CN100367080C - Light interference display panel and its mfg. method - Google Patents
Light interference display panel and its mfg. method Download PDFInfo
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- CN100367080C CN100367080C CNB031579086A CN03157908A CN100367080C CN 100367080 C CN100367080 C CN 100367080C CN B031579086 A CNB031579086 A CN B031579086A CN 03157908 A CN03157908 A CN 03157908A CN 100367080 C CN100367080 C CN 100367080C
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Abstract
The present invention relates to an optical interference type display panel and a manufacture method thereof. The method comprises the following steps: a first electrode and a sacrificial layer are firstly formed in sequence on a base board, and first openings are formed in the first electrode and the sacrificial layer to be suitable for forming supporters in the first openings. The supporters are formed in the first openings, and second electrodes are then formed above the sacrificial layer and the supporter to form a micro electromechanical structure. Subsequently, a sticking structure is used for sticking a protective structure and the base board to form a cavity, the micro electromechanical structure is coated in the cavity, and the side wall of the cavity is preserved with at least one second opening. A structure releasing and etching manufacture course is carried out, and an etchant is used for removing the sacrificial layer through the second opening to form a chamber. Finally, the second opening is closed, and an optical interference type reflection structure is sealed between the base board and the protective structure.
Description
Technical field
The present invention relates to a kind of flat-panel screens and manufacture method thereof, and be particularly related to a kind of light interference type display panel and manufacture method thereof.
Background is held art
Flat-panel screens is owing to have little, the lightweight characteristic of volume, very advantageous in the monitor market of Portable display device and the application of little space.Existing flat-panel screens is removed LCD (Liquid CrystalDisplay, LCD), organic electric exciting light-emitting diode display (Organic Electro-Luminescent Display, OLED) and plasma display panel (Plasma Display Panel, PDP) or the like outside, a kind of plane display mode of light interference type that utilizes is suggested.
This kind has low electric power power consumption, rapid answer (Response Time) and bistable state (Bi-Stable) characteristic in itself by the characteristic of the formed display of light interference type changeable colour picture element cell array, the panel of display will be can be applicable to, particularly can be applicable to Portable (Portable) product, for example mobile phone (Mobile Phone), PDA(Personal Digital Assistant), portable computer (Portable Computer) or the like.
See also United States Patent (USP) the 5th, 835, No. 255, this patent has disclosed a kind of adjustment assembly (Array ofModulation) of visible light, is a changeable colour picture element unit, is used as the usefulness of flat-panel screens.See also Figure 1A, it is the diagrammatic cross-section of existing changeable colour picture element unit.Each changeable colour picture element unit 100 is formed on the substrate 110, comprises twice wall (Wall) 102 and 104, and 102,104 on twice wall is supported by stilt 106 and forms a chamber (Cavity) 108.The distance that the twice wall is 102,104, just the length of chamber 108 is D.Wall 102 is a smooth incident electrode, has absorptivity, but the absorption portion visible light.104 on wall is a smooth reflecting electrode, utilizes driven can make it produce deformation.
Usually utilize the incident light source of white light as this changeable colour picture element unit 100, white light is blended together by the light of various different ripples in the visible light spectrum scope-length (Wave Length represents with λ).When incident light passes wall 102 and when entering in the chamber 108, only has the incident light of coincidence formula 1.1 medium wavelengths restriction to produce constructive interference and the output that is reflected in chamber 108, wherein N is a natural number.In other words,
2D＝Nλ
1(1.1)
When the double length 2D of chamber 108 satisfies lambda1-wavelength λ
1Integral multiple the time, can make this lambda1-wavelength λ
1In this chamber 108, produce constructive interference, and export this wavelength X
1Reflected light.At this moment, observer's eyes are observed along the direction of incident light incident wall 102, can see that wavelength is λ
1Reflected light, therefore, changeable colour picture element unit 100 is in " open " state, be a bright attitude state.
Figure 1B illustrates the diagrammatic cross-section of changeable colour picture element unit 100 after adding voltage among Figure 1A.Please refer to Figure 1B, under the driving of voltage, wall 104 can produce deformation because of electrostatic attraction, sinks to the direction of wall 102.At this moment, the distance that the twice wall is 102,104, just the length of chamber 108 is also non-vanishing, but is d, and this d can equal zero.
That is to say that the D in the formula 1.1 can replace with d, in the wavelength of all light, the wavelength (λ of coincidence formula 1.1 is only arranged in the incident light
2) can in cavity 108, produce constructive interference, penetrate wall 102 and export via the reflection of wall 104.In this changeable colour picture element unit 100, it is λ that wall 102 is designed to wavelength
2Light have higher absorptivity, so all light in the incident light are all by filtering, the observer for observing along the direction of incident light incident wall 102 will can not see that any light is reflected out.Therefore, this moment changeable colour picture element unit 100 is in " pass " and state, be a dark attitude state.
As mentioned above, under the driving of voltage, wall 104 can produce deformation because of electrostatic attraction, sinks to the direction of wall 102, makes these changeable colour picture element unit 100 states by " opening " switch to the state of " pass ".And to open by " pass " state switch to " when changeable colour picture element unit 100 " state the time, then must remove earlier in order to drive the voltage of wall 104 deformation, then, deformation restoring force own paddles one's own canoe, the wall 104 that loses the electrostatic attraction effect can revert to the original state as the 1st figure, makes this changeable colour picture element unit 100 present the state of " opening ".
Yet above-mentioned smooth reflecting electrode (wall 104) is a thin layer (Membrane), and its material is generally metal material, and (Micro Electro Mechanical System, MEMS) sacrificial layer technology in is made to utilize the micro electromechanical structure system usually.The thickness of this light reflecting electrode is extremely thin, therefore is very easy to just cause damage because of a little the touching of external force, and influences the ability of its actuating.Moreover chamber 108 is a clearance (Air Gap), in order to above-mentioned two electrodes in interval (wall 102 and wall 104).Yet, in fact but damage the display quality of this changeable colour picture element unit 100 because of the influence of external environment through regular meeting.Especially in its manufacture process, the destruction especially severe that external environment is caused changeable colour picture element unit 100.
For instance, in manufacture process, for example above-mentioned sacrifice layer is etched remove after, airborne hydrone is very easy to just to be adsorbed among the chamber 108.The length D of chamber 108 generally can be less than 1 μ m, this moment, the hydrone of absorption can produce unnecessary electrostatic attraction between two electrodes, when this changeable colour picture element unit 100 will present a "open" state, but can be because of the electrostatic attraction of hydrone, allow two electrodes adsorb mutually and be close together, make this changeable colour picture element unit 100 present a "off" state on the contrary.
Perhaps in manufacture process, for example above-mentioned sacrifice layer is etched shift out remove after, or during the processing cutting substrate, dust in air also may be adsorbed among the chamber 108, hinders the normal switch operation of light reflecting electrode.In addition, after airborne oxygen touches this two electrode, also can this two electrode of oxidation, thereby change the optics or the electric characteristics of this two electrode.
Summary of the invention
The invention provides a protection structure and substrate bonding, make that changeable colour picture element unit is sealed to be coated on wherein, to attempt to solve the problems referred to above.Yet; if in processing procedure, remove sacrifice layer earlier, and then bind protection structure and substrate, then the changeable colour picture element unit that produces according to this sequence of steps; though can slightly reduce the influence of the problems referred to above, still can't avoid the problems referred to above fully to changeable colour picture element unit.Because after removing sacrifice layer, carry out before the processing procedure of protective seam, changeable colour picture element unit still can be exposed among the atmosphere, and hydrone and the oxygen in the atmosphere still can influence changeable colour picture element unit at this moment, and causes the decline of changeable colour picture element unit effect.
Therefore purpose of the present invention just provide a kind of light interference type display panel with and manufacture method, be used for preventing that airborne hydrone, dust or oxygen from destroying light interference reflection structure in manufacture process.
Another object of the present invention just provide a kind of light interference type display panel with and manufacture method, be used for protecting light interference reflection structure wherein.
Another object of the present invention just provide a kind of light interference type display panel with and manufacture method, be used for improving the display quality of light interference type display panel, and increase its fiduciary level and prolong its serviceable life.
Still a further object of the present invention just provide a kind of light interference type display panel with and manufacture method; structure release etch processing procedure is placed after protection structure and the substrate bonding step; with the sacrifice layer that prevents existing light interference reflection structure etched after, because of being exposed in the atmosphere by the problem of hydrone and oxygen destruction.
The present invention more a purpose just provide a kind of light interference type display panel with and manufacture method; utilize protection structure, substrate and bind the cavity that structure formation one has opening; carry out a structure via this opening and discharge processing procedure to remove the sacrifice layer of light interference reflection structure, to reduce the chance that hydrone and oxygen destroy light interference reflection structure.
According to above-mentioned purpose of the present invention, a kind of manufacture method of light interference type display panel is proposed, it is characterized in that this manufacture method comprises following steps at least:
One substrate is provided, has a micro electromechanical structure on this substrate, this micro electromechanical structure comprises at least:
One is positioned at first electrode on this substrate;
One is positioned at the sacrifice layer on this first electrode;
One is positioned at second electrode on this sacrifice layer; And
Several are supported in the stilt between this first electrode and this second electrode;
Utilize one first to bind structure bonding one protection structure and this substrate, to form a cavity for holding this micro electromechanical structure, wherein the sidewall of this cavity has at least one opening;
Carry out a structure release etch processing procedure, utilize an etchant to remove this sacrifice layer of this micro electromechanical structure, to form a light interference reflection structure via this opening etching; And
After finishing this release etch processing procedure, seal this opening.
According to one embodiment of the invention; the feature of said method also is: this first material that binds structure comprises a separation material; utilize this separation material to make and keep a preset distance between this protection structure and this substrate, hurt this interference of light reflection configuration to avoid this protection structure contact.
According to another embodiment of the present invention, the feature of said method also is: this first material that binds structure comprises a UV glue or a hot-setting adhesive.
According to an embodiment more of the present invention, the feature of said method also is: the step of this sealing opening utilizes one second to bind this opening of structure filling sealing.
The present invention also propose a kind of light interference type display panel with and manufacture method.On a substrate, form earlier first electrode and sacrifice layer in regular turn, in first electrode and sacrifice layer, form first opening again and form stilt within it to be applicable to.In first opening, form stilt, on sacrifice layer and stilt, form second electrode then, to form a micro electromechanical structure.Then, utilize and bind structure bonding one protection structure and substrate, to form a cavity micro electromechanical structure is coated on wherein, and reserves one second opening on the sidewall of this cavity at least.Carry out a structure release etch processing procedure (Release Etch Process), remove sacrifice layer and form chamber with an etchant via second opening.With this second closure of openings, light interference reflection structure is sealed between substrate and the protection structure at last.
According to a preferred embodiment of the present invention, light interference reflection structure comprises several changeable colour picture element unit.The bonding structure will be protected the sealing all around of the bond area of structure and substrate.The external form of protection structure is a slab construction, a glass substrate for example, and the bonding structure is UV glue, hot-setting adhesive or other adhesive agent.Moreover, bind in the structure and add separation material (spacer).In another preferred embodiment, protection structure external form also can be the ㄇ font structure that a ㄇ font structure or a sidewall have the second above-mentioned opening.
In the present invention, position, shape and the quantity of second opening on cavity does not limit, when second opening big more or number more for a long time, then the etching efficiency of structure release etch processing procedure is good more.The position of second opening then can promote the homogeneity of whole etch process if can be dispersed on the cavity.
The generation type of second opening can be utilized earlier and bind structure with complete closed between substrate and the protection structure, and then utilizes cutting or other method to form this second opening.Or when utilizing the sealing of bonding structure at the beginning, promptly reserve second opening earlier and also can.
In this embodiment, structure release etch processing procedure is a long-range etching electric paste etching processing procedure.Long-range etching electric paste etching processing procedure to be to contain fluorine-based or the etchant of chloro, for example etchants such as xenon difluoride, carbon tetrafluoride, boron chloride, Nitrogen trifluoride or sulfur hexafluoride etc. for precursor to produce a long-range electric paste etching sacrifice layer.
The present invention is carrying out structure release etch processing procedure with before removing sacrifice layer; utilize a connected structure to bind protection structure and substrate earlier; to form a cavity micro electromechanical structure is coated on wherein, and reserves at least one opening on the sidewall of this cavity, for carrying out follow-up structure release etch processing procedure.So can avoid in manufacture process, product is exposed among the atmosphere in order to carry out different processing procedures, makes airborne hydrone, dust or oxygen have an opportunity to influence light interference reflection structure, and hurts light interference reflection structure.
Moreover the bonding of protection structure and substrate is coated on micro electromechanical structure wherein, so can avoid directly touching because of external force and destroy light interference reflection structure.Moreover; last and utilization bonding structure is sealed in substrate with light interference reflection structure and protects among the structure; can avoid external environment effectively; for example airborne hydrone, dust or oxygen; touch light interference reflection structure and produce electrostatic attraction or its metallic film of oxidation, and destroy its optics or electric characteristics.Therefore, the present invention can promote the display quality of light interference type display panel, reduces the incidence of defective, and prolongs the life-span of its use.
Description of drawings
Figure 1A is the diagrammatic cross-section of existing changeable colour picture element unit;
Figure 1B is the diagrammatic cross-section of changeable colour picture element unit 100 after adding voltage among Figure 1A;
Fig. 2 A is the diagrammatic cross-section of a preferred embodiment of the present invention;
Fig. 2 B is the diagrammatic cross-section of another preferred embodiment of the present invention;
Fig. 3 A is the synoptic diagram of variable picture element unit in another preferred embodiment manufacture method of the present invention;
Fig. 3 B is for binding the synoptic diagram that structure is reserved an opening at least in another preferred embodiment manufacture method of the present invention;
Bind the synoptic diagram that structure is got up closure of openings in another preferred embodiment manufacture method of Fig. 3 C the present invention;
Fig. 4 A is the side schematic view of another preferred embodiment of the present invention;
Fig. 4 B is the side schematic view of another preferred embodiment of the present invention;
Fig. 4 C is the side schematic view of another preferred embodiment of the present invention;
Fig. 5 A is the side schematic view of another preferred embodiment of the present invention;
Fig. 5 B is the side schematic view of another preferred embodiment of the present invention; And
Fig. 5 C is the side schematic view of another preferred embodiment of the present invention.
Embodiment
In manufacture process, destroy light interference reflection structure for fear of airborne hydrone, dust or oxygen, the present invention propose a kind of light interference type display panel with and manufacture method.
Manufacture method of the present invention is to form earlier first electrode and sacrifice layer on a substrate in regular turn, forms first opening again and form stilt within it to be applicable in first electrode and sacrifice layer.In first opening, form stilt, form second electrode then on sacrifice layer and stilt, to form a micro electromechanical structure.Then, utilize and bind structure bonding one protection structure and substrate, to form a cavity micro electromechanical structure is coated on wherein, and reserves one second opening on the sidewall of this cavity at least.Carry out a structure release etch processing procedure (Release Etch Process), remove sacrifice layer and form chamber with an etchant,, light interference reflection structure is sealed between substrate and the protection structure at last with this second closure of openings via second opening.
Fig. 2 A is the diagrammatic cross-section of a preferred embodiment of the present invention.Light interference reflection structure is made up of several changeable colour picture element unit, in order to represent conveniently, explain orally and figure in only with a variable picture element unit 100, represent the light interference reflection structure in the present invention's the light interference type display panel.Shown in Fig. 2 A, a dull and stereotyped protection structure 200a utilizes bonding structure 202 and substrate 110 to bind, and wherein this substrate 110 for example is the substrate of a glass substrate or a pair of visible transparent.So dull and stereotyped protection structure 200a just can reduce the chance that external force touches changeable colour picture element unit 100.
Moreover; in this embodiment; bonding structure 202 is protected flat board the sealing all around of the bond area of structure 200a and substrate 110, makes that changeable colour picture element unit 100 and external environment are isolated, the damage changeable colour picture element unit 100 to avoid airborne hydrone, dust or oxygen intrusion.
As mentioned above, airborne hydrone is if enter the chamber 108 of changeable colour picture element unit 100, because the distance D of chamber 108 is quite little, so the change that the electrostatic attraction of hydrone can be relative is big, the problem that causes the switch of changeable colour picture element unit 100 to switch smoothly.If oxygen touches the metallic film in the changeable colour picture element unit, for example light incident electrode and light reflecting electrode, then because the very easy oxidation of metallic film, so oxygen can the oxidized metal film, and destroys the optics and the electric characteristics of changeable colour picture element unit 100.
Bonding structure among the present invention can be hedged off from the outer world changeable colour picture element unit when binding protection structure and substrate in the lump, and isolated degree is high more, and it is good more to prevent that then changeable colour picture element unit is subjected to the extraneous effect of destroying.According to a preferred embodiment of the present invention, bind protection structure and substrate when binding structure in the mode of sealing, when being sealed in changeable colour picture element unit wherein fully, this moment fiduciary level and the serviceable life of changeable colour picture element unit all can be promoted significantly.
In this embodiment, dull and stereotyped protection structure 200a is a glass substrate.The material that binds structure 202 uses UV glue or hot-setting adhesive.Yet other is applicable to that the bonding structure of binding dull and stereotyped protection structure 200a and substrate 110 can apply among the present invention, not limited by present embodiment.
In addition, it should be noted that dull and stereotyped protection structure 200a when binding with substrate 110, usually can be through a pressing process, impose one and defeat to close dull and stereotyped protection structure 200a is more closely being sticked together with substrate 110.For fear of when the pressing; dull and stereotyped protection structure 200a damages the wall 104 of changeable colour picture element unit 100 by pressure; or being subjected to the situation that external force produces skew or tilts toward the substrate place after avoiding when protecting structure, the present invention more can add separation material (spacer) in binding structure 202.
Have the bonding structure 202 of separation material except can preventing that dull and stereotyped protection structure 200a from damaging changeable colour picture element unit 100 by pressure when the pressing, and can make the distance that is maintained fixed between dull and stereotyped protection structure 200a and the substrate 110.With this preferred embodiment, the size of separation material is about 100 μ m, and the size of changeable colour picture element unit 100 is then usually less than 1 μ m, and therefore dull and stereotyped protection structure 200a and wall 104 can not produce above-mentioned problem of damaging by pressure at a distance of sizable distance.
Fig. 2 B is the synoptic diagram of another preferred embodiment of the present invention.In this embodiment, protection structure provided by the present invention is ㄇ font protection structure 200b, and this ㄇ font protection structure 200b one has the slab construction of extending sidewall.Similarly; ㄇ font protection structure 200b utilizes and binds structure 202 and substrate 110 bondings; so not only can reduce the chance that external force touches changeable colour picture element unit 100, and can avoid airborne hydrone, dust or oxygen to invade and damage changeable colour picture element unit 100.
Fig. 3 A to Fig. 3 C illustrates the synoptic diagram of manufacture method of the present invention.As previously mentioned, conveniently in explanation and figure, only represent light interference reflection structure in order to represent with a variable picture element unit.Please refer to Fig. 3 A, form electrode 310 and sacrifice layer 311 in regular turn earlier on a substrate 309, the material of this sacrifice layer is dielectric material, metal material or silicon materials.In electrode 310 and sacrifice layer 311, form opening 312 again and form stilt 306 within it to be applicable to.Then, in opening 312, form stilt 306, form electrode 314 then on sacrifice layer 311 and stilt 306, to form a micro electromechanical structure.
Please refer to Fig. 3 B, utilize bonding structure 308 to protect structure 304 and substrate 309 to bind flat board, micro electromechanical structure is coated on wherein, and in this bonding structure 308, reserves an opening 320 at least.And when binding, the pressing process that can impose makes dull and stereotyped protection structure 304 and substrate 309 bind more tight.In addition,, then can add a heating process, hot-setting adhesive can be heated and fix if utilize hot-setting adhesive as binding structure 308.
Then, carry out a structure release etch processing procedure (Release Etch Process), for example a long-range electric paste etching processing procedure removes sacrifice layer 311 with an etchant and forms chamber 316 (position of sacrifice layer 311) via opening 320, and the length D of chamber 316 is the thickness of sacrifice layer 311.Long-range etching electric paste etching processing procedure to be to contain fluorine-based or the etchant of chloro, for example etchants such as xenon difluoride, carbon tetrafluoride, boron chloride, Nitrogen trifluoride or sulfur hexafluoride etc. for precursor to produce a long-range electric paste etching sacrifice layer 311.
Shown in Fig. 3 C; after said structure release etch processing procedure is finished; promptly comprise utilize bleed or other method with above-mentioned etchant remove clean after, utilize one to bind structure 328 opening 320 is closed, make micro electromechanical structure be sealed between protection structure 304 and the substrate 309.Bind structure 328 materials and can be UV glue or hot-setting adhesive.According to another embodiment of the present invention, also available other object seals opening 320, and for example plastics, sheet metal or polymer flake etc. are not limited to bind in the present embodiment structure 328 employed UV glue or hot-setting adhesives.
It should be noted that in the bonding structure 328 that is used for sealing opening 320 herein and do not need to add separation material.That is to say that bonding structure 308 differs with bonding structure 328 and is decided to be identical materials.To bind structure 308 and to keep a fixing distance in order making between substrate 309 and the dull and stereotyped protection structure 304 sometimes, therefore can add separation material therein.And on the other hand, bind structure 328 just in order to seal the usefulness of opening 320, therefore wherein needn't add separation material.
Above being illustrated as explains to have the dull and stereotyped manufacture method of protecting the light interference type display panel of structure; and the light interference type display panel that has ㄇ font protection structure among Fig. 2 B; therefore its manufacture method is also quite similar with the manufacture method shown in Fig. 3 A and Fig. 3 B, only it is done explanation simply below.
At first, on a substrate, form a micro electromechanical structure, comprise first electrode, second electrode and the sacrifice layer between two electrodes.Then, utilize adhesion material to bind the ㄇ font and protect structure and substrate, micro electromechanical structure is coated on wherein to form a cavity.At last,, utilize the sacrifice layer in the structure release etch processing procedure etching micro electromechanical structure, again this closure of openings is got up via the opening on the sidewall of cavity.Similarly, when binding, can impose the pressing process and make the bonding of ㄇ font protection structure and substrate more tight.So, can make and finish the light interference type display panel that has ㄇ font protection structure among Fig. 2 B.
Fig. 4 A to Fig. 4 C is the side schematic view of several embodiment of the present invention, is used for the configuration and the shape of the opening 320 among the key diagram 3B.Shown in Fig. 4 A, the opening 412 among the present invention is positioned at and binds on the structure 406, and its position does not limit, and can be Any shape, and when opening 412 was big more, then the etching efficiency of structure release etch processing procedure was good more.
Moreover the number of split shed of the present invention can be one incessantly, shown in the embodiment of Fig. 4 B, binds structure 406 and has two openings 414, and opening number is many more, and then the etching efficiency of structure release etch processing procedure is also good more.And the position of opening then can promote the homogeneity of whole etch process if can be dispersed on the bonding structure 406.
In addition, according to another embodiment of the present invention, this opening even can be one side of substrate 402 and dull and stereotyped protection structure 404, the opening 416 as shown in Fig. 4 C.When utilizing bonding structure 406 to bind substrates 402 with flat board protection structure 404, reservation feeds the usefulness of etchant wherein on one side as opening 416 for structure release etch processing procedure afterwards.
The generation type of this opening can be utilized earlier and bind structure with complete closed between substrate and the protection structure, and then utilizes cutting or other method to form this opening.Or when utilizing the sealing of bonding structure at the beginning, promptly reserve opening earlier and also can.
Be used to carry out the opening of structure release etch processing procedure among the present invention; except as shown in above-mentioned embodiment, being positioned at the connected structure; according to another preferred embodiment of the present invention, when the protection structure was protected structure for the ㄇ font, this opening also can be positioned on the sidewall of this ㄇ font protection structure.
Fig. 5 A to Fig. 5 C is the side schematic view of several embodiment of the present invention, is used for illustrating the situation when opening is positioned at ㄇ font protection structure.Shown in Fig. 5 A; opening 512 among the present invention is positioned on the sidewall of ㄇ font protection structure 504a; ㄇ font protection structure 504a utilizes and binds structure 506 and bind with substrate 502, and forms a cavity to hold the light interference reflection structure (not shown) in wherein.The position of opening of the present invention does not limit, and when opening was big more, then the etching efficiency of structure release etch processing procedure was good more.
This opening 512 can be Any shape, and for example in Fig. 5 A, the side of opening 512 does not seal, and can contact with bonding structure 502.And in Fig. 5 B, opening 514 is positioned at the sidewall of ㄇ font protection structure 504b, and its side sealing, does not therefore contact with bonding structure 502.
Moreover the number of opening of the present invention can be one incessantly.Shown in Fig. 5 C, the side of ㄇ font protection structure 504c has two openings 514.The number of opening is many more, and then the etching efficiency of structure release etch processing procedure is also good more.And the position of opening then can promote the homogeneity of whole etch process if can be dispersed on the ㄇ font protection structure.
The present invention is carrying out structure release etch processing procedure with before removing sacrifice layer; utilize a connected structure to bind protection structure and substrate earlier; to form a cavity micro electromechanical structure is coated on wherein, and reserves at least one opening on the sidewall of this cavity, for carrying out follow-up structure release etch processing procedure.So can avoid in manufacture process, product is exposed among the atmosphere in order to carry out different processing procedures, makes airborne hydrone, dust or oxygen have an opportunity to influence light interference reflection structure, and hurts light interference reflection structure.
Moreover the bonding of protection structure and substrate is coated on micro electromechanical structure wherein, so can avoid directly touching because of external force and destroy light interference reflection structure.Moreover; last and utilization bonding structure is sealed in substrate with light interference reflection structure and protects among the structure; can avoid external environment effectively; for example airborne hydrone, dust or oxygen; touch light interference reflection structure and produce electrostatic attraction or its metallic film of oxidation, and destroy its optics or electric characteristics.Therefore, the present invention can promote the display quality of light interference type display panel, reduces the incidence of defective, and prolongs the life-span of its use.
Though the present invention discloses as above with a preferred embodiment; right its is not in order to limit the present invention; anyly have the knack of this skill person; without departing from the spirit and scope of the present invention; when can being used for a variety of modifications and variations, so protection scope of the present invention is as the criterion when looking the accompanying Claim scope person of defining.
Claims (12)
1. the manufacture method of a light interference type display panel, it is characterized in that: this manufacture method comprises following steps at least:
One substrate is provided, has a micro electromechanical structure on this substrate, this micro electromechanical structure comprises at least:
One is positioned at first electrode on this substrate;
One is positioned at the sacrifice layer on this first electrode;
One is positioned at second electrode on this sacrifice layer; And
Several are supported in the stilt between this first electrode and this second electrode;
Utilize one first to bind structure bonding one protection structure and this substrate, to form a cavity for holding this micro electromechanical structure, wherein the sidewall of this cavity has at least one opening;
Carry out a structure release etch processing procedure, utilize an etchant to remove this sacrifice layer of this micro electromechanical structure, to form a light interference reflection structure via this opening etching; And
After finishing this release etch processing procedure, seal this opening.
2. manufacture method according to claim 1; it is characterized in that: this first material that binds structure comprises a separation material; utilize this separation material to make and keep a preset distance between this protection structure and this substrate, hurt this light interference reflection structure to avoid this protection structure contact.
3. manufacture method according to claim 1 is characterized in that: this first material that binds structure comprises a UV glue or a hot-setting adhesive.
4. manufacture method according to claim 1 is characterized in that: the step of this sealing opening utilizes one second to bind this opening of structure filling sealing.
5. manufacture method according to claim 4 is characterized in that: this second material that binds structure comprises a UV glue or a hot-setting adhesive.
6. manufacture method according to claim 1 is characterized in that: this protection structure is a slab construction or a ㄇ font structure.
7. manufacture method according to claim 1 is characterized in that: this protection structure is a ㄇ font structure, and this opening is positioned at the sidewall of this ㄇ font structure.
8. light interference type display panel comprises at least:
One substrate;
One protection structure becomes to be arranged in parallel with this substrate;
One micro electromechanical structure is formed on this substrate; And
One is used to bind the bonding structure of this protection structure and this substrate; to form a cavity for holding this micro electromechanical structure; wherein the sidewall of this cavity has at least one opening; by this opening circulation one etchant that is used in the structure release etch processing procedure; to form a light interference reflection structure, wherein this opening finally seals.
9. light interference type display panel according to claim 8 is characterized in that: this micro electromechanical structure further comprises:
One first electrode and one second electrode; And
Several are used for supporting the stilt of this first electrode and this second electrode.
10. light interference type display panel according to claim 8 is characterized in that: this protection structure is a slab construction or a ㄇ font structure.
11. light interference type display panel according to claim 8; it is characterized in that: the material of this bonding structure comprises a separation material; utilize this separation material to make and keep a preset distance between this protection structure and this substrate, hurt this light interference reflection structure to avoid this protection structure contact.
12. light interference type display panel according to claim 8 is characterized in that: the material of this bonding structure comprises a UV glue or a hot-setting adhesive.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031579086A CN100367080C (en) | 2003-08-27 | 2003-08-27 | Light interference display panel and its mfg. method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031579086A CN100367080C (en) | 2003-08-27 | 2003-08-27 | Light interference display panel and its mfg. method |
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| Publication Number | Publication Date |
|---|---|
| CN1591095A CN1591095A (en) | 2005-03-09 |
| CN100367080C true CN100367080C (en) | 2008-02-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB031579086A Expired - Fee Related CN100367080C (en) | 2003-08-27 | 2003-08-27 | Light interference display panel and its mfg. method |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8576474B2 (en) * | 2004-08-14 | 2013-11-05 | Fusao Ishii | MEMS devices with an etch stop layer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4403248A (en) * | 1980-03-04 | 1983-09-06 | U.S. Philips Corporation | Display device with deformable reflective medium |
| EP0513911A1 (en) * | 1991-05-17 | 1992-11-19 | Philips Electronics Uk Limited | Method of fabricating mim type device arrays and display devices incorporating such arrays |
| US6377233B2 (en) * | 1998-10-08 | 2002-04-23 | International Business Machines Corporation | Micromechanical display and fabrication method |
| US20030072070A1 (en) * | 1995-05-01 | 2003-04-17 | Etalon, Inc., A Ma Corporation | Visible spectrum modulator arrays |
-
2003
- 2003-08-27 CN CNB031579086A patent/CN100367080C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4403248A (en) * | 1980-03-04 | 1983-09-06 | U.S. Philips Corporation | Display device with deformable reflective medium |
| EP0513911A1 (en) * | 1991-05-17 | 1992-11-19 | Philips Electronics Uk Limited | Method of fabricating mim type device arrays and display devices incorporating such arrays |
| US20030072070A1 (en) * | 1995-05-01 | 2003-04-17 | Etalon, Inc., A Ma Corporation | Visible spectrum modulator arrays |
| US6377233B2 (en) * | 1998-10-08 | 2002-04-23 | International Business Machines Corporation | Micromechanical display and fabrication method |
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| CN1591095A (en) | 2005-03-09 |
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