CN100365844C - Polymer micro chip hot bonding package method based on peltier heat circulation principle - Google Patents
Polymer micro chip hot bonding package method based on peltier heat circulation principle Download PDFInfo
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- CN100365844C CN100365844C CNB200410053698XA CN200410053698A CN100365844C CN 100365844 C CN100365844 C CN 100365844C CN B200410053698X A CNB200410053698X A CN B200410053698XA CN 200410053698 A CN200410053698 A CN 200410053698A CN 100365844 C CN100365844 C CN 100365844C
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 229920000642 polymer Polymers 0.000 title claims abstract description 28
- 238000001816 cooling Methods 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000010438 heat treatment Methods 0.000 claims abstract description 28
- 238000005538 encapsulation Methods 0.000 claims abstract description 22
- 239000004065 semiconductor Substances 0.000 claims abstract description 14
- 239000011521 glass Substances 0.000 claims abstract description 7
- 239000002861 polymer material Substances 0.000 claims abstract description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 19
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 14
- 229910052714 tellurium Inorganic materials 0.000 claims description 14
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 14
- -1 bismuth tellurium compound Chemical class 0.000 claims description 11
- 238000012856 packing Methods 0.000 claims description 10
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 239000000615 nonconductor Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 claims description 3
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 230000005679 Peltier effect Effects 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 6
- 238000004093 laser heating Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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Abstract
The present invention discloses a heat bonding encapsulation method for polymer microchips on the basis of a Peltier heat circulation principle. A semiconductor thermoelectric cooler is adopted to heat a polymer material to make the surfaces of a cover plate and a substrate of the polymer softened at a temperature when the cover plate and the substrate are nearly in a glass state. The cover plate and the substrate are combined into integration in a heat bonding mode, and the encapsulation of a polymer microchip is realized. The thermoelectric cooler which is adopted for Peltier heat circulation is formed by matching and combining an N type semiconductor unit and a P type semiconductor unit. With the help of the flow of direct current, one side of the cooler is heated, and the other side is cooled. By changing the polarity of a power supply, the moving direction of heat is reversed, so the complete interchangeability (namely, the Peltier effect) circulation of heating and cooling can be realized. By adopting the cooler based on the Peltier heat circulation principle, the heating time and the cooling time are shortened, which is favorable for raising encapsulation efficiency. A temperature changing curve is flatter, which is convenient for accurately controlling temperatures and raising encapsulation quality.
Description
Technical field
The present invention relates to a kind of micro polymer chip thermal bonding method for packing based on Po Erpa thermal cycle principle.
Background technology
Glass and silicon materials all have performances such as good optics and electric osmose, be widely used in making the micro-system chip, but the photoetching and the etching technique technology of making glass or silicon materials micro-system chip are tediously long, time-consuming, need super-clean environment, the chip bonding difficulty is big, material brittle and cost are higher, and therefore, high molecular polymer has become the important materials of making the micro-system chip.Polymeric material commonly used has: polymethyl methacrylate (PMMA), Merlon (PC), polytetrafluoroethylene (Teflon), polyvinyl chloride (PVC), dimethyl silicone polymer (PDMS) etc.
Encapsulation operation is in particularly extensive use in the micro-system chip manufacture of micromachined.It can for good and all connect to one to identical or different elements by mechanism (passing through photoelectric action sometimes).The middle gluing layer that forms from the covalent bonding between the element to special material, available encapsulation operation has multiple.Especially requirement on devices when sealing, particularly important when the bonding in chamber is used for the encapsulation of micro-system chip.The method of summarizing encapsulation in fact has thermal bonding, anode linkage, bonding etc.But because polymer has the characteristic that the glassy state temperature is low, molecular structure is big, not all method all is suitable for the encapsulation of micro polymer chip.At present to the polymer chip encapsulation methods that adopt thermal bonding more.
The principle of thermal bonding be make polymer cover plate and substrate by heating temperature near its glassy state temperature, thereby make cover plate and substrate surface softening, mutually combining under the effect of pressure becomes one, and then reaches the purpose of encapsulation.Between 120～180 ℃, therefore, polymer chip thermal bonding package temperature is lower mostly for the glassy state temperature of polymeric material.Even responsive to temperature reagent is housed or also can encapsulates the substrate that passage carried out chemical modification with responsive to temperature reagent.Heating to polymeric material at present mainly contains two kinds of approach: the one, and resistance heating is as the local electrical resistance heating bonding method of Lin and Cheng proposition.The 2nd, LASER HEATING.Nd:YAG LASER HEATING bonding method as people such as Wild proposition.
The LASER HEATING encapsulation has simple quick, the advantage of high production efficiency of technology, but its shortcoming is also apparent: (1) LASER HEATING encapsulation requires patch material transparent and substrate material is opaque, be beneficial to the laser radiation faying face, this makes being limited in scope that cover plate and substrate material select; If the two all is transparent material, then need between faying face, add absorbed layer or the surface is handled, this has increased difficulty of processing undoubtedly.(2) simultaneously owing to need to use relatively more expensive excimer laser, and manipulate, make this method be difficult in common lab and realize that cost of manufacture is also relatively more expensive by the professional.Comparatively speaking, traditional resistive heater heats exactly has simple to operate, cheap characteristics, and polymeric material is selected not have specific (special) requirements.Its major defect is that the heat efficiency is low, and the intensification cooling rate is slow; Heating time and temperature controlling more complicated are difficult to carry out precise dose control, and the uniformity of the power-sharing of little heating lines and bonding line is difficult to guarantee that still there are some influences the peripheral region; While mechanical structure is more complicated also.
And concerning the microchip encapsulation, temperature controlling is directly connected to the quality of chip finished product, and the distribution of temperature or heat is the key factor that influences bonding quality in the thermal bonding process.Too high bonding temperature can cause that strain causes existing the structure of parts and performance to change the off-design value; Cross low bonding temperature and can cause that then bonding not exclusively influences package strength, can't reach design load.Therefore, precise dose control can increase substantially the bond strength of cover plate and substrate material, reduces the influence of thermal deformation.If can adopt reasonably design to overcome the shortcoming of resistance heating bonding, so such microchip packaging technology can yet be regarded as a kind of low cost, high efficiency, high-quality method for packing.
Summary of the invention
In order to realize the simple relatively again micro polymer chip thermal bonding encapsulation of rapid temperature rise and drop, accurate temperature control, structure, the object of the present invention is to provide a kind of micro polymer chip thermal bonding method for packing based on Po Erpa thermal cycle principle.
The technical solution adopted for the present invention to solve the technical problems is to comprise the steps:
1) cover plate of same polymer material and substrate are stacked together are put between two thermoelectric cooling modules and are positioned the center; All put into vacuum (-tight) housing then, vacuumizing influences chip quality to prevent polymeric material from containing air bubble;
2) after vacuum degree reaches 0.002～0.005MPa, apply 0.1～0.2MPa pressure for simultaneously two thermoelectric cooling modules, carry out precompressed for cover plate and substrate; Thermoelectric cooling module feeds 8～9A direct current to cover plate and substrate heating simultaneously;
3) reach 105～145 ℃ during promptly near polymer glass attitude temperature when temperature, cover plate and substrate surface begin to soften, and further be forced into 0.9～1.0MPa to two thermoelectric cooling modules this moment, applies final pressure for cover plate and substrate; Temperature more than keeping and pressure 3～5 minutes are up to cover plate and the abundant bonding of substrate faying face;
4) change cold and hot surface then for the anti-phase logical 8～9A direct current of thermoelectric cooling module,, open liquid cooling loop simultaneously the heat of thermoelectric cooling module hot side is left cover plate and substrate cooling curing;
5) after cover plate and substrate are cooled to 60～70 ℃, stop liquid cooling loop being closed in the pressurization of two thermoelectric cooling modules; Open vacuum (-tight) housing, treat that temperature is cooled to 25 ℃ of room temperatures, polymer chip behind the bonding is taken out, the encapsulation of microchip is finished.
Adopting the semiconductor heat electric refrigerator is the bismuth tellurium compound, be that P type bismuth tellurium piece and N type bismuth tellurium piece are alternately placed, electrically connect as connected in series, connecting line adopts copper, hot link connects for parallel, is finished by two ceramic substrate, on P type bismuth tellurium piece, hole stream carries hot-fluid and moves downward, on N type bismuth tellurium piece, electron stream carries hot-fluid and moves downward, because the bismuth tellurium compound is the non-conductor of heat, it but is the good conductor of electricity, so this device heat efficiency is very high, since P-N of no use knot, this structure energy two-way operation, the polarity of DC power supply that change adds just can be exchanged the substrate of heating and refrigeration.
The polymeric material of cover plate and substrate is polymethyl methacrylate, Merlon, polytetrafluoroethylene, polyvinyl chloride, dimethyl silicone polymer.
Microchip method for packing among the present invention is a kind of thermal bonding method for packing, adopts Po Erpa circulation theory heated polymerizable thing cover plate and substrate to encapsulate.Its innovation part is on traditional resistor heating method for packing basis, and the heating of the polymeric material in the encapsulation process is improved, and adopts Po Erpa thermal cycle principle that polymeric material is carried out heating and cooling.The thermoelectric cooling module that the Po Erpa thermal cycle is adopted is formed by N type and P type semiconductor unit combinations of pairs.Flow by galvanic, the one side of refrigerator is heated, another side then is cooled.By changing the polarity of power supply, the moving direction of heat is reversed in addition, thereby realize exchange fully (the being the Po Erpa effect) circulation of heating, cooling.Avoid the shortcoming of resistance heating, also need not the higher cost of LASER HEATING.
The useful effect that the present invention has is: owing to the semiconductor heat electric refrigerator that has adopted based on Po Erpa thermal cycle principle, compare with traditional resistance heating, the time of heating obviously shortens, and helps enhancing productivity; The variation of temperature curve is milder, the quality that helps accurately controlling temperature and improve finished product.And the conversion by electrode, thermoelectric cooling module has the effect of cooling, be resistance and LASER HEATING can't realize; Moreover the thermoelectric cooling module compact conformation is small and exquisite, intensity is higher, can make mechanical structure simpler, and volume is littler, and outward appearance is also more attractive in appearance.
Description of drawings
Fig. 1 is the structure and the operation principle schematic diagram of semiconductor heat electric refrigerator;
Fig. 2 is a packaging technology schematic flow sheet of the present invention.
Among the figure: the 1-ceramic substrate, 2-P type bismuth tellurium piece, 3-N type bismuth tellurium piece, 4-Cu connects, 5-DC power supply, 6-semiconductor heat electric refrigerator, 7-cover plate, 8-substrate, 9-liquid cooling runner, 10-micro polymer chip.
Embodiment
The invention will be further described below in conjunction with accompanying drawing.
As shown in Figure 1, the principle of the invention is as follows:
Adopt the heating of semiconductor heat electric refrigerator.The semiconductor heat electric refrigerator generally all adopts the bismuth tellurium compound.Typical case is that P type bismuth tellurium piece 2 and N type bismuth tellurium piece 3 alternately placed, and electrically connects as connected in seriesly, and connecting line adopts copper, and hot link connects for parallel, is finished by two ceramic substrate 1.On P type bismuth tellurium piece 2, hole stream carries hot-fluid and moves downward, and on N type bismuth tellurium piece 3, electron stream carries hot-fluid and moves downward.Because the bismuth tellurium compound is the non-conductor of heat, but be the good conductor of electricity, so this device heat efficiency is very high.Because P-N knot of no use, this structure can two-way operation.The polarity of DC power supply 5 that change adds just can be exchanged the substrate of heating and refrigeration.
As shown in Figure 2, technical process of the present invention is as follows:
1) cover plate 7 of PMMA material and substrate 8 are stacked together are put between two thermoelectric cooling modules 6 and are positioned the center; All put into vacuum (-tight) housing then, vacuumizing influences chip quality to prevent polymeric material from containing air bubble;
2) after vacuum degree reaches 0.002MPa, apply 0.2MPa pressure for simultaneously two thermoelectric cooling modules 6, carry out precompressed for cover plate 7 and substrate 8; Thermoelectric cooling module 6 feeds the 8A direct current to cover plate 7 and substrate 8 heating simultaneously;
3) reach 105 ℃ during promptly near polymer glass attitude temperature when temperature, cover plate 7 begins to soften with substrate 8 surfaces, and further be forced into 0.9MPa to two thermoelectric cooling modules 6 this moment, applies final pressure for cover plate 7 and substrate 8; Temperature more than keeping and pressure 5 minutes are up to cover plate 7 and the abundant bonding of substrate 8 faying faces;
4) then give thermoelectric cooling module 6 anti-phase logical 8A direct currents conversion cold and hot surfaces,, open liquid cooling loop 9 simultaneously the heat of thermoelectric cooling module 6 hot sides is left cover plate 7 and substrate 8 cooling curings;
5) after cover plate 7 and substrate 8 are cooled to 70 ℃, stop liquid cooling loop 9 is closed in 6 pressurizations of two thermoelectric cooling modules; Open vacuum (-tight) housing, treat that temperature is cooled to 25 ℃ of room temperatures, polymer chip behind the bonding 10 is taken out.The encapsulation of microchip is finished.
The present invention to the improvement of microchip thermal bonding packaging technology mainly is:
1. consider to shorten the heating and cooling time.For adopting heating to carry out the thermal bonding technology of micro polymer Chip Packaging, the time of heating and cooling is occupied very big proportion in whole technical process, is the key that improves packaging efficiency so shorten this time.The semiconductor heat electric refrigerator is formed by N type and P type semiconductor unit combinations of pairs.Flow by galvanic, the one side of refrigerator is heated, another side then is cooled.By changing the polarity of power supply, the moving direction of heat is reversed, can realize exchange fully (the being the Po Erpa effect) circulation of heating, cooling off.Compare the semiconductor heat electric refrigerator heat efficiency with resistance higher.According to the Po Erpa effect, galvanic couple is Q at the hot junction liberated heat
H=Q
0+ N
0, its exothermic coefficient (heat that the unit electrical power exhales) is ε '=Q
H/ N
0=1+ ε＞1 is better than resistance heating.And change the electric power polarity thermoelectric cooling module and can also freeze, further shorten cooling time.
2. consider to optimize temperature variation curve.Concerning the microchip encapsulation, temperature controlling is directly connected to package quality, and the distribution of temperature or heat is the key factor that influences bonding quality in the thermal bonding process.Variations in temperature, precise dose control stably helps reducing the influence of thermal deformation, but in encapsulation because factor affecting such as heat conduction and radiation, variations in temperature can produce fluctuation.The present invention adopts finite element that the temperature changing process of thermoelectric cooling module is carried out transient analysis and calculates, use post processor then and calculate its temperature field distribution and thermal stress, obtain the corresponding relation of thermal stress and direct current, and in control procedure, to electric current input carrying out reasonable compensation, basically eliminated by the caused temperature fluctuation of thermal loss, made temperature variation curve smooth-out.
3. consider to reduce the temperature of thermal bonding.Because the temperature in the thermal bonding process is near the glassy state temperature of polymer, so the microchannel in the chip may be out of shape.For overcoming this shortcoming, can on the polymer cover plate, be coated with the condensate of last layer low glass state temperature.For example, the glassy state temperature of polybutyl methacrylate is 45 ℃, far below the glassy state temperature of polymethyl methacrylate.The glassy state temperature of polybutyl methacrylate and polymethyl methacrylate polymer mixture is lower than the polymethyl methacrylate, and the two ratio decision in mixture by them.On the polymethyl methacrylate cover plate, coat the film of this composite polymeric body, can reduce the thermal bonding temperature of polymer chip greatly, and can avoid that the microchannel deforms in the chip in encapsulation process.
Claims (3)
1. micro polymer chip thermal bonding method for packing based on Po Erpa thermal cycle principle is characterized in that technical process of the present invention is as follows:
1) cover plate (7) of same polymer material and substrate (8) are stacked together are put between two thermoelectric cooling modules (6) and are positioned the center; All put into vacuum (-tight) housing then, vacuumizing influences chip quality to prevent polymeric material from containing air bubble;
2) after vacuum degree reaches 0.002～0.005MPa, apply 0.1～0.2MPa pressure for simultaneously two thermoelectric cooling modules (6), carry out precompressed for cover plate (7) and substrate (8); Thermoelectric cooling module (6) feeds 8～9A direct current to cover plate (7) and substrate (8) heating simultaneously;
3) reach 105～145 ℃ during when temperature promptly near polymer glass attitude temperature, cover plate (7) begins to soften with substrate (8) surface, further be forced into 0.9～1.0MPa to two thermoelectric cooling modules (6) this moment, applies final pressure for cover plate (7) and substrate (8); Temperature more than keeping and pressure 3～5 minutes are up to cover plate (7) and the abundant bonding of substrate (8) faying face;
4) then give thermoelectric cooling module (6) anti-phase logical 8～9A direct current conversion cold and hot surface,, open liquid cooling loop (9) simultaneously the heat of thermoelectric cooling module (6) hot side is left cover plate (7) and substrate (8) cooling curing;
5) after cover plate (7) and substrate (8) are cooled to 60～70 ℃, stop liquid cooling loop (9) is closed in two thermoelectric cooling modules (6) pressurization; Open vacuum (-tight) housing, treat that temperature is cooled to 25 ℃ of room temperatures, polymer chip behind the bonding (10) is taken out, the encapsulation of microchip is finished.
2. a kind of micro polymer chip thermal bonding method for packing according to claim 1 based on Po Erpa thermal cycle principle, it is characterized in that: the semiconductor heat electric refrigerator adopts the bismuth tellurium compound, be that P type bismuth tellurium piece (2) and N type bismuth tellurium piece (3) are alternately placed, electrically connect as connected in series, connecting line adopts copper, hot link connects for parallel, finish by two ceramic substrate (1), on P type bismuth tellurium piece (2), hole stream carries hot-fluid and moves downward, on N type bismuth tellurium piece (3), electron stream carries hot-fluid and moves downward, because the bismuth tellurium compound is the non-conductor of heat, but be the good conductor of electricity, so this device heat efficiency is very high, because P-N knot of no use, this structure energy two-way operation, the polarity of DC power supply (5) that change adds just can be exchanged the substrate of heating and refrigeration.
3. a kind of micro polymer chip thermal bonding method for packing based on Po Erpa thermal cycle principle according to claim 1 is characterized in that: cover plate (7) is polymethyl methacrylate, Merlon, polytetrafluoroethylene, polyvinyl chloride, dimethyl silicone polymer with the polymeric material of substrate (8).
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| Application Number | Priority Date | Filing Date | Title |
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| CNB200410053698XA CN100365844C (en) | 2004-08-10 | 2004-08-10 | Polymer micro chip hot bonding package method based on peltier heat circulation principle |
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| CNB200410053698XA CN100365844C (en) | 2004-08-10 | 2004-08-10 | Polymer micro chip hot bonding package method based on peltier heat circulation principle |
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| CN100365844C true CN100365844C (en) | 2008-01-30 |
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| CN102886281A (en) * | 2012-10-18 | 2013-01-23 | 哈尔滨工业大学 | Micro-fluidic chip bonding device based on PMMA (polymethyl methacrylate) and other polymers |
| CN108598254A (en) * | 2018-04-19 | 2018-09-28 | 嘉盛半导体(苏州)有限公司 | Filter package method and encapsulating structure |
| CN111474232A (en) * | 2019-01-24 | 2020-07-31 | 上海仪擎生物科技有限公司 | Electrophoresis tank capable of setting temperature |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000274976A (en) * | 1999-03-26 | 2000-10-06 | Honda Access Corp | Thermal insulation double container |
| US6489677B2 (en) * | 2000-05-11 | 2002-12-03 | The Furukawa Electric Co., Ltd. | Optical semiconductor device package and optical semiconductor module having the same |
| JP2004165677A (en) * | 1994-06-20 | 2004-06-10 | Yamaha Corp | Semiconductor device |
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2004
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004165677A (en) * | 1994-06-20 | 2004-06-10 | Yamaha Corp | Semiconductor device |
| JP2000274976A (en) * | 1999-03-26 | 2000-10-06 | Honda Access Corp | Thermal insulation double container |
| US6489677B2 (en) * | 2000-05-11 | 2002-12-03 | The Furukawa Electric Co., Ltd. | Optical semiconductor device package and optical semiconductor module having the same |
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Assignee: Zhejiang Gute Pneumatic Machinery Co., Ltd. Assignor: Zhejiang University Contract fulfillment period: 2009.1.15 to 2014.6.30 contract change Contract record no.: 2009330001779 Denomination of invention: Polymer micro chip hot bonding package method based on peltier heat circulation principle Granted publication date: 20080130 License type: Exclusive license Record date: 2009.7.31 |
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Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.1.15 TO 2014.6.30; CHANGE OF CONTRACT Name of requester: ZHEJIANG GUTE PNEUMATIC MACHINERY CO., LTD. Effective date: 20090731 |
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Granted publication date: 20080130 Termination date: 20110810 |