CN100339940C - Film electric crystal array substrate and its micro-shadow mfg. method, and light shade designing method - Google Patents
Film electric crystal array substrate and its micro-shadow mfg. method, and light shade designing method Download PDFInfo
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- CN100339940C CN100339940C CNB031559719A CN03155971A CN100339940C CN 100339940 C CN100339940 C CN 100339940C CN B031559719 A CNB031559719 A CN B031559719A CN 03155971 A CN03155971 A CN 03155971A CN 100339940 C CN100339940 C CN 100339940C
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Abstract
The present invention relates to a film electric crystal array substrate and a microimage manufacturing method thereof and an optical design structure. The microimage manufacturing method has the procedures: firstly, an optical cover is arranged above a substrate, and a photoresistive layer is formed on the substrate; secondly, a display element area of the optical cover is covered, and the exposure manufacturing process of a non-display element area is carried out to the photoresistive layer; thirdly, the non-display element area of the optical cover is covered, and the exposure manufacturing process of the display element area is repeatedly carried out to the photoresisitive layer for at least one time; finally, a development manufacturing process is carried out to pattern the photoresistive layer. A plurality of pixel patterns can be formed in the photoresistive layer corresponding to the display element area, a plurality of periphery line patterns and a plurality of simulation pixel patterns can be formed in the photoresistive layer corresponding to the non-display element area, and each of the simulation pixel patterns is correspondingly bonded with each of the pixel patterns. The present invention can reduce the number of required exposure times in an exposure manufacturing process, traces caused by exposure bonding can be reduced, and the problem of nonuniform brightness caused by poor bonding among multiple exposure manufacturing processes can be effectively reduced.
Description
Technical field
The present invention relates to electric crystal array film substrate and little shadow manufacture method and optical cover design structure in the semiconductor device of a kind of basic electrical component field, particularly relate to a kind of exposure frequency required can reduce exposure manufacture process the time, and can reduce electric crystal array film substrate and little shadow manufacture method and the optical cover design structure that engages the vestige that is produced because of exposure.
Background technology
Thin Film Transistor-LCD, mainly be (to be thin-film transistor array base-plate by electric crystal array film substrate, below all be called electric crystal array film substrate), colorful filter array substrate and liquid crystal layer constitute, electric crystal array film substrate wherein, be by a plurality of thin-film transistors, and a pixel capacitors (Pixel Electrode) of corresponding configuration with each thin-film transistor is formed with arrayed.And above-mentioned thin-film transistor is to comprise gate, channel layer, drain and source electrode, thin-film transistor is intended for the switch element of liquid crystal display, its operating principle and traditional semiconductor MOS element are similar, all are the elements with three terminals (gate, drain and source electrode).
Electric crystal array film substrate can utilize repeatedly little shadow and etching (photolithography and etch) manufacture method to make usually; meaning is promptly carried out the action of multiple tracks exposure; with with the photoresist layer of the design transfer on a plurality of light shields to the substrate; and then through step of developing with the patterning photoresist layer; utilize this patterned light blockage layer the rete on the substrate to be carried out etching afterwards again, and form each element pattern as etch mask.
Wherein, the employed device of exposure manufacture process, but generally include the substrate stage that moves in order to mounting substrate and Quadratic Finite Element, and have the light shield of pattern and can do the light shield platform that Quadratic Finite Element moves in order to mounting.When carrying out exposure manufacture process, be mobile one by one light shield platform of one side and substrate stage, simultaneously the process of the pattern on light shield projection optical system transferred to the photoresist layer on the substrate.So-called exposure manufacture process, knownly mainly contain two types, be about to the blanket type exposure manufacture process of the photoresist layer of whole patterns transcriptions simultaneously to the substrate on the cover curtain, and the scanning type exposure processing procedure of the photoresist layer of the continuous pattern transfer that will cover act of one side synchronous scanning cover curtain platform and substrate platform and one side to the substrate.Wherein, for the demand that maximizes in the viewing area that shows device in response to the liquid crystal white, the scanning type exposure processing procedure more is widely used in the making of large-scale LCD.
The existing known scanning type exposure processing procedure that is applied to electric crystal array film substrate is to use light shield for example shown in Figure 1, and light shield 100 is divided into the peripheral pattern area 110 and the central pattern area 120 of left and right side in regular turn.Have a plurality of pixel patterns 122 in the wherein central pattern area 120, and have two driving element patterns 124 at the edge of central pattern area 120.In addition, have a plurality of pixel patterns 112 and perimeter circuit pattern 114 in the peripheral pattern area 110.In addition, the edge of peripheral pattern area 110 also has a driving element pattern 116 respectively.Then, make above-mentioned light shield 100 and the same moved further of substrate, and each pattern area is carried out the one or many exposure, with the photoresist layer of design transfer to the substrate, and these patterns are bonded with each other, can finish the exposure manufacture process of one light shield on the electric crystal array film substrate.
See also shown in Figure 2, it is the structural representation that has known electric crystal array film substrate now, after the peripheral pattern area 110 of the left and right side by light shield 100 is respectively carried out the action of single exposure, can be with the design transfer of the peripheral pattern area 110 of left and right side on the light shield 100 photoresist layer (not shown) to the substrate 150, pass through step of developing afterwards, utilize patterned light blockage layer the rete (not shown) on the substrate to be carried out etching again, can on substrate 150, form the peripheral element district 110a of left and right side as etch mask.Wherein, be to comprise pixel structure 112a, perimeter circuit 114a and driving element 116a among the peripheral element district 110a of left and right side.In addition, central pattern area 120 on the light shield 100 is through the action of repeated exposure, can be to the photoresist layer of substrate 150 with central pattern area 120 design transfer on the light shield 100, pass through step of developing afterwards, utilize patterned light blockage layer the rete on the substrate to be carried out etching again as etch mask, can form central viewing area 120a, 120b, 120c on substrate 150, wherein, be to comprise pixel structure 122a and driving element 124a among central viewing area 120a, 120b, the 120c.
Please consult Figure 1 and Figure 2 simultaneously, pixel structure 122a among central authorities viewing area 120a, 120b, the 120c, the pixel structure 112a that reaches among the peripheral element district 110a engages along closing line L1～L4 respectively, and forms 130 (zones that dotted line surrounded among the figure), panel viewing area.Wherein, because closing line L1～L4 all is arranged in panel viewing area 130, will make to produce vestige because of alignment error when occurring engaging in the panel viewing area 130.
Above-mentioned scanning type exposure processing procedure, though can keep good imaging characteristic, and the exposure device that need not maximize just can obtain big exposure area.Yet, because above-mentioned scanning type exposure processing procedure need carry out the action of repeated exposure to central pattern area, and except the pixel pattern that is come by the central pattern area transfer of light shield can engage in the panel viewing area, the pixel pattern that is come by the peripheral element district transfer of the left and right side on the light shield also must engage with the pixel pattern of central pattern area in the panel viewing area, if produce alignment error slightly in the contraposition of light shield, will produce vestige at joint, and the related briliancy uniformity that influences whole front panel.
This shows that above-mentioned existing electric crystal array film substrate and little shadow manufacture method thereof and photomask structure still have many defectives, and demand urgently further being improved.In order to solve the defective of existing electric crystal array film substrate and little shadow manufacture method and photomask structure, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, this obviously is the problem that the anxious desire of relevant dealer solves.
Because the defective that above-mentioned existing electric crystal array film substrate and little shadow manufacture method thereof and photomask structure exist, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, actively studied innovation, in the hope of founding a kind of new electric crystal array film substrate and little shadow manufacture method and optical cover design structure, can improve existing electric crystal array film substrate and little shadow manufacture method and photomask structure, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
Main purpose of the present invention is, overcome the defective that existing electric crystal array film substrate and little shadow manufacture method thereof and photomask structure exist, and provide a kind of new electric crystal array film substrate and little shadow manufacture method and optical cover design structure, technical problem underlying to be solved is that it can be reduced because of not good to have joint not good if aim between the multiexposure, multiple exposure processing procedure, and the problem that causes luminance nonuniformity to be spared, thereby be suitable for practicality more, and have the value on the industry.
Purpose of the present invention and to solve its technical problem underlying be to adopt following technical scheme to realize.Little shadow manufacture method of a kind of electric crystal array film substrate that proposes according to the present invention, it may further comprise the steps: a light shield is provided, this light shield has two non-display element districts and a display element district, wherein those non-display element districts are positioned at the relative both sides in this display element district, and this display element district and the preset distance of respectively being separated by between this non-display element district, and contiguous this display element district part is that design has a plurality of plan pixel patterns in those non-display element districts; This light shield is arranged on substrate top, and has been formed with a photoresist layer on this substrate; This display element district of this light shield is covered, this photoresist layer is carried out the exposure manufacture process in non-display element district; Those non-display element districts of this light shield are covered, this photoresist layer is repeated the exposure manufacture process at least display element district; And carry out a developing manufacture process, with this photoresist layer of patterning, be to be formed with a plurality of pixel patterns in this photoresist layer corresponding to this place, display element district wherein, be to be formed with a plurality of perimeter circuit patterns and a plurality of plan pixel pattern in this photoresist layer corresponding to those non-display element district parts, and those plan pixel patterns engage with those pixel patterns.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Little shadow manufacture method of aforesaid electric crystal array film substrate, edge in this display element district of wherein said light shield comprises that more design has a plurality of driving element patterns, and those driving element patterns are near the same side in the in addition relative both sides in this display element district.
Purpose of the present invention and solve its technical problem underlying and also realize by the following technical solutions.A kind of optical cover design structure that is used for electric crystal array film substrate according to the present invention's proposition, it has a display element district and two non-display element districts, wherein those non-display element districts are positioned at the relative both sides in this display element district, and this display element district and the preset distance of respectively being separated by between this non-display element district, this light shield comprises: a plurality of pixel patterns are configured in this display element district; A plurality of perimeter circuit patterns are configured in those non-display element districts; And a plurality of plan pixel patterns, be configured in those non-display element districts that are adjacent to this display element district.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The optical cover design structure of aforesaid electric crystal array film substrate, it more comprises a plurality of driving element patterns, is configured in the edge in this display element district, those driving element patterns are near the same side in the in addition relative both sides in this display element district.
Purpose of the present invention and solve its technical problem underlying and also realize by the following technical solutions.A kind of electric crystal array film substrate according to the present invention's proposition, it has two non-panel viewing areas and a panel viewing area, those non-panel viewing areas are positioned at the relative both sides of this panel viewing area, and this panel viewing area and the preset distance of respectively being separated by between this non-panel viewing area, this substrate comprises: a plurality of pixel structures are configured in this panel display element; A plurality of perimeter circuits are configured in those non-panel viewing areas; And a plurality of plan pixel structures, be configured in those non-panel viewing areas, and those plan pixel structures are to engage in those non-panel viewing areas with those pixel structures.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid electric crystal array film substrate, it more comprises a plurality of driving elements, is configured in the edge in this panel viewing area, those driving elements are near the same side in the in addition relative both sides of this panel viewing area.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, in order to reach aforementioned goal of the invention, major technique of the present invention thes contents are as follows:
The present invention proposes a kind of optical cover design structure that is used for electric crystal array film substrate, and it has a display element district and a non-display element district.This light shield is made of a plurality of pixel patterns, a plurality of perimeter circuit pattern and a plurality of plan pixel pattern.Wherein pixel pattern is disposed in the display element district, and the perimeter circuit pattern arrangement is intended pixel pattern and then is disposed in the non-display element district that is adjacent to the display element district in non-display element district.
In the optical cover design structure of electric crystal array film substrate of the present invention, non-display element district is the both sides that are positioned at the display element district, and the edge in display element district, more for example disposes a plurality of driving element patterns.
Based on the above-mentioned optical cover design structure that is used for electric crystal array film substrate, the present invention proposes a kind of little shadow manufacture method of electric crystal array film substrate again.At first, provide the light shield that is used for electric crystal array film substrate of the present invention.Then, this light shield is arranged on substrate top, and has been formed with a photoresist layer on this substrate.Then, the display element district of light shield is covered, photoresist layer is carried out the exposure manufacture process in non-display element district.Continue it, the non-display element district of light shield is covered, photoresist layer is repeated the exposure manufacture process at least display element district.At last, carry out a developing manufacture process, with the patterning photoresist layer.Wherein corresponding to forming a plurality of pixel patterns in the photoresist layer of display element district part, and can form a plurality of perimeter circuit patterns and a plurality of plan pixel pattern in the photoresist layer corresponding to non-display element district part, and each intends the corresponding joint with each pixel pattern of pixel pattern.
By the exposure manufacture process of above-mentioned electric crystal array film substrate, utilize patterned light blockage layer the rete on the substrate to be carried out etching again as etch mask, just can obtain electric crystal array film substrate of the present invention.Electric crystal array film substrate of the present invention has a non-panel viewing area and a panel viewing area.This electric crystal array film substrate is made of a plurality of pixel structures, a plurality of periphery circuit and a plurality of plan pixel structure.Wherein, pixel structure is disposed in the panel viewing area, and perimeter circuit is disposed in the non-panel viewing area.In addition, intend pixel structure and be disposed in the non-panel viewing area, and each plan pixel structure is a corresponding joint in non-panel viewing area with each pixel structure.
In electric crystal array film substrate of the present invention, non-panel viewing area is the both sides that are positioned at the panel viewing area.In addition, electric crystal array film substrate of the present invention more for example comprises a plurality of driving elements, and these driving elements are the edges that are disposed in the panel viewing area.
Based on above-mentioned, the optical cover design structure of electric crystal array film substrate of the present invention is a plurality of plan pixel patterns of configuration and a plurality of perimeter circuit pattern in non-display element district, and disposes a plurality of pixel patterns in the display element district.Follow exposure manufacture process by electric crystal array film substrate of the present invention, can see through a plurality of light shields of using optical cover design structure of the present invention, respectively photoresist layer is carried out the multiple tracks exposure and the developing manufacture process in display element district and non-display element district, and utilize patterned light blockage layer the rete on the substrate to be carried out etching as etch mask, finally can form electric crystal array film substrate of the present invention.
By technique scheme, electric crystal array film substrate of the present invention and exposure manufacture process thereof and optical cover design structure are that the plan pixel pattern pixel pattern next with being shifted by the display element district that will be come by the transfer of non-display element district engages.Meaning promptly moves on to original pattern joint outside the panel viewing area, thereby reduces the chance that produces vestige because of the exposure joint.In addition, compare with existing known scanning type exposure processing procedure, in the optical cover design structure of the present invention, only stay plan pixel structure required when exposing joint in the non-display element district, reducing the width in the non-display element district on the light shield, and increase the width in display element district relatively.Thus, in the exposure manufacture process of electric crystal array film substrate of the present invention, can reduce exposure frequency required when exposing joint, and can shorten the time of processing procedure, and can improve production capacity.
In sum, the electric crystal array film substrate that the present invention is special and little shadow manufacture method and optical cover design structure, required exposure frequency in the time of can reducing exposure manufacture process, and can reduce the vestige that is produced because of the exposure joint, can effectively reduce because of not good to have joint not good if aim between the multiexposure, multiple exposure processing procedure, and cause the even problem of luminance nonuniformity, thereby be suitable for practicality more; The present invention also can shorten the time of processing procedure and can improve production capacity, has the extensive value of industry.It has above-mentioned many advantages and practical value, on product and manufacture method, really belong to innovation, bigger improvement is all arranged on product structure, manufacture method or function, more existing electric crystal array film substrate and little shadow manufacture method thereof and photomask structure have the multinomial effect of enhancement, have than much progress technically, and produced handy and practical effect, quite have the extensive value of industry, thereby being suitable for practicality more, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, below with preferred embodiment of the present invention and conjunction with figs. describe in detail as after.
Description of drawings
Fig. 1 is existing known photomask structure schematic diagram.
Fig. 2 is the structural representation that has known electric crystal array film substrate now.
Fig. 3 is the schematic diagram that is used for the optical cover design structure of electric crystal array film substrate of the present invention.
Fig. 4 a～Fig. 4 d is the wherein schematic flow sheet of one little shadow manufacture method of electric crystal array film substrate of the present invention.
Fig. 5 is the floor map of electric crystal array film substrate of the present invention.
100: light shield 110: peripheral pattern area
110a: peripheral element district 112: pixel pattern
112a: pixel structure 114: perimeter circuit pattern
114a: perimeter circuit 116: driving element pattern
116a: driving element 120: central pattern area
120a～120c: central viewing area 122: pixel pattern
122a: pixel structure 124: driving element pattern
124a: driving element 130: panel viewing area
150: electric crystal array film substrate 200: light shield
210: display element district 212: pixel pattern
214: driving element pattern 220: non-display element district
220a: left side non-display element district 220b: the non-display element in right side district
222: perimeter circuit pattern 224: intend pixel pattern
300: substrate 301: rete
302: resistance layer 312a: first pixel pattern
312b: the second pixel pattern 312c: the first pixel pattern image
312d: the second pixel pattern image 314: driving element pattern
314a: driving element pattern image 322: perimeter circuit pattern
322a: perimeter circuit pattern image 324: intend pixel pattern
324a: intend pixel pattern image 400: electric crystal array film substrate
410: panel viewing area 412: non-panel viewing area
412a: the first pixel structure 412b: second pixel structure
414: driving element 422: perimeter circuit
424: intend pixel structure L1～L4: closing line
A1～A3: closing line
Embodiment
Below in conjunction with accompanying drawing and preferred embodiment, to electric crystal array film substrate and little shadow manufacture method and its concrete structure of optical cover design structure, manufacture method, step, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Hereinafter the optical cover design structure of electric crystal array film substrate of the present invention will be described at first, and enumerate wherein one exposure manufacture process of electric crystal array film substrate of the present invention, and through formed electric crystal array film substrate after development and the etching, the present invention is done more abundant, clearly elaboration.
At first seeing also shown in Figure 3ly, is the schematic diagram that is used for the optical cover design structure of electric crystal array film substrate of the present invention.Light shield 200 of the present invention can be divided into the display element district 210 of central authorities, the non-display element district 220 of both sides.Wherein, display element district 210 for example comprises pixel pattern 212 and a plurality of driving element pattern 214, but not display element district 220 for example comprises perimeter circuit pattern 222 and intends pixel pattern 224.In addition, non-display element district 220 can be subdivided into left side non-display element district 220a and right side non-display element district 220b again.
Seeing also shown in Fig. 4 a to Fig. 4 e, is respectively the wherein schematic flow sheet of one little shadow manufacture method of electric crystal array film substrate of the present invention.At first shown in Fig. 4 a, above-mentioned light shield 200 is arranged on a substrate 300 tops, and has been formed with a rete 301 on this substrate 300, and be formed with a photoresist layer 302 on the rete 301.Display element district 210 and the right side non-display element district 220b of light shield 200 is covered, and photoresist layer 302 carried out the exposure manufacture process of left side non-display element district 220a, be transferred in the photoresist layer 302 with pattern (comprise perimeter circuit pattern 222 and intend pixel pattern 224) the left side of light shield 200 non-display element district 220a.
Then shown in Fig. 4 b, the left side of light shield 200 non-display element district 220a and right side non-display element district 220b are covered, photoresist layer 302 is carried out the exposure manufacture process in primary display element district 210, be transferred in the photoresist layer 302 with pattern (comprising pixel pattern 212 and a plurality of driving element pattern 214) with the display element district 210 of light shield 200.Particularly, in photoresist layer 302, the pixel pattern image 312a that comes by display element district 210 transfers of light shield 200, the plan pixel pattern image 324 that needs to come with being shifted by the left side of light shield 200 non-display element district 220a engage.
Then shown in Fig. 4 c, continue to cover the left side non-display element district 220a and the right side non-display element district 220b of light shield 200, and light shield 200 is moved to right, then photoresist layer 302 is carried out the exposure manufacture process in secondary display element district 210, be transferred in the photoresist layer 302 with pattern (comprising pixel pattern 212 and a plurality of driving element pattern 214) with the display element district 210 of light shield 200.And in photoresist layer 302, the exposure manufacture process first time in display element district 210 shifts and next pixel pattern image 312a, needs the pixel pattern image 312b that comes with the exposure manufacture process transfer second time in display element district 210 to engage.
At last, shown in Fig. 4 d, the left side of light shield 200 non-display element district 220a and display element district 210 are covered, photoresist layer 302 is carried out the exposure manufacture process of display element district, right side 220b, be transferred in the photoresist layer 302 with pattern (comprise perimeter circuit pattern 222 and intend pixel pattern 224) with the right side of light shield 200 non-display element district 220b.And, in photoresist layer 302, shift and next plan pixel pattern image 324 by the right side of light shield 200 non-display element district 220b, need engage with the pixel pattern image 312b that comes by display element district 210 transfers of light shield 200.
Afterwards, see also shown in Fig. 4 e, carry out a development step,, and form periphery circuit pattern 322a, plan pixel pattern 324a, pixel pattern 312c, 312d and driving element pattern 314a with patterning photoresist layer 302.Wherein intending pixel pattern 324a is to engage with pixel pattern 312c, 312d.
As etch mask, the rete on the substrate 300 301 is carried out etching by above-mentioned patterned light blockage layer, finally just can obtain electric crystal array film substrate of the present invention.Seeing also shown in Figure 5ly, is the floor map of electric crystal array film substrate of the present invention.Electric crystal array film substrate 400 for example comprises substrate 300, the first pixel structure 412a, the second pixel structure 412b, driving element 414, periphery circuit 422 and intends pixel structure 424.The first pixel structure 412a engages along closing line A2 with the second pixel structure 412b, and constitutes the panel viewing area 410 (zone that dotted line surrounded among the figure) of electric crystal array film substrate 400 of the present invention.In addition, intending pixel structure 424 engages in non-panel viewing area 412 along closing line A1 and closing line A3 with the first pixel structure 412a and the second pixel structure 412b respectively.Thus, in the time of can avoiding the first pixel structure 412a and the second pixel structure 412b and intend pixel structure 424 and engage, because of slightly the vestige that alignment error caused can occur in panel viewing area 410.
In sum, use the optical cover design structure of electric crystal array film substrate of the present invention, the exposure manufacture process of the electric crystal array film substrate of the present invention of arranging in pairs or groups can be produced electric crystal array film substrate of the present invention.Wherein, the exposure manufacture process of electric crystal array film substrate of the present invention is to engage with pixel pattern in the display element district by a plurality of plan pixel patterns in the non-display element district.Meaning promptly moves on to original pattern joint outside the viewing area of electric crystal array film substrate, to reduce the chance that produces vestige because of the exposure joint.In addition, in the optical cover design structure of the present invention, only comprise plan pixel structure required when perimeter circuit pattern and exposure engage in the non-display element district, thus, can reduce non-display element district on the light shield shared area in whole light shield, and make the area in display element district increase relatively.Therefore, when carrying out the exposure manufacture process of electric crystal array film substrate of the present invention, can use less exposure frequency to form display element district on the electric crystal array film substrate, and can shorten the time of processing procedure, and can improve production capacity.
It should be noted that, in the foregoing description only wherein one exposure manufacture process with regard to electric crystal array film substrate of the present invention make an explanation, in fact electric crystal array film substrate of the present invention is by a plurality of light shields, and made by multiple tracks exposure, development and etched step.In addition, exposure manufacture process of the present invention has more than and is limited to use in the making of electric crystal array film substrate, and it more can and change optical cover design structure through improvement partly, and can be applicable in the association areas such as other semiconductor element or micro electronmechanical processing procedure.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, but every content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (6)
1, a kind of little shadow manufacture method of electric crystal array film substrate is characterized in that it may further comprise the steps:
One light shield is provided, this light shield has two non-display element districts and a display element district, wherein those non-display element districts are positioned at the relative both sides in this display element district, and this display element district and the preset distance of respectively being separated by between this non-display element district, and contiguous this display element district part is that design has a plurality of plan pixel patterns in those non-display element districts;
This light shield is arranged on substrate top, and has been formed with a photoresist layer on this substrate;
This display element district of this light shield is covered, this photoresist layer is carried out the exposure manufacture process in non-display element district;
Those non-display element districts of this light shield are covered, this photoresist layer is repeated the exposure manufacture process at least display element district; And
Carry out a developing manufacture process, with this photoresist layer of patterning, be to be formed with a plurality of pixel patterns in this photoresist layer corresponding to this place, display element district wherein, be to be formed with a plurality of perimeter circuit patterns and a plurality of plan pixel pattern in this photoresist layer corresponding to those non-display element district parts, and those plan pixel patterns engage with those pixel patterns.
2, little shadow manufacture method of electric crystal array film substrate according to claim 1, it is characterized in that the edge in this display element district of wherein said light shield comprises that more design has a plurality of driving element patterns, those driving element patterns are near the same side in the both sides relatively in addition in this display element district.
3, a kind of optical cover design structure that is used for electric crystal array film substrate, it has a display element district and two non-display element districts, wherein those non-display element districts are positioned at the relative both sides in this display element district, and this display element district and the preset distance of respectively being separated by between this non-display element district is characterized in that this light shield comprises:
A plurality of pixel patterns are configured in this display element district;
A plurality of perimeter circuit patterns are configured in those non-display element districts; And
A plurality of plan pixel patterns are configured in those non-display element districts that are adjacent to this display element district.
4, the optical cover design structure of electric crystal array film substrate according to claim 3, it is characterized in that it more comprises a plurality of driving element patterns, be configured in the edge in this display element district, those driving element patterns are near the same side in the in addition relative both sides in this display element district.
5, a kind of electric crystal array film substrate, it has two non-panel viewing areas and a panel viewing area, those non-panel viewing areas are positioned at the relative both sides of this panel viewing area, and this panel viewing area and the preset distance of respectively being separated by between this non-panel viewing area, it is characterized in that this substrate comprises:
A plurality of pixel structures are configured in this panel display element;
A plurality of perimeter circuits are configured in those non-panel viewing areas; And
A plurality of plan pixel structures are configured in those non-panel viewing areas, and those plan pixel structures are to engage in those non-panel viewing areas with those pixel structures.
6, electric crystal array film substrate according to claim 5 is characterized in that it more comprises a plurality of driving elements, is configured in the edge in this panel viewing area, and those driving elements are near the same side in the in addition relative both sides of this panel viewing area.
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| CNB031559719A CN100339940C (en) | 2003-08-28 | 2003-08-28 | Film electric crystal array substrate and its micro-shadow mfg. method, and light shade designing method |
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| CNB031559719A CN100339940C (en) | 2003-08-28 | 2003-08-28 | Film electric crystal array substrate and its micro-shadow mfg. method, and light shade designing method |
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| CN100339940C true CN100339940C (en) | 2007-09-26 |
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| CN101271267B (en) * | 2007-03-21 | 2012-09-19 | 鸿富锦精密工业（深圳）有限公司 | Production method of exposure light shield and thin film graphic pattern layer |
| CN107290879B (en) * | 2017-08-11 | 2020-06-09 | 深圳市华星光电技术有限公司 | Light shield for liquid crystal display panel |
| CN110398848A (en) * | 2019-07-22 | 2019-11-01 | 深圳市华星光电半导体显示技术有限公司 | A kind of light shield, array substrate and preparation method thereof |
| CN113671789A (en) * | 2020-05-14 | 2021-11-19 | 咸阳彩虹光电科技有限公司 | Photomask, exposure method and exposure system |
| US11854808B2 (en) * | 2021-08-30 | 2023-12-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photo mask and lithography method using the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6087648A (en) * | 1997-07-01 | 2000-07-11 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix display device and method of manufacturing the same |
| JP2003156831A (en) * | 2001-11-21 | 2003-05-30 | Toshiba Corp | Mask, method for producing mask and apparatus therefor |
| US6583439B2 (en) * | 1998-05-15 | 2003-06-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
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2003
- 2003-08-28 CN CNB031559719A patent/CN100339940C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6087648A (en) * | 1997-07-01 | 2000-07-11 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix display device and method of manufacturing the same |
| US6583439B2 (en) * | 1998-05-15 | 2003-06-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2003156831A (en) * | 2001-11-21 | 2003-05-30 | Toshiba Corp | Mask, method for producing mask and apparatus therefor |
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| CN1591773A (en) | 2005-03-09 |
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