CN100382342C - Light-emitting diode support and producing method thereof - Google Patents
Light-emitting diode support and producing method thereof Download PDFInfo
- Publication number
- CN100382342C CN100382342C CNB2004100906101A CN200410090610A CN100382342C CN 100382342 C CN100382342 C CN 100382342C CN B2004100906101 A CNB2004100906101 A CN B2004100906101A CN 200410090610 A CN200410090610 A CN 200410090610A CN 100382342 C CN100382342 C CN 100382342C
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- supporting part
- light
- emitting diode
- plastic body
- section
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Abstract
The present invention relates to a support frame which is provided with two load bearing parts, wherein the two load bearing parts correspond to each other and have a fixed height drop. A light emitting chip can be positioned by one load bearing part which has a higher height, and an antistatic chip can be positioned by the other load bearing part which has a lower height, so that a light source generated by the light emitting chip can not be blocked by the antistatic chip. Therefore, the present invention is especially suitable for light emitting diodes which have the antistatic function.
Description
Technical field
The present invention is about relating to light-emittingdiode wherein in order to the support manufacturing technology of carrying luminescent wafer and antistatic wafer, aims to provide a supporting structure and a manufacture method thereof that is fit to be applied in antistatic light-emittingdiode especially.
Background technology
As shown in Figures 1 and 2, be for generally commonly using semi-finished product plane graph and the semi-finished product end view of light-emitting diode support in each manufacture process; Wherein, support 10 is with punch process operation elder generation two mutual correspondences of punch forming and the disjunct supporting part 12 of corresponding end on a straight metallic strip 11, then with drape forming one plastic body 13 of injection moulding processing operation at two supporting parts 12, then become pin 14 sections of set shape in the section punching out of supporting part 12 being stretched out plastic body 13 with the punch process operation, through at least one punching press action pin 14 sections are bent towards the both allocations that correspond to plastic body again, to become complete pin 14 structures, promptly finish the procedure for processing of integral support, can be and obtain in supporting part 12 fixation luminescent wafers, and insert the light-emitting diode support structure of fluorescence associated material or encapsulating material in plastic body 13.
Moreover, metal material belt 11 is in aforesaid procedure for processing, except having position that two supporting parts 12 are extended and plastic body 13 to coat mutually to connect, at least be provided with a jointing 15 in addition and embed plastic body 13 1 proper depth, to use processing operation moulding pin in the later use punching press, or further in the middle of the procedure for processing of light-emittingdiode encapsulated moulding, can allow semi-finished product remain on both allocations of metal material belt 11, and help the charging operation of automation processing.
Yet, the support 10 of commonly using light-emittingdiode is in the forming process of two supporting parts 12, directly with the metal material belt 11 plate faces of flat last moulding height as two supporting parts 12, therefore this support 10 is when being applied in its light-emittingdiode that anti-static function is arranged, two supporting parts 12 must supply the fixation of luminescent wafer 21 and antistatic wafer 22 respectively, but because the height of two supporting parts 12 is the same, the thickness that adds luminescent wafer 21 and antistatic wafer 22 is suitable, and the light source that luminescent wafer 21 will be produced suffers stopping of antistatic wafer 22, and makes the brightness expression effect of whole light-emittingdiode be not so good as expection.
Summary of the invention
The present invention wherein in order to the support manufacturing technology of carrying luminescent wafer and antistatic wafer, aims to provide a supporting structure and a manufacture method thereof that is fit to be applied in antistatic light-emittingdiode especially about light-emittingdiode.
A kind of light-emitting diode support of the present invention and manufacture method thereof, mainly be before carrying out plastic body injection moulding processing operation, promptly in advance the section of one of them supporting part is carried out at least one punch process program, make the section of this supporting part form a class that is different from virgin metal strip plate face, to allow integral support have mutual correspondence but have two supporting parts of a set height fall, can utilize the fixation of one of them highly higher supporting part for luminescent wafer, another highly lower supporting part then can be for the fixation of antistatic wafer, the light source that luminescent wafer is produced is unlikely and suffers stopping of antistatic wafer, so be fit to be applied in the light-emittingdiode with anti-static exercise energy especially.
Description of drawings
Fig. 1 commonly uses the semi-finished product plane structure chart of light-emitting diode support in each manufacture process;
Fig. 2 commonly uses the semi-finished product construction profile of light-emitting diode support in each manufacture process;
Fig. 3 is the semi-finished product plane structure chart of light-emitting diode support of the present invention in each manufacture process;
The semi-finished product construction profile of Fig. 4 light-emitting diode support of the present invention in each manufacture process.
[figure number explanation]
10 supports, 14 pins
11 metal material belts, 15 jointings
12 supporting parts, 21 luminescent wafers
13 plastic bodies, 22 antistatic wafers
Embodiment
For the clear structure of the present invention of your auditor is formed, and the overall operation mode, cooperate graphic being described as follows now:
A kind of light-emitting diode support of the present invention and manufacture method thereof, the manufacture method of its integral support as shown in Figures 3 and 4, be with punch process operation elder generation two mutual correspondences of punch forming and disjunct supporting part 12 shapes of corresponding end on a straight metallic strip 11, the length of one of them supporting part 12 is longer, and to length wherein the section of a long supporting part 12 carry out at least one punch process program, make the section of this supporting part 12 form a class that is different from virgin metal strip 11 plate faces, then with section moulding one plastic body 13 of injection moulding processing operation at two supporting parts 12, then become pin 14 sections of set shape in the section punching out of supporting part 12 being stretched out plastic body 13 with the punch process operation, through at least one punching press action pin 14 sections are bent towards the both allocations that correspond to plastic body again, to become complete pin 14 structures, promptly finish the procedure for processing of integral support, can be and obtain in supporting part 12 fixation luminescent wafers, and insert the light-emitting diode support structure of fluorescence associated material or encapsulating material in plastic body 13.
Same, metal material belt 11 is in the middle of aforesaid procedure for processing, except having position that two supporting parts 12 are extended and plastic body 13 to coat mutually to connect, at least be provided with a jointing 15 in addition and embed plastic body 13 1 proper depth, to use processing operation moulding pin in the later use punching press, or further in the middle of the procedure for processing of light-emittingdiode encapsulated moulding, can allow semi-finished product remain on both allocations of metal material belt 11, and help the charging operation of automation processing.
What deserves to be mentioned is, because the present invention is in the middle of the procedure for processing of support 10, be before carrying out plastic body injection moulding processing operation, promptly in advance the section of one of them supporting part 12 is carried out at least one punch process program, make the section of this supporting part 12 form a class that is different from virgin metal strip 11 plate faces, to allow integral support 10 have mutual correspondence but have two supporting parts 12 of a set height fall.
Can utilize the fixation of one of them highly higher supporting part 12 for luminescent wafer 21,12 of another highly lower supporting parts can be for the fixation of antistatic wafer 22, the light source that luminescent wafer 21 is produced is unlikely and suffers stopping of antistatic wafer 22, is fit to be applied in the Framework construction that resists quiet light-emittingdiode especially so can obtain one.
As mentioned above, the invention provides the manufacture method of another preferable feasible light-emitting diode support structure and this support, so, offer the application of novel patent in accordance with the law; Yet, above implementation and graphic shown in, be one of preferred embodiment of the present invention; be not to limit to the present invention with this; therefore, all and structure of the present invention, device, feature etc. are approximate, identical, all should belong within the protection range of founding purpose and applying for a patent of the present invention.
Claims (5)
1. light-emitting diode support, it is characterized in that: have mutual correspondence but have two supporting parts of a set height fall, and the setting of staggering mutually, can utilize the fixation of one of them highly higher supporting part for luminescent wafer, another highly lower supporting part then can be for the fixation of antistatic wafer, and luminescent wafer and antistatic wafer stagger mutually.
2. light-emitting diode support as claimed in claim 1 is characterized in that: the position of these two supporting parts is to be coated with a plastic body.
3. the manufacture method of a light-emitting diode support, it is characterized in that: each support is two mutual correspondences of punch forming and the disjunct supporting part shape of corresponding end on the straight metallic strip, and the section to one of them supporting part carries out at least one punch process program, make the section of this supporting part form a class that is different from virgin metal strip plate face, then with drape forming one plastic body of injection moulding processing operation at two supporting parts, then become the pin section of set shape in the section punching out of supporting part being stretched out plastic body with the punch process operation, through at least one punching press action the pin section is bent towards the both allocations that correspond to plastic body again, to become complete pin structure.
4. the manufacture method of light-emitting diode support as claimed in claim 3, it is characterized in that: this metal material belt is in the procedure for processing of integral body, be to have two positions that supporting part extended to coat connection mutually, be provided with a jointing in addition at least and embed plastic body one proper depth with plastic body.
5. the manufacture method of light-emitting diode support as claimed in claim 3, it is characterized in that: in the step of this support two mutual correspondences of punch forming and the disjunct supporting part shape of corresponding end on the straight metallic strip, be that Design of length with one of them supporting part is for longer, then the long supporting part of this length is carried out at least one punch process program, make the section of this supporting part form a class that is different from virgin metal strip plate face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100906101A CN100382342C (en) | 2004-11-09 | 2004-11-09 | Light-emitting diode support and producing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100906101A CN100382342C (en) | 2004-11-09 | 2004-11-09 | Light-emitting diode support and producing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1773734A CN1773734A (en) | 2006-05-17 |
| CN100382342C true CN100382342C (en) | 2008-04-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100906101A Expired - Fee Related CN100382342C (en) | 2004-11-09 | 2004-11-09 | Light-emitting diode support and producing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100382342C (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09298309A (en) * | 1996-05-08 | 1997-11-18 | Oki Electric Ind Co Ltd | Optical coupler element |
| US5770867A (en) * | 1995-02-14 | 1998-06-23 | Sharp Kabushiki Kaisha | Photocoupler device with light-transmissive resin including fillers and a producing process thereof |
| JP2002124703A (en) * | 2000-08-09 | 2002-04-26 | Rohm Co Ltd | Chip type light emitting device |
| US20040188697A1 (en) * | 2001-06-29 | 2004-09-30 | Herbert Brunner | Surface-mountable radiation-emitting component and method of producing such a component |
-
2004
- 2004-11-09 CN CNB2004100906101A patent/CN100382342C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5770867A (en) * | 1995-02-14 | 1998-06-23 | Sharp Kabushiki Kaisha | Photocoupler device with light-transmissive resin including fillers and a producing process thereof |
| JPH09298309A (en) * | 1996-05-08 | 1997-11-18 | Oki Electric Ind Co Ltd | Optical coupler element |
| JP2002124703A (en) * | 2000-08-09 | 2002-04-26 | Rohm Co Ltd | Chip type light emitting device |
| US20040188697A1 (en) * | 2001-06-29 | 2004-09-30 | Herbert Brunner | Surface-mountable radiation-emitting component and method of producing such a component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1773734A (en) | 2006-05-17 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080416 Termination date: 20181109 |