CN100349274C - Clamp for vertical cavity emission laser To coaxial encapsulation lest - Google Patents
Clamp for vertical cavity emission laser To coaxial encapsulation lest Download PDFInfo
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- CN100349274C CN100349274C CNB2004100097732A CN200410009773A CN100349274C CN 100349274 C CN100349274 C CN 100349274C CN B2004100097732 A CNB2004100097732 A CN B2004100097732A CN 200410009773 A CN200410009773 A CN 200410009773A CN 100349274 C CN100349274 C CN 100349274C
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- circular hole
- cover plate
- end part
- vertical cavity
- coaxial packaging
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Abstract
The present invention relates to a clamp for the TO coaxial encapsulation test of a vertical cavity surface emission laser. The clamp is characterized in that the clamp comprises a bottom component, a cover plate and a tube seat, wherein the bottom component is in a rectangular structure, the upper surface of the bottom component is provided with a circular hole of which the size is smaller than that of a TO coaxial encapsulation tube seat, and both sides of the circular hole are respectively provided with a screw hole; the long lateral surface of the bottom component is provided with a first circular hole and a second circular hole; the cover plate is in a rectangular structure, the external dimension of the cover plate is smaller than that of the bottom component, the upper surface of the cover plate is provided with a third circular hole which is smaller than the periphery of the TO coaxial encapsulation tube seat corresponding to the circular hole on the bottom component, and a fourth circular hole and a fifth circular hole which correspond to the two screw holes on the bottom component are arranged on both sides of the third circular hole; the cover plate is fixed to the bottom component through screws. The length of a heat shrinkable tube which is sheathed on pins of the tube seat is equal to or smaller than the length of pins of the TO coaxial encapsulation tube seat, and the tube seat is arranged between the bottom component and the cover plate.
Description
Technical field
The invention belongs to field of optoelectronic devices, a kind of anchor clamps that are used for the TO coaxial packaging test of vertical cavity surface emitting laser of saying so more specifically.
Background technology
Since semiconductor laser in 1962 comes out, with regard to type of device, structure and gain media, from initial homojunction, single heterojunction, double heterojunction, quantum well, strained quantum well, Fabry-Perot (F-P) cavity configuration, the distributed feed-back formula structure in no chamber, horizontal cavity structure, vertical cavity structure have been experienced, the important development stage of the self assembly quantum dot that is developing up to today and the unipolarity structure of quantum cascade.Wherein in 1977 by Suo Da (Soda), she congratulates first of development such as (Iga) people of etc.ing and has epoch making significance only on the sharp development history of vertical cavity surface emitting laser (VCSEL) at semiconductor laser of penetrating of pulse under the 77K temperature.The main characteristics of vertical cavity surface emitting laser are to swash to penetrate the exiting surface of light perpendicular to p-n junction.Its structure mainly includes source region and upper and lower reflector.Vertical cavity surface emitting laser is compared with edge-emitting laser has following several advantage:
1, chip does not need cleavage just may carry out the key property of individual devices at built-in testing;
2, far away, the near field distribution of the little angle of divergence and circular symmetry improve the coupling efficiency of itself and optical fiber greatly;
3, bright dipping reverse vertical substrate can be realized the integrated of high density two-dimensional array;
4, fiber lengths is extremely short, can indulge film work, dynamic modulation frequency height by list in wider temperature range;
5, manufacturing process and light-emitting diode compatibility, the extensive cost of making is very low, and in the last few years, vertical cavity surface emitting laser became the focus of people's research.
The packing forms of semiconductor laser mainly comprises three kinds of the encapsulation of TO coaxial packaging, butterfly type and dip.Wherein the TO coaxial packaging because have that size is little, price is low, simple in structurely need not freeze, advantage such as flexible and convenient to use, technology maturation is particularly suited for being used for the vertical cavity surface emitting laser encapsulation.Owing in the vertical cavity surface emitting laser encapsulation, do not need to be used to detect the back light detector of outgoing light energy, therefore can select the TO coaxial packaging base that structure is better simply, be used for semiconductor detector for use.When vertical cavity surface emitting laser adopt TO coaxial packaging form packaged after, need test its light, electrical property usually, how to be fixed becomes the problem that needs solve.
Summary of the invention
In order to solve the fixation problem of TO coaxial packaging assembly in test process of vertical cavity surface emitting laser, the object of the present invention is to provide a kind of anchor clamps of TO coaxial packaging test of vertical cavity surface emitting laser, use this structural design not only can make things convenient for the electricity and the optical performance test of encapsulated device, but also considered the problem of electric insulation.
The technical solution adopted for the present invention to solve the technical problems is:
The anchor clamps of the TO coaxial packaging of a kind of vertical cavity surface emitting laser of the present invention test, its characteristic are, comprising:
One end part, this end part is a rectangular configuration, has the circular hole of a size less than the size of TO coaxial packaging base above the end part at this, has two screws in the both sides of this circular hole; On the long side surface of this end part, have first circular hole and second circular hole;
One cover plate, this cover plate is a rectangular configuration, the overall dimension of this cover plate is less than the overall dimension of end part, circular hole on cover plate on the part of the corresponding end has the 3rd circular hole less than TO coaxial packaging base edge, has the 4th circular hole and the 5th circular hole of two screws on the part of the corresponding end in the both sides of the 3rd circular hole; This cover plate is fixed with screw and end part;
One base, the heat-shrink tube of socket on the pin on this base, its length is equal to or less than the length of the pin on the TO coaxial packaging base, and this base places between end part and the cover plate.
Wherein the material of end part employing is: plastics, metal, stainless steel, polytetrafluoroethylene, polymethyl methacrylate or oak.
Wherein the material of cover plate employing is: plastics, metal, stainless steel, polytetrafluoroethylene, polymethyl methacrylate or oak.
Wherein the upper and lower surface of end part and cover plate is through polishing PROCESS FOR TREATMENT.
The invention has the beneficial effects as follows: the clamp structure of the TO coaxial packaging test usefulness of this vertical cavity surface emitting laser has following advantage:
1, processing technology is simple, material selection is extensive, cost is low;
2, adopt heat-shrink tube, solved between the TO coaxial packaging pin or TO coaxial packaging pin and end part 1 short circuit problem, can defective chip or test result caused harmful effect.
Description of drawings
For further specifying technology contents of the present invention, the invention will be further described below in conjunction with drawings and Examples, wherein:
Fig. 1 is a kind of TO coaxial packaging base (having overlapped heat-shrink tube) schematic diagram of vertical cavity surface emitting laser;
Fig. 2 is a kind of stereogram of clamp structure of TO coaxial packaging test of vertical cavity surface emitting laser;
Fig. 3 is a kind of top view of clamp structure of TO coaxial packaging test of vertical cavity surface emitting laser.
Embodiment
See also Fig. 1, Fig. 2 and Fig. 3, the anchor clamps of the TO coaxial packaging test of a kind of vertical cavity surface emitting laser of the present invention, comprising:
One end part 1, this end part 1 is a rectangular configuration, has the circular hole 6 of a size less than the size of TO coaxial packaging base 20 above the end part 1 at this, has two screws 7,8 in the both sides of this circular hole 6, these two screws 7,8 are used for the spiral shell solid (afterwards chatting) of cover plate 2; On the long side surface of this end part 1, have first circular hole 9 and second circular hole 10 (shown in Figure 2, this first circular hole 9 and second circular hole 10 are used for end part 1 is fixed on testboard); The material that this end part 1 adopts is: plastics, metal, stainless steel, polytetrafluoroethylene, polymethyl methacrylate or oak;
One cover plate 2, this cover plate 2 is a rectangular configuration, the overall dimension of this cover plate 2 is less than the overall dimension of end part 1, circular hole 6 on cover plate 2 on the part of the corresponding end 1 has the 3rd circular hole 3 less than TO coaxial packaging base edge, have the 4th circular hole 4 of two screws 7,8 on the part of the corresponding end 1 and the 5th circular hole 5, the four circular holes 4 and the 5th circular hole 5 is used for screw cover plate 2 being fixed on end part 1 in the both sides of the 3rd circular hole 3; The material that this cover plate 2 adopts is: plastics, metal, stainless steel, polytetrafluoroethylene, polymethyl methacrylate or oak;
One base 20, the heat-shrink tube 11 of socket on the pin two 1 on this base 20, its length is equal to or less than the length of the pin two 1 on the TO coaxial packaging base 20, this heat-shrink tube 11 is used to prevent between the TO coaxial packaging pin or short circuit between TO coaxial packaging pin and the end part 1, and this base 20 places between end part 1 and the cover plate 2.
Wherein should end part 1 and the upper and lower surface of cover plate 2 through polishing PROCESS FOR TREATMENT.
The anchor clamps that the present invention tests usefulness in use, three pin twos 1 with base 20 put heat-shrink tube 11 earlier, prevent between the TO coaxial packaging pin or short circuit between TO coaxial packaging pin and the end part 1, three pin twos 1 of base 20 are inserted in the circular hole 6 on the end part 1, on base 20, place tube core 30, again cover plate 2 is covered on base 20, with screw that cover plate 2 is fixing with end part 1, carry out TO coaxial packaging test to laser.
Claims (4)
1, the anchor clamps of a kind of TO coaxial packaging of vertical cavity surface emitting laser test is characterized in that, comprising:
One end part, this end part is a rectangular configuration, has the circular hole of a size less than the size of TO coaxial packaging base above the end part at this, has two screws in the both sides of this circular hole; On the long side surface of this end part, have first circular hole and second circular hole;
One cover plate, this cover plate is a rectangular configuration, the overall dimension of this cover plate is less than the overall dimension of end part, circular hole on cover plate on the part of the corresponding end has the 3rd circular hole less than TO coaxial packaging base edge, has the 4th circular hole and the 5th circular hole of two screws on the part of the corresponding end in the both sides of the 3rd circular hole; This cover plate is fixed with screw and end part;
One base, the heat-shrink tube of socket on the pin on this base, its length is equal to or less than the length of the pin on the TO coaxial packaging base, and this base places between end part and the cover plate.
2, the anchor clamps of the TO coaxial packaging of a kind of vertical cavity surface emitting laser as claimed in claim 1 test is characterized in that, wherein the material of end part employing is: plastics, metal, stainless steel, polytetrafluoroethylene, polymethyl methacrylate or oak.
3, the anchor clamps of the TO coaxial packaging of a kind of vertical cavity surface emitting laser as claimed in claim 1 test is characterized in that, wherein the material of cover plate employing is: plastics, metal, stainless steel, polytetrafluoroethylene, polymethyl methacrylate or oak.
4, the anchor clamps of the TO coaxial packaging of a kind of vertical cavity surface emitting laser as claimed in claim 1 test is characterized in that, wherein the upper and lower surface of end part and cover plate is through polishing PROCESS FOR TREATMENT.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100097732A CN100349274C (en) | 2004-11-11 | 2004-11-11 | Clamp for vertical cavity emission laser To coaxial encapsulation lest |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100097732A CN100349274C (en) | 2004-11-11 | 2004-11-11 | Clamp for vertical cavity emission laser To coaxial encapsulation lest |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1773303A CN1773303A (en) | 2006-05-17 |
| CN100349274C true CN100349274C (en) | 2007-11-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100097732A Expired - Fee Related CN100349274C (en) | 2004-11-11 | 2004-11-11 | Clamp for vertical cavity emission laser To coaxial encapsulation lest |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100349274C (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1051067A (en) * | 1996-04-29 | 1998-02-20 | Motorola Inc | Reflection type power monitoring system for vertical cavity surface emission laser |
| TW434919B (en) * | 1997-10-13 | 2001-05-16 | Ind Tech Res Inst | Vertical cavity surface emitting laser diode and the packaging device of the same |
| US20030138008A1 (en) * | 2002-01-18 | 2003-07-24 | Riaziat Majid Leondard | High-speed TO-can optoelectronic packages |
| CN1479126A (en) * | 2002-08-26 | 2004-03-03 | 中国科学院半导体研究所 | Semiconductor laser V shaped groove fixed optical fiber coaxial device |
| CN1479456A (en) * | 2002-08-26 | 2004-03-03 | 中国科学院半导体研究所 | Semiconductor laser coaxial device |
-
2004
- 2004-11-11 CN CNB2004100097732A patent/CN100349274C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1051067A (en) * | 1996-04-29 | 1998-02-20 | Motorola Inc | Reflection type power monitoring system for vertical cavity surface emission laser |
| TW434919B (en) * | 1997-10-13 | 2001-05-16 | Ind Tech Res Inst | Vertical cavity surface emitting laser diode and the packaging device of the same |
| US20030138008A1 (en) * | 2002-01-18 | 2003-07-24 | Riaziat Majid Leondard | High-speed TO-can optoelectronic packages |
| CN1479126A (en) * | 2002-08-26 | 2004-03-03 | 中国科学院半导体研究所 | Semiconductor laser V shaped groove fixed optical fiber coaxial device |
| CN1479456A (en) * | 2002-08-26 | 2004-03-03 | 中国科学院半导体研究所 | Semiconductor laser coaxial device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1773303A (en) | 2006-05-17 |
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