CH655518B - - Google Patents
Info
- Publication number
- CH655518B CH655518B CH360083A CH360083A CH655518B CH 655518 B CH655518 B CH 655518B CH 360083 A CH360083 A CH 360083A CH 360083 A CH360083 A CH 360083A CH 655518 B CH655518 B CH 655518B
- Authority
- CH
- Switzerland
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1889—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US39444282A | 1982-07-01 | 1982-07-01 | |
| US50116783A | 1983-06-10 | 1983-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH655518B true CH655518B (US06174465-20010116-C00003.png) | 1986-04-30 |
Family
ID=27014738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH360083A CH655518B (US06174465-20010116-C00003.png) | 1982-07-01 | 1983-06-30 |
Country Status (15)
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3339946A1 (de) * | 1983-11-04 | 1985-05-23 | Klaus 6500 Mainz Eisenmenger | Verfahren zum metallisieren der bohrungswandungen in leiterplatten |
| DE3412447A1 (de) * | 1984-03-31 | 1985-11-28 | Schering AG, 1000 Berlin und 4709 Bergkamen | Verfahren zur herstellung von gedruckten schaltungen |
| US4891069A (en) * | 1986-06-06 | 1990-01-02 | Techno Instruments Investments 1983 Ltd. | Composition for the electrolytic coating of circuit boards without an electroless metal coating |
| US4749449A (en) * | 1987-06-05 | 1988-06-07 | E. I. Du Pont De Nemours And Company | Metallization utilizing a catalyst which is removed or deactivated from undesired surface areas |
| US5007990A (en) * | 1987-07-10 | 1991-04-16 | Shipley Company Inc. | Electroplating process |
| DE3741459C1 (de) * | 1987-12-08 | 1989-04-13 | Blasberg Oberflaechentech | Verfahren zur Herstellung durchkontaktierter Leiterplatten |
| US4810333A (en) * | 1987-12-14 | 1989-03-07 | Shipley Company Inc. | Electroplating process |
| US4895739A (en) * | 1988-02-08 | 1990-01-23 | Shipley Company Inc. | Pretreatment for electroplating process |
| US4873136A (en) * | 1988-06-16 | 1989-10-10 | General Electric Company | Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom |
| US5004525A (en) * | 1988-08-23 | 1991-04-02 | Shipley Company Inc. | Copper electroplating composition |
| US5068013A (en) * | 1988-08-23 | 1991-11-26 | Shipley Company Inc. | Electroplating composition and process |
| US4969979A (en) * | 1989-05-08 | 1990-11-13 | International Business Machines Corporation | Direct electroplating of through holes |
| DE3928832C2 (de) * | 1989-08-31 | 1995-04-20 | Blasberg Oberflaechentech | Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug |
| AU644602B2 (en) * | 1989-08-31 | 1993-12-16 | Blasberg-Oberflachentechnik Gmbh | Plated-through printed circuit board with resist and process for producing it |
| US5342501A (en) * | 1989-11-21 | 1994-08-30 | Eric F. Harnden | Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating |
| US5071517A (en) * | 1989-11-21 | 1991-12-10 | Solution Technology Systems | Method for directly electroplating a dielectric substrate and plated substrate so produced |
| US4959121A (en) * | 1990-01-05 | 1990-09-25 | General Electric Company | Method for treating a polyimide surface for subsequent plating thereon |
| US5207888A (en) * | 1991-06-24 | 1993-05-04 | Shipley Company Inc. | Electroplating process and composition |
| US5376248A (en) * | 1991-10-15 | 1994-12-27 | Enthone-Omi, Inc. | Direct metallization process |
| DE4138214A1 (de) * | 1991-11-21 | 1993-05-27 | Daimler Benz Ag | Verfahren zur metallisierung von aluminiumnitridkeramik |
| US5262042A (en) * | 1991-12-12 | 1993-11-16 | Eric F. Harnden | Simplified method for direct electroplating of dielectric substrates |
| DE4206680C1 (de) * | 1992-02-28 | 1994-01-27 | Schering Ag | Verfahren zur Metallisierung von Nichtleiteroberflächen und die Verwendung von Hydroxymethansulfinsäure im Verfahren |
| US5262041A (en) * | 1992-12-11 | 1993-11-16 | Shipley Company Inc. | Additive plating process |
| US5415762A (en) * | 1993-08-18 | 1995-05-16 | Shipley Company Inc. | Electroplating process and composition |
| DE4412463C3 (de) * | 1994-04-08 | 2000-02-10 | Atotech Deutschland Gmbh | Verfahren zur Herstellung einer Palladium-Kolloid-Lösung und ihre Verwendung |
| US5626736A (en) | 1996-01-19 | 1997-05-06 | Shipley Company, L.L.C. | Electroplating process |
| DE19643823C2 (de) * | 1996-10-30 | 2002-10-17 | Lpw Chemie Gmbh | Verfahren zur direkten Funktionsmetallisierung der Oberfläche eines Kunststoffgegenstandes |
| FR2946433B1 (fr) | 2009-06-05 | 2013-07-12 | Ecole Polytechnique Dgar | Utilisation d'une couche de silicium amorphe et procede d'analyse |
| KR101460749B1 (ko) * | 2013-06-12 | 2014-11-13 | (주)제이스 | 우수한 방열성을 갖는 Ｍｅｔａｌ ＰＣＢ 적층 기술 개발 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2733198A (en) * | 1956-01-31 | Acid copper plating bath | ||
| US3095608A (en) * | 1959-12-09 | 1963-07-02 | Cabot Corp | Process and apparatus for extruding and curing polymeric compositions |
| US3099608A (en) * | 1959-12-30 | 1963-07-30 | Ibm | Method of electroplating on a dielectric base |
| US3414493A (en) * | 1965-10-19 | 1968-12-03 | Lea Ronal Inc | Electrodeposition of copper |
| DE1790293B2 (de) * | 1966-02-22 | 1973-12-13 | Photocircuits Corp., Glen Cove, N.Y. (V.St.A.) | Verfahren zur Herstellung von ge druckten Schaltungen Ausscheidung aus 1665314 |
| US3682671A (en) * | 1970-02-05 | 1972-08-08 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
| FR2102630A5 (en) * | 1970-08-12 | 1972-04-07 | Commissariat Energie Atomique | Insulant-metal-bond formation process - esp for metal coating of quartz tubes |
| FR2122456B1 (US06174465-20010116-C00003.png) * | 1971-01-20 | 1976-07-23 | Hoechst Ag | |
| US3984290A (en) * | 1973-10-01 | 1976-10-05 | Georgy Avenirovich Kitaev | Method of forming intralayer junctions in a multilayer structure |
| US4336114A (en) * | 1981-03-26 | 1982-06-22 | Hooker Chemicals & Plastics Corp. | Electrodeposition of bright copper |
-
1983
- 1983-06-27 DE DE19833323476 patent/DE3323476A1/de active Granted
- 1983-06-28 GB GB08317516A patent/GB2123036B/en not_active Expired
- 1983-06-29 CA CA000431423A patent/CA1226846A/en not_active Expired
- 1983-06-29 SE SE8303716A patent/SE462434B/sv not_active IP Right Cessation
- 1983-06-30 KR KR8302962A patent/KR890002623B1/ko not_active IP Right Cessation
- 1983-06-30 DK DK303083A patent/DK303083A/da not_active Application Discontinuation
- 1983-06-30 FR FR838310851A patent/FR2529582B1/fr not_active Expired
- 1983-06-30 IL IL69122A patent/IL69122A/xx not_active IP Right Cessation
- 1983-06-30 CH CH360083A patent/CH655518B/de not_active IP Right Cessation
- 1983-06-30 AT AT0240783A patent/AT383149B/de not_active IP Right Cessation
- 1983-07-01 IT IT8348608A patent/IT1208659B/it active
- 1983-07-01 NL NL8302344A patent/NL8302344A/nl not_active Application Discontinuation
- 1983-07-01 ES ES523785A patent/ES523785A0/es active Granted
- 1983-07-01 AU AU16481/83A patent/AU564034B2/en not_active Ceased
-
1984
- 1984-01-24 IN IN68/DEL/84A patent/IN160555B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB8317516D0 (en) | 1983-08-03 |
| SE8303716L (sv) | 1984-01-02 |
| ES8404769A1 (es) | 1984-05-16 |
| NL8302344A (nl) | 1984-02-01 |
| AU564034B2 (en) | 1987-07-30 |
| CA1226846A (en) | 1987-09-15 |
| DE3323476A1 (de) | 1984-01-05 |
| DK303083D0 (da) | 1983-06-30 |
| FR2529582A1 (fr) | 1984-01-06 |
| IL69122A (en) | 1987-01-30 |
| IL69122A0 (en) | 1983-10-31 |
| IT1208659B (it) | 1989-07-10 |
| KR840005498A (ko) | 1984-11-14 |
| ATA240783A (de) | 1986-10-15 |
| SE462434B (sv) | 1990-06-25 |
| SE8303716D0 (sv) | 1983-06-29 |
| DK303083A (da) | 1984-01-02 |
| GB2123036A (en) | 1984-01-25 |
| ES523785A0 (es) | 1984-05-16 |
| GB2123036B (en) | 1986-07-09 |
| IT8348608A0 (it) | 1983-07-01 |
| AU1648183A (en) | 1984-01-05 |
| KR890002623B1 (en) | 1989-07-20 |
| DE3323476C2 (US06174465-20010116-C00003.png) | 1988-10-20 |
| FR2529582B1 (fr) | 1989-05-19 |
| AT383149B (de) | 1987-05-25 |
| IN160555B (US06174465-20010116-C00003.png) | 1987-07-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |