice laser ablation procedure to one earlier.Its second be with directly with the laser of high power density, remove this separation layer simultaneously and weld the maintenance thread of this lug and overlapping thereof, this mode only need be through one laser ablation procedure.
Disclosed laser preparing structure and method when the above interlocks for the present invention is directed to maintenance thread and signal wire, but when maintenance thread was parallel with signal wire and overlapping, its laser preparing structure and method were as described below.
See also shown in Fig. 6 A, the 6B, its laser preparing structure synoptic diagram when to be maintenance thread R1 parallel and overlapping with signal wire 2 comprises the first metal layer M1, and this first metal layer M1 has at least one maintenance thread R1, and the side of this maintenance thread R1 is provided with first lug 61; Separation layer 7 is covered on this first metal layer M1; And the second metal level M2, to be located on this separation layer 7, it comprises at least one signal wire 2 and second lug 62, this signal wire 2 parallel and overlapping with this maintenance thread R1 (or partial parallel and overlapping) wherein, and this second lug 62 is overlapping with this first lug 61.When carrying out laser preparing, only need to aim at second lug 62 and carry out laser bonding, with first lug 61 and 62 conductings of second lug, just finish the repairing (shown in Fig. 6 B) of maintenance thread R1 and signal wire 2.
See also shown in Figure 7, it is the laser repairing method process flow diagram of maintenance thread when parallel with signal wire and overlapping, its step comprises: at first form the first metal layer, this first metal layer comprises at least one maintenance thread, and a side of this maintenance thread is provided with first lug (S71); On this first metal layer, cover separation layer (S72); Form second metal level on this separation layer, this second metal level comprises at least one signal wire and second lug, wherein this signal wire and this maintenance thread partial parallel and overlapping, and this second lug and this first lug overlapping (S73); This second lug is carried out laser bonding, it is formed with this first lug be electrically connected (S74).
The present invention is disclosed laser preparing structure and method when parallel with signal wire and overlapping for maintenance thread, and therefore the field of its application and scope repeat no more as hereinbefore.
The above only is preferred embodiment of the present invention, and it is not in order to limiting practical range of the present invention, anyly has the knack of the modification slightly that this skill person makes according to spirit of the present invention, must belong to spirit of the present invention and scope.
Claims (16)
1. a laser preparing structure is arranged in the LCD, comprising:
The first metal layer comprises at least one maintenance thread;
Separation layer is covered on this first metal layer; And
Second metal level is located on this separation layer, and it comprises that at least one signal wire and this maintenance thread are overlapping, and forms lug in this overlapping region, and wherein this lug is located on the side of this maintenance thread no signal transmission planning.
2. laser preparing structure as claimed in claim 1, wherein this LCD has at least one drive IC and is electrically connected with an end of this signal wire.
3. laser preparing structure as claimed in claim 1, wherein this LCD has at least one ESD device and is electrically connected with the other end of this signal wire.
4. laser preparing structure as claimed in claim 3, wherein this ESD device is electrically connected with the other end of this signal wire through the lug of this second metal level.
5. laser preparing structure as claimed in claim 1, wherein this LCD has a plurality of thin film transistor (TFT)s, and this signal wire is electrically connected with the drain electrode of above-mentioned thin film transistor (TFT).
6. laser preparing structure as claimed in claim 1, wherein this LCD has a plurality of thin film transistor (TFT)s, and this signal wire is electrically connected with the grid of above-mentioned thin film transistor (TFT).
7. laser repairing method, its step comprises:
Form the first metal layer, this first metal layer comprises at least one maintenance thread;
On this first metal layer, cover separation layer;
Form second metal level on this separation layer, this second metal level comprises that at least one signal wire and this maintenance thread are overlapping;
Side in this overlapping region forms lug, and wherein this maintenance thread is in this side no signal transmission planning;
This lug is carried out laser bonding cutting off this maintenance thread, and connect the maintenance thread of this lug and overlapping thereof.
8. laser repairing method as claimed in claim 7, wherein this first metal layer is formed on the glass substrate.
9. laser repairing method as claimed in claim 7, wherein in the process of this laser bonding earlier with this separation layer of laser ablation of low power density, again with this lug of laser bonding of high power density and the maintenance thread of overlapping thereof.
10. laser repairing method as claimed in claim 7, wherein in the process of this laser bonding with the laser of high power density, remove this separation layer simultaneously and weld the maintenance thread of this lug and overlapping thereof.
11. a laser preparing structure comprises:
The first metal layer comprises at least one maintenance thread, and a side of this maintenance thread is provided with first lug;
Separation layer is covered on this first metal layer; And
Second metal level is located on this separation layer, and it comprises at least one signal wire and second lug, and wherein this signal wire and this maintenance thread partial parallel are overlapping, and this second lug and this first lug are overlapping.
12. laser preparing structure as claimed in claim 11, it is arranged among the LCD.
13. a laser repairing method, its step comprises:
Form the first metal layer, this first metal layer comprises at least one maintenance thread, and a side of this maintenance thread is provided with first lug;
On this first metal layer, cover separation layer;
Form second metal level on this separation layer, this second metal level comprises at least one signal wire and second lug, and wherein this signal wire and this maintenance thread partial parallel are overlapping, and this second lug and this first lug are overlapping;
This second lug is carried out laser bonding, it is formed with this first lug be electrically connected.
14. laser repairing method as claimed in claim 13, wherein this first metal layer is formed on the glass substrate.
15. laser repairing method as claimed in claim 13, wherein in the process of this laser bonding earlier with this separation layer of laser ablation of low power density, again with this lug of laser bonding of high power density and the maintenance thread of overlapping thereof.
16. laser repairing method as claimed in claim 13, wherein in the process of this laser bonding with the laser of high power density, remove this separation layer simultaneously and weld this first lug and second lug.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100912116A CN100388064C (en) | 2006-06-07 | 2006-06-07 | Laser preparing structure and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100912116A CN100388064C (en) | 2006-06-07 | 2006-06-07 | Laser preparing structure and method |
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| CN1866081A CN1866081A (en) | 2006-11-22 |
| CN100388064C true CN100388064C (en) | 2008-05-14 |
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| CNB2006100912116A Active CN100388064C (en) | 2006-06-07 | 2006-06-07 | Laser preparing structure and method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002268081A (en) * | 2001-03-06 | 2002-09-18 | Matsushita Electric Ind Co Ltd | Method of manufacturing liquid crystal display device |
| US6867823B2 (en) * | 2000-08-11 | 2005-03-15 | Hannstar Display Corp. | Process and structure for repairing defect of liquid crystal display |
| US20050285989A1 (en) * | 2004-06-28 | 2005-12-29 | Nec Lcd Technologies, Ltd. | Liquid crystal display substrate and method of repairing the same |
| CN1758123A (en) * | 2005-10-18 | 2006-04-12 | 广辉电子股份有限公司 | Liquid crystal display panel and its repairing method |
| CN1776512A (en) * | 2005-12-02 | 2006-05-24 | 友达光电股份有限公司 | Repair line structure for liquid crystal display device |
-
2006
- 2006-06-07 CN CNB2006100912116A patent/CN100388064C/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6867823B2 (en) * | 2000-08-11 | 2005-03-15 | Hannstar Display Corp. | Process and structure for repairing defect of liquid crystal display |
| JP2002268081A (en) * | 2001-03-06 | 2002-09-18 | Matsushita Electric Ind Co Ltd | Method of manufacturing liquid crystal display device |
| US20050285989A1 (en) * | 2004-06-28 | 2005-12-29 | Nec Lcd Technologies, Ltd. | Liquid crystal display substrate and method of repairing the same |
| CN1758123A (en) * | 2005-10-18 | 2006-04-12 | 广辉电子股份有限公司 | Liquid crystal display panel and its repairing method |
| CN1776512A (en) * | 2005-12-02 | 2006-05-24 | 友达光电股份有限公司 | Repair line structure for liquid crystal display device |
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| Publication number | Publication date |
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| CN1866081A (en) | 2006-11-22 |
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