CN100347829C - Etching device for high precision silicon senser chip - Google Patents
Etching device for high precision silicon senser chip Download PDFInfo
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- CN100347829C CN100347829C CNB031340989A CN03134098A CN100347829C CN 100347829 C CN100347829 C CN 100347829C CN B031340989 A CNB031340989 A CN B031340989A CN 03134098 A CN03134098 A CN 03134098A CN 100347829 C CN100347829 C CN 100347829C
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Abstract
The present invention relates to a corrosion device for high precision silicon sensor chips, which comprises an industrial control computer, an electric appliance control cubicle, reaction chambers, a KOH liquid reservoir and a cleaning liquid storage tank. The present invention is characterized in that the computer has a CRT touch screen and an operation control program, the CRT touch screen and the operation control program are connected with a control circuit of the electric appliance control cubicle, the reaction chambers and valves and pumps on pipelines through communication interfaces, wherein a driving spraying mechanism is put in each of the reaction chambers, a spraying pipe is connected with submerged pumps of the cleaning liquid storage tank and the KOH liquid storage tank through liquid pipelines, and probes for measuring temperature and KOH concentration are respectively arranged in the reaction chambers. The device has the advantages of adoption of computer control, simple operation and realization of large-scale production; six silicon chips of 4 inches are launched at a time, and simultaneously, due to the adoption of a spraying process for corrosion, the corrosion process is always in good environment with continuous flushing, reaction, rewashing and secondary reaction so that various generated products and generated gases in the reaction process can be eliminated in time, and the present invention has the advantages of acceleration of the reaction process and enhanced reaction quality; all the silicon chips with the diameter of less than 110mm can be corroded by the device.
Description
Affiliated field
The present invention relates to the corrosion device of the silicon that uses in the wet chemical etching technique technology of silicon sensor.
Background technology
The silicon sensor corrosion device is one of key equipment in the batch silicon-sensitive preparing diaphragm technology in the sensor mems micromachined manufacturing technology.Its mechanism is by wet chemical etching technique technology silicon chip surface to be carried out directed etching to reach the purpose of producing the silicon sensor sensitive diaphragm in batches.
All do not appear in the newspapers for " high precision silicon slice corrosion device " relevant home and abroad, but adopt the means of wet chemical etch to form the easy device of desired silicon diaphragm and the technology of etching, all have a lot of articles to discuss at home, outward.In the past for scientific research need also prepare some easily relevant silicon chip erosion devices, but exist many weak points.Mainly show: the complicated operation of the inefficiency of device, etch mask (protection back side circuit etc.); The process of etching all is omnidistance the immersion, therefore requires high in technological operation.Simultaneously because device is to be based upon on the chemical experimental unit basis, its technological parameter and various condition are difficult to obtain strict control, the consistency of silicon chip erosion is relative with controllability relatively poor, and especially silicon chip whole process is immersed in the corrosive liquid in the etching process, often occurs undercutting easily.The diaphragm thickness control precision is low, and rate of finished products is not high, and the final corrosion thickness control of silicon chip is inaccurate, defective or problems such as long processing time.Therefore, research is fit to the wet chemical etch device and the related process of batch process, improves the uniformity of etching and the controllability of etch amount, and is just very important.
Summary of the invention
The purpose of this invention is to provide a kind of high accuracy, high efficiency silicon sensor corrosion device, be applicable to scientific research, the production field of silicon sensor.
This is a kind of high precision silicon sensor chip corrosion device, comprise industrial computer 2, control circuit, electric control cabinet, reative cell 4, KOH fluid reservoir 7, cleaning fluid fluid reservoir 6 compositions, it is characterized in that computer has CRT touch-screen and job control program, link to each other by valve, pump on control circuit, reative cell and the pipeline of communication interface and electrical control cubicles; The built-in transmission spraying mechanism of reative cell, its shower links to each other with the submerged pump of KOH fluid reservoir with the cleaning fluid fluid reservoir by liquid line; The probe of thermometric, survey concentration is located in the reative cell respectively.
Similar corrosion device with other of this device or experimental provision are compared, owing to adopt computer control, large-scale production (once dropping into 64 inches silicon chips), so degree of concentration of control height, simple to operate, the production efficiency height.Particularly adopted spray technology to corrode, the immersion corrosion technology of complete corrosion device of the same type different from the past, reduced adopt that immersion corrosion technology brings generate defectives such as gas exhaust is smooth as surperficial undercutting, product deposition and course of reaction, avoided soaking the undercutting that produces in the etching process, surface resultant deposition causes that corrosion surface is rough, non-uniform phenomenon takes place, and corrosion process is in the benign environment that constantly washes away, react, washes away, reacts all the time.Because course of reaction is not soaked environment, the various generation gases in the course of reaction can in time be got rid of simultaneously, be beneficial to also and can accelerate course of reaction, improve reaction mass.This installs corrodible silicon chip: all silicon chips that diameter 110mm is following.This device is applicable to scientific research, the production field of silicon sensor fully.
Description of drawings
Accompanying drawing 1 is a chip corrosion device structural representation of the present invention;
Accompanying drawing 3 is that each parts connects block diagram among the present invention;
Accompanying drawing 4 is this device circuit schematic diagrames;
Accompanying drawing 6 is corrosion device control program block diagrams;
Accompanying drawing 7 is that the PLC program in Fig. 6 control program is formed schematic block diagram;
Accompanying drawing 8 is the transmission spraying mechanism schematic diagrames in the corrosion device;
Accompanying drawing 9 is cage-shaped structure vertical views in the spraying mechanism;
Accompanying drawing 10 is corrosion device job control stream journey block diagrams;
Accompanying drawing 11 is CRT touch-screen paralell schematic diagrames;
Accompanying drawing 12 is control system control panels;
Embodiment
The formation of each part of accompanying drawings apparatus of the present invention:
High precision silicon sensor chip corrosion device, see Fig. 3: comprise industrial computer, reative cell, KOH fluid reservoir, cleaning fluid fluid reservoir, the computer 2 that it is characterized in that device 1 has CRT touch-screen and job control program, links to each other by valve, pump on control circuit, reative cell 4 and the pipeline of communication interface and electrical control cubicles; The built-in transmission spraying mechanism of reative cell, its shower links to each other with the submerged pump of KOH fluid reservoir 7 with cleaning fluid fluid reservoir 6 by liquid line; The probe of thermometric, survey concentration is located at respectively in the reative cell 4.
The control mode of apparatus of the present invention:
(1). corrosive liquid temperature control: water-bath+PID temperature control system
(2). the dynamic control of etching extent during the corrosion: high accuracy alkalescence concentration controller+computer
(3). corrosive liquid endless form: dynamically spray+circulation
(4). the corrosive liquid circulatory system: the miniature elevator pump of anti-highly basic+anticorrosion pipeline+container
(5). final purging system: H2O (pure)+circulation line
The electrical appliance part structure of described corrosion device 1: industrial control computer 2 is seen Fig. 1 on the top of device, adds thermal agitation controller A1, sees Fig. 4, and concentration tester A4, temperature measuring device A5 are placed in the electrical control cubicles of device left side.PLC Programmable Logic Controller A3,24V power supply A6, relay J 1-J4, air-operated solenoid valve F5, A.C. contactor ZJ1, A.C. contactor ZJ2, A.C. contactor ZJ3, three-phase power socket KQ, air switch K, relay switch K4 are installed on the interior distribution board of cabinet.Key switch K1-K3a K3b on the control system control panel sees Figure 12, is to realize manual, automatic two cover control system.The three phase electric machine DZ1 of flushing liquor elevator pump is installed on the corrosion flow container 7 of Fig. 1, and the three phase electric machine DZ2 of corrosive liquid elevator pump is installed on the washing device 6.Two-phase induction motor DZ3 is installed on Fig. 8 spraying mechanism, and promptly motor 15.Electromagnet B is installed on the bell jar 3 of reative cell, sees Fig. 2.Electromagnetically operated valve F1 is installed on the flushing liquor watering pipeline, and electromagnetically operated valve F2 is installed on the flushing liquor water return pipeline, and electromagnetically operated valve F3 is installed on the corrosive liquid watering pipeline, and electromagnetically operated valve F4 is installed on the corrosive liquid water return pipeline.The transducer of concentration tester A4 is installed on the corrosive liquid watering pipeline, and the transducer of temperature measuring device A5 is installed in the bottom of reative cell 4.
The circuit connecting relation of above-mentioned electrical equipment is described in conjunction with Fig. 4: add thermal agitation controller A1 one end and link to each other with phase voltage V, the other end links to each other with N.An end links to each other with the end of key switch K2, K1 and the end of relay J 4 contact J44 after industrial control computer A2, PLC Programmable Logic Controller A3, concentration tester A4, temperature measuring device A5, the 24V power supply A6 parallel connection, and the other end links to each other with N.The other end of key switch K2 links to each other with phase voltage U through air switch K.The other end of key switch K1 links to each other with relay J 4 coils one end.The relay J 4 coil other ends link to each other with N.The other end of relay J 4 contact J44 links to each other with contact K3b one end with key switch K3 contact K3a one end.Link to each other with the contact K3b other end after key switch SK1, SK2, the SK3 one end parallel connection.Link to each other with the contact K3a other end after output contact K11, the K21 of PLC, the K31 one end parallel connection.Link to each other with relay J 1 coil one end after the other end parallel connection of the other end of SK1 and K11.Link to each other with relay J 2 coils one end after the other end parallel connection of the other end of SK2 and K21.Link to each other with relay J 3 coils one end after the other end parallel connection of the other end of SK3 and K31.Link to each other with N after the J1 coil other end and the J2 coil other end and the parallel connection of the J3 coil other end.Link to each other with phase voltage V through air switch K after the end parallel connection of the end of air-operated solenoid valve F5 and A.C. contactor ZJ1, ZJ2, ZJ3.The other end of air-operated solenoid valve F5 links to each other with the end of relay J 4 contact J41.The A.C. contactor ZJ1 other end links to each other with the end of relay J 1 contact J11.The A.C. contactor ZJ2 other end links to each other with the end of relay J 2 contact J21.The A.C. contactor ZJ3 other end links to each other with the end of relay J 3 contact J31.Link to each other with N after the other end of the other end of relay J 1 contact J11 and the other end of relay J 2 contact J21, relay J 3 contact J31, the other end parallel connection of relay J 4 contact J41.The binding post of three phase electric machine DZ1 links to each other with phase voltage V, U, W through air switch K through the contact of A.C. contactor ZJ1 respectively again.The binding post of three phase electric machine DZ2 links to each other with phase voltage V, U, W through air switch K through the contact of A.C. contactor ZJ2 respectively again.1. the binding post of two-phase induction motor DZ3 links to each other with phase voltage V through air switch K through the contact of A.C. contactor ZJ3 again.The binding post of two-phase induction motor DZ3 2., 3. the normally opened contact of process relay switch K4 links to each other with N with normally-closed contact respectively.
Relay switch K4 coil one end is seen Fig. 5, and links to each other with A after electromagnet B coil one end, electromagnetically operated valve F1, F2, F3, the one end parallel connection of F4 coil, and the A point is the lead-out terminal of A6.The relay switch K4 coil other end links to each other with output contact K41 one end of PLC Programmable Logic Controller A3.The electromagnet B coil other end links to each other with the end of relay J 4 contact J43.Link to each other with the end of relay J 2 contact J23 after electromagnetically operated valve F1, the parallel connection of the F2 coil other end.Link to each other with the end of relay J 1 contact J13 after electromagnetically operated valve F3, the parallel connection of the F4 coil other end.Link to each other with 0V after the K41 other end and the J43 other end, the J23 other end, the parallel connection of the J13 other end.Control program is installed on the industrial control computer A2.Contact J12, J14, J22, J24, J32, J34 free time among Fig. 4, Fig. 5.
The industrial computer control program is made up of seven program modules, sees Fig. 6: 6.1 initialize routines: parameter is carried out initialization.6.2 logging program: divide operator's login, engineer's login, manager to login three kinds of modes.Every kind of login mode is with different passwords, the authority difference that has after the login.The operator is only to use automatic preference pattern.The engineer can be with automatic preference pattern and artificial selection model.The keeper can revise parameter.6.3 parameter setting, erosion model option program: setup parameter has chip number, corrosion concentration, corrosion temperature, diaphragm thickness, corrosion depth.Erosion model H
n(N), erosion model is corrosion depth H and etching time t, corrosion temperature T, corrodes the functional relation between the concentration N=F, determines that according to the requirement of etching process erosion model is divided into five for t, T.According to setting corrosion temperature and corrosion concentration selective etching model H
n6.4 with the PLC communication program: Content of communciation has corrosive liquid temperature value, corrosive liquid concentration value; Corrosion depth; Set corrosion depth; The equipment order that brings into operation; Equipment order out of service; Industrial computer open state sign; Industrial computer off-mode sign; 6.5 alert program: the overproof alarm of corrosion temperature, the overproof alarm of corrosion concentration are arranged.Overproof or corrosion concentration ejects warning window when overproof on the display screen when corrosion temperature, shows " temperature is overproof " or " concentration is overproof ".Whether finish corrosion process by operator's decision.6.6 expert system analysis program: a. calculates corrosion depth by erosion model and etching time, compares according to the corrosion depth of calculating and the corrosion depth of setting, makes the judgement that whether finishes corrosion process.B. online demonstration corrosion depth and etching time.C. online demonstration corrosive liquid concentration and corrosive liquid temperature.6.7 data deposit program: deposit the parameter of setting in database.
The PLC control program is made up of eight program modules, sees Fig. 7: 7.1 main programs: control corrosive liquid elevator pump three phase electric machine DZ2 working procedure; Control flushing liquor elevator pump three phase electric machine DZ1 working procedure; Control two-phase induction motor DZ3 rotary work program; 7.2 interrupt routine: timer interrupt routine, carry out corrosive liquid temperature, the collection of corrosive liquid concentration data.7.3 beginning, shut down procedure: the order of accepting industrial computer brings into operation equipment; If arriving set point, corrosion depth make equipment out of service.7.4 rotating control program:, realize the rotating control of two-phase induction motor DZ3 by the output contact control relay K switch 4 of A3.7.5A/D conversion program: the test data of corrosive liquid temperature measuring device and the corrosive liquid concentration tester A/D modular converter by PLC is carried out the A/D conversion, the industrial computer of giving to be sent.7.6A/D digital router:, send to industrial computer with the processing of packing of the numeral of A/D conversion.7.7 communication data packets is carried out the Eigenvalue Analysis program: the packet of the transmission of industrial computer is carried out Eigenvalue Analysis, therefrom decomposite the different command word.Command word is as follows: action command word, the word of ceasing and desisting order, transmission types command word, temperature alarming command word, concentration alarm command word, corrode the tabbing command word, wash tabbing command word, open state command word, off-mode command word, send A/D data command word.7.8 the data processor after the industrial computer start: in the PLC running, after industrial computer is started shooting again, the image data of plc data memory block is uploaded to industrial computer.The line data of going forward side by side is handled.
The electric control function explanation: industrial control computer A2 is responsible for the automatic operation control of equipment, and the serial communication interface of A2 links to each other with A3 and carries out communication.PLC Programmable Logic Controller A3 accepts the instruction of A2, the state of control K11, K21, K31, K4.Concentration tester A4 is responsible for testing the concentration of corrosive liquid.Temperature when temperature measuring device A5 is responsible for test reaction office work.24V power supply A6 is responsible for providing 24V DC power supply to electrical appliance.The bell 3 of key switch K1 control reative cell 4 is opened, is closed, and cuts off power supplys such as motor, electromagnet, relay when bell 3 is opened.When closing, bell 3 connects power supplys such as motor, electromagnet, relay.Key switch K2 control apparatus mains switch.From the normally-closed contact K3a of/hand switch K3 control operation automatically.From the normally opened contact K3b of/hand switch K3 control manual operation.Key switch SK1 under manual state, the work of control relay J1.Key switch SK2 under manual state, the work of control relay J2.Key switch SK3 under manual state, the work of control relay J3.The output contact K11 of A3 under auto state, the work of control relay J1.The output contact K21 of A3 under auto state, the work of control relay J2.The output contact K31 of A3 under auto state, the work of control relay J3.The output contact K41 of A3 under auto state, the work of control relay K switch 4.Relay J 1 contact J13 control electromagnetically operated valve F3, F4, the coil of relay J 1 contact J11 control A.C. contactor ZJ1.The motor D Z1 of the contact control corrosion usefulness of A.C. contactor ZJ1.Relay J 2 contact J23 control electromagnetically operated valve F1, F2, the coil of relay J 2 contact J21 control A.C. contactor ZJ2.The motor D Z2 of the contact control flushing usefulness of A.C. contactor ZJ2.The coil of relay J 3 contact J31 control A.C. contactor ZJ3.The motor D Z3 of the contact control horse rotation usefulness of A.C. contactor ZJ3.The rotating of relay switch K4 control horse electric rotating machine DZ3.The bell 3 of electromagnet B suction and reative cell.
Reative cell is seen Fig. 1 by forming as the bell jar 3 and the cylinder body 4 of lid, and the coupling 5 that bell jar 3 has sealing the margin, magnet B and promoted by cylinder is seen Fig. 2, and cylinder communicates with the source of the gas processor and the source of the gas of air-operated solenoid valve, triplet by pneumatic line, circuit; Prevent to occur leakages such as KOH solution and steam in the course of the work, cause environmental pollution or personnel injury.
The transmission spraying mechanism comprises transmission and spray two parts, adopts two groups of Bevel Gear Transmission engagements, guarantees gear-driven efficiency and reduces the transmission space as far as possible.See Fig. 8: the cylinder body 4 bottom circle centre positions of reative cell have vertical shaft 8, fixing bevel gear wheel 9 and transmission spraying mechanism as bearing table on it; Be fixed with power transmission shaft 13 on reative cell cylinder body 4 walls, axle 13 has bevel gear 14 in cylinder body 4 wall outer ends with intersecting vertically, is 90 ° with power transmission shaft by the fixing gear reduction motor 15 of electric machine support 16 and intersects; Axle 13 has bevel pinion 12 at the cylinder body other end, is 90 ° with bevel gear wheel 9 and intersects.Its kind of drive is as follows: machine shaft rotates by the bevel gear of key on being fixed on rotating shaft, driving another is fixed on bevel gear on the rotation axis 13 on cylinder body 4 walls and motor is rotated adjusts 90 degree, and will rotate and introduce reative cell by being fixed on power transmission shaft on the reative cell, simultaneously by the bevel gear of pair of meshing transmission direction is adjusted 90 degree again at the other end of reative cell intermediate solid drive shaft 13, this group bevel gear is a reduction gearing, finish once more deceleration adjustment by the gear size, speed reducing ratio is 1: 6, therefore finally pay and realize the speed governing actuation, satisfy the transmission needs by driven by motor two sleeve gears.
The mouse cage frame 10 of spraying mechanism is the three-dimensional polygon frame concentric with vertical shaft 8, sees Fig. 8, Fig. 9; And the cross section of many stiles is that both sides have groove, the width of groove equates with silicon wafer thickness, every length of side of polygon frame equates with the width of silicon chip, equidistant groove between vertical frame can vertically insert 6 of 4 inches silicon chips simultaneously, and it is hexagon that silicon chip vertically inserts the back distribution form.Also be fixed with shower 11 on the vertical shaft 8, evenly the distribute spout of up to a hundred diameter 0.5-0.7mm of tube-surface, spout is vertically opposite with the silicon chip that is inserted on the mouse cage silicon chip frame, spout pressure 1.0Kg/cm
2, shower 11 upper ends are cecum, the lower end links to each other with two boost in pressure pump line roads of KOH flow container, cleaning fluid tank.
CRT touch-screen and cantilever expansion plunger arm: CRT are touching display screen 2, placing one can be all around arbitrarily on the platform 20 of degree of freedom rotation, see Figure 11, fixed axis 17 is clamped on the edge on device top, cantilever 18 two ends are connected and fixed axle 17 and rotation axis 19 respectively, and landing slab 20 is fixed on the rotation axis 19.This cantilever expansion plunger arm can satisfy operating personnel and in different angles equipment be touched and control.
The course of work of this device is as follows: referring to Figure 10;
Open general supply, connect the power supply of respectively organizing valve and pump.Start pneumatic push-button switch and start the air-powered electromagnetic valve, compressed air is introduced the traction cylinder, cylinder promotes by coupling or the traction bell jar moves, and opens reative cell.After will treating that corrosion of silicon is handled cleaning, put into reative cell.Close air-operated solenoid valve, cylinder is oppositely exitted, and bell jar is falling and compressing sealing ring under the effect of gravity, and corrosion work is prepared to begin in the off-response chamber.CRT touch-screen input service by control unit is instructed to computer, and the corrosion elevator pump is opened, and the water loop electromagnetically operated valve is opened on the corrosive liquid.Clean liquid pump and upper and lower penstock Close All, corrosive liquid enters in the reative cell through water supply valve door, pipeline and by mouth spray silicon chip is treated that erosional surface ejects corrosive liquid, reative cell corrosive liquid return valve is opened simultaneously, corrosive liquid repeats to finish the spray process through elevator pump again finishing course of injection after return valve is got back to the filling of corrosion liquid bath.After treating all to finish the work of corrosion program setting, computer sends instruction, corrosive liquid elevator pump, elevator pump pump valve, reative cell corrosive liquid return valve Close All.Open cleaning fluid elevator pump, elevator pump pump valve, reative cell cleaning fluid return valve, repeat the previous whole actions of corrosive liquid.After the action of finishing cleaning procedure control, equipment is power cut-off voluntarily.
Claims (6)
1, a kind of high precision silicon sensor chip corrosion device, comprise industrial computer, electrical control cubicles, reative cell, KOH flow container, cleaning fluid tank, it is characterized in that the computer in the corrosion device has CRT touch-screen and job control program, link to each other with valve, pump on electrical control cubicles, reative cell and the pipeline by communication interface, and be furnished with hand switch; The built-in transmission spraying mechanism of reative cell, its shower links to each other by the submerged pump of liquid line with KOH flow container and cleaning fluid tank; The probe of thermometric, survey concentration is located in the reative cell respectively; The control mode of device:
[1]. corrosive liquid temperature control: water-bath+PID temperature control system
[2]. the dynamic control of etching extent during the corrosion: high accuracy alkalescence concentration controller+computer
[3]. corrosive liquid endless form: dynamically spray+circulation
[4]. the corrosive liquid circulatory system: the miniature elevator pump of anti-highly basic+anticorrosion pipeline+container
[5]. final purging system: H
2O (pure)+circulation line.
2, chip corrosion device according to claim 1 is characterized in that job control program is made of the follow procedure that deposits in the module: (1) initialize routine: parameter is carried out initialization; (2) logging program: divide operator's login, engineer's login, manager to login three kinds of modes, every kind of login mode is with different passwords, the authority difference that has after the login; (3) parameter setting, erosion model option program: setup parameter has chip number, corrosion concentration, corrosion temperature, diaphragm thickness, corrosion depth; Erosion model H
n(N), erosion model is corrosion depth H and etching time t, corrosion temperature T, corrodes the functional relation between the concentration N, according to setting corrosion temperature and corrosion concentration selective etching model H=F for t, T
n(4) with the program of PLC communication: Content of communciation has corrosive liquid temperature value, corrosive liquid concentration value, corrosion depth, setting corrosion depth, equipment bring into operation order, equipment order out of service, industrial computer open state sign, industrial computer off-mode sign; (5) alert program: the overproof alarm of corrosion temperature, the overproof alarm of corrosion concentration are arranged; Eject warning window on the display screen, show " temperature is overproof " or " concentration is overproof "; (6) expert system analysis program: a. calculates corrosion depth by erosion model and etching time, compares according to the corrosion depth of calculating and the corrosion depth of setting, makes the judgement that whether finishes corrosion process; B. online demonstration corrosion depth and etching time; C. online demonstration corrosive liquid concentration and corrosive liquid temperature; (7) data deposit program: deposit the parameter of setting in database.
3, chip corrosion device according to claim 2, the communication program that it is characterized in that PLC is made up of following 8 modules: (1) main program: comprise control corrosive liquid elevator pump (DZ2) working procedure, control flushing liquor elevator pump (DZ1) working procedure, control electric rotating machine (DZ3) working procedure; (2) interrupt routine: timer interrupt routine, carry out corrosive liquid temperature, the collection of corrosive liquid concentration data; (3) beginning, shut down procedure: the order of accepting industrial computer brings into operation equipment, makes equipment out of service if corrosion depth arrives set point; (4) rotating program:, realize the rotating control of motor (DZ3) by the output contact control relay switch (K4) of PLC Programmable Logic Controller (A3); (5) A/D conversion program: the test data of corrosive liquid temperature measuring device and the corrosive liquid concentration tester A/D modular converter by PLC is carried out the A/D conversion, the industrial computer of giving to be sent; (6) A/D numeral sending module:, send to industrial computer with the processing of packing of the numeral of A/D conversion; (7) communication data is carried out the Eigenvalue Analysis program: the packet of the transmission of industrial computer is carried out Eigenvalue Analysis, therefrom decomposite the different command word; Command word is as follows: action command word, the word of ceasing and desisting order, transmission types command word, temperature alarming command word, concentration alarm command word, corrode the tabbing command word, wash tabbing command word, open state command word, off-mode command word, send A/D data command word; (8) data processor after the industrial computer start: in the PLC running, after industrial computer is started shooting again, the image data of plc data memory block is uploaded to industrial computer, the line data of going forward side by side is handled.
4, chip corrosion device according to claim 1, it is characterized in that reative cell is by forming as the bell jar (3) and the cylinder body (4) of lid, the coupling that bell jar (3) has sealing the margin, magnet (B) and promoted by cylinder, cylinder communicates with the source of the gas processor and the source of the gas of air-operated solenoid valve, triplet by pneumatic line, circuit; The cylinder body of reative cell (4) bottom circle centre position has vertical shaft (8), fixing bevel gear wheel (9) and transmission spraying mechanism as bearing table on it; Be fixed with power transmission shaft (13) on cylinder body (4) wall, power transmission shaft (13) has bevel gear (14) in cylinder body (4) wall outer end with intersecting vertically, is 90 ° with power transmission shaft by the fixing gear reduction motor (15) of electric machine support (16) and intersects; Power transmission shaft (13) has bevel pinion (12) at the cylinder body other end, is 90 ° with bevel gear wheel (9) and intersects.
5, chip corrosion device according to claim 4, the mouse cage frame (10) that it is characterized in that the transmission spraying mechanism is the three-dimensional polygon frame concentric with vertical shaft (8), and there is groove mouse cage frame stile both sides, the width of groove equates with silicon wafer thickness, the length of side of polygon frame equates with the width of silicon chip, has equidistant groove can vertically insert 6 of 4 inches silicon chips simultaneously between the framework mutually.
6, chip corrosion device according to claim 4, it is characterized in that also being fixed with on the vertical shaft (8) shower (11), evenly the distribute spout of up to a hundred diameter 0.5-0.7mm of tube-surface, spout and silicon chip in being fixed on mouse cage frame stile present vertical, spout pressure 1.0Kg/cm
2, shower (11) upper end is a cecum, the lower end links to each other with two boost in pressure pump line roads of KOH flow container, cleaning fluid tank.
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| CNB031340989A CN100347829C (en) | 2003-09-28 | 2003-09-28 | Etching device for high precision silicon senser chip |
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| CNB031340989A CN100347829C (en) | 2003-09-28 | 2003-09-28 | Etching device for high precision silicon senser chip |
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| CN101654809B (en) * | 2009-09-25 | 2011-12-21 | 耿彪 | Tank-type crystalline silicon wet-method etching equipment |
| CN102212824A (en) * | 2010-04-09 | 2011-10-12 | 中国科学院微电子研究所 | One-sided silicon wafer wet etching equipment |
| CN102420159A (en) * | 2011-12-15 | 2012-04-18 | 杭州立昂微电子股份有限公司 | Semiconductor wet etching device and method |
| CN103187338B (en) * | 2011-12-30 | 2015-08-19 | 无锡华瑛微电子技术有限公司 | Modularized semiconductor treatment facility |
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| JPH1187305A (en) * | 1997-09-10 | 1999-03-30 | Dainippon Screen Mfg Co Ltd | Substrate-drying apparatus, substrate-processing apparatus equipped therewith, and substrate-drying method |
| JP2000221073A (en) * | 1999-01-29 | 2000-08-11 | Dainippon Screen Mfg Co Ltd | In-tank liquid level detection device for substrate treating device |
| CN1388568A (en) * | 2001-05-30 | 2003-01-01 | S.E.S.株式会社 | Vane type substrate cleaning method and its apparatus |
-
2003
- 2003-09-28 CN CNB031340989A patent/CN100347829C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0810673A (en) * | 1994-06-28 | 1996-01-16 | Dainippon Screen Mfg Co Ltd | Substrate treatment device |
| JPH1187305A (en) * | 1997-09-10 | 1999-03-30 | Dainippon Screen Mfg Co Ltd | Substrate-drying apparatus, substrate-processing apparatus equipped therewith, and substrate-drying method |
| JP2000221073A (en) * | 1999-01-29 | 2000-08-11 | Dainippon Screen Mfg Co Ltd | In-tank liquid level detection device for substrate treating device |
| CN1388568A (en) * | 2001-05-30 | 2003-01-01 | S.E.S.株式会社 | Vane type substrate cleaning method and its apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1601708A (en) | 2005-03-30 |
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