CH608246A5 - Use of a composition which can be cured to give an elastomer as an adhesive - Google Patents

Use of a composition which can be cured to give an elastomer as an adhesive

Info

Publication number
CH608246A5
CH608246A5 CH218174A CH218174A CH608246A5 CH 608246 A5 CH608246 A5 CH 608246A5 CH 218174 A CH218174 A CH 218174A CH 218174 A CH218174 A CH 218174A CH 608246 A5 CH608246 A5 CH 608246A5
Authority
CH
Switzerland
Prior art keywords
elastomer
cured
give
adhesive
composition
Prior art date
Application number
CH218174A
Other languages
English (en)
Inventor
Manfred Dr Leiser
Karl-Heinrich Dr Wegehaupt
Wilhelm Marsch
Original Assignee
Wacker Chemie Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemie Gmbh filed Critical Wacker Chemie Gmbh
Publication of CH608246A5 publication Critical patent/CH608246A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Laminated Bodies (AREA)
CH218174A 1973-02-16 1974-02-15 Use of a composition which can be cured to give an elastomer as an adhesive CH608246A5 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2307776A DE2307776C3 (de) 1973-02-16 1973-02-16 Verwendung von Gemischen auf Basis von OrganopolysUoxanen als Klebstoffe

Publications (1)

Publication Number Publication Date
CH608246A5 true CH608246A5 (en) 1978-12-29

Family

ID=5872178

Family Applications (1)

Application Number Title Priority Date Filing Date
CH218174A CH608246A5 (en) 1973-02-16 1974-02-15 Use of a composition which can be cured to give an elastomer as an adhesive

Country Status (13)

Country Link
US (1) US4051454A (fr)
JP (1) JPS5637267B2 (fr)
AT (1) AT329719B (fr)
BE (1) BE811161A (fr)
CA (1) CA1050189A (fr)
CH (1) CH608246A5 (fr)
DE (1) DE2307776C3 (fr)
FR (1) FR2218373B1 (fr)
GB (1) GB1455376A (fr)
IT (1) IT1002927B (fr)
NL (1) NL7401835A (fr)
NO (1) NO137943C (fr)
SE (1) SE410002B (fr)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4130707A (en) * 1973-02-16 1978-12-19 Wacker-Chemie Gmbh Adhesive compositions
US4208504A (en) * 1975-03-05 1980-06-17 Wacker-Chemie Gmbh Adhesive repellent coatings and substrates coated therewith
DE2616855C3 (de) * 1976-04-15 1981-11-12 Wacker-Chemie GmbH, 8000 München Verfahren zum Isolieren von Organopolysiloxanelastomer als Bindemittel enthaltendem Widerstandsmaterial von Flächenheizwiderständen
GB1602372A (en) * 1977-05-18 1981-11-11 Hotfoil Ltd Electrically conductive rubber composition
DE2728465C2 (de) * 1977-06-24 1982-04-22 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Gedruckte Schaltung
US4326238A (en) * 1977-12-28 1982-04-20 Fujitsu Limited Electronic circuit packages
DE2816872A1 (de) * 1978-04-18 1979-10-31 Wacker Chemie Gmbh Verfahren zum herstellen von elektrisch leitfaehigen organopolysiloxanelastomeren
JPS55120656A (en) * 1979-03-09 1980-09-17 Toray Silicone Co Ltd Curable liquid organopolysiloxane composition
US4279783A (en) * 1979-04-04 1981-07-21 Dow Corning Corporation Electrically conductive silicone elastomers
US4303735A (en) * 1979-04-04 1981-12-01 Dow Corning Corporation Base member coated with an electrically conductive silicone elastomer
JPS57178221A (en) * 1981-04-28 1982-11-02 Ricoh Elemex Corp Sealant for liquid crystal display panel
US4505847A (en) * 1982-03-02 1985-03-19 University Of Strathclyde Electrically-conductive materials
JPS5945356A (ja) * 1982-09-08 1984-03-14 Toray Silicone Co Ltd 導電性シリコ−ンゴム組成物
DE3279590D1 (en) * 1982-12-10 1989-05-11 Toray Silicone Co Method for making unitary molded silicone rubber product from two different silicone rubbers
JPS59199756A (ja) * 1983-04-27 1984-11-12 Toshiba Silicone Co Ltd 導電性シリコ−ンゴム組成物
EP0143994B1 (fr) * 1983-11-01 1992-01-02 Sumitomo Bakelite Company Limited Article composite à base de résines thermoplastiques et silicones
US4686124A (en) * 1983-12-12 1987-08-11 Sumitomo Bakelite Company Ltd. Thermoplastic resin-silicone rubber composite shaped article
FR2575085B1 (fr) * 1984-12-20 1987-02-20 Rhone Poulenc Spec Chim Complexe platine-triene comme catalyseur de reaction d'hydrosilylation et son procede de preparation
GB8502203D0 (en) * 1985-01-29 1985-02-27 Univ Strathclyde Elastomeric electro-conductive materials
EP0264635B1 (fr) * 1986-09-25 1991-08-21 Siemens Aktiengesellschaft Adhésif conducteur de l'électricité pour grand intervalle de température
US4938820A (en) * 1987-06-11 1990-07-03 Raychem Corporation Joining of sheets
US5286952A (en) * 1987-06-11 1994-02-15 Raychem Corporation Methods and devices which make use of conductive polymers to join articles
GB2222171B (en) * 1988-06-17 1992-01-29 Shinetsu Polymer Co Method for the preparation of an integral rubber article having electrically insulating and conductive parts
US5075038A (en) * 1988-11-04 1991-12-24 Dow Corning Corporation Electrically conductive silicone compositions
JP2974700B2 (ja) * 1989-11-30 1999-11-10 東レ・ダウコーニング・シリコーン株式会社 導電性接着剤
JP2864944B2 (ja) * 1993-04-30 1999-03-08 信越化学工業株式会社 難燃性シリコーン組成物
WO2012074558A2 (fr) 2010-12-03 2012-06-07 Michael Colburn Mélange de particules de graphite et diélectriques pour dispositifs de génération et d'échange de chaleur
US8708553B2 (en) 2010-12-06 2014-04-29 Cooper-Atkins Corporation System for verifying temperature measurement
CN112703240B (zh) 2018-08-10 2022-08-05 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2610167A (en) * 1946-12-07 1952-09-09 Grotenhuis Theodore A Te Pigmented silicone elastomers
US2714099A (en) * 1954-01-11 1955-07-26 Dow Corning Vinyl containing organosiloxane fluids
US2976185A (en) * 1955-12-12 1961-03-21 Du Pont Coated polymeric thermoplastic dielectric film
US2887558A (en) * 1956-04-10 1959-05-19 Sanders Associates Inc Electrical resistors and process for manufacturing same
US2894930A (en) * 1956-07-17 1959-07-14 Dow Corning Siloxane casting resins
US3003975A (en) * 1958-11-26 1961-10-10 Myron A Coler Conductive plastic composition and method of making the same
US3284406A (en) * 1963-12-18 1966-11-08 Dow Corning Organosiloxane encapsulating resins
GB1040871A (en) * 1964-05-04 1966-09-01 Midland Silicones Ltd Method of making electrical connections
FR1561922A (fr) * 1966-08-16 1969-04-04
US3457537A (en) * 1966-11-23 1969-07-22 Paul J Hines Flexible resistance element film
US3527655A (en) * 1968-08-09 1970-09-08 Gen Electric Adhesive silicone rubber
GB1281343A (en) * 1968-10-18 1972-07-12 Dow Corning Ltd Silicon containing compositions
US3527842A (en) * 1969-04-14 1970-09-08 Dow Corning Pressure sensitive adhesive made from siloxane resins
US3631220A (en) * 1970-05-08 1971-12-28 Dow Corning Curable organosilicon compositions
US3714204A (en) * 1970-05-22 1973-01-30 Dow Corning Pelletized silicone rubber
US3732330A (en) * 1972-03-08 1973-05-08 Dow Corning Curable compositions containing hydrogen-functional organopolysiloxanes
US3878362A (en) * 1974-02-15 1975-04-15 Du Pont Electric heater having laminated structure

Also Published As

Publication number Publication date
US4051454A (en) 1977-09-27
AT329719B (de) 1976-05-25
NO137943C (no) 1978-05-24
NO137943B (no) 1978-02-13
SE410002B (sv) 1979-09-17
IT1002927B (it) 1976-05-20
DE2307776C3 (de) 1979-08-30
GB1455376A (en) 1976-11-10
JPS5637267B2 (fr) 1981-08-29
DE2307776B2 (de) 1979-01-04
CA1050189A (fr) 1979-03-06
NO740502L (no) 1974-08-19
BE811161A (fr) 1974-08-19
FR2218373A1 (fr) 1974-09-13
DE2307776A1 (de) 1974-08-22
FR2218373B1 (fr) 1976-11-26
ATA121774A (de) 1975-08-15
NL7401835A (fr) 1974-08-20
JPS49114643A (fr) 1974-11-01

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Legal Events

Date Code Title Description
PL Patent ceased