CH622163GA3 - Method for the series production of printed circuits of small dimensions - Google Patents

Method for the series production of printed circuits of small dimensions Download PDF

Info

Publication number
CH622163GA3
CH622163GA3 CH476979A CH476979A CH622163GA3 CH 622163G A3 CH622163G A3 CH 622163GA3 CH 476979 A CH476979 A CH 476979A CH 476979 A CH476979 A CH 476979A CH 622163G A3 CH622163G A3 CH 622163GA3
Authority
CH
Switzerland
Prior art keywords
printed circuits
assembly frame
fitting
substrate material
small dimensions
Prior art date
Application number
CH476979A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to CH476979A priority Critical patent/CH622163GA3/en
Priority to DE19803011755 priority patent/DE3011755A1/en
Priority to FR8008916A priority patent/FR2457588A1/en
Publication of CH622163GA3 publication Critical patent/CH622163GA3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The printed circuits (2) provided with conductor tracks and separated from the remaining substrate material are inserted into special cutouts in a template-like assembly frame (7) and elastically clamped in a predetermined position in these cutouts. This is followed by fitting circuit components to the printed circuits (2) held in the assembly frame (7) and aligned in the favourable position for fitting the components. The assembly frame is advantageously strip-shaped and consists of steel. The method leads to savings in substrate material and results in a more accurate positioning and proper holding of the printed circuits during the fitting process, the bonding or other further processing of the printed circuits (2) to become the actual printed circuits or electronic modules for hearing aids, pocket calculators, electronic clocks and so forth. <IMAGE>
CH476979A 1979-05-22 1979-05-22 Method for the series production of printed circuits of small dimensions CH622163GA3 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CH476979A CH622163GA3 (en) 1979-05-22 1979-05-22 Method for the series production of printed circuits of small dimensions
DE19803011755 DE3011755A1 (en) 1979-05-22 1980-03-26 METHOD FOR THE SERIAL PRODUCTION OF PRINTED CIRCUITS OF SMALL DIMENSIONS
FR8008916A FR2457588A1 (en) 1979-05-22 1980-04-21 PROCESS FOR THE SERIAL MANUFACTURE OF LOW DIMENSIONAL PRINTED CIRCUITS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH476979A CH622163GA3 (en) 1979-05-22 1979-05-22 Method for the series production of printed circuits of small dimensions

Publications (1)

Publication Number Publication Date
CH622163GA3 true CH622163GA3 (en) 1981-03-31

Family

ID=4282213

Family Applications (1)

Application Number Title Priority Date Filing Date
CH476979A CH622163GA3 (en) 1979-05-22 1979-05-22 Method for the series production of printed circuits of small dimensions

Country Status (3)

Country Link
CH (1) CH622163GA3 (en)
DE (1) DE3011755A1 (en)
FR (1) FR2457588A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3113031A1 (en) * 1981-04-01 1982-10-21 Hagenuk GmbH, 2300 Kiel Handling device for printed-circuit boards

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1278785A (en) * 1968-11-01 1972-06-21 Nat Res Dev Substrate magazine loading device

Also Published As

Publication number Publication date
FR2457588A1 (en) 1980-12-19
DE3011755A1 (en) 1980-12-04

Similar Documents

Publication Publication Date Title
DE3665274D1 (en) Mass soldering system
GB1541326A (en) Machine for automatically affixing electronic circuit elements of printed circuits to the substrate thereof
IN171365B (en)
HK11893A (en) Process for making substrates for printed circuit boards
ES8703712A1 (en) Apparatus for handling and assembling axial electronic components on printed circuit cards.
CH623452GA3 (en)
CH622163GA3 (en) Method for the series production of printed circuits of small dimensions
CH643978GA3 (en)
GB2062681B (en) Copper plating process for printing circuit board or other non metallic substrates
AU554348B2 (en) Apparatus for mounting chip type circuits on printed circuit boards
GB2067315B (en) Substrate board/carrier frame assembly for an electronic timepiece
JPS55132098A (en) Method of amounting chip type electronic part on printed board
GB1555227A (en) Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards
JPS5597896A (en) Ring solder sheet
JPS56166392A (en) Partial plating jig
JPS57180155A (en) Vessel for electronic circuit
JPS554977A (en) Method of holding electronic parts on printed circuit board
JPS56115599A (en) Method of soldering electronic circuit component on printed circuit board
JPS6437042A (en) Substrate for carrying electronic component
JPS54140970A (en) Circuit substrate for electronic watch
JPS5633898A (en) Method of conveying substrate in soldering bath treatment for conductive circuit printed board
JPS54106876A (en) Method of spot facing printed circuit board for electronic wrist watch
JPS57126108A (en) Mounting method for coil
JPS5793282A (en) Electronic device
JPS6445195A (en) Method of soldering printed circuit board