CH596736A5 - - Google Patents
Info
- Publication number
- CH596736A5 CH596736A5 CH208876A CH208876A CH596736A5 CH 596736 A5 CH596736 A5 CH 596736A5 CH 208876 A CH208876 A CH 208876A CH 208876 A CH208876 A CH 208876A CH 596736 A5 CH596736 A5 CH 596736A5
- Authority
- CH
- Switzerland
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coating With Molten Metal (AREA)
- Die Bonding (AREA)
- Molten Solder (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2511210A DE2511210C3 (de) | 1975-03-14 | 1975-03-14 | Verfahren und Vorrichtung zum Tauchlöten von Halbleiterbauelementen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH596736A5 true CH596736A5 (US20100292554A1-20101118-C00004.png) | 1978-03-15 |
Family
ID=5941404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH208876A CH596736A5 (US20100292554A1-20101118-C00004.png) | 1975-03-14 | 1976-02-20 |
Country Status (5)
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5731195A (en) * | 1980-08-01 | 1982-02-19 | Aiwa Co | Method of soldering leadless electric part |
| US4475682A (en) * | 1982-05-04 | 1984-10-09 | The United States Of America As Represented By The United States Department Of Energy | Process for reducing series resistance of solar cell metal contact systems with a soldering flux etchant |
| IT1210953B (it) * | 1982-11-19 | 1989-09-29 | Ates Componenti Elettron | Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile. |
| US4538757A (en) * | 1983-08-01 | 1985-09-03 | Motorola, Inc. | Wave soldering in a reducing atmosphere |
| DE8622551U1 (de) * | 1986-08-22 | 1989-09-21 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Vorrichtung zum Verlöten von elektrischen Schaltungsplatten |
| NL8701237A (nl) * | 1987-05-22 | 1988-12-16 | Soltec Bv | Inrichting voor het aanbrengen van geleidend hechtmiddel, zoals soldeer, op een kaart met bedrukte bedrading. |
| DE4041272C2 (de) * | 1990-12-21 | 1996-12-05 | Siemens Ag | Wellenlötvorrichtung |
| US5230462A (en) * | 1992-07-08 | 1993-07-27 | Materials Research Corporation | Method of soldering a sputtering target to a backing member |
| DE10108023C2 (de) * | 2001-02-19 | 2003-04-17 | Air Liquide Gmbh | Verfahren zum Löten unter einer Schutzgasatmosphäre und Lötvorrichtung |
| NL1017843C2 (nl) * | 2001-04-12 | 2002-10-22 | Vitronics Soltec B V | Inrichting voor selectief solderen. |
| US8205784B1 (en) * | 2011-04-29 | 2012-06-26 | Trane International Inc. | Systems and methods for joining metal |
| DE102020007704A1 (de) * | 2020-12-16 | 2022-06-23 | Amsel-Advanced Materials and Surfaces for Environment and Life GmbH | Verfahren und Vorrichtung zum Reduzieren von Oberflächen sowie Verwendung des Verfahrens |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB567286A (en) * | 1941-10-01 | 1945-02-07 | John Louis Coltman | Improvements in or relating to the manufacture of heat exchange devices |
| DE1235713B (de) * | 1965-09-02 | 1967-03-02 | Siemens Ag | Vorrichtung zum Tauchloeten elektrischer Anschluesse |
| DE1514561C3 (de) * | 1965-09-06 | 1975-10-30 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum serienmäßigen Herstellen von Halbleiterbauelementen |
| DE2004320A1 (de) * | 1970-01-30 | 1971-08-05 | Siemens Ag | Verfahren zum Herstellen eines Halb leiterbauelementes |
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1975
- 1975-03-14 DE DE2511210A patent/DE2511210C3/de not_active Expired
-
1976
- 1976-02-20 CH CH208876A patent/CH596736A5/xx not_active IP Right Cessation
- 1976-03-11 US US05/665,762 patent/US4019671A/en not_active Expired - Lifetime
- 1976-03-12 FR FR7607283A patent/FR2304176A1/fr active Granted
- 1976-03-12 JP JP51027022A patent/JPS51115772A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2511210B2 (de) | 1979-06-28 |
| US4019671A (en) | 1977-04-26 |
| JPS51115772A (en) | 1976-10-12 |
| FR2304176A1 (fr) | 1976-10-08 |
| DE2511210C3 (de) | 1980-03-06 |
| DE2511210A1 (de) | 1976-09-23 |
| FR2304176B1 (US20100292554A1-20101118-C00004.png) | 1979-08-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |